Ublox LISA-U200 FOTA Use and care manual

LISA-U2 series
3.75G HSPA / HSPA+ Cellular Modules
System Integration Manual
Abstract
This document describes the features and the system integration of
LISA-U2 series HSPA+ cellular modules.
These modules are complete and cost efficient 3.75G solutions
offering up to six-band HSDPA/HSUPA and quad-band GSM/EGPRS
voice and/or data transmission technology in a compact form factor.
www.u-blox.com
UBX-13001118 - R19

LISA-U2 series - System Integration Manual
UBX-13001118 - R19
Page 2 of 175
Document Information
Title
LISA-U2 series
Subtitle
3.75G HSPA / HSPA+ Cellular Modules
Document type
System Integration Manual
Document number
UBX-13001118
Revision, date
R19
09-Sep-2015
Document status
Early Production Information
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN / IN
LISA-U200
LISA-U200-01S-00
22.40
UBX-TN-12040
LISA-U200-02S-00
22.90
UBX-13003492
LISA-U200-03S-00
23.41
A01.01
UBX-15020745
LISA-U200-52S-00
22.86
UBX-13004628
LISA-U200-62S-00
22.90
UBX-13003492
LISA-U200 FOTA
LISA-U200-82S-00
22.92
UBX-13004629
LISA-U200-83S-00
23.41
A01.01
UBX-15020745
LISA-U201
LISA-U201-03S-00
23.41
A01.01
UBX-15020745
LISA-U230
LISA-U230-01S-00
22.40
UBX-TN-12040
LISA-U260
LISA-U260-01S-00
22.61
UBX-TN-12061
LISA-U260-02S-00
22.90
UBX-13003492
LISA-U270
LISA-U270-01S-00
22.61
UBX-TN-12061
LISA-U270-02S-00
22.90
UBX-13003492
LISA-U270-62S-00
22.90
UBX-13003492
LISA-U270-68S-00
22.93
A01.03
UBX-15019240
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in
whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2015, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in
the EU and other countries.

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Preface
How to use this Manual
The LISA-U2 series System Integration Manual provides the necessary information to successfully design in and
configure these u-blox cellular modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the supported AT commands by the
LISA-U2 modules to verify all implemented functionalities.
System Integration Manual: This Manual provides hardware design instructions and information on how to
set up production and final product tests.
Application Note: document provides general design instructions and information that applies to all u-blox
Cellular modules. See Related documents for a list of Application Notes related to your Cellular Module.
Questions
If you have any questions about u-blox Cellular Integration, please:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com
Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
Contact the closest Technical Support office by email. Use our service pool email addresses rather than any
personal email address of our staff. This makes sure that your request is processed as soon as possible. You will
find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support, have the following information ready:
Module type (e.g. LISA-U200) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details

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Contents
Preface ........................................................................................................................................... 3
Contents ........................................................................................................................................ 4
1System description.................................................................................................................. 7
1.1 Overview ..............................................................................................................................................................7
1.2 Architecture.......................................................................................................................................................... 9
1.2.1 Functional blocks .......................................................................................................................................... 9
1.3 Pin-out ............................................................................................................................................................... 11
1.4 Operating modes................................................................................................................................................ 15
1.5 Power management ........................................................................................................................................... 17
1.5.1 Power supply circuit overview ..................................................................................................................... 17
1.5.2 Module supply (VCC).................................................................................................................................. 18
1.5.3 Current consumption profiles...................................................................................................................... 27
1.5.4 RTC Supply (V_BCKP).................................................................................................................................. 32
1.5.5 Interface supply (V_INT) .............................................................................................................................. 35
1.6 System functions ................................................................................................................................................ 36
1.6.1 Module power-on....................................................................................................................................... 36
1.6.2 Module power-off ...................................................................................................................................... 40
1.6.3 Module reset .............................................................................................................................................. 42
1.7 RF connection..................................................................................................................................................... 44
1.8 (U)SIM interface.................................................................................................................................................. 45
1.8.1 (U)SIM application circuits ........................................................................................................................... 46
1.9 Serial communication ......................................................................................................................................... 52
1.9.1 Serial interfaces configuration ..................................................................................................................... 53
1.9.2 Asynchronous serial interface (UART) .......................................................................................................... 54
1.9.3 USB interface.............................................................................................................................................. 73
1.9.4 SPI interface................................................................................................................................................ 78
1.9.5 MUX Protocol (3GPP 27.010) ...................................................................................................................... 83
1.10 DDC (I2C) interface.............................................................................................................................................. 84
1.10.1 Overview .................................................................................................................................................... 84
1.10.2 DDC application circuits .............................................................................................................................. 84
1.11 Audio Interface................................................................................................................................................... 89
1.11.1 I2S interface - PCM mode ............................................................................................................................ 90
1.11.2 I2S interface - Normal I2S mode.................................................................................................................... 91
1.11.3 I2S interface application circuits ................................................................................................................... 91
1.11.4 Voiceband processing system...................................................................................................................... 94
1.12 General Purpose Input/Output (GPIO).................................................................................................................. 96
1.13 Reserved pins (RSVD) ........................................................................................................................................ 103
1.14 Schematic for LISA-U2 module integration ........................................................................................................ 104
1.15 Approvals ......................................................................................................................................................... 105
1.15.1 R&TTED and European Conformance CE mark .......................................................................................... 106
1.15.2 US Federal Communications Commission notice ....................................................................................... 106
1.15.3 Industry Canada notice ............................................................................................................................. 108
1.15.4 ACMA Certification .................................................................................................................................. 110

