Sharp 55R-WP4H User manual

1
61R-WP4H
55R-WP4H
REAR PROJECTION TV
In the interests of user-safety (Required by safety regulations in some countries) the set should be restored to its
original condition and only parts identical to those specified should be used.
S61W155R-WP4H
SHARP CORPORATION This document has been published to be used for after
sales service only.
The contents are subject to change without notice.
•CHANGING PART LIST ............................................................................................................................ 2
•SPECIFICATIONS .................................................................................................................................... 3
•
SCHEMATIC DIAGRAMS
MAIN UNIT-1/5 ................................................................................................................................................ 4
MAIN UNIT-3/5 ................................................................................................................................................ 6
•PARTS LIST .............................................................................................................................................. 8
Page
CONTENTS
SERVICE MANUAL
61R-WP4H
55R-WP4H
MODELS
PUSH OPEN
POWER
POWER
OUTLINE
This model is based on the current model 55/61R-WP5H. The HD (RGB) INPUT is not available and the style
partially redesigned.
This Service Manual covers only the modifications from the basic model. For details, refer to the 55/61R-WP5H
Service Manual.

2
61R-WP4H
55R-WP4H
CHANGING PART LIST
Ref.No. Description 55/61R-WP5H 55/61R-WP4H Note
Printed Wiring Board Ass'y
Service chassis DSETUA232FMV0S DSETUA232FMV1S
PWB-A Main Unit DUNTKA232WEV0 DUNTKA232WEV1
MAIN UNIT
R3626 Resistor 10k 1/16W VRS-CY1JF103J —
R3627 Resistor 10k 1/16W — VRS-CY1JF103J
The 55/61R-WP4H does not have the following parts when compared to 55/61R-WP5H.
IC1401, IC1402, IC1901 to IC1903
Q1901 to Q1905
D1901 to D1905, D1953, D1954
L1901
C1406 to C1418, C1901 to C1922, C1925, C1930, C1931
R1448 to R1452, R1454 to R1461, R1464 to R1468, R1901 to R1907, R1909, R1910, R1912 to R1917,
R1919, R1921 to R1925, R1960 to R1973
SC1953
CABINET PARTS
2 Control Cover GCOVA1051MESA GCOVA1051MESB
3 Front Door GDORF1117MESA GDORF1117MESB
4 SP Grill (61R) HGRL-5000MESA HGRL-5004MESA
4 SP Grill (55R) HGRL-5001MESA HGRL-5003MESA
7 Control Panel HPNLC1107MEKA HPNLC1107MEKB
10 Frame-Top (61R) CWAKP0109ME01 CWAKP0109ME02
10 Frame-Top (55R) CWAKP0108ME01 CWAKP0108ME02
11 Frame-Bottom (61R) CWAKP0106ME01 CWAKP0106ME02
11 Frame-Bottom (55R) CWAKP0107ME01 CWAKP0107ME02
12 Frame-Side (61R) CWAKP0103ME01 CWAKP0103ME02
12 Frame-Side (55R) CWAKP0105ME01 CWAKP0105ME02
24 Badge HBDGD3017MESA HBDGB3121CESB
29 Indication Plate-Rear HiNDP0109MEKZ HiNDP0111MEKZ
35 Corner (RT) CHLDZ0105ME01 CHLDZ0105ME02
36 Corner (LT) CHLDZ0106ME01 CHLDZ0106ME02
SUPPLIED ACCESORRIES
Registration Card TGAN-1061MEZZ TGAN-1006MEZZ
Operation Manual TiNS-7197MEZZ TiNS-7360MEZZ
PACKING PARTS
Packing Case, Top (61R) SPAKC0680MEZZ SPAKC0681MEZZ
Packing Case, Top (55R) SPAKC0682MEZZ SPAKC0684MEZZ

