LeddarTech LeddarSteer User manual

LeddarSteer™
DBSD Evaluation Board
USER GUIDE
TF ID 033130

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© 2021 LeddarTech Inc. All rights reserved.
The information contained herein is the property of the Company and shall not be reproduced in whole or in
part without the prior written approval of the Company.
Leddar, LeddarTech, LeddarSteer, LeddarEngine, LeddarVision, LeddarSP, LeddarCore, VAYADrive,
VayaVision, and related logos are trademarks or registered trademarks of LeddarTech Inc. All other brands,
product names, and marks are or may be trademarks or registered trademarks used to identify products or
services of their respective owners.
Please contact a LeddarTech sales representative if you have any questions regarding the information
contained in this document or regarding LeddarTech products. For the most recent version of this document,
visit LeddarTech’s website. We also highly recommend that you read our Standard Sales Terms and
Conditions, Product Warranty, and End-User License Agreement carefully. Documentation available at
www.leddartech.com, section “Resources.”
Leddar™ Configurator software: this software is based in part on the work of the Independent JPEG Group.
Keep this User Guide for future reference.

4 | 50 © 2021 LeddarTech Inc.
DISCLAIMER
LeddarTech®shall not be liable for any errors or omissions herein or for any damages arising out of or related
to this document or the information contained herein, even if LeddarTech has been advised of the possibility
of such damages.
Descriptions of products, including, but not limited to, specifications and drawings, and other related
information contained in this document, are provided only to illustrate their operation and application
examples. The illustrations shown, including screen captures, may differ from the appearance of the actual
product.
LeddarTech has made every effort to ensure that the information contained in the documentation
accompanying its products, including, without limitation, its Specification Sheet, is accurate. However,
LeddarTech will not be liable for any errors or omissions therein and reserves the right to modify the design
and characteristics of products at any time without notice. For the most recent version of any product
documentation, visit LeddarTech’s website at www.leddartech.com. In case of discrepancy, the web version
takes precedence over any printed literature.
LeddarTech may expressly designate certain products as completing a particular qualification (e.g., AEC-
Q100). Customer agrees that it has the necessary expertise to select the product with the appropriate
qualification designation for its applications and that proper product selection is at customer’s own risk. The
customer is solely responsible for compliance with all legal and regulatory requirements in connection with
such selection.
LeddarTech does not control the installation and use of its products and shall have no liability if a product is
used for an application for which it is not suited. LeddarTech’s products are not recommended or authorized
for safety, life support, medical applications, applications involving hazardous, corrosive, or radioactive
substances, or for any use or application in which the failure of a component could cause personal injury,
loss of life, or substantial harm to the environment or property. Where LeddarTech specifically promotes
products as facilitating functional safety or as compliant with functional safety standards, such products are
intended to help enable customers to design and create their own applications that meet applicable functional
safety standards and requirements. Using products in an application does not by itself establish any safety
features in the application.
Any technical advice provided by LeddarTech with reference to the use of its products is given without
assumption by LeddarTech of any liability, and LeddarTech assumes no obligation or liability for the advice
given or results obtained, all such advice being given and accepted at customer’s sole risk.
LeddarTech reserves the right to modify its products at any time, without notice, at its sole discretion. The
products’ performance specifications and operating parameters are determined in an independent state and
are not guaranteed to perform the same way if installed in a customer product.
NOTICE
This device is intended for evaluation under laboratory conditions. It has not been tested against vibration or
shocks.