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1.15.5 ICASA Certification................................................................................................................................... 110
1.15.6 KCC Certification...................................................................................................................................... 111
1.15.7 Anatel Certification................................................................................................................................... 111
1.15.8 CCC Certification ..................................................................................................................................... 112
1.15.9 TELEC / JATE Certification ......................................................................................................................... 112
2Design-In ............................................................................................................................. 113
2.1 Design-in checklist ............................................................................................................................................ 113
2.1.1 Schematic checklist................................................................................................................................... 113
2.1.2 Layout checklist ........................................................................................................................................ 114
2.1.3 Antenna checklist ..................................................................................................................................... 114
2.2 Design Guidelines for Layout............................................................................................................................. 115
2.2.1 Layout guidelines per pin function ............................................................................................................ 115
2.2.2 Footprint and paste mask.......................................................................................................................... 124
2.2.3 Placement................................................................................................................................................. 125
2.3 Thermal guidelines............................................................................................................................................ 126
2.4 Antenna guidelines........................................................................................................................................... 128
2.4.1 Antenna termination ................................................................................................................................ 130
2.4.2 Antenna radiation..................................................................................................................................... 131
2.4.3 Examples of antennas ............................................................................................................................... 132
2.4.4 Antenna detection functionality ................................................................................................................ 134
2.5 ESD guidelines .................................................................................................................................................. 135
2.5.1 ESD immunity test overview ...................................................................................................................... 135
2.5.2 ESD immunity test of u-blox LISA-U2 series reference designs.................................................................... 136
2.5.3 ESD application circuits ............................................................................................................................. 137
3Features description ........................................................................................................... 140
3.1Network indication ........................................................................................................................................... 140
3.2 Antenna detection............................................................................................................................................ 140
3.3 Jamming Detection........................................................................................................................................... 140
3.4 TCP/IP and UDP/IP............................................................................................................................................. 141
3.4.1 Multiple PDP contexts and sockets ............................................................................................................ 141
3.5 FTP ................................................................................................................................................................... 141
3.6 HTTP ................................................................................................................................................................ 141
3.7 SSL/TLS............................................................................................................................................................. 142
3.8 Dual stack IPv4/IPv6 .......................................................................................................................................... 143
3.9 AssistNow clients and GNSS integration ............................................................................................................ 144
3.10 Hybrid positioning and CellLocate®.................................................................................................................... 144
3.10.1 Positioning through cellular information: CellLocate®................................................................................. 144
3.10.2 Hybrid positioning .................................................................................................................................... 146
3.11 Control Plane Aiding / Location Services (LCS) ................................................................................................... 146
3.12 Firmware (upgrade) Over AT (FOAT) .................................................................................................................. 146
3.12.1 Overview .................................................................................................................................................. 146
3.12.2 FOAT procedure ....................................................................................................................................... 147
3.13 In-Band modem (eCall / ERA-GLONASS)............................................................................................................ 147
3.14 SIM Access Profile (SAP).................................................................................................................................... 147
3.15 Smart Temperature Management ..................................................................................................................... 149
3.15.1 Smart Temperature Supervisor (STS) .......................................................................................................... 149

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3.15.2 Threshold Definitions ................................................................................................................................ 151
3.16 Bearer Independent Protocol............................................................................................................................. 151
3.17 Multi-Level Precedence and Pre-emption Service ............................................................................................... 151
3.18 Network Friendly Mode .................................................................................................................................... 152
3.19 Power saving .................................................................................................................................................... 152
4Handling and soldering ...................................................................................................... 153
4.1 Packaging, shipping, storage and moisture preconditioning .............................................................................. 153
4.2 Soldering.......................................................................................................................................................... 153
4.2.1 Soldering paste......................................................................................................................................... 153
4.2.2 Reflow soldering....................................................................................................................................... 153
4.2.3 Optical inspection ..................................................................................................................................... 155
4.2.4 Cleaning................................................................................................................................................... 155
4.2.5 Repeated reflow soldering ........................................................................................................................ 155
4.2.6 Wave soldering......................................................................................................................................... 155
4.2.7 Hand soldering ......................................................................................................................................... 155
4.2.8 Rework..................................................................................................................................................... 155
4.2.9 Conformal coating.................................................................................................................................... 155
4.2.10 Casting..................................................................................................................................................... 156
4.2.11 Grounding metal covers............................................................................................................................ 156
4.2.12 Use of ultrasonic processes ....................................................................................................................... 156
5Product Testing ................................................................................................................... 157
5.1 u-blox in-series production test ......................................................................................................................... 157
5.2 Test parameters for OEM manufacturer ............................................................................................................ 157
5.2.1 ‘Go/No go’ tests for integrated devices...................................................................................................... 158
5.2.2 Functional tests providing RF operation ..................................................................................................... 158
Appendix ................................................................................................................................... 161
AMigration from LISA-U1 to LISA-U2 series......................................................................... 161
A.1 Checklist for migration ..................................................................................................................................... 161
A.2 Software migration........................................................................................................................................... 161
A.2.1 Software migration from LISA-U1 series to LISA-U2 series modules............................................................ 161
A.3 Hardware migration.......................................................................................................................................... 162
A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series modules .......................................................... 162
A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series................................................................................. 163
A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series.................................................................................. 170
BGlossary............................................................................................................................... 171
Related documents.................................................................................................................... 173
Revision history......................................................................................................................... 174
Contact....................................................................................................................................... 175