3
61R-WP4H
55R-WP4H
Specifications
Model 61R-WP4H/55R-WP4H
Signal System NTSC
Channel AIR 2ch — 69ch
CATV 1ch — 125ch
Antenna input ANT A/B 75 Ωunbalance
Video input (INPUT 1, 2, 3, 4) Composite
Input jack: Pin-jack ×1
Input level: 1 Vp-p/75 Ω/negative sync
S video input (INPUT 1, 2, 3) Y/C
Y: 1 Vp-p/75 Ω/negative sync
C: 0.286 Vp-p/75 Ω
Component input (INPUT 4, 5) Component (Y, PB, PR)
Input jack: Pin-jack ×3 (INPUT 4)
Input signal: 480I, 480P, 720P, 1080I
Y: 1 Vp-p/75 Ω/negative sync
PB, PR: 0.525 Vp-p/75 Ω
(75% saturation level)
AUDIO input (INPUT 1, 2, 3, 4, 5)
Input jack: Pin-jack ×2
0.5 Vrms/22 kΩor over
VAO Output Jack: Pin-jack ×2
(Variable audio output) 0.89 Vrms (max)/2.2 kΩ
Monitor Out Video: Composite Video 1 Vp-p/75 Ω/negative
Audio: 500 mVrms (100% modulation/Less than 1 kΩ)
Audio output 30 W (15 W + 15 W)
Power supply 120 V AC, 60 Hz
Power consumption 290 W
Dimensions 61R-WP4H: 5621/32" (W) ×577/8" (H) ×2845/64" (D)
[1439 mm (W) ×1470 mm (H) ×729 mm (D)]
55R-WP4H: 5117/64" (W) ×505/64" (H) ×285/32" (D)
[1302 mm (W) ×1272 mm (H) ×715 mm (D)]
Weight 61R-WP4H: 298lbs (135.2 kg)
55R-WP4H: 257lbs (116.6kg)

1234567891011 12 13 14 15 16 17 18 19 20
A
B
C
D
E
F
G
H
I
J
4~5
SCHEMATIC DIAGRAMS
MAIN UNIT-1/5

1234567891011 12 13 14 15 16 17 18 19 20
A
B
C
D
E
F
G
H
I
J
MAIN UNIT-3/5
6~7

8
61R-WP4H
55R-WP4H
Ref. No. Part No. ★Description Code
Ref. No. Part No. ★Description Code
PARTS LIST
PARTS REPLACEMENT
Replacement parts which have these special safety characteristics
identified in this manual; electrical components having such features
are identified by åand shaded areas in the Replacement Parts Lists
and Schematic Diagrams. The use of a substitute replacement part
which dose no have the same safety characteristic as the factory
recommended replacement parts shown in this service manual may
create shock, fire or other hazards.
"HOW TO ORDER REPLACEMENT PARTS"
To have your order filled promptly and correctly, please furnish the
following informations.
1. MODEL NUMBER 2. REF. NO.
3. PART NO. 4. DESCRIPTION
in USA: Contact your nearest SHARP Parts Distributor to order.
For location of SHARP Parts Distributor, Please call Toll-
Free; 1-800-BE-SHARP
★MARK: SPARE PARTS-DELIVERY SECTION
çMARK : X- RAY RELATED PARTS
PRINTED WIRING BOARD ASSEMBLIES
(NOT REPLACEMENT ITEM)
DSETUA232FMV1S M Service chassis DC
PWB-A DUNTKA232WEV1 – Main Unit —
CABINET PARTS
2 GCOVA1051MESB M Control Cover AR
3 GDORF1117MESB M Front Door AL
4 HGRL-5004MESA M Speaker Grille (61R -WP4H ) BP
4 HGRL-5003MESA M Speaker Grille (55R -WP4H ) BT
7 HPNLC1107MEKB M Control Panel AQ
10 CWAKP0109ME02 M Frame-Top (61R-WP4H) BQ
10 CWAKP0108ME02 M Frame-Top (55R-WP4H) BP
11 CWAKP0106ME02 M Frame-Bottom(61R-WP4H) AZ
11 CWAKP0107ME02 M Frame-Bottom(55R-WP4H) AY
12 CWAKP0103ME02 M Frame-Side, x2 (61R-WP4H) AW
12 CWAKP0105ME02 M Frame-Side, x2 (55R-WP4H) AX
24 HBDGB3121CESB M Badge AF
29 HiNDP0111MEKZ M Indication Plate-Rear AX
35 CHLDZ0105ME02 M Corner (RT), x2 AE
36 CHLDZ0106ME02 M Corner (LT), x2 AE
PWB-A: DUNTKA232WEV1
MAIN UNIT
RESISTOR
R3627 VRS-CY1JF103J J 10k 1/16W Metal Oxide AA
SUPPLIED ACCESORRIES
TGAN-1006MEZZ M Registration Card AD
TiNS-7360MEZZ M Operation Manual AK
SPAKC0681MEZZ – Packing Case, Top —
(61R-WP4H)
SPAKC0684MEZZ – Packing Case, Top —
(55R-WP4H)
PACKING PARTS
(NOT REPLACEMANT ITEM)