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Table of Contents
1. DEFINITIONS .................................................................................................................................. 11
2. DBSD STARTER KIT OVERVIEW ................................................................................................. 12
2.1. INTENDED USE AND DESCRIPTION.................................................................................................... 12
2.2. PACKAGE CONTENTS ...................................................................................................................... 12
2.3. SOFTWARE REQUIREMENTS ............................................................................................................ 13
2.4. OPTICAL TEST EQUIPMENT REQUIREMENTS ..................................................................................... 13
3. DBSD REFERENCE INFORMATION ............................................................................................. 13
3.1. INTRODUCTION TO DBSD................................................................................................................ 13
3.2. ANGULAR DEFLECTION.................................................................................................................... 14
3.3. QUARTER-WAVE PLATE .................................................................................................................. 14
3.4. VOLTAGE WAVEFORM CONTROL...................................................................................................... 14
3.5. TRANSITION TIME............................................................................................................................ 15
3.6. ITO HEATER................................................................................................................................... 16
3.7. OVERDRIVE .................................................................................................................................... 16
4. LABEL EXPLANATION AND SAFETY INFORMATION ............................................................... 17
4.1. DBSD LABEL.................................................................................................................................. 17
4.2. LEDDARSTEER EVALUATION BOARD LABEL ...................................................................................... 17
4.3. REGULATORY COMPLIANCE ............................................................................................................. 17
5. DIGITAL BEAM STEERING DEVICE SPECIFICATIONS.............................................................. 18
5.1. MECHANICAL SPECIFICATIONS......................................................................................................... 18
5.2. MAIN SPECIFICATIONS..................................................................................................................... 19
5.3. HIGH-LEVEL IMPLEMENTATION......................................................................................................... 19
5.4. INTERFACES ................................................................................................................................... 19
5.4.1. Interface and Connectors ...................................................................................................... 19
5.4.2. Liquid Crystal Cell Control and Temperature Acquisition (P1).............................................. 20
5.4.3. DBSD Heating (P3) ............................................................................................................... 20
6. LEDDARSTEER EVB SPECIFICATIONS ...................................................................................... 22
6.1. MECHANICAL SPECIFICATIONS......................................................................................................... 22
6.2. MAIN SPECIFICATIONS..................................................................................................................... 23
6.3. HIGH-LEVEL IMPLEMENTATION......................................................................................................... 23
6.4. BLOCK DIAGRAMS........................................................................................................................... 24
6.5. ENVIRONMENTAL SPECIFICATIONS ................................................................................................... 26
6.6. INTERFACES ................................................................................................................................... 26
6.6.1. Main Power Input (P1)........................................................................................................... 27
6.6.2. Liquid Crystal Cell Control and Temperature Acquisition (P3).............................................. 27

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6.6.3. DBSD Heating (P2) ............................................................................................................... 28
6.6.4. Auxiliary DBSD Heating Input (P7)........................................................................................ 28
6.6.5. Universal Serial Bus (J1)....................................................................................................... 28
6.6.6. LCA3 Evaluation Board Interface (P4) .................................................................................. 29
6.6.7. Visual Status (Green & Red LEDs) ....................................................................................... 29
6.6.8. Microswitch (S1) .................................................................................................................... 29
6.6.9. JTAG Interface (P6) .............................................................................................................. 29
7. HARDWARE AND SOFTWARE SETUP ........................................................................................ 30
7.1. INSTALLING THE SOFTWARE............................................................................................................. 30
7.2. CONNECTING THE DBSD TO THE DRIVER BOARD ............................................................................. 30
7.2.1. Liquid Crystal and Temperature Acquisition ......................................................................... 30
7.2.2. Heater.................................................................................................................................... 31
7.3. CONNECTING THE DRIVER BOARD TO THE COMPUTER (UNIVERSAL SERIAL BUS)............................... 31
7.4. POWERING THE DRIVER BOARD....................................................................................................... 32
7.5. FIRMWARE UPDATE......................................................................................................................... 33
8. OPERATING MODES ..................................................................................................................... 35
8.1. STAND-ALONE MODE ...................................................................................................................... 35
8.2. SLAVE MODE .................................................................................................................................. 36
8.2.1. Slave Mode 1 (HW Trigger)................................................................................................... 36
8.2.2. Slave Mode 2 (HW Trigger + SPI)......................................................................................... 36
9. FIRST MEASUREMENTS............................................................................................................... 37
9.1. POWER SUPPLIES ........................................................................................................................... 37
9.2. DRIVING LIQUID CRYSTAL CELLS ..................................................................................................... 37
9.3. DRIVING ITO HEATERS ................................................................................................................... 37
9.4. MACROS......................................................................................................................................... 38
10. INTERFACING WITH THE LCA3 EVALUATION BOARD............................................................. 38
11. OPTICAL SETUP EXAMPLES ....................................................................................................... 39
11.1. DBSD CALIBRATION ....................................................................................................................... 39
11.1.1. First 7 Cells............................................................................................................................ 39
11.1.2. 8th Cell ................................................................................................................................... 41
11.2. OPTICAL EFFICIENCY ...................................................................................................................... 42
11.3. TRANSITION TIME............................................................................................................................ 44
12. SOFTWARE SYNTAX..................................................................................................................... 46
13. TROUBLESHOOTING .................................................................................................................... 49
14. MAINTENANCE .............................................................................................................................. 49
15. DISPOSAL....................................................................................................................................... 49
16. TECHNICAL SUPPORT.................................................................................................................. 49