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1System description
1.1 Overview
LISA-U2 cellular modules integrate full-feature 3G UMTS/HSxPA and 2G GSM/GPRS/EDGE protocol stack with
Assisted GPS support. These SMT modules come in the compact LISA form factor, featuring Leadless Chip
Carrier (LCC) packaging technology.
3G UMTS/HSDPA/HSUPA Characteristics
2G GSM/GPRS/EDGE Characteristics
Class A User Equipment1
Class B Mobile Station2
UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD)
3GPP Release 7 (HSPA+)
Rx Diversity for LISA-U230
GSM EDGE Radio Access (GERA)
3GPP Release 7
Rx Diversity for LISA-U230
2-band support for LISA-U260:
Band II (1900 MHz), Band V (850 MHz)
2-band support for LISA-U270:
Band I (2100 MHz), Band VIII (900 MHz)
5-band support for LISA-U201:
Band I (2100 MHz), Band II (1900 MHz), Band V (850 MHz),
Band VI (800 MHz), Band VIII (900 MHz)
6-band support for LISA-U200 and LISA-U230:
Band I (2100 MHz), Band II (1900 MHz), Band IV (1700 MHz),
Band V (850 MHz), Band VI (800 MHz), Band VIII (900 MHz)
4-band support
GSM 850 MHz, E-GSM 900 MHz,
DCS 1800 MHz, PCS 1900 MHz
WCDMA/HSDPA/HSUPA Power Class
Power Class 3 (24 dBm) for WCDMA/HSDPA/HSUPA mode
GSM/GPRS Power Class
Power Class 4 (33 dBm) for GSM/E-GSM bands
Power Class 1 (30 dBm) for DCS/PCS bands
EDGE Power Class
Power Class E2 (27 dBm) for GSM/E-GSM bands
Power Class E2 (26 dBm) for DCS/PCS bands
PS (Packet Switched) Data Rate
HSUPA category 6, up to 5.76 Mb/s UL
HSDPA category 8 up to 7.2 Mb/s DL for LISA-U200, LISA-U201,
LISA-U260 and LISA-U270
HSDPA category 14 up to 21.1 Mb/s DL for LISA-U230
WCDMA PS data up to 384 kb/s DL/UL
PS (Packet Switched) Data Rate
GPRS multislot class 123, coding scheme CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multislot class 123, coding scheme MCS1-MCS9,
up to 236.8 kb/s DL/UL
CS (Circuit Switched) Data Rate
WCDMA CS data up to 64 kb/s DL/UL
CS (Circuit Switched) Data Rate
GSM CS data up to 9.6 kb/s DL/UL
supported in transparent/non transparent mode
Table 1: LISA-U2 series UMTS/HSDPA/HSUPA and GSM/GPRS/EDGE characteristics
Operation modes I to III are supported on GSM/GPRS networks, with allowing users to define their preferred
service from GSM to GPRS. Paging messages for GSM calls may be monitored (optional) during GPRS data
transfer in non-coordinating NOM II-III.
1Device can work simultaneously in Packet Switch and Circuit Switch mode: voice calls are possible while the data connection is active
without any interruption in service.
2Device can be attached to both GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode) using one service at a time. If for
example during data transmission an incoming call occurs, the data connection is suspended to allow the voice communication. Once the
voice call has terminated, the data service is resumed.
3GPRS/EDGE multislot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total

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3G Transmission and Receiving: LISA-U2 modules implement 3G High-Speed Uplink Packet Access (HSUPA)
category 6. LISA-U200, LISA-U201, LISA-U260 and LISA-U270 modules implement 3G High Speed Downlink
Packet Access (HSDPA) category 8. LISA-U230 modules implement the 3G HSDPA category 14. HSUPA and
HSDPA categories determine the maximum speed at which data can be respectively transmitted and received.
Higher categories allow faster data transfer rates, as indicated in Table 1.
The 3G network automatically performs adaptive coding and modulation using a choice of forward error
correction code rate and choice of modulation type, to achieve the highest possible data rate and data
transmission robustness according to the quality of the radio channel.
2G Transmission and Receiving: LISA-U2 series modules implement GPRS/EGPRS multislot class 12. GPRS and
EGPRS multislot classes determine the maximum number of timeslots available for upload and download and
thus the speed at which data can be transmitted and received. Higher classes typically allow faster data transfer
rates, as indicated in Table 1.
The 2G network automatically configures the number of timeslots used for reception or transmission (voice calls
take precedence over GPRS/EGPRS traffic) and channel encoding (from Coding Scheme 1 up to Modulation and
Coding Scheme 9), performing link adaptation to achieve the highest possible data rate. Table 2 summarizes the
interfaces and features provided by LISA-U2 modules.
Model
UMTS
Bands
Interfaces
Audio
Functions
Grade
HSUPA [Mb/s]
HSDPA [Mb/s]
UMTS/HSPA [MHz]
GSM/GPRS/EDGE quad-band
UART
SPI
USB
DDC (I2C)
GPIO
Analog Audio
Digital Audio
Network indication
Antenna detection
Jamming detection
Embedded TCP/UDP
Embedded FTP, HTTP
Embedded SSL/TLS
AssistNow software
CellLocate®
FOTA
FW update via serial
eCall / ERA-GLONASS
Rx diversity
GNSS via Modedm
Standard
Professional
Automotive
LISA-U200
5.76
7.2
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U200 FOTA
5.76
7.2
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
•
LISA-U201
5.76
7.2
800/850/900
1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
LISA-U230
5.76
21.1
800/850/900
1700/1900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•
•
LISA-U260
5.76
7.2
850/1900
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U270
5.76
7.2
900/2100
•
1
1
1
1
14
2
•
•
•
•
•
•
•
•
•
•4
•
LISA-U200-52S module product version is approved by SKT Korean network operator.
LISA-U200-62S module product version is approved by NTT DoCoMo Japanese network operator
LISA-U270-62S and LISA-U270-68S modules product versions are approved and locked for SoftBank Japanese network operator.
Table 2: LISA-U2 series summary of interfaces and features
4Not supported by ”01” product version

