Ublox LISA-U200 FOTA Use and care manual

LISA-U2 series
3.75G HSPA / HSPA+ Cellular Modules
System Integration Manual
Abstract
This document describes the features and the system integration of
LISA-U2 series HSPA+ cellular modules.
These modules are complete and cost efficient 3.75G solutions
offering up to six-band HSDPA/HSUPA and quad-band GSM/EGPRS
voice and/or data transmission technology in a compact form factor.
www.u-blox.com
UBX-13001118 - R19

LISA-U2 series - System Integration Manual
UBX-13001118 - R19
Page 2 of 175
Document Information
Title
LISA-U2 series
Subtitle
3.75G HSPA / HSPA+ Cellular Modules
Document type
System Integration Manual
Document number
UBX-13001118
Revision, date
R19
09-Sep-2015
Document status
Early Production Information
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN / IN
LISA-U200
LISA-U200-01S-00
22.40
UBX-TN-12040
LISA-U200-02S-00
22.90
UBX-13003492
LISA-U200-03S-00
23.41
A01.01
UBX-15020745
LISA-U200-52S-00
22.86
UBX-13004628
LISA-U200-62S-00
22.90
UBX-13003492
LISA-U200 FOTA
LISA-U200-82S-00
22.92
UBX-13004629
LISA-U200-83S-00
23.41
A01.01
UBX-15020745
LISA-U201
LISA-U201-03S-00
23.41
A01.01
UBX-15020745
LISA-U230
LISA-U230-01S-00
22.40
UBX-TN-12040
LISA-U260
LISA-U260-01S-00
22.61
UBX-TN-12061
LISA-U260-02S-00
22.90
UBX-13003492
LISA-U270
LISA-U270-01S-00
22.61
UBX-TN-12061
LISA-U270-02S-00
22.90
UBX-13003492
LISA-U270-62S-00
22.90
UBX-13003492
LISA-U270-68S-00
22.93
A01.03
UBX-15019240
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in
whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2015, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in
the EU and other countries.

LISA-U2 series - System Integration Manual
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Preface
How to use this Manual
The LISA-U2 series System Integration Manual provides the necessary information to successfully design in and
configure these u-blox cellular modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the supported AT commands by the
LISA-U2 modules to verify all implemented functionalities.
System Integration Manual: This Manual provides hardware design instructions and information on how to
set up production and final product tests.
Application Note: document provides general design instructions and information that applies to all u-blox
Cellular modules. See Related documents for a list of Application Notes related to your Cellular Module.
Questions
If you have any questions about u-blox Cellular Integration, please:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com
Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
Contact the closest Technical Support office by email. Use our service pool email addresses rather than any
personal email address of our staff. This makes sure that your request is processed as soon as possible. You will
find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support, have the following information ready:
Module type (e.g. LISA-U200) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details

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Contents
Preface ........................................................................................................................................... 3
Contents ........................................................................................................................................ 4
1System description.................................................................................................................. 7
1.1 Overview ..............................................................................................................................................................7
1.2 Architecture.......................................................................................................................................................... 9
1.2.1 Functional blocks .......................................................................................................................................... 9
1.3 Pin-out ............................................................................................................................................................... 11
1.4 Operating modes................................................................................................................................................ 15
1.5 Power management ........................................................................................................................................... 17
1.5.1 Power supply circuit overview ..................................................................................................................... 17
1.5.2 Module supply (VCC).................................................................................................................................. 18
1.5.3 Current consumption profiles...................................................................................................................... 27
1.5.4 RTC Supply (V_BCKP).................................................................................................................................. 32
1.5.5 Interface supply (V_INT) .............................................................................................................................. 35
1.6 System functions ................................................................................................................................................ 36
1.6.1 Module power-on....................................................................................................................................... 36
1.6.2 Module power-off ...................................................................................................................................... 40
1.6.3 Module reset .............................................................................................................................................. 42
1.7 RF connection..................................................................................................................................................... 44
1.8 (U)SIM interface.................................................................................................................................................. 45
1.8.1 (U)SIM application circuits ........................................................................................................................... 46
1.9 Serial communication ......................................................................................................................................... 52
1.9.1 Serial interfaces configuration ..................................................................................................................... 53
1.9.2 Asynchronous serial interface (UART) .......................................................................................................... 54
1.9.3 USB interface.............................................................................................................................................. 73
1.9.4 SPI interface................................................................................................................................................ 78
1.9.5 MUX Protocol (3GPP 27.010) ...................................................................................................................... 83
1.10 DDC (I2C) interface.............................................................................................................................................. 84
1.10.1 Overview .................................................................................................................................................... 84
1.10.2 DDC application circuits .............................................................................................................................. 84
1.11 Audio Interface................................................................................................................................................... 89
1.11.1 I2S interface - PCM mode ............................................................................................................................ 90
1.11.2 I2S interface - Normal I2S mode.................................................................................................................... 91
1.11.3 I2S interface application circuits ................................................................................................................... 91
1.11.4 Voiceband processing system...................................................................................................................... 94
1.12 General Purpose Input/Output (GPIO).................................................................................................................. 96
1.13 Reserved pins (RSVD) ........................................................................................................................................ 103
1.14 Schematic for LISA-U2 module integration ........................................................................................................ 104
1.15 Approvals ......................................................................................................................................................... 105
1.15.1 R&TTED and European Conformance CE mark .......................................................................................... 106
1.15.2 US Federal Communications Commission notice ....................................................................................... 106
1.15.3 Industry Canada notice ............................................................................................................................. 108
1.15.4 ACMA Certification .................................................................................................................................. 110