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Table of Figures
Fig. 1: DBSD optical stack (conceptual view) ............................................................................................... 13
Fig. 2: Single-waveform example.................................................................................................................. 15
Fig. 3: Relaxation time vs. temperature ........................................................................................................ 16
Fig. 4: Overdrive waveform, from high to low voltage................................................................................... 16
Fig. 5: DBSD front and side views ................................................................................................................ 18
Fig. 6: DBSD isometric view.......................................................................................................................... 18
Fig. 7: DBSD high-level implementation diagram ......................................................................................... 19
Fig. 8: DBSD electronic interface .................................................................................................................. 19
Fig. 9: LeddarSteer EVB front and side views .............................................................................................. 22
Fig. 10: LeddarSteer EVB isometric view ..................................................................................................... 22
Fig. 11: LeddarSteer EVB high-level implementation diagram ..................................................................... 23
Fig. 12: LeddarSteer EVB logical block diagram .......................................................................................... 24
Fig. 13: LeddarSteer EVB power block diagram........................................................................................... 25
Fig. 14: LeddarSteer EVB electronic interface.............................................................................................. 26
Fig. 15: Connector P3 inserted into the driver board .................................................................................... 30
Fig. 16: Connector P2 inserted into the driver board .................................................................................... 31
Fig. 17: USB cable inserted into the driver board ......................................................................................... 31
Fig. 18: Connector P1 inserted into the driver board .................................................................................... 32
Fig. 19: DIP switch S1-3 in position for firmware update .............................................................................. 33
Fig. 20: State and transition –Stand-alone mode ........................................................................................ 35
Fig. 21: State and transition –Slave mode 1 ................................................................................................ 36
Fig. 22: Flat flexible cable properly oriented ................................................................................................. 38
Fig. 23: Flat flexible cable properly inserted ................................................................................................. 38
Fig. 24: LeddarTech’s current optical setup for calibrating the first 7 cells (conceptual view)...................... 39
Fig. 25: LeddarTech’s current optical setup for calibrating the 8th cell (conceptual view) ............................ 41
Fig. 26: LeddarTech’s current optical setup for optical efficiency (conceptual view).................................... 42
Fig. 27: DBSD efficiency vs. angle................................................................................................................ 43
Fig. 28: LeddarTech’s current optical setup for transition time (conceptual view) ........................................ 44

