Honeywell MT13-520 User manual

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8-Node
Multinode Module Service
MT13-520

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Implementation
8-Node Micro TDC 3000
8-Node
Multinode Module Service
MT13-520
Release 500
CE Compliant
9/95

Copyright, Trademarks, and Notices
Printed in U.S.A. — © Copyright 1995 by Honeywell Inc.
Revision 01 -– September 15, 1995
While this information is presented in good faith and believed to be accurate,
Honeywell disclaims the implied warranties of merchantability and fitness for a
particular purpose and makes no express warranties except as may be stated in its
written agreement with and for its customer.
In no event is Honeywell liable to anyone for any indirect, special or consequential
damages. The information and specifications in this document are subject to
change without notice.

Multinode Module Service 9/95
About This Publication
This publication provides instructions for use by the system service personnel, to service the
Multinode Module. It will help you determine how to perform service required on the module and to
identify spare parts. It also provides disassembly/assembly instructions useful when replacing the
required part.
This publication is to be used in conjunction with the remainder of the TDC 3000Xbookset.
This publication supports TDC 3000Xsoftware release 500 and CE Compliant hardware.
Any equipment designated as “CE Compliant” complies with the European Union EMC and
Health and Safety Directives. All equipment shipping into European Union countries after
January 1, 1996 requires this type of compliance—denoted by the “CE Mark.”

Multinode Module Service 9/95
Standard Symbols
Scope The following defines standard symbols used in this publication
ATTENTION Notes inform the reader about information that is required, but not
immediately evident
CAUTION Cautions tell the user that damage may occur to equipment if proper care is
not exercised
WARNING Warnings tell the reader that potential personal harm or serious economic
loss may happen if instructions are not followed
53893
OR Ground connection to building safety ground
53894 Ground stake for building safety ground
53895
DANGER
SHOCK HAZARD Electrical Shock Hazard—can be lethal
53896
DANGER
HIGH VOLTAGE Electrical Shock Hazard—can be lethal
53897 Rotating Fan—can cause personal injury

Table of Contents
Multinode Module Service i9/95
1 INTRODUCTION
1.1 Overview
1.2 Related Publications
2 MODULE DESCRIPTION
2.1 General Description
2.2 Module and Node Configurations
2.2.1 Multinode Module Node Configurations
2.2.2 Multinode Module Node Configurations (CE Compliant)
2.2.3 Multinode Module Board Types
2.2.4 Replacement Board Application Notes
2.3 Front Panel
2.4 Rear Panel
2.5 Field Adjustment
3 TEST/TROUBLESHOOTING
3.1 Tests
3.2 Test Procedures
3.3 Troubleshooting
3.3.1 Power Supply/Fan
3.3.2 PWB Troubleshooting
3.3.2.1 Controller Boards
3.3.2.2 Processor Board K2LCN
3.3.2.3 EPDG Board
4 DISASSEMBLY/ASSEMBLY
4.1 Disassembly
4.2 Assembly
5 SPARE PARTS
5.1 Introduction
6 STARTUP
6.1 Visual Checks
6.2 Initialize Module
APPENDIX A—ALPHANUMERIC DISPLAYS
A.1 Recommended Actions for Specific Code Occurrences
INDEX

Multinode Module Service ii 9/95

Multinode Module Service 1-1 9/95
1
INTRODUCTION
Section 1
1.1 OVERVIEW
This manual provides detailed instructions for maintenance, test, troubleshooting, and
repair of the Multinode Module shown in Figure 1-1 (with front cover installed) and Figure
1-2. The Multinode Module will not have the front cover installed when mounting in
Micro TDC 3000 or LCN cabinets. The troubleshooting, disassembly, and assembly
procedures are effective down to the optimum replaceable-unit (ORU) level. An ORU parts
list is included and is keyed to a module-exploded view that is also used with the
disassembly and assembly procedures.
53679
Figure 1-1 — Multinode Module

Multinode Module Service 1-2 9/95
1.1
This manual also contains information about the EC compatible Ten-Slot Module. It
accommodates both the older and newer EC I/O board designs. The EC card file remains
the same in all other details except each I/O board has a faceplate which provides grounding
of the board and cable shield to the card file. The fan intake and exhaust openings on the
sides of the module are covered with a honeycomb wire mesh for EC Compliant protection.
The EC I/O card file is shown in Figure 1-2.
53898
SPC-3 I/O
EPDGC I/O
TP-485-3 I/O
Figure 1-2 — Multinode Module for EC
1.2 RELATED PUBLICATIONS
The following related publications should be referred to as required and available:
Publication
Title Publication Number Binder Title Binder Number
Maintenance Test Operations SW11-502 LCN Service - 1 3060-1
System Maintenance Guide SW13-500 LCN Service - 1 3060-1
Test System Executive SW13-510 LCN Service - 3 3060-3
Hardware Verification Test System SW13-511 LCN Service - 3 3060-3
Core Module Test System SW13-512 LCN Service - 3 3060-3
8-Node Enhanced Micrro TDC 3000
User’s Manual
MT11-520 Implementation /
8-Node Micro
TDC 3000
3091