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1.2 Architecture
Wireless
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT
Switch & Multi ba nd & mode PA
DDC (for GNSS)
(U)SIM card
UART
SPI
USB
GPIO(s)
Power on
External reset
V_BCKP (RTC)
Vcc (supply)
V_INT (I/O)
Digital audio (I2S)
RF
SWITCH
RF
Transceiver
Duplexers
& Filters
ANT_DIV
RF
SWITCH
Filter
Bank
PA
PMU
Transceiver
PMU
Figure 1: LISA-U2 series block diagram (for available options see Table 2)
1.2.1 Functional blocks
LISA-U2 modules consist of the following internal functional blocks: RF section, Baseband and Power
Management Unit section.
LISA-U2 series RF section
A shielding box contains the RF high-power signal circuitry, including:
Multimode Single Chain Power Amplifier Module used for 3G HSPA/WCDMA and 2G EDGE/GSM operations
Power Management Unit with integrated DC/DC converter for the Power Amplifier Module
The RF antenna pad (ANT) is directly connected to the main antenna switch, which dispatches the RF signals
according to the active mode. For time-duplex 2G operation, the incoming signal at the active Receiver (RX) slot
is applied by the main antenna switch to the duplexer SAW filter bank for out-of-band rejection and then sent to
the appropriate receiver port of the RF transceiver. During the allocated Transmitter (TX) slots, the low level
signal coming from the RF transceiver is enhanced by the power amplifier and then directed to the antenna pad
through the main antenna switch. The 3G transmitter and receiver are active at the same time due to frequency-
domain duplex operation. The switch integrated in the main antenna switch connects the antenna port to the
duplexer SAW filter bank which separates the TX and RX signal paths. The duplexer itself provides front-end RF
filtering for RX band selection while combining the amplified TX signal coming from the power amplifier.
A separated shielding box contains all the other analog RF components, including:
Antenna Switch and duplexer SAW filter bank for main paths
Antenna Switch and SAW filter bank for diversity receiver
Up to six-band HSPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver

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Power Management Unit with integrated DC/DC converter for the Power Amplifier Module
Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO)
While operating in 3G mode, the RF transceiver performs direct up-conversion and down-conversion of the
baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the
downlink path, the integrated LNA enhances the RX sensitivity while discrete inter-stage SAW filters additionally
improve the rejection of out-of-band blockers. An internal programmable gain amplifier optimizes the signal
levels before delivering to the analog I/Q to baseband for further digital processing.
For 2G operations, a constant gain direct conversion receiver with integrated LNAs and highly linear RF
quadrature demodulator are used to provide the same I/Q signals to the baseband as well. In transmission mode,
the up-conversion is implemented by means of a digital sigma-delta transmitter or polar modulator depending
on the modulation to be transmitted.
The RF antenna pad for the diversity receiver (ANT_DIV) available on LISA-U230 modules is directly connected to
the antenna switch for the diversity receiver, which dispatches the incoming RF signals to the dedicated SAW
filter bank for out-of-band rejection and then to the diversity receiver port of the RF transceiver.
In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.296-4.340 GHz voltage controlled
oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by
the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation
circuits while operating in active mode.
LISA-U2 series modulation techniques
Modulation techniques related to radio technologies supported by LISA-U2 modules, are listed as follows:
GSM GMSK
GPRS GMSK
EDGE GMSK / 8-PSK
WCDMA QPSK
HSDPA QPSK / 16-QAM
HSUPA QPSK / 16-QAM
LISA-U2 series Baseband and Power Management Unit section
Another shielding box of LISA-U2 modules includes all the digital circuitry and the power supplies, basically the
following functional blocks:
Cellular baseband processor, a mixed signal ASIC which integrates:
Microprocessor for controller functions, 2G & 3G upper layer software
DSP core for 2G Layer 1 and audio processing
3G coprocessor and HW accelerator for 3G Layer 1 control software and routines
Dedicated HW for interfaces management
Memory system in a Multi-Chip Package (MCP) integrating two devices:
NOR flash non-volatile memory
DDR SRAM volatile memory
Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC
32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or
power-off mode

