Honeywell MT13-520 User manual

L
8-Node
Multinode Module Service
MT13-520

L
Implementation
8-Node Micro TDC 3000
8-Node
Multinode Module Service
MT13-520
Release 500
CE Compliant
9/95

Copyright, Trademarks, and Notices
Printed in U.S.A. — © Copyright 1995 by Honeywell Inc.
Revision 01 -– September 15, 1995
While this information is presented in good faith and believed to be accurate,
Honeywell disclaims the implied warranties of merchantability and fitness for a
particular purpose and makes no express warranties except as may be stated in its
written agreement with and for its customer.
In no event is Honeywell liable to anyone for any indirect, special or consequential
damages. The information and specifications in this document are subject to
change without notice.

Multinode Module Service 9/95
About This Publication
This publication provides instructions for use by the system service personnel, to service the
Multinode Module. It will help you determine how to perform service required on the module and to
identify spare parts. It also provides disassembly/assembly instructions useful when replacing the
required part.
This publication is to be used in conjunction with the remainder of the TDC 3000Xbookset.
This publication supports TDC 3000Xsoftware release 500 and CE Compliant hardware.
Any equipment designated as “CE Compliant” complies with the European Union EMC and
Health and Safety Directives. All equipment shipping into European Union countries after
January 1, 1996 requires this type of compliance—denoted by the “CE Mark.”

Multinode Module Service 9/95
Standard Symbols
Scope The following defines standard symbols used in this publication
ATTENTION Notes inform the reader about information that is required, but not
immediately evident
CAUTION Cautions tell the user that damage may occur to equipment if proper care is
not exercised
WARNING Warnings tell the reader that potential personal harm or serious economic
loss may happen if instructions are not followed
53893
OR Ground connection to building safety ground
53894 Ground stake for building safety ground
53895
DANGER
SHOCK HAZARD Electrical Shock Hazard—can be lethal
53896
DANGER
HIGH VOLTAGE Electrical Shock Hazard—can be lethal
53897 Rotating Fan—can cause personal injury

Table of Contents
Multinode Module Service i9/95
1 INTRODUCTION
1.1 Overview
1.2 Related Publications
2 MODULE DESCRIPTION
2.1 General Description
2.2 Module and Node Configurations
2.2.1 Multinode Module Node Configurations
2.2.2 Multinode Module Node Configurations (CE Compliant)
2.2.3 Multinode Module Board Types
2.2.4 Replacement Board Application Notes
2.3 Front Panel
2.4 Rear Panel
2.5 Field Adjustment
3 TEST/TROUBLESHOOTING
3.1 Tests
3.2 Test Procedures
3.3 Troubleshooting
3.3.1 Power Supply/Fan
3.3.2 PWB Troubleshooting
3.3.2.1 Controller Boards
3.3.2.2 Processor Board K2LCN
3.3.2.3 EPDG Board
4 DISASSEMBLY/ASSEMBLY
4.1 Disassembly
4.2 Assembly
5 SPARE PARTS
5.1 Introduction
6 STARTUP
6.1 Visual Checks
6.2 Initialize Module
APPENDIX A—ALPHANUMERIC DISPLAYS
A.1 Recommended Actions for Specific Code Occurrences
INDEX

Multinode Module Service ii 9/95

Multinode Module Service 1-1 9/95
1
INTRODUCTION
Section 1
1.1 OVERVIEW
This manual provides detailed instructions for maintenance, test, troubleshooting, and
repair of the Multinode Module shown in Figure 1-1 (with front cover installed) and Figure
1-2. The Multinode Module will not have the front cover installed when mounting in
Micro TDC 3000 or LCN cabinets. The troubleshooting, disassembly, and assembly
procedures are effective down to the optimum replaceable-unit (ORU) level. An ORU parts
list is included and is keyed to a module-exploded view that is also used with the
disassembly and assembly procedures.
53679
Figure 1-1 — Multinode Module