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1.15.5 ICASA Certification................................................................................................................................... 110
1.15.6 KCC Certification...................................................................................................................................... 111
1.15.7 Anatel Certification................................................................................................................................... 111
1.15.8 CCC Certification ..................................................................................................................................... 112
1.15.9 TELEC / JATE Certification ......................................................................................................................... 112
2Design-In ............................................................................................................................. 113
2.1 Design-in checklist ............................................................................................................................................ 113
2.1.1 Schematic checklist................................................................................................................................... 113
2.1.2 Layout checklist ........................................................................................................................................ 114
2.1.3 Antenna checklist ..................................................................................................................................... 114
2.2 Design Guidelines for Layout............................................................................................................................. 115
2.2.1 Layout guidelines per pin function ............................................................................................................ 115
2.2.2 Footprint and paste mask.......................................................................................................................... 124
2.2.3 Placement................................................................................................................................................. 125
2.3 Thermal guidelines............................................................................................................................................ 126
2.4 Antenna guidelines........................................................................................................................................... 128
2.4.1 Antenna termination ................................................................................................................................ 130
2.4.2 Antenna radiation..................................................................................................................................... 131
2.4.3 Examples of antennas ............................................................................................................................... 132
2.4.4 Antenna detection functionality ................................................................................................................ 134
2.5 ESD guidelines .................................................................................................................................................. 135
2.5.1 ESD immunity test overview ...................................................................................................................... 135
2.5.2 ESD immunity test of u-blox LISA-U2 series reference designs.................................................................... 136
2.5.3 ESD application circuits ............................................................................................................................. 137
3Features description ........................................................................................................... 140
3.1Network indication ........................................................................................................................................... 140
3.2 Antenna detection............................................................................................................................................ 140
3.3 Jamming Detection........................................................................................................................................... 140
3.4 TCP/IP and UDP/IP............................................................................................................................................. 141
3.4.1 Multiple PDP contexts and sockets ............................................................................................................ 141
3.5 FTP ................................................................................................................................................................... 141
3.6 HTTP ................................................................................................................................................................ 141
3.7 SSL/TLS............................................................................................................................................................. 142
3.8 Dual stack IPv4/IPv6 .......................................................................................................................................... 143
3.9 AssistNow clients and GNSS integration ............................................................................................................ 144
3.10 Hybrid positioning and CellLocate®.................................................................................................................... 144
3.10.1 Positioning through cellular information: CellLocate®................................................................................. 144
3.10.2 Hybrid positioning .................................................................................................................................... 146
3.11 Control Plane Aiding / Location Services (LCS) ................................................................................................... 146
3.12 Firmware (upgrade) Over AT (FOAT) .................................................................................................................. 146
3.12.1 Overview .................................................................................................................................................. 146
3.12.2 FOAT procedure ....................................................................................................................................... 147
3.13 In-Band modem (eCall / ERA-GLONASS)............................................................................................................ 147
3.14 SIM Access Profile (SAP).................................................................................................................................... 147
3.15 Smart Temperature Management ..................................................................................................................... 149
3.15.1 Smart Temperature Supervisor (STS) .......................................................................................................... 149