9
61R-WP4H
55R-WP4H
654321
A
B
C
D
E
F
G
H
CABINET PARTS LOCATION
13 14
36 22
21
22
22
36
32
3333
35
22
35 18
23
4
21
Operation PWB
SHARP
28
24
23
25
27 20
10
12 12
11
88
99
5
39
39
37
34
7
1

10
61R-WP4H
55R-WP4H
COPYRIGHT © 2001 BY SHARP CORPORATION
ALL RIGHTS RESERVED.
No part of this publication may be reproduced,
stored in a retrieval system, or transmitted in
any form or by any means, electronic, mechanical,
photocopying, recording, or otherwise, without
prior written permission of the publisher.
SHARP CORPORATION
AV Systems Group
Quality & Reliability Control Center
Yaita, Tochigi 329-2193, Japan
D SMCA P SMCA TQ1161-S
Jun. 2001 Printed in Japan
SY. KD

1
61R-WP5H
55R-WP5H
REAR PROJECTIONTV
In the interests of user-safety (Required by safety regulations in some countries) the set should be restored to its
original condition and only parts identical to those specified should be used.
S41S655R-WP5H
SHARP CORPORATION This document has been published to be used for after
sales service only.
The contents are subject to change without notice.
»SPECIFICATIONS ............................................... 2
» IMPORTANT SERVICE SAFETY PRECAUTION ... 3
»LOCATION OF USER CONTROL..................... 12
»DIMENSIONS.................................................... 15
»REMOVAL OF MAJOR PARTS ......................... 17
»DRESSING THE LEADS ...................................20
»ELECTRICALADJUSTMENT ...........................24
Page
CONTENTS
SERVICE MANUAL
61R-WP5H
55R-WP5H
MODELS
Page
PUSH OPEN
POWER
POWER
»CHASSIS LAYOUT............................................ 42
»BLOCK DIAGRAM ............................................ 46
»UNIT LAYOUT ................................................... 48
»SCHEMATIC DIAGRAMS ................................. 50
»PRINTED WIRING BOARD ASSEMBLIES ....... 82
»PARTS LIST ....................................................100
»PACKING OF THE SET ..................................129