Multinode Module Service 1-2 9/95
1.1
This manual also contains information about the EC compatible Ten-Slot Module. It
accommodates both the older and newer EC I/O board designs. The EC card file remains
the same in all other details except each I/O board has a faceplate which provides grounding
of the board and cable shield to the card file. The fan intake and exhaust openings on the
sides of the module are covered with a honeycomb wire mesh for EC Compliant protection.
The EC I/O card file is shown in Figure 1-2.
53898
SPC-3 I/O
EPDGC I/O
TP-485-3 I/O
Figure 1-2 — Multinode Module for EC
1.2 RELATED PUBLICATIONS
The following related publications should be referred to as required and available:
Publication
Title Publication Number Binder Title Binder Number
Maintenance Test Operations SW11-502 LCN Service - 1 3060-1
System Maintenance Guide SW13-500 LCN Service - 1 3060-1
Test System Executive SW13-510 LCN Service - 3 3060-3
Hardware Verification Test System SW13-511 LCN Service - 3 3060-3
Core Module Test System SW13-512 LCN Service - 3 3060-3
8-Node Enhanced Micrro TDC 3000
User’s Manual
MT11-520 Implementation /
8-Node Micro
TDC 3000
3091

Multinode Module Service 2-1 9/95
2
MODULE DESCRIPTION
Section 2
2.1 GENERAL DESCRIPTION
The Multinode Module is designed to mount either horizontally in a standard NEMA rack
or vertically in a cabinet (or tower) designed to stand vertically on the floor. Cooling is
provided by four fans in one side of the module enclosure. An integral power supply is
located at the bottom (or side) of the module.
Each Multinode Module supports up to four functional nodes in the TDC 3000 System.
Each node occupies a specific address on the Local Control Network (LCN). Figure 2-1
illustrates a typical Micro TDC 3000 System using two Multinode Modules in vertical
cabinets.
Application
Module
Optional
Universal
Stat
i
o
n
RIGHT TOWER
LEFT TOWER
Network Interface
Module
History
Module Universal
Station
UNIVERSAL
CONTROL NETWORK
Optional Redundant
Network Interface
M
odu
l
e
LCN
54120
620 LCS
Optional
Enhanced
Programmable
Logic Controller
Gateway
Optional
Computer
Gate
w
ay
(Example)
DEC VAX
(Example)
Advanced Process
Manager
Figure 2-1 — Typical Micro TDC 3000 Multinode Module Application

Multinode Module Service 2-2 9/95
2.2
2.2 MODULE AND NODE CONFIGURATIONS
Circuit board slots are numbered from 1 to 10 starting at the bottom (nearest the power
supply). When the module is oriented vertically, the slots are numbered from right to left.
Nodes within a single Multinode Module are in a 3/3/2/2 arrangement, with slots 1 through
3 containing the first node, 4 through 6 containing the second node, slots 7 and 8
containing the third node, and slots 9 and 10 containing the fourth node.
The functional control boards are installed in the front card file of the module so that status
indicators on the boards may be viewed through the transparent cover. If an Input/Output
(I/O) adapter board (or paddleboard) is directly associated with a functional control board,
it is installed in the slot behind it in a card file at the rear of the module. Paddleboards
which do not perform an I/O function may also be installed in the rear card file in an unused
slot.

Multinode Module Service 2-3 9/95
2.2.1
2.2.1 Multinode Module Node Configurations
Because of the limited board space, the boards used to construct various nodes must
contain only certain boards and be configured as shown in Table 2-1.
CAUTION
Power must be removed from the module whenever you are removing or installing any board,
including an I/O paddleboard. Be sure that an I/O paddleboard is installed in the correct slot;
some boards have only one slot that they can be installed in without causing damage. I/O
paddleboards plugged into the wrong slot can cause traces on the backplane to burn open.
In the following table, slot numbers are identified by a-b-c. Remember, in the Multinode
Module 3/3/2/2 arrangement, slots are grouped by node, therefore, a given node may
occupy slots 1-2-3, 4-5-6, 7-8, or 9-10 to match slots a-b-c, or only a-b.
Table 2-1 — Node Configurations for Multinode Modules
Application Module (AM) Universal Station (US)
Slot Front Rear Slot Front Rear
c EPDG EPDG(P) I/O
b b Empty (3)
a K2LCN-4/8 (4) a K2LCN-4/6 (5) (1, 2)
Network Interface Module (NIM) History Module (HM)
Slot Front Rear Slot Front Rear
b EPNI NIM MODEM b SPC SPC I/O
a K2LCN-3 (1, 2) a K2LCN-3
Notes: (1) A TP485 I/O card is located in Slot 1 and 9 of the modules in the Micro TDC 3000.
(2) The TP485 in Slot 9 provides the interface to the twisted pair, short distance
(≤10 meters) TPLCN.
(3) The EPDG board set should be slots 3 and 6 with slots 2 and 5 empty.
(4) Standard AM is 4 Mw; optional is 8 Mw.
(5) Standard US is 4 Mw or 6Mw. 6MW is required for Universal Personality.
(Continued)