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1.3 Pin-out
Table 3 lists the pin-out of the LISA-U2 modules, with pins grouped by function.
Function
Pin
Module
No
I/O
Description
Remarks
Power
VCC
All
61, 62, 63
I
Module supply
input
Clean and stable supply is required: low ripple and
low voltage drop must be guaranteed.
Voltage provided has to be always above the
minimum limit of the operating range.
Consider that there are large current spikes in
connected mode, when a GSM call is enabled.
VCC pins are internally connected, but all the
available pads must be connected to the external
supply in order to minimize power loss due to
series resistance.
See section 1.5.2
GND
All
1, 3, 6, 7,
8, 17, 25,
28, 29, 30,
31, 32, 33,
34, 35, 36,
37, 38, 60,
64, 65, 66,
67, 69, 70,
71, 72, 73,
75, 76
N/A
Ground
GND pins are internally connected but a good
(low impedance) external ground connection can
improve RF performance: all GND pins must be
externally connected to ground.
V_BCKP
All
2
I/O
Real Time Clock
supply
input/output
V_BCKP = 1.8 V (typical) generated by the module
when VCC supply voltage is within valid operating
range.
See section 1.5.4
V_INT
All
4
O
Digital Interfaces
supply output
V_INT = 1.8V (typical) generated by the module
when it is switched-on and the RESET_N (external
reset input pin) is not forced to the low level.
See section 1.5.5
VSIM
All
50
O
SIM supply
output
VSIM = 1.80 V typical or 2.90 V typical generated
by the module according to the SIM card type.
See section 1.8
RF
ANT
All
68
I/O
RF input/output
for main Tx/Rx
antenna
50 nominal impedance.
See section 1.7, section 2.4 and section 2.2.1.1
ANT_DIV
LISA-U230
74
I
RF input for Rx
diversity antenna
50 Ωnominal impedance
See section 1.7, section 2.4 and section 2.2.1.1
SIM
SIM_IO
All
48
I/O
SIM data
Internal 4.7 kpull-up to VSIM.
Must meet SIM specifications.
See section 1.8
SIM_CLK
All
47
O
SIM clock
Must meet SIM specifications.
See section 1.8
SIM_RST
All
49
O
SIM reset
Must meet SIM specifications.
See section 1.8

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Function
Pin
Module
No
I/O
Description
Remarks
SPI
SPI_MISO
All
57
O
SPI Data Line
Output
Module Output: module runs as an SPI slave.
Shift data on rising clock edge (CPHA=1).
Latch data on falling clock edge (CPHA=1).
Idle high.
See section 1.9.4
SPI_MOSI
All
56
I
SPI Data Line
Input
Module Input: module runs as an SPI slave.
Shift data on rising clock edge (CPHA=1).
Latch data on falling clock edge (CPHA=1).
Idle high.
Internal active pull-up to V_INT (1.8 V) enabled.
See section 1.9.4
SPI_SCLK
All
55
I
SPI Serial Clock
Input
Module Input: module runs as an SPI slave.
Idle low (CPOL=0).
Internal active pull-down to GND enabled.
See section 1.9.4
SPI_SRDY
All
58
O
SPI Slave Ready
Output
Module Output: module runs as an SPI slave.
Idle low.
See section 1.9.4
SPI_MRDY
All
59
I
SPI Master Ready
Input
Module Input: module runs as an SPI slave.
Idle low.
Internal active pull- down to GND enabled.
See section 1.9.4
DDC
SCL
All
45
O
I2C bus clock line
Fixed open drain. External pull-up required.
See section 1.10
SDA
All
46
I/O
I2C bus data line
Fixed open drain. External pull-up required.
See section 1.10
UART
RxD
All
16
O
UART data
output
Circuit 104 (RxD) in ITU-T V.24.
Provide access to the pin for FW update and
debugging if the USB interface is connected to the
application processor.
See section 1.9.2
TxD
All
15
I
UART data input
Circuit 103 (TxD) in ITU-T V.24.
Internal active pull-up to V_INT (1.8 V) enabled.
Provide access to the pin for FW update and
debugging if the USB interface is connected to the
application processor.
See section 1.9.2
CTS
All
14
O
UART clear to
send output
Circuit 106 (CTS) in ITU-T V.24.
Provide access to the pin for debugging if the USB
interface is connected to the application processor.
See section 1.9.2
RTS
All
13
I
UART ready to
send input
Circuit 105 (RTS) in ITU-T V.24.
Internal active pull-up to V_INT (1.8 V) enabled.
Provide access to the pin for debugging if the USB
interface is connected to the application processor.
See section 1.9.2
DSR
All
9
O
UART data set
ready output
Circuit 107 (DSR) in ITU-T V.24.
See section 1.9.2
RI
All
10
O
UART ring
indicator output
Circuit 125 (RI) in ITU-T V.24.
See section 1.9.2
DTR
All
12
I
UART data
terminal ready
input
Circuit 108/2 (DTR) in ITU-T V.24.
Internal active pull-up to V_INT (1.8 V) enabled.
See section 1.9.2
DCD
All
11
O
UART data carrier
detect output
Circuit 109 (DCD) in ITU-T V.24.
See section 1.9.2