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3.15.2 Threshold Definitions ................................................................................................................................ 151
3.16 Bearer Independent Protocol............................................................................................................................. 151
3.17 Multi-Level Precedence and Pre-emption Service ............................................................................................... 151
3.18 Network Friendly Mode .................................................................................................................................... 152
3.19 Power saving .................................................................................................................................................... 152
4Handling and soldering ...................................................................................................... 153
4.1 Packaging, shipping, storage and moisture preconditioning .............................................................................. 153
4.2 Soldering.......................................................................................................................................................... 153
4.2.1 Soldering paste......................................................................................................................................... 153
4.2.2 Reflow soldering....................................................................................................................................... 153
4.2.3 Optical inspection ..................................................................................................................................... 155
4.2.4 Cleaning................................................................................................................................................... 155
4.2.5 Repeated reflow soldering ........................................................................................................................ 155
4.2.6 Wave soldering......................................................................................................................................... 155
4.2.7 Hand soldering ......................................................................................................................................... 155
4.2.8 Rework..................................................................................................................................................... 155
4.2.9 Conformal coating.................................................................................................................................... 155
4.2.10 Casting..................................................................................................................................................... 156
4.2.11 Grounding metal covers............................................................................................................................ 156
4.2.12 Use of ultrasonic processes ....................................................................................................................... 156
5Product Testing ................................................................................................................... 157
5.1 u-blox in-series production test ......................................................................................................................... 157
5.2 Test parameters for OEM manufacturer ............................................................................................................ 157
5.2.1 ‘Go/No go’ tests for integrated devices...................................................................................................... 158
5.2.2 Functional tests providing RF operation ..................................................................................................... 158
Appendix ................................................................................................................................... 161
AMigration from LISA-U1 to LISA-U2 series......................................................................... 161
A.1 Checklist for migration ..................................................................................................................................... 161
A.2 Software migration........................................................................................................................................... 161
A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules............................................................ 161
A.3 Hardware migration.......................................................................................................................................... 162
A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules .......................................................... 162
A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series................................................................................. 163
A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series.................................................................................. 170
BGlossary............................................................................................................................... 171
Related documents.................................................................................................................... 173
Revision history......................................................................................................................... 174
Contact....................................................................................................................................... 175