2
61R-WP5H
55R-WP5H
Specifications
Model 61R-WP5H/55R-WP5H
Signal System NTSC
Channel AIR 2ch – 69ch
CATV 1ch – 125ch
Antenna input ANTA/B 75 Ωunbalance
Video input (INPUT 1, 2, 3, 4) Composite
Input jack: Pin-jack ×1
Input level: 1 Vp-p/75 Ω/negative sync
S video input (INPUT 1, 2, 3) Y/C
Y: 1 Vp-p/75 Ω/negative sync
C: 0.286 Vp-p/75 Ω
Component input (INPUT 4, 5) Component (Y, PB, PR)
Input jack: Pin-jack ×3 (INPUT 4)
Input signal: 480I, 480P, 720P, 1080I
Y: 1Vp-p/75 Ω/negative sync
PB, PR: 0.525 Vp-p/75 Ω
(75 % saturation level)
HD input (INPUT 3) R, G, B, H. V /R, G, B
INPUT jack: Dsub 15 pin ×1
Input signal: 480P, 1080I
RGB: 0.7 Vp-p/75 Ω/no sync
HD/CS, VD: TTL level/positive and negative
AUDIO input (INPUT 1, 2, 3, 4, 5)
Input jack: Pin-jack ×2
0.5 Vrms/22 kΩor over
VAO Output jack: Pin-jack ×2
(Variable audio output) 0.89 Vrms (max)/2.2 kΩ
Monitor Out Video: Composite Video 1 Vp-p/75Ω/negative
Audio: 500 mVrms (100% modulation/Less than 1 kΩ)
Audio output 30 W (15 W + 15 W)
Power supply 120 V AC, 60Hz
Power consumption 290 W
Dimensions 61R-WP5H: 5621/32" (W) ×577/8" (H) ×2845/64" (D)
[1439 mm (W) ×1470 mm (H) ×729 mm (D)]
55R-WP5H: 5117/64" (W) ×505/64" (H) ×28 5/32" (D)
[1302 mm (W) ×1272 mm (H) ×715 mm (D)]
Weight 61R-WP5H: 298lbs (135.2 kg)
55R-WP5H: 257lbs (116.6 kg)

3
61R-WP5H
55R-WP5H
IMPORTANT SERVICE SAFETY PRECAUTION
Service work should be performed only by qualified service technicians who are
thoroughly familiar with all safety checks and the servicing guidelines which follow:
CAUTION: FOR CONTINUED
PROTECTION AGAINST A
RISK OF FIRE, REPLACE
ONLY WITH SAME TYPE 5A-
125V FUSE.
X-RADIATION AND HIGHVOLTAGE LIMITS
1. Be sure all service personnel are aware of the
proceduresandinstructionscoveringX-radiation.The
only potential source of X-ray in current solid state
TVreceivers is the picturetube. However,the picture
tube does not emit measurable X-Ray radiation, if
the high voltage is as specified in the "High Voltage
Check" instructions.
It is only when high voltage is excessive that X-
radiation is capable of penetrating the shell of the
picture tube including the lead in the glass material.
The important precaution is to keep the high voltage
below the maximum level specified.
2. It is essential that servicemen have available at all
times an accurate high voltage meter.
The calibration of this meter should be checked
periodically.
3. Highvoltage should always be keptattherated value
−no higher. Operation at higher voltages may cause
a failure of the picture tube or high voltage circuitry
and;also, under certain conditions, may produce
radiation in exceeding of desirable levels.
4. Whenthe high voltage regulator isoperatingproperly
thereisnopossibilityofanX-radiationproblem.Every
timeacolorchassisisserviced,thebrightnessshould
be tested while monitoring the high voltage with a
meter to be certain that the high voltage does not
exceed the specified value and that it is regulating
correctly.
5. Do not use a picture tube other than that specified or
make unrecommended circuit modifications to the
high voltage circuitry.
6. Whentroubleshootingandtakingtestmeasurements
onareceiverwithexcessivehighvoltage,avoidbeing
unnecessarily close to the receiver.
Do not operate the receiver longer than is necessary
to locate the cause of excessive voltage.
WARNING
1. For continued safety, no modification of any circuit
should be attempted.
2. Disconnect AC power before servicing.
3. Semiconductorheatsinksarepotentialshockhazards
when the chassis is operating.
4. The chassis in this receiver has two ground systems
which are separated by insulating material. The non-
isolated (hot) ground system is for the B+ voltage
regulator circuit and the horizontal output circuit. The
isolatedground system is for the low B+ DCvoltages
and the secondary circuit of the high voltage
transformer.
To prevent electrical shock use an isolation
transformer between the line cord and power
receptacle, when servicing this chassis.
SERVICING OF HIGH VOLTAGE SYSTEM
AND PICTURE TUBE
When servicing the high voltage system,
remove the static charge by connecting a
10k ohm resistor in series with an insulated
wire (such as a test probe) between the pic-
ture tube ground and the anode lead. (AC
line cord should be disconnected from AC
outlet.)
1. Picture tube in this receiver employs integral
implosion protection.
2. Replace with tube of the same type number for
continued safety.
3. Do not lift picture tube by the neck.
4. Handle the picture tube only when wearing
shatterproof goggles and after discharging the high
voltage anode completely.
5A 125V