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Function
Pin
Module
No
I/O
Description
Remarks
GPIO
GPIO1
All
20
I/O
GPIO
See section 1.12
GPIO2
All
21
I/O
GPIO
See section 1.12
GPIO3
All
23
I/O
GPIO
See section 1.12
GPIO4
All
24
I/O
GPIO
See section 1.12
GPIO5
All
51
I/O
GPIO
See section 1.12
GPIO6
All
39
I/O
GPIO
See section 1.12
GPIO7
All
40
I/O
GPIO
See section 1.12
GPIO8
All
53
I/O
GPIO
See section 1.12
GPIO9
All
54
I/O
GPIO
See section 1.12
GPIO10
All
55
I/O
GPIO
See section 1.12
GPIO11
All
56
I/O
GPIO
See section 1.12
GPIO12
All
57
I/O
GPIO
See section 1.12
GPIO13
All
58
I/O
GPIO
See section 1.12
GPIO14
All
59
I/O
GPIO
See section 1.12
USB
VUSB_DET
All
18
I
USB detect input
Input for VBUS (5 V typical) USB supply sense to
enable USB interface.
Provide access to the pin for FW update and
debugging if the USB interface is not connected to
the application processor.
See section 1.9.3
USB_D-
All
26
I/O
USB Data Line D-
90 Ωnominal differential impedance (Z0)
30 Ω nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series
resistors as required by USB 2.0 specifications [7]
are part of the USB pad driver and need not be
provided externally.
Provide access to the pin for FW update and
debugging if the USB interface is not connected to
the application processor.
See section 1.9.3
USB_D+
All
27
I/O
USB Data Line
D+
90 Ωnominal differential impedance (Z0)
30 Ω nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series
resistors as required by USB 2.0 specifications [7]
are part of the USB pad driver and need not be
provided externally.
Provide access to the pin for FW update and
debugging if the USB interface is not connected to
the application processor.
See section 1.9.3
System
PWR_ON
All
19
I
Power-on input
PWR_ON pin has high input impedance.
Do not keep floating in noisy environment:
external pull-up required.
See section 1.6.1
RESET_N
All
22
I
External reset
input
Internal 10 kΩpull-up to V_BCKP.
See section 1.6.3

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Function
Pin
Module
No
I/O
Description
Remarks
Digital
Audio
I2S_CLK
All
43
I/O
First I2S clock
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S_RXD
All
44
I
First I2S receive
data
Internal active pull-down to GND enabled.
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S_TXD
All
42
O
First I2S transmit
data
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S_WA
All
41
I/O
First I2S word
alignment
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S1_CLK
All
53
I/O
Second I2S clock
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S1_RXD
All
39
I
Second I2S
receive data
Internal active pull-down to GND enabled.
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S1_TXD
All
40
O
Second I2S
transmit data
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
I2S1_WA
All
54
I/O
Second I2S word
alignment
Check device specifications to ensure compatibility
to module supported modes.
See section 1.11.
CODEC_CLK
All
52
O
Clock output
Digital clock output for external audio codec
See section 1.11.
Reserved
RSVD
All
5
N/A
RESERVED pin
This pin must be connected to ground
See section 1.13
RSVD
LISA-U200
LISA-U201
LISA-U260
LISA-U270
74
N/A
RESERVED pin
Do not connect
See section 1.13
Table 3: LISA-U2 modules pin definition, grouped by function

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1.4 Operating modes
LISA-U2 series modules have several operating modes. The operating modes are defined in Table 4 and
described in details in Table 5, providing general guidelines for operation.
General Status
Operating Mode
Definition
Power-down
Not-Powered Mode
VCC supply not present or below operating range: module is switched off.
Power-Off Mode
VCC supply within operating range and module is switched off.
Normal Operation
Idle-Mode
Module processor core runs with 32 kHz as reference oscillator.
Active-Mode
Module processor core runs with 26 MHz as reference oscillator.
Connected-Mode
Voice or data call enabled and processor core runs with 26 MHz as reference oscillator.
Table 4: Module operating modes definition
Operating
Mode
Description
Transition between operating modes
Not-Powered
Module is switched off.
Application interfaces are not accessible.
Internal RTC timer operates only if a valid
voltage is applied to V_BCKP pin.
When VCC supply is removed, the module enters not-powered mode.
When in not-powered mode, the module cannot be switched on by a
low pulse on PWR_ON input, by a rising edge on RESET_N input, or
by a preset RTC alarm.
When in not-powered mode, the module can be switched on applying
VCC supply (see 1.6.1) so that the module switches from not-powered
to active-mode.
Power-Off
Module is switched off: normal shutdown by an
appropriate power-off event (see 1.6.2).
Application interfaces are not accessible.
Only the internal RTC timer in operation.
When the module is switched off by an appropriate power-off event
(see 1.6.2), the module enters power-off mode from active-mode.
When in power-off mode, the module can be switched on by a low
pulse on PWR_ON input, by a rising edge on RESET_N input, or by a
preset RTC alarm (see 1.6.1): module switches from power-off to
active-mode.
When VCC supply is removed, the module switches from power-off
mode to not-powered mode.
Idle
Application interfaces are disabled: the module
does not accept data signals from an external
device connected to the module.
The module automatically enters idle-mode
whenever possible if power saving is enabled by
AT+UPSV (see u-blox AT Commands Manual
[2]), reducing current consumption (see 1.5.3.3).
If HW flow control is enabled (default setting)
and AT+UPSV=1 or AT+UPSV=3 has been set,
the UART CTS line indicates when the UART is
enabled (see 1.9.2.2, 1.9.2.3).
If HW flow control is disabled by AT&K0, the
UART CTS line is fixed to ON state (see 1.9.2.2).
Power saving configuration is not enabled by
default: it can be enabled by AT+UPSV (see the
u-blox AT Commands Manual [2]).
The module automatically switches from active-mode to idle-mode
whenever possible if power saving is enabled (see 1.5.3.3, 1.9.2.3,
1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [2], AT+UPSV).
The module wakes up from idle-mode to active-mode in these events:
Automatic periodic monitoring of the paging channel for the
paging block reception according to network conditions (see
1.5.3.3, 1.9.2.3)
Automatic periodic enable of the UART interface to receive and
send data, if AT+UPSV=1 has been set (see 1.9.2.3)
RTC alarm occurs (see u-blox AT Commands Manual [2],
AT+CALA)
Data received on UART interface, if HW flow control has been
disabled by AT&K0 and AT+UPSV=1 has been set (see 1.9.2.3)
RTS input set ON by the DTE if HW flow control has been
disabled by AT&K0 and AT+UPSV=2 has been set (see 1.9.2.3)
DTR input set ON by DTE if AT+UPSV=3 has been set (see 1.9.2.3)
USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.3)
The connected USB host forces a remote wakeup of the module
as USB device (see 1.9.3)
The connected SPI master indicates by the SPI_MRDY input signal
that it is ready for transmission or reception (see 1.9.4)
The connected u-blox GNSS receiver indicates by the GPIO3 pin
that it is ready to send data (see 1.10, 1.12)