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1System description
1.1 Overview
LISA-U2 cellular modules integrate full-feature 3G UMTS/HSxPA and 2G GSM/GPRS/EDGE protocol stack with
Assisted GPS support. These SMT modules come in the compact LISA form factor, featuring Leadless Chip
Carrier (LCC) packaging technology.
3G UMTS/HSDPA/HSUPA Characteristics
2G GSM/GPRS/EDGE Characteristics
Class A User Equipment1
Class B Mobile Station2
UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD)
3GPP Release 7 (HSPA+)
Rx Diversity for LISA-U230
GSM EDGE Radio Access (GERA)
3GPP Release 7
Rx Diversity for LISA-U230
2-band support for LISA-U260:
Band II (1900 MHz), Band V (850 MHz)
2-band support for LISA-U270:
Band I (2100 MHz), Band VIII (900 MHz)
5-band support for LISA-U201:
Band I (2100 MHz), Band II (1900 MHz), Band V (850 MHz),
Band VI (800 MHz), Band VIII (900 MHz)
6-band support for LISA-U200 and LISA-U230:
Band I (2100 MHz), Band II (1900 MHz), Band IV (1700 MHz),
Band V (850 MHz), Band VI (800 MHz), Band VIII (900 MHz)
4-band support
GSM 850 MHz, E-GSM 900 MHz,
DCS 1800 MHz, PCS 1900 MHz
WCDMA/HSDPA/HSUPA Power Class
Power Class 3 (24 dBm) for WCDMA/HSDPA/HSUPA mode
GSM/GPRS Power Class
Power Class 4 (33 dBm) for GSM/E-GSM bands
Power Class 1 (30 dBm) for DCS/PCS bands
EDGE Power Class
Power Class E2 (27 dBm) for GSM/E-GSM bands
Power Class E2 (26 dBm) for DCS/PCS bands
PS (Packet Switched) Data Rate
HSUPA category 6, up to 5.76 Mb/s UL
HSDPA category 8 up to 7.2 Mb/s DL for LISA-U200, LISA-U201,
LISA-U260 and LISA-U270
HSDPA category 14 up to 21.1 Mb/s DL for LISA-U230
WCDMA PS data up to 384 kb/s DL/UL
PS (Packet Switched) Data Rate
GPRS multislot class 123, coding scheme CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multislot class 123, coding scheme MCS1-MCS9,
up to 236.8 kb/s DL/UL
CS (Circuit Switched) Data Rate
WCDMA CS data up to 64 kb/s DL/UL
CS (Circuit Switched) Data Rate
GSM CS data up to 9.6 kb/s DL/UL
supported in transparent/non transparent mode
Table 1: LISA-U2 series UMTS/HSDPA/HSUPA and GSM/GPRS/EDGE characteristics
Operation modes I to III are supported on GSM/GPRS networks, with allowing users to define their preferred
service from GSM to GPRS. Paging messages for GSM calls may be monitored (optional) during GPRS data
transfer in non-coordinating NOM II-III.
1Device can work simultaneously in Packet Switch and Circuit Switch mode: voice calls are possible while the data connection is active
without any interruption in service.
2Device can be attached to both GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode) using one service at a time. If for
example during data transmission an incoming call occurs, the data connection is suspended to allow the voice communication. Once the
voice call has terminated, the data service is resumed.
3GPRS/EDGE multislot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total

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3G Transmission and Receiving: LISA-U2 modules implement 3G High-Speed Uplink Packet Access (HSUPA)
category 6. LISA-U200, LISA-U201, LISA-U260 and LISA-U270 modules implement 3G High Speed Downlink
Packet Access (HSDPA) category 8. LISA-U230 modules implement the 3G HSDPA category 14. HSUPA and
HSDPA categories determine the maximum speed at which data can be respectively transmitted and received.
Higher categories allow faster data transfer rates, as indicated in Table 1.
The 3G network automatically performs adaptive coding and modulation using a choice of forward error
correction code rate and choice of modulation type, to achieve the highest possible data rate and data
transmission robustness according to the quality of the radio channel.
2G Transmission and Receiving: LISA-U2 series modules implement GPRS/EGPRS multislot class 12. GPRS and
EGPRS multislot classes determine the maximum number of timeslots available for upload and download and
thus the speed at which data can be transmitted and received. Higher classes typically allow faster data transfer
rates, as indicated in Table 1.
The 2G network automatically configures the number of timeslots used for reception or transmission (voice calls
take precedence over GPRS/EGPRS traffic) and channel encoding (from Coding Scheme 1 up to Modulation and
Coding Scheme 9), performing link adaptation to achieve the highest possible data rate. Table 2 summarizes the
interfaces and features provided by LISA-U2 modules.
Model
UMTS
Bands
Interfaces
Audio
Functions
Grade
HSUPA [Mb/s]
HSDPA [Mb/s]
UMTS/HSPA [MHz]
GSM/GPRS/EDGE quad-band
UART
SPI
USB
DDC (I2C)
GPIO
Analog Audio
Digital Audio
Network indication
Antenna detection
Jamming detection
Embedded TCP/UDP
Embedded FTP, HTTP
Embedded SSL/TLS
AssistNow software
CellLocate®
FOTA
FW update via serial
eCall / ERA-GLONASS
Rx diversity
GNSS via Modedm
Standard
Professional
Automotive
LISA-U200
5.76
7.2
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U200 FOTA
5.76
7.2
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
•
LISA-U201
5.76
7.2
800/850/900
1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
LISA-U230
5.76
21.1
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
LISA-U260
5.76
7.2
850/1900
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U270
5.76
7.2
900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U200-52S module product version is approved by SKT Korean network operator.
LISA-U200-62S module product version is approved by NTT DoCoMo Japanese network operator
LISA-U270-62S and LISA-U270-68S modules product versions are approved and locked for SoftBank Japanese network operator.
Table 2: LISA-U2 series summary of interfaces and features
4Not supported by ”01” product version