4
61R-WP5H
55R-WP5H
SAFETY PRECAUTIONS
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EXWWRQ6HHWKHIROORZLQJFRQQHFWLRQGLDJUDP
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FRQQHFWLRQWRWKHDQRGHEXWWRQLVPDGH
LEAKAGE
CURRENT
TESTER
(READING
SHOULD NOT
BE ABOVE 0.5mA)
EARTH
GROUND
TEST ALL
EXPOSED
METAL SURFACES
DEVICE
UNDER
TEST
2-WIRE CORD
ALSO TEST WITH PLUG
REVERSED
(USING AC ADAPTER
PLUS AS REQUIRED)
Chassis
ground
High Impedance
H.V. meter
Deflection P.W.B.
FBT
(TH01)
High voltage
connector
AC Leakage Test

5
61R-WP5H
55R-WP5H
g. X-radiation – TUBE: The primary source of X-
radiation in this receiver is the picture tube. The tube
utilized for the above mentioned function in this
chassis is specially constructed to limit X-radiation
emissions.
For continued X-radiation protection, the replacement
tube must be the same type as the original, Sharp
approved type.
When troubleshooting and making test measure-
ments in a receiver with a problem of excessive high
voltage, avoid being unnecessarily close to the pic-
ture tube and the high voltage component.
Do not operate the chassis longer than is necessary
to locate the cause of excessive voltage.
Shield Plate A (1.6mm)
Glass Lens for Shielding
Shield Plate B (1.6mm)
Shield Plate B (1.6mm)
Shield Plate C (1.6mm)
Detailing X-radiation shield, ( ) plate thickness
Shield Plate B (1.6mm)
)LJ,QVWDOODWLRQRIVKLHOGOHQVVKLHOGFRYHUDQGVKLHOGSODWHVREOLTXHYLHZ
(Note: This figure is for your reference. The body’s
actual shape is different from this one.)

6
61R-WP5H
55R-WP5H
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!

7
61R-WP5H
55R-WP5H
SERVICING PRECAUTIONS
CAUTION: Before servicing instruments covered by this
service data and its supplements and addenda, read and
follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict between
the following servicing precautions and any of the safety
precautions on page 3 of this publication, always follow the
safety precautions. Remember: Safety First.
General Servicing Guidelines
1. Always unplug the instrumentAC power cord from the AC
power source before:
a. Removing or reinstalling any component, circuit
board, module, or any other instrument assembly.
b. Disconnecting or reconnecting any instrument
electrical plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the instrument.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic
capacitors may result in an explosion
hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device
(DVM, FETVOM, etc.) equipped with a suitable high
voltage probe. Do not test high voltage by “drawing an
arc.”The H.V. Distribution Box has an internal 400MΩ
resistor (bleeder resistor) connected from the high
voltage to ground. After power is removed from the
instrument the high voltage will discharge through the
high voltage bleeder resistor. If the tubes have high
voltage after power is removed, then the bleeder resistor
is defective or the bleeder ground is disconnected.
3. Discharge the picture tube’s anode at any of the R, G, or
B outputs on the H.V. Distribution Box only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield at
the point where the picture tube socket ground lead is
connected, and then (b) touch the other end of the
insulated clip lead to the picture tube high voltage
distribution box R, G, or B output, using an insulated
handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this instrument or any
of its assemblies.
5. Unless specified otherwise in these service data, clean
electrical contracts by applying the following mixture to
the contacts with a pipe cleaner, cotton-tipped stick or
comparable nonabrasive applicator: 10% (by volume)
Acetone and 90% (by volume) isopropyl alcohol (90%-
99% strength).
CAUTION: This is a flammable mixture. Unless
specified otherwise in these service data,
lubrication of contacts is not required.
6. Do not defeat any plug/socket B+ voltage interlocks with
which instruments covered by this service data might be
equipped.
7. Do not applyAC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat-
sinks are correctly installed.
8. Always connect the test instrument ground lead to the
appropriate instrument chassis ground before connecting
the test instrument positive lead. Always remove the test
instrument ground lead last.
9. Use with this instrument only the test fixtures specified in
this service data.
CAUTION: Do not connect the test fixture ground strap
to any heatsink in this instrument.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field-
effect transistors and semiconductor “chip”components. The
following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge
buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
desolder ES devices.
4. Use only can anti-static type solder removal device.
Some solder removal devices not classified as “anti-
static”can generate electrical charges sufficient to
damage ES device.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive
material.)
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly into
which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can generate
static charges.