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List of Tables
Table 1: Definitions ....................................................................................................................................... 11
Table 8: Package contents (STARTERKIT-DBSD-120-24-A1) .................................................................... 12
Table 9: Software requirements .................................................................................................................... 13
Table 10: Optical test equipment requirements ............................................................................................ 13
Table 2: DBSD base parameters .................................................................................................................. 14
Table 3: QWP base parameters ................................................................................................................... 14
Table 4: Waveform parameters .................................................................................................................... 15
Table 5: ITO heater resistance...................................................................................................................... 16
Table 6: DBSD identification label ................................................................................................................ 17
Table 7: LeddarSteer Evaluation Board identification label .......................................................................... 17
Table 11: DBSD main specifications............................................................................................................. 19
Table 12: P1 pinout –Liquid crystal cell control and temperature acquisition.............................................. 20
Table 13: P3 pinout –DBSD heating ............................................................................................................ 20
Table 14: LeddarSteer EVB main specifications........................................................................................... 23
Table 15: Environmental specifications ........................................................................................................ 26
Table 16: P1 pinout –Main power input ....................................................................................................... 27
Table 17: P3 pinout –Liquid crystal cell control and temperature acquisition.............................................. 27
Table 18: P2 pinout –DBSD heating ............................................................................................................ 28
Table 19: J1 pinout –Universal serial bus .................................................................................................... 28
Table 20: P4 pinout –LCA3 EVB interface................................................................................................... 29
Table 21: Visual status LEDs ........................................................................................................................ 29
Table 22: Microswitch ................................................................................................................................... 29
Table 23: Operating Modes........................................................................................................................... 35
Table 24: Optical setup legend, first 7 cells .................................................................................................. 39
Table 25: Tile ID by azimuthal and elevation angle (degrees)...................................................................... 40
Table 26: Optical setup legend, 8th cell......................................................................................................... 41
Table 27: Optical setup legend, optical efficiency......................................................................................... 42
Table 28: Optical setup legend, transition time............................................................................................. 44
Table 29: Expected rise time from 10% to 90% for each transition type ...................................................... 45
Table 30: Software syntax............................................................................................................................. 46

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Version History
Version
Description
Date (YYYY-MM-DD)
54A0059_V1.0_EN
Initial release
2021-06-11
54A0059_V1.1_EN
Changed range values for following commands: cv, odtc, tcs
2021-07-23

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Contact Information
LeddarTech Inc.
Address
Head Office
Production & Shipping
4535, boulevard Wilfrid-Hamel, Suite 240
Québec (Québec) G1P 2J7, Canada
4535, boulevard Wilfrid-Hamel, Suite 140
Québec (Québec) G1P 2J7, Canada
Phone
+ 1-418-653-9000
1-855-865-9900
8:30 a.m. –5:00 p.m. EST
Fax
+ 1-418-653-9099
Support
[email protected]
Website
www.leddartech.com

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1. Definitions
Table 1: Definitions
Entry
Description
ADC
Analog-to-digital converter (or conversion)
CPU
Central processing unit. The electronic component that makes decisions.
DAC
Digital-to-analog converter (or conversion)
DBSD
Digital beam steering device
ESD
Electrostatic discharge
EVB
Evaluation Board
FoV
Field of view
ITO
Indium tin oxide
LC
Liquid crystal in general. Can be used to identify an LC switch layer.
PG
(Or LCPG). Polarization grating, one DBSD layer used to deflect the light.
QWP
Quarter-wave plate
Rx
Reception, related to receiving light and going on to the photodetector
Stack
(Or optical stack). Full stacking of all optical components, made up of multiple stages
comprised of individual optical components.
Stage
Angular deflection element. One stage is composed of one LC switch plus one or two
polarization gratings.
Tile
Angular field of view
Tx
Transmission, related to the laser emission
This document uses the metric system (SI).