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Operating
Mode
Description
Transition between operating modes
Active
The module is ready to accept data signals from
an external device unless power saving
configuration is enabled by AT+UPSV (see
sections 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT
Commands Manual [2]).
When the module is switched on by an appropriate power-on event
(see 1.6.1), the module enters active-mode from not-powered or
power-off mode.
If power saving configuration is enabled by the AT+UPSV command,
the module automatically switches from active to idle-mode whenever
possible and the module wakes up from idle to active-mode in the
events listed above (see the idle to active transition description).
When a voice call or a data call is initiated, the module switches from
active-mode to connected-mode.
Connected
A voice call or a data call is in progress.
When a voice or a data call is enabled, the
application interfaces are kept enabled and the
module is prepared to accept data from an
external device unless power saving
configuration is enabled by AT+UPSV (see
1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT
Commands Manual [2]).
When a voice call or a data call is initiated, the module enters
connected-mode from active-mode.
If power saving configuration is enabled by the AT+UPSV command,
the module automatically switches from connected to idle-mode
whenever possible in case of PSD data call with internal context
activation, and then it wakes up from idle to connected mode in the
events listed above (see the idle to active transition description).
When a voice call or a data call is terminated, the module returns to
the active-mode.
Table 5: Module operating modes description
Figure 2 describes the transition between the different operating modes.
Switch ON:
•Apply VCC
If power saving is enabled
and there is no activity for
a defined time interval
Any wake up event described
in the module operating
modes summary table above
Incoming/outgoing call or
other dedicated device
network communication
Call terminated,
communication dropped
Remove VCC
Switch ON:
•PWR_ON
•RESET_N
•RTC Alarm
Not
powered
Power off
ActiveConnected Idle
Switch OFF:
•AT+CPWROFF
•PWR_ON
Figure 2: Operating modes transition

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1.5 Power management
1.5.1 Power supply circuit overview
LISA-U2 series modules feature a power management concept optimized for the most efficient use of supplied
power. This is achieved by hardware design utilizing a power efficient circuit topology (Figure 3), and by power
management software controlling the module’s power saving mode.
Baseband Processor
2G/3G
Power Amplifier(s)
Switching
Step-Down
5 x 10 µF
61
VCC
62
VCC
63
VCC
50
VSIM
2
V_BCKP
4
V_INT
Linear
LDO
Linear
LDO
Switching
Step-Down
Linear
LDO
Linear
LDO
Linear
LDO
I/O
EBU
CORE
Analog
SIM
RTC
NOR Flash
DDR SRAM
RF Transceiver
Memory
Power Management Unit
22 µF 220 nF 220 nF
2G/3G PA
PMU
Transceiver
PMU
Figure 3: LISA-U2 series power management simplified block diagram

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Pins with supply function are reported in Table 6, Table 12 and Table 15.
LISA-U2 series modules must be supplied via the VCC pins. There is only one main power supply input, available
on the three VCC pins that must be all connected to the external power supply.
The VCC pins are directly connected to the RF power amplifiers and to the integrated Power Management Unit
(PMU) within the module: all supply voltages needed by the module are generated from the VCC supply by
integrated voltage regulators.
V_BCKP is the Real Time Clock (RTC) supply. When the VCC voltage is within the valid operating range, the
internal PMU supplies the Real Time Clock and the same supply voltage will be available to the V_BCKP pin. If
the VCC voltage is under the minimum operating limit (for example, during not powered mode), the Real Time
Clock can be externally supplied via the V_BCKP pin (see section 1.5.4).
When a 1.8 V or a 3 V SIM card type is connected, LISA-U2 series modules automatically supply the SIM card via
the VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is
implemented, in accordance to the ISO-IEC 7816-3 specifications.
The same voltage domain used internally to supply the digital interfaces is also available on the V_INT pin, to
allow more economical and efficient integration of the LISA-U2 series modules in the final application.
The integrated Power Management Unit also provides the control state machine for system start up and system
reset control.
1.5.2 Module supply (VCC)
The LISA-U2 series modules must be supplied through the VCC pins by a DC power supply. Voltages must be
stable: during operation, the current drawn from VCC can vary by some orders of magnitude, especially due to
surging consumption profile of the GSM system (described in the section 1.5.3). It is important that the system
power supply circuit is able to support peak power (see LISA-U2 series Data Sheet [1] for the detailed
specifications).
Name
Description
Remarks
VCC
Module power supply input
VCC pins are internally connected, but all the available pads
must be connected to the external supply in order to
minimize the power loss due to series resistance.
Clean and stable supply is required: low ripple and low
voltage drop must be guaranteed.
Voltage provided must always be above the minimum limit of
the operating range.
Consider that during a GSM call there are large current spikes
in connected mode.
GND
Ground
GND pins are internally connected but a good (low
impedance) external ground can improve RF performance: all
available pads must be connected to ground.
Table 6: Module supply pins
VCC pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher
protection level can be required if the line is externally accessible on the application board. Higher
protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor
array) on the line connected to this pin, close to accessible point.
The voltage provided to the VCC pins must be within the normal operating range limits as specified in the
LISA-U2 series Data Sheet [1]. Complete functionality of the module is only guaranteed within the specified
minimum and maximum VCC voltage normal operating range.