8
61R-WP5H
55R-WP5H
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range 500°F to 600°F.
2. Use an appropriate gauge of resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well-tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
small wire-bristle (0.5 inch or 1.25 cm) brush with a metal
handle. Do not use freon-propelled spray-on cleaners.
5. Use the following desoldering technique.
a. Allow the soldering iron tip to reach normal
temperature (500°F to 600°F).
b. Heat the component lead until the solder melts.
Quickly draw away the melted solder with an anti-
static, suction-type solder removal device or with
solder braid.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach normal
temperature (500°F to 600°F).
b. First, hold the soldering iron tip and solder strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil or components.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as
the solder melts.
2. Draw away the melted solder with an anti-static suction-
type solder removal device (or with solder braid) before
removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to areas.)
“Small-signal”Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a “U”shape the end of each of three leads
remaining on the circuit board.
3. Bend into a “U”shape the replacement transistor leads.
4. Connect to replacement transistor leads to the
corresponding leads extending from the circuit board and
crimp the “U”with long nose pliers to insure metal to
metal contact, then solder each connection.
Power Output Transistor Devices Removal/Replacements
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heatsink mounting screw (if so equipped).
3. Carefully remove the transistor from the circuit board.
4. Insert new transistor in circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heatsink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicularly to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints
of the two “original leads”. If they are not shiny, reheat
them and, if necessary, apply additional solder.
Use Solding Iron to Pry Leads
IC Removal/Replacement
Some Sharp unitized chassis circuit boards have slotted
holes (oblong) through which the IC leads are inserted and
then bent flat against the circuit foil. When holes are the
slotted type, the following technique should be used to
remove and replace the IC. When working with boards using
the familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.