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2. DBSD Starter Kit Overview
The LeddarSteer™Evaluation Kit enables the demonstration and evaluation of the digital beam steering
device (DBSD) performances as a LiDAR component for the automotive industry or other end markets. The
LeddarSteer Evaluation Kit is comprised of the LeddarSteer Evaluation Board, the LeddarSteer DBSD, and
related accessories (see detailed list in section 2.2).
2.1. Intended Use and Description
The LeddarSteer Evaluation Board enables demonstration and evaluation of the DBSD performances as a
LiDAR component for the automotive industry or other end markets.
The goal of this User Guide is to help optimize your use of the Evaluation Board and the associated user
software interface. This User Guide is intended for developers and integrators.
In this document, the LeddarSteer Evaluation Board is referred to as the “LeddarSteer EVB.”
With the LeddarSteer EVB, you will be able to:
•Measure the tiles’ DBSD optical efficiency using an external photometer and a laser module
•Measure the DBSD optical transition time using an external photodetector and a laser module
•Integrate the LeddarSteer EVB to your own LiDAR architecture
•Interface with the LeddarSteer EVB through serial terminal software in order to:
oConfigure the LC cell voltage, state ID, overdrive, and voltage monitoring
oConfigure heaters and temperature acquisition
oSave configuration inside the LeddarSteer EVB memory
2.2. Package Contents
Table 2: Package contents (STARTERKIT-DBSD-120-24-A1)
Qty
Description
Manufacturer
Manufacturer P/N
1 x
DBSD with mechanical assembly
LeddarTech Inc.
DBSD-120-24-56-A0
1 x
LeddarSteer EVB with mechanical assy
LeddarTech Inc.
EVALBOARD-LEDDARSTEER-8
1 x
28 AWG LC + I2C harness
LeddarTech Inc.
71A0051-2
1 x
26 AWG ITO heater harness
LeddarTech Inc.
71A0056-1
1 x
22 AWG power supply harness
LeddarTech Inc.
71A0054-1
1 x
0.50 mm pitch Premo-Flex FFC jumper
Molex Inc.
0150200172
1 x
AC-DC power supply
Input: 100-240 VAC / 50-60 Hz / 1 A max.
Output: 12 VDC / 3 A
CUI Inc.
LeddarTech Inc.
SDI40-12-U-P5
71Z0001-1
1 x
Power cord (US), or
Qualtek Corp.
312003-01
Power cord (UK), or
Qualtek Corp.
370001-E01
Power cord (EU), or
Volex Inc.
2111H 10 C3
Power cord (CH)
Qualtek Corp.
399012-01
1 x
USB 2.0 cable A male to Micro B male
Qualtek Corp.
3021088-06

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2.3. Software Requirements
Table 3: Software requirements
Description
Manufacturer
Terminal emulator
TeraTerm (see www.ttssh2.osdn.jp)
2.4. Optical Test Equipment Requirements
Table 4: Optical test equipment requirements
Description
Manufacturer
Model
Power and energy meter console
Thorlabs Inc.
PM100D
Sensor with IR target
Thorlabs Inc.
S120C
Temperature-controlled laser diodes
Thorlabs Inc.
LDM90 + TED200C + LDC205C
Photodiode
Thorlabs Inc.
DET10A
3. DBSD Reference Information
3.1. Introduction to DBSD
A DBSD is a passive opto-electrical device able to steer light at a specific wavelength in two dimensions,
horizontal and vertical.
The term “optical stack” is used to refer to the multiple layers that make up the entire DBSD: end caps,
angular deflection elements (liquid crystal cells, polarization grating), quarter-wave plates, and heaters.
The term “stage” is used to refer to an angular deflection element, able to deflect light at specific wavelengths
using one LC cell plus one or more polarization gratings. The light deflects more and more as it passes
through the multiple stages. An external device controls LC cells with an AC square-wave voltage. The PGs
deflect light according to polarization; PGs are fixed and uncontrollable.
Finally, the term “tile” is used to designate a specific steered field of view, a 2D section of the deflection
angle, after passing through the multiple deflections of all “stages.”
Fig. 1: DBSD optical stack (conceptual view)
Alternating stage of LC switches (LC) and LC polarization gratings (PG)

