Osram OSTAR Projection Power User manual

1 / 182020-06-04 | Document No.: AN149
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Application Note
Handling of the OSRAM OSTAR®Projection Power
Abstract
The OSRAM OSTAR®Projection Power family LEDs offer
highest luminance and are specially designed for projection
applications. Different versions and designs offer the best
implementation possible in the application. In addition to
thermal management, correct handling and processing of the
LEDs are essential for a successful application. This application
note provides a recommendation for the appropriate handling
and processing of the different versions of the LED family.
Valid for:
OSRAM OSTAR®Projection Power
Author: Retsch Stefanie / Jiang, DeGen
Further information:
AN053_Thermal management ofOSRAM OSTAR®Projection light sources
AN084_Projection with LED light sources
Application Note No. AN149

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Table of contents
A. Basic information ....................................................................................................2
Mechanical and optical design resources ..........................................................3
B. General Handling recommendations ......................................................................4
ESD stability ........................................................................................................4
Cleaning ..............................................................................................................4
Precautions and storage .....................................................................................5
C. OSRAM OSTAR®Projection Power with connecting board ..................................5
Delivery ...............................................................................................................7
Handling recommendations ................................................................................7
Assembly of the connector .................................................................................9
D. OSRAM OSTAR®Projection Power SMT ............................................................13
Handling recommendations ..............................................................................14
Solder pad design .............................................................................................15
Solder stencil ....................................................................................................16
Reflow soldering ...............................................................................................16
A. Basic information
OSRAM OSTAR®Projection devices are optimized for Étendue-limited systems
that require the highest achievable luminance, such as projection applications.
Since an encapsulation with a material comprising a refractive index >1 may lead
to an increase in effective Étendue, the chips radiate directly into air. To protect
the chips, either a glass cover or a frame with protective tape (which must be
removed before operation) is used.
The design of the OSRAM OSTAR®Projection light source is also focused on
thermal optimization, as for the highest current density of max 6A/mm² efficient
cooling is necessary. Please refer to the data sheet for the individual current of
each LED.
OSRAM OSTAR®Projection Power devices offer lowest thermal resistance as
the chips are mounted directly on a copper substrate. Since an adequate thermal

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management is indispensable, please refer to the Application Note
“AN053_Thermal management of OSRAM OSTAR®Projection light sources”.
Table 1 shows a product selector guide to find the recommended product for the
individual applications.
Mechanical and optical design resources
For detailed information about the mechanical dimensions of the OSRAM
OSTAR®Projection Power devices please refer to the detailed drawings
available in the data sheet. To obtain CAD data and optical rayfile, please visit
the “Optical Simulation / Ray Files + Package CAD Data” webpage on the
OSRAM Opto Semiconductor website.
For more information on importing rayfiles and ray-measurement files of LEDs
from OSRAM Opto Semiconductors, please refer to the application note
“AN086_Importing rayfiles and ray-measurement files of LEDs from OSRAM
Opto Semiconductors”.
The newest generation of OSRAM OSTAR®Projection Power devices come with
a protective tape covering the chip area (Figure 1) for the deep blue, blue and
Table 1: Product selector guide
Application
OSRAM OSTAR®
Projection Cube
OSRAM OSTAR®
Projection Compact
OSRAM OSTAR®
Projection Power
Embedded
solutions
Camera 
Smartphones 
Tablets 
Compact
solutions
Home cinema 
Gaming 
Notebook accessory 
Control room 
Head-up display 
Business
solutions
Office 
Education 
Professional 

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amber devices. This tape also protects the LED during the soldering process and
should be left in place until initial operation.
Figure 1: Protective tape for deep blue, blue and amber colored OSRAM OSTAR®
Projection Power
B. General Handling recommendations
The use of any type of sharp objects should generally be avoided, since this can
damage the component. Generally the LED light-emitting area should not be
touched or punctured as this can damage the component.
ESD stability
All OSRAM OSTAR®Projection devices offer a build-in 2kV ESD providing ESD
stability of up to 2 kV. It is assigned to the “Class 2 HBM” category in accordance
with ANSI / ESDA / JEDEC JS-001. With this class the LED can be considered
as uncritical for processing and assembly by state-of-the-art SMT equipment
aligned with ESD precautions. To achieve higher ESD protection on the system
level, additional ESD protection must be applied.
Nevertheless, please be aware of ESD safety precautions while handling LEDs.
As a matter of principle, common ESD safety precautions must be observed
during the handling, assembly and production of electronic devices (LEDs). For
further information about ESD protection please refer to the application note
“ESD protection while handling LEDs”.
Cleaning
Any direct mechanical or chemical cleaning of the LED should be avoided. For
dusty LEDs, simple cleaning by means of purified compressed air (e.g. central
supply or spray can) is recommended. In order to ensure that the compressed
air does not contain any oil residues, the use of a spray can is recommended. A
maximum pressure of 4 bar at a distance of 20 cm to the component is also
recommended.