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The module cannot be switched on if the VCC voltage value is below the specified normal operating
range minimum limit. Ensure that the input voltage at VCC pins is above the minimum limit of the normal
operating range for more than 3 s after the start of the module switch-on sequence.
When LISA-U2 series modules are in operation, the voltage provided to VCC pins can go outside the normal
operating range limits but must be within the extended operating range limits specified in LISA-U2 series Data
Sheet [1]. Occasional deviations from the ETSI specifications may occur when the input voltage at VCC pins is
outside the normal operating range and is within the extended operating range.
LISA-U2 series modules switch off when VCC voltage value drops below the specified extended operating
range minimum limit: ensure that the input voltage at VCC pins never drops below the minimum limit of
the extended operating range when the module is switched on, not even during a GSM transmit burst,
where the current consumption can rise up to maximum peaks of 2.5 A in case of a mismatched antenna
load.
Operation above the normal operating range maximum limit is not recommended and extended
exposure beyond it may affect device reliability.
Stress beyond the VCC absolute maximum ratings can cause permanent damage to the module:
if necessary, voltage spikes beyond VCC absolute maximum ratings must be restricted to values
within the specified limits by using appropriate protection.
When designing the power supply for the application, pay specific attention to power losses and
transients. The DC power supply must be able to provide a voltage profile to the VCC pins with the
following characteristics:
oVoltage drop during transmit slots must be lower than 400 mV
oNo undershoot or overshoot at the start and at the end of transmit slots
oVoltage ripple during transmit slots must be minimized:
lower than 70 mVpp if fripple ≤200 kHz
lower than 10 mVpp if 200 kHz < fripple ≤400 kHz
lower than 2 mVpp if fripple > 400 kHz
Time
undershoot
overshoot
ripple
ripple
drop
Voltage
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
Figure 4: Description of the VCC voltage profile versus time during a GSM call

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Any degradation in power supply performance (due to losses, noise or transients) will directly affect the RF
performance of the module since the single external DC power source indirectly supplies all the digital and
analog interfaces, and also directly supplies the RF power amplifier (PA).
The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms. This VCC slope allows a proper
switch on of the module when the voltage rises to the VCC normal operating range from a voltage of less
than 2.25 V. If the external supply circuit cannot raise the VCC voltage from 2.5 V to 3.2 V within 1 ms,
the RESET_N pin should be kept low during VCC rising edge, so that the module will switch on releasing
the RESET_N pin when the VCC voltage stabilizes at its nominal value within the normal operating range.
1.5.2.1 VCC application circuits
LISA-U2 series modules must be supplied through the VCC pins by a proper DC power supply, which can be
selected according to the application requirements (see Figure 5) between the different possible supply sources
types, which most common ones are the following:
Switching regulator
Low Drop-Out (LDO) linear regulator
Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery
Primary (disposable) battery
Main Supply
Available?
Battery
Li-Ion 3.7 V
Linear LDO
Regulator
Main Supply
Voltage > 5V?
Switching Step-Down
Regulator
No, portable device
No, less than 5 V
Yes, greater than 5 V
Yes, always available
Figure 5: VCC supply concept selection
The switching step-down regulator is the typical choice when the available primary supply source has a nominal
voltage much higher (e.g. greater than 5 V) than the LISA-U2 series modules operating supply voltage. The use
of switching step-down provides the best power efficiency for the overall application and minimizes current
drawn from the main supply source.
The use of an LDO linear regulator becomes convenient for a primary supply with a relatively low voltage (e.g.
less than 5 V). In this case the typical 90% efficiency of the switching regulator will diminish the benefit of
voltage step-down and no true advantage will be gained in input current savings. On the opposite side, linear
regulators are not recommended for high voltage step-down as they will dissipate a considerable amount of
energy in thermal power.
If LISA-U2 series modules are deployed in a mobile unit where no permanent primary supply source is available,
then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected
to VCC is the usual choice for battery-powered devices. During charging, batteries with Ni-MH chemistry
typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided.
The use of primary (not rechargeable) battery is uncommon, since the most cells available are seldom capable of
delivering the burst peak current for a GSM call due to high internal resistance.
Keep in mind that the use of batteries requires the implementation of a suitable charger circuit (not included in
LISA-U2 series modules). The charger circuit should be designed in order to prevent over-voltage on VCC beyond
the upper limit of the absolute maximum rating.
The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply
source characteristics, different DC supply systems can result as mutually exclusive.