Multinode Module Service 2-4 9/95
2.2.1
CAUTION
Power must be removed from the module whenever you are removing or installing any board,
including an I/O paddleboard. Be sure that an I/O paddleboard is installed in the correct slot;
some boards have only one slot that they can be installed in without causing damage. I/O
paddleboards plugged into the wrong slot can cause traces on the backplane to burn open.
Note that a given node may occupy slots 1-2-3, 4-5-6, 7-8, or 9-10 to match slots a-b-c, or
only a-b.
Table 2-1 — Node Configurations for Multinode Modules (Continued)
Computer Gateway (CG) PLC Gateway (PLCG)
Slot Front Rear Slot Front Rear
cc
b CLI CLI I/O b PLCI PLCI I/O
a K2LCN-2 a K2LCN-2
Redundant NIM Network Gateway (NG)
Slot Front Rear Slot Front Rear
b EPNI NIM MODEM b NGI NGIO
a K2LCN-3 (1, 2) a K2LCN-2
Notes: (1) A TP485 I/O card is located in Slot 1 and 9 of the modules in the Micro TDC 3000.
(2) The TP485 in Slot 9 provides the interface to the twisted pair, short distance
(≤10 meters) TPLCN.

Multinode Module Service 2-5 9/95
2.2.2
2.2.2 Multinode Module Node Configurations (CE Compliant)
Because of the limited board space, the boards used to construct various nodes must
contain only certain boards and be configured as shown in Table 2-1.
CAUTION
Power must be removed from the module whenever you are removing or installing any board,
including an I/O paddleboard. Be sure that an I/O paddleboard is installed in the correct slot;
some boards have only one slot that they can be installed in without causing damage. I/O
paddleboards plugged into the wrong slot can cause traces on the backplane to burn open.
In the following table, slot numbers are identified by a-b-c. Remember, in the Multinode
Module 3/3/2/2 arrangement, slots are grouped by node, therefore, a given node may
occupy slots 1-2-3, 4-5-6, 7-8, or 9-10 to match slots a-b-c, or only a-b.
Table 2-2 — Node Configurations for Multinode Modules (CE Compliant)
Application Module (AM) Universal Station (US)
Slot Front Rear Slot Front Rear
c EPDG2 EPDGC I/O
b b Empty (3)
a K2LCN-4/8 (4) a K2LCN-4/6 (5) (1, 2)
Network Interface Module (NIM) History Module (HM)
Slot Front Rear Slot Front Rear
b EPNI NIM MODEM b SPC SPC3 I/O
a K2LCN-3 (1, 2) a K2LCN-3
Notes: (1) A TP485 I/O card is located in Slot 1 and 9 of the modules in the Micro TDC 3000.
(2) The TP485 in Slot 9 provides the interface to the twisted pair, short distance
(≤10 meters) TPLCN.
(3) The EPDG2 board set should be slots 3 and 6 with slots 2 and 5 empty.
(4) Standard AM is 4 Mw; optional is 8 Mw.
(5) Standard US is 4 Mw or 6Mw. 6MW is required for Universal Personality.
(Continued)