9
61R-WP5H
55R-WP5H
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CRIMP AND
SOLDER
BARE JUMPER
WIRE
Install Jumper Wire and Solder
DEFECTIVE
COPPER
REMOVED
Insulated Jumper Wire
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10
61R-WP5H
55R-WP5H
Leadless Chip Components
(surface mount)
Chip components must be replaced with identical
chips due to critical foil track spacing. There are no
holes in the board to mount standard transistors or
diodes. Some chip capacitor or resistor board solder
pads may have holes through the board, however the
hole diameter limits standard resistor replacement to
1/8 watt. Standard capacitors may also be limited for
the same reason. It is recommended that identical
chip components be used. .
Chip resistors have a three digit numerical resistance
code -1st and 2nd significant digits and a multiplier.
Example: 162 = 1600 or 1.6KΩresistor, 0 = 0Ω
(jumper).
Chip capacitors generally do not have the value
indicated on the capacitor. The color of the component
indicates the general range of the capacitance.
Chip transistors are identified by a two letter code. The
first letter indicates the type and the second letter, the
grade of transistor.
Chip diodes have a two letter identification code as
per the code chart and are a dual diode pack with
either
common anode or common cathode. Check the parts
list for correct diode number.
Component Removal
1. Use solder wick to remove solder from component
end caps or terminals.
2. Without pulling up, carefully twist the component
with tweezers to break the adhesive.
3. Do not reuse removed leadless or chip
components since they are subject to stress
fracture during removal .
Chip Component Installation
1. Put a small amount of solder on the board
soldering pads.
2. Hold the chip component against the soldering
pads with tweezers or with a miniature alligator
clip and apply heat to the pad area with a 30 watt
iron until solder flows. Do not apply heat for more
than 3 seconds
How to Replace Flat-lC
—Required Tools—
•Soldering iron •iron wire or small awl
•De-solder braids •Magnifier
1. Remove the solder from all of the pins of a Flat-lC
by using a de-solder braid.
2. Put the iron wire under the pins of the Flat-lC and
pull it in the direction indicated while heating the
pins using a soldering iron. A small awl can be
used instead of the iron wire.
3. Remove the solder from all of the pads of the
Fiat-lC by using
a de-solder braid.
4. Position the new Flat-lC in place (apply the pins of
the Flat-lC to the soldering pads where the pins
need to be soldered). Properly
determine the positions of the
soldering pads and pins by
correctly aligning the polarity
symbol.
6. Check with a magnifier for solder bridge between
the pins or for dry joint between pins and soldering
pads. To remove a solder bridge, use a de-solder
braid as shown in the figure below.
NOTE: These components are affixed with glue. Be careful not to break or damage any foil under the
component or at the pins of the ICs when removing. Usually applying heat to the component for a short
time while twisting with tweezers will break the component loose.
Chip Components
TYPE GRADE
C
BE
SOLDER
CAPS
TRANSISTOR CAPACITOR
1ST DIGIT
2ND DIGIT
MULTIPLIER
= 1600 = 1.6K
ANODES
MH DIODE RESISTOR
SOLDER CAPS
COMMON CATHODE
De-Solder
Braid
Soldering
Iron
Soldering
Iron
Soldering
Iron
Soldering
Iron
Soldering
Iron
Soldering
Iron
De-Solder
Braid
Flat-IC
Bridge
Solder
De-Solder
Braid
Iron
Wire
Pull
Awl
Polarity Symbol
5. Solder all pins to the soldering pads using a fine
tipped soldering iron.

11
61R-WP5H
55R-WP5H
HighVoltage Shutdown Circuit Operation Check
1. Turn off TV and connect Jig as shown in Figure.
2. Set the AC line voltage to 120V AC and turn on the TV.
3. Confirm a usable picture by receiving a TV test pattern.
4. Measure the normal voltage between TP653 and TP651. It should be 8.1± 0.7VDC.
5. Insert 13.5VDC between TP653 and TP651 and confirm that high voltage shutdown occurred.
6. Turn off TV and disconnect Jig.
TV Test Point
TP651/3
Test Jig
TV SET
8.1±0.7VDC
TP651-3
SW-1
13.5VDC
DHHS
DIGITAL
VOLTMETER
DC POWER
SUPLLY
+
–

12
61R-WP5H
55R-WP5H
LOCATION OF USER CONTROL
Front control section
To open the cover
BEHINDTHE COVER
POWER
Press →On.
Press again →Off.
MENU button
Press MENU button to
access the MAIN MENU
screen
VOL (+)/(–) buttons
(+) Increases sound
(–) Decreases sound
SENSOR AREA
FOR REMOTE CONTROL
ENTER button
S-VIDEO input
VIDEO input
(Other terminals are
located on the rear)
CH (up)/(down) buttons
( ) Selects the next higher channel as well asVIDEO INPUT
( ) Selects the next lower channel as well asVIDEO INPUT
AUDIO L/R input
MENU
POWER
POWER
VIEWTIMER
MENU ENTER
VOL CH
IN 2
L-AUDIO-R
VIDEO S-VIDEO
POWER
POWER
VIEWTIMER
PUSHOPEN
PUSH OPEN
POWER
POWER
VIEW TIMER
Note
•If the Rear Projection TV is not used for a long period or during a blackout, turn OFF the POWER of the main unit to
prevent the Rear ProjectionTV from malfunctioning. (e.g. If the TV POWER is set to ON during blackout, the state of
Rear Projection TV before the blackout is remaining, theTV POWER switches to ON when the electricity is restored.)