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3.2. Angular Deflection
DBSD deflects light at a specific wavelength over a total of field of view of 110° x 18° (horizontal x vertical).
A DBSD is used to perform the coarse light beam steering, and additional lenses can be used to further
increase the FoV.
DBSD deflects the transmitted and received laser source with the same angle. Therefore, a single DBSD
device may be conceptually sufficient for the purpose of specific LiDAR.
The number of angular deflection elements is as follows:
•Five (5) stages to cover 110° horizontal field of view with 14 x approx. 7.5° tiles
•Two (2) stages to cover 18° vertical field of view with 4 x approx. 6° tiles
Table 5: DBSD base parameters
Parameter
Value
FoV (horizontal x vertical)
110° x 18°
Number of controllable stages
7
Horizontal angular step
Approx. 7.5°
Vertical angular step
Approx. 6°
Number of tiles (horizontal x vertical)
56 (14 x 4)
3.3. Quarter-Wave Plate
QWPs are used to create the required circular polarization needed for the DBSD. One is needed when the
laser source is linearly polarized. It can also be used to optimize light signal returns and to clean up potential
stray light.
Table 6: QWP base parameters
Parameter
Value
Number of QWPs
2
Number of controllable QWPs
1
3.4. Voltage Waveform Control
At each stage, each specific liquid crystal cell is individually controlled with an AC square-wave voltage at a
frequency between 1 kHz and 5 kHz (typically 2 kHz) and a peak-to-peak amplitude between 2 V and 40 V.
Frequency is a trade-off between power consumption and cell stability during the cycle. Slower frequencies
consume less power but might cause a slight variation in light amplitude through the cycle.
We aim at controlling one DBSD with a maximum of 8 “stages.” Each individual “stage” may have electrical
differences (capacitance and resistance change over the surface area); therefore, a characterization must
be considered by design.
The “positive” and “negative” sides of the waveform must cancel each other sufficiently when integrated.
This means that, when subtracting them, the absolute residual must be lower than 20 mV. This measurement
can be done with a voltmeter in DC mode, measuring the average voltage of an AC square wave, and the
result should be close to zero.
The voltage control needs to be accurate. At low voltages (below a few volts), accuracy must be 10 mV or
better. On higher voltages (closer to 20 V), an accuracy of 200 mV is sufficient.

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Table 7: Waveform parameters
Parameter
Value
Maximum number of controllable waveforms per DBSD
8
Frequency
1 kHz to 5 kHz (2 kHz typ.)
Duty cycle
50% high, 50% low
Min AC amplitude (peak-to-peak)
2 V
Max AC amplitude (peak-to-peak)
40 V
Average AC voltage target
≤20 mV
Magnitude discretization
@ low voltage (1 V)
@ high voltage (20 V)
≤10 mV
≤200 mV
Single LC cell (1.5 µm thick design)
Capacitance
Resistance
240 nF
>4 MΩ
-20 V
200 µs -1 ms
Avg mV
-1 V
+1 V
+20 V
High drive Low drive
2 Vpp
40 Vpp
Fig. 2: Single-waveform example
3.5. Transition Time
The transition time represents the time to change from a deflection angle to another.
Fast transition time will occur from low to high voltage LC cell drive. Fast transition time is between 20 µs
and 100 µs, and will be lower than 60 µs for temperatures above 30 °C.
Slow transition time (also referred to as “relaxation time”) will occur from high to low voltage LC cell drive.
The DBSD internal temperature will impact the slow transition time. Above a DBSD internal temperature of
60°C, the slow transition time is lower than or equal to 750 µs.
Therefore, the DBSD needs to be heated to achieve optimal temperature using ITO layers.

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Fig. 3: Relaxation time vs. temperature
3.6. ITO Heater
Each DBSD has three ITO heaters dedicated to heating (one internal and two on the external layer).
Table 8: ITO heater resistance
Parameter
Value
Single ITO heater resistance
250 Ω to 325 Ω/□ (Ω/sq) (310 ±20%)
Sheet resistance is a special case of resistivity for a uniform sheet thickness. Ohms-per-square (Ω/□ or Ω/sq)
is the unit of measurement when measuring the resistance of a thin film of material using the four-point probe
technique. It is equal to the resistance between two electrodes on opposite sides of a theoretical square.
The size of the square is unimportant. It is dimensionally equal to an ohm but is exclusively used for sheet
resistance.
3.7. Overdrive
The relaxation time can be accelerated by briefly applying an “overdrive” voltage beyond the one that must
be applied before going to the target voltage. The overdrive duration can be between 10 µs and 20 ms
depending on the temperature and the voltage difference between the previous and target voltages. This
overdrive is applied only during a slow transition time, from high to low-voltage drive.
Avg mV
+1 V
+20 V
Initial state Overdrive Required drive
-20 V
-1 V
Fig. 4: Overdrive waveform, from high to low voltage