Multinode Module Service 2-6 9/95
2.2.2
CAUTION
Power must be removed from the module whenever you are removing or installing any board,
including an I/O paddleboard. Be sure that an I/O paddleboard is installed in the correct slot;
some boards have only one slot that they can be installed in without causing damage. I/O
paddleboards plugged into the wrong slot can cause traces on the backplane to burn open.
Note that a given node may occupy slots 1-2-3, 4-5-6, 7-8, or 9-10 to match slots a-b-c, or
only a-b.
Table 2-2 — Node Configurations for Multinode Modules (CE Compliant) (Continued)
Computer Gateway (CG) PLC Gateway (PLCG)
Slot Front Rear Slot Front Rear
cc
b CLI CLI I/O b PLCI PLCI I/O
a K2LCN-2 a K2LCN-2
Redundant NIM Network Gateway (NG)
Slot Front Rear Slot Front Rear
b EPNI NIM MODEM b NGI NGFOM
a K2LCN-3 (1, 2) a K2LCN-2
Notes: (1) A TP485 I/O card is located in Slot 1 and 9 of the modules in the Micro TDC 3000.
(2) The TP485 in Slot 9 provides the interface to the twisted pair, short distance
(≤10 meters) TPLCN. The TP485 in Slot 1 provides the interface to the module
temperature sensors.

Multinode Module Service 2-7 9/95
2.2.3
2.2.3 Multinode Module Board Types
The board types listed in Table 2-3 are the current production board types suitable for use
in the Multinode Module.
Table 2-3 — Multinode Module Board Types
Board Description
Type
CLI Communications Line Interface Board (PN 80360206-001)
CNI I/O Communications Network Interface (PN 51304537-100)
CNI I/O Communications Network Interface I/O Brd (EC) (PN 51304537-200)
EPDG Enhanced Peripheral Display Generator (PN 51401286-100)
EPDG2 Enhanced Peripheral Display Generator (EC) (PN 51402089-100)
K2LCN-2 High Performance/Density Processor Board (PN 51401551-200)
K2LCN-3 High Performance/Density Processor Board (PN 51401551-300)
K2LCN-4 High Performance/Density Processor Board (PN 51401551-400)
K2LCN-6 High Performance/Density Processor Board (PN 51401551-600)
TP485 TPLCN/Temperature-Sensor Interface Card (PN 51304776-100)
TP485-3 Temp.-Sensor I/O Face Plate w/connector (EC) (PN 51304776-300)
TP485-4 Temp.-Sensor I/O Face Plate w/o connector (EC) (PN 51304776-400)
NIM MODEM Network Interface Module MODEM Card (PN 51304511-100)
PLCI Programmable Logic Controller Interface Board (PN 51400997-100)
EPLCI Enhanced Prog. Logic Controller Interface I/O (PN 51304812-100)
EPNI Enhanced Process Network Interface Board (PN 51401583-100)
SPC Smart Peripheral Controller Board (PN 51401052-100)
NGI Network Gateway Interface Board (PN 51401583-200)
EPDGP I/O Enhanced Peripheral Display Generator Interface Card (PN 51401286-100)
EPDGC I/O Enhanced Peripheral Dis. Gen. Int. Card (EC) (PN 51402477-100)
SPC I/O Smart Peripheral Controller Interface Card (PN 51304156-100)
SPC3 Smart Peripheral Controller Interface Card (EC) (PN 51305088-100)

Multinode Module Service 2-8 9/95
2.2.3
Table 2-3 — Multinode Module Board Types (Continued)
Board Description
Type
CLI I/O Communications Line Interface I/O Card (RS-232C) (PN 80360209-001)
CLI/B Comm. Line Interface I/O Card (RS-232C) (EC) (PN 51305090-100)
CLI I/O Communications Line Interface I/O Card (RS-449) (PN 80360230-001)
CLI/A Comm. Line Interface I/O Card (RS-449) (EC) (PN 51305091-100)
PLCI I/O Programmable Logic Controller Interface I/O Card (PN 51195096-100)
PLCI I/O Prog. Logic Controllers Interface I/O Card (EC) (PN 51195096-200)
NGIO Network Gateway Interface I/O Card (PN 51304472-100)
CLCN I/O Local Control Network I/O Card (EC) (PN 51305072-100)
Refer to subsection 2.2.3 Replacement Board Application Notes, for information about
compatible replacements.
2.2.4 Replacement Board Application Notes
Table 2-4 lists boards which are dependent upon a minimum software release.
Table 2-4 — Replacement Board Applications
BOARD MINIMUM SOFTWARE
TYPE DESCRIPTION RELEASE *
K2LCN 68020 processor and memory board used in all nodes 320
EPDG With the EPDGP I/O board, operates the 20" noninterlaced CRT 320
monitor. The EPDGP I/O also has a Cartridge Disk Interface.
TP485 Paddleboard that interfaces short-distance LCN used in the 320
Micro TDC 3000, and interfaces the cabinet temperature sensors
(sensors on non-CE Compliant equipment only).
TP485-3 I/O board interfaces the current loop interface between the XXX
I/O modules located in a Micro TDC 3000 tower.
TP485-4 I/O board interfaces the current loop interface between the XXX
I/O modules located in a Micro TDC 3000 tower.
*All boards are upwards compatible.