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1.2 Architecture
Wireless
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT
Switch & Multi ba nd & mode PA
DDC (for GNSS)
(U)SIM card
UART
SPI
USB
GPIO(s)
Power on
External reset
V_BCKP (RTC)
Vcc (supply)
V_INT (I/O)
Digital audio (I2S)
RF
SWITCH
RF
Transceiver
Duplexers
& Filters
ANT_DIV
RF
SWITCH
Filter
Bank
PA
PMU
Transceiver
PMU
Figure 1: LISA-U2 series block diagram (for available options see Table 2)
1.2.1 Functional blocks
LISA-U2 modules consist of the following internal functional blocks: RF section, Baseband and Power
Management Unit section.
LISA-U2 series RF section
A shielding box contains the RF high-power signal circuitry, including:
Multimode Single Chain Power Amplifier Module used for 3G HSPA/WCDMA and 2G EDGE/GSM operations
Power Management Unit with integrated DC/DC converter for the Power Amplifier Module
The RF antenna pad (ANT) is directly connected to the main antenna switch, which dispatches the RF signals
according to the active mode. For time-duplex 2G operation, the incoming signal at the active Receiver (RX) slot
is applied by the main antenna switch to the duplexer SAW filter bank for out-of-band rejection and then sent to
the appropriate receiver port of the RF transceiver. During the allocated Transmitter (TX) slots, the low level
signal coming from the RF transceiver is enhanced by the power amplifier and then directed to the antenna pad
through the main antenna switch. The 3G transmitter and receiver are active at the same time due to frequency-
domain duplex operation. The switch integrated in the main antenna switch connects the antenna port to the
duplexer SAW filter bank which separates the TX and RX signal paths. The duplexer itself provides front-end RF
filtering for RX band selection while combining the amplified TX signal coming from the power amplifier.
A separated shielding box contains all the other analog RF components, including:
Antenna Switch and duplexer SAW filter bank for main paths
Antenna Switch and SAW filter bank for diversity receiver
Up to six-band HSPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver

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Power Management Unit with integrated DC/DC converter for the Power Amplifier Module
Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO)
While operating in 3G mode, the RF transceiver performs direct up-conversion and down-conversion of the
baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the
downlink path, the integrated LNA enhances the RX sensitivity while discrete inter-stage SAW filters additionally
improve the rejection of out-of-band blockers. An internal programmable gain amplifier optimizes the signal
levels before delivering to the analog I/Q to baseband for further digital processing.
For 2G operations, a constant gain direct conversion receiver with integrated LNAs and highly linear RF
quadrature demodulator are used to provide the same I/Q signals to the baseband as well. In transmission mode,
the up-conversion is implemented by means of a digital sigma-delta transmitter or polar modulator depending
on the modulation to be transmitted.
The RF antenna pad for the diversity receiver (ANT_DIV) available on LISA-U230 modules is directly connected to
the antenna switch for the diversity receiver, which dispatches the incoming RF signals to the dedicated SAW
filter bank for out-of-band rejection and then to the diversity receiver port of the RF transceiver.
In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.296-4.340 GHz voltage controlled
oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by
the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation
circuits while operating in active mode.
LISA-U2 series modulation techniques
Modulation techniques related to radio technologies supported by LISA-U2 modules, are listed as follows:
GSM GMSK
GPRS GMSK
EDGE GMSK / 8-PSK
WCDMA QPSK
HSDPA QPSK / 16-QAM
HSUPA QPSK / 16-QAM
LISA-U2 series Baseband and Power Management Unit section
Another shielding box of LISA-U2 modules includes all the digital circuitry and the power supplies, basically the
following functional blocks:
Cellular baseband processor, a mixed signal ASIC which integrates:
Microprocessor for controller functions, 2G & 3G upper layer software
DSP core for 2G Layer 1 and audio processing
3G coprocessor and HW accelerator for 3G Layer 1 control software and routines
Dedicated HW for interfaces management
Memory system in a Multi-Chip Package (MCP) integrating two devices:
NOR flash non-volatile memory
DDR SRAM volatile memory
Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC
32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or
power-off mode