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4. Label Explanation and Safety Information
4.1. DBSD Label
Table 9: DBSD identification label
Location
Description
Upper side of DBSD unit
MOD: DBSD-120-24-56-A0 (model number)
SN: Serial number
MFD: Manufacturing date
4.2. LeddarSteer Evaluation Board Label
Table 10: LeddarSteer Evaluation Board identification label
Location
Description
Bottom of LeddarSteer EVB unit
MOD: EVALBOARD-LEDDARSTEER-8 (model number)
SN: Serial number
MFD: Manufacturing date
4.3. Regulatory Compliance
This device is intended for evaluation under laboratory conditions and is not intended for outdoor operation.
It has not been tested against vibration or shocks. Any other certification or regulatory compliance information
to come.

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5. Digital Beam Steering Device Specifications
5.1. Mechanical Specifications
Fig. 5: DBSD front and side views
Fig. 6: DBSD isometric view

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5.2. Main Specifications
Table 11: DBSD main specifications
Parameter
Value
LC cell voltage drive
Square-wave input, 20 V max.
ITO heater voltage supply
30 V max.
Temperature sensor
TMP112-Q1
Form factor
93 mm x 28.4 mm x 120 mm (W x H x D)
5.3. High-Level Implementation
DBSD
20-pin
16
T_I2C
HEATER
Optical switches
16
Temperature
sensor
6-pin
Connector
Integrated circuit
Power
Digital
Analog
Optical element
Heating elements
Diffraction
gratings
3.3V
Fig. 7: DBSD high-level implementation diagram
5.4. Interfaces
5.4.1. Interface and Connectors
The figure below shows the interface connectors available on the DBSD.
DBSD
heating
(P3)
Liquid crystal
cell control and
temperature
acquisition (P1)
Fig. 8: DBSD electronic interface

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5.4.2. Liquid Crystal Cell Control and Temperature Acquisition (P1)
Table 12: P1 pinout –Liquid crystal cell control and temperature acquisition
Connector #
Number of pins / Type / Mating
P1
20 pin / Molex 2035642017 (Mating: Molex 5011892010)
Pin #
Signal
Description
Specifications
1
LC_8N
Liquid crystal negative input
Square-wave input
0 V to 20 V
1 kHz to 5 kHz (typ. 2 kHz)
50% duty cycle
2
LC_7N
3
LC_6N
4
LC_5N
5
LC_4N
6
LC_3N
7
LC_2N
8
LC_1N
9
3V3_I2C
DBSD temperature sensor supply
3.3 V supply input
10
GND
Ground
N/A
11
EXT_I2C_SCL
I2C clock
Digital input (3.3 V)
12
EXT_I2C_SDA
I2C data
Digital input/output (3.3 V)
13
LC_8P
Liquid crystal positive input
Square-wave input
0 V to 20 V
1 kHz to 5 kHz (typ. 2 kHz)
50% duty cycle
14
LC_7P
15
LC_6P
16
LC_5P
17
LC_4P
18
LC_3P
19
LC_2P
20
LC_1P
5.4.3. DBSD Heating (P3)
Table 13: P3 pinout –DBSD heating
Connector #
Number of pins / Type / Mating
P3
6 pin / Molex 0533980671 (Mating: Molex 0510210600)
Pin #
Signal
Description
Specifications
1
ITO_1P
To ITO heater positive pin
Square-wave input
30 V, 200 Hz
0 to 100% duty cycle
2
GND
Ground
N/A