Multinode Module Service 2-9 9/95
2.3
2.3 FRONT PANEL
Controls on the front panel of the power supply consist of a POWER switch, a RESET
button, a FAN CONTROL, and a LO-NOM-HI margin jumper. The function and operation of
the power and reset controls are discussed elsewhere in this manual. The margin jumper is
a power supply test/maintenance diagnostic aide and should be left in the NOM (center)
jumper position at all times. The EC power supply contains a fan control switch/jumper
and is set for either a thermally-controlled or fixed-fan power (see Figure 3-2). One setting
varies the fan voltage with temperature and load. The other setting provides a continuous
27 volts.
The front panel contains indicators that provide status of the unit’s performance and aid in
fault isolation. The LED indicators on the bottom left of the front panel (the power supply)
give an indication of the power-supply status. Another indicator on the fan assembly
lights if the fan assembly fails. LEDs on each of the boards are used in conjunction with an
alphanumeric display on the processor board to isolate malfunctions on the boards. Further
information on the use of the module indicators is located in Section 3 of this manual.
2.4 REAR PANEL
The rear panel contains the I/O boards (paddleboards), chassis power-cable, a 100-pin
backplane breakout board (if provided), and a grounding lug. As shown in Table 2-1 the
I/O boards are installed in the chassis in the slot corresponding in number to the applicable
board installed in the front of the module. All communication with the Micro TDC 3000 is
through the I/O boards.
There are two methods of communicating between nodes on the system. The conventional
LCNI I/O paddleboards form the Local Control Network with coaxial cables that run to all
of the LCN nodes in a network. In the network, all LCN I/O boards are connected by T
connectors and cable (or to a terminating load on the last T in a series). Because of loading
characteristics, the minimum LCN cable length is 2 meters (6 feet), so there may appear to
be some cable “waste” when nearby LCN boards are interconnected. In all LCN cabling,
the I/O board connectors are marked A and B; make sure that the A cable connects to the A
connector and that the B cable is connected to the B connector.
A special short distance LCN network has been designed which uses twisted pair and
multinode module backplane wiring instead of coaxial cable and T connectors. The I/O
paddleboards used for this network are the TP485 boards. This twisted pair LCN cabling
follows the RS 485 interface standard. One of the K2LCN processor boards and TP485
I/O cards in slot 9 of each tower supplies clock to other nodes on the short distance
network. The twisted pair cables which tie this short distance LCN together are keyed so
that cables A and B cannot be misconnected and terminating loads are built-in.
Ribbon cables are used to connect to such items as the Winchester Drive, Cartridge Drive,
and other peripherals. Other connectors, for example RS 232C or RS 449 on the
Computer Gateway, are also used.

Multinode Module Service 2-10 9/95
2.5
2.5 FIELD ADJUSTMENT
There are no field adjustments for the Multinode Module. Each K2LCN board, however,
has a node address jumper-pack that must be characterized for the particular node address it
occupies on the TPLCN. Refer to subsection 8.1 of the LCN System Installation manual
for system pinning.
A replacement power supply must be pinned for internal (INT) clock only (see Figure 2-2).
52389
E23
E20
(EXT)
No Link Clock
(INT)
With Link Clock
E21
Figure 2-2 — Power Supply Showing Location of Clock Jumper