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Precautions and storage
For storage and dispatch, the reels or trays are packed in vacuum-sealed dry
bags together with desiccants. It is generally recommended to leave reels in their
original packaging until they are assembled, and to store components under
ambient conditions of ≤ 10 % RH during processing. Drying cabinets with dry
nitrogen (N2) or dry air are suitable for this type of storage. The product complies
with moisture-sensitive Level 2 (MSL 2) according to JEDEC J-STD- 020E. For
more information please refer to the application note “Dry pack information”.
As is the case for all LEDs from OSRAM Opto Semiconductors, the product also
fulfills the current RoHS guidelines (European Union and China) and therefore
contains no lead or other defined hazardous substances.
Since the OSRAM OSTAR®Projection Power is generally supplied on tape or on
a tray with a dry pack, it should be factory-sealed when stored. The hermetically
sealed package should only be opened immediately before mounting and
processing, after which the remaining LEDs should be repacked in accordance
with the moisture level specified in the data sheet (see JEDEC J-STD-033 —
Moisture Sensitivity Levels).
A suitable storage system should be implemented in order to ensure that
assembled LED boards are not stacked on top of each other (Figure 2). To avoid
the risk of damage to the assembled LEDs, make sure that they are not exposed
to compression forces of any kind. Furthermore, the LED of the assemblies must
also not be touched directly.
Figure 2: Correct storage
C. OSRAM OSTAR®Projection Power with connecting board
The OSRAM OSTAR®Projection Power devices on a connecting board are
available in three different colors:
• Deep Blue / Blue
•Amber
• Converted Green
Figure 3 shows an overview of the standard OSRAM OSTAR®Projection Power
devices witha connecting board. Amber and (deep) blue devices are covered
with a glass window, the converted green LED is cast in silicone.

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Figure 3: Overview of standard OSRAM OSTAR®Projection Power devices
The newest generation of devices provides series connection of chips which
leads to a reduction of the absolute forward current, and therefore to a lower LED
driver complexity and a smaller connector size. The devices also have a
potential-free LED backside and the amber and (deep) blue devices are
windowless. This avoids losses due to cover reflectivity and stray light. Figure 4
shows an overview of all the devices of this class.
Figure 4: Overview of new generation OSRAM OSTAR®Projection Power with a
connecting board
LE CG P2ALE CG P1A LE CG P3A
LE B P1W LE B P2W LE B P3W
LE A P1W LE A P2W LE A P3W
LE CG P2AQLE CG P1AQ LE CG P3AQ
LE B P1MQ LE B P2MQ LE B P3MQ
LE A P1MQ LE A P2MQ LE A P3MQ

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Figure 5 shows the principal design of the OSRAM OSTAR®Projection Power
devices with connecting board. All the devices are available as a 2-chip, 4-chip
or 6-chip light source, mounted on an IMS with drilled holes for mounting and
connector pads for electrical connections.
Figure 5: Principal design of the OSRAM OSTAR®Projection Power with a connecting
board
Delivery
The OSRAM OSTAR®Projection Power devices on IMS-PCB (Insulated Metal
Substrate) will be delivered on trays, like illustrated in Figure 6. OSRAM Opto
Semiconductors can be contacted for a detailed drawing.
Figure 6: Example of a tray
Handling recommendations
In addition to general guidelines on the handling of LEDs, additional care should
be taken that mechanical tension on the carrier board and especially stress (e.g.
sheering forces) on the glass cover or ceramic are avoided. This means, that the
LED must not be picked up or handled by the glass or ceramic.
In general, any type of sharp object (e.g. forceps, fingernails, etc.) should be
avoided in order to prevent stress to, or penetration of, the encapsulation since
this can lead to damage to the component. Exerting pressure on the elastic
Globe-Top can lead to the spontaneous failure of the LED (damage to the
contacts).
IMS
Connector pads for
electrical connections
Protective tape
Frame

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Care should be taken that the light-emitting area is not touched or contaminated
in any way. Figure 7 shows the critical area that should be not touched or
contaminated.
Figure 7: Keep out area
The handling of the products using finger cots or anti-static plastic gloves is
recommended to avoid contamination of the products, especially in the keep-out
area. If the products are handled using tweezers, a round-end type is
recommended. The tips of the tweezers must be kept away from the solder pad
and the keep-out area. Avoid the use of sharp-end type tweezers which may
damage the surface of the products. Figure 8 shows the recommendations for
manual handling.
Figure 8: Manual handling recommendations
Keep out, don‘t touch area

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For the connection to the heat sink, please use thermal interface material (for
detailed information on thermal interface material, please refer to Application
Note “AN053_Thermal management of OSRAM OSTAR®Projection light
sources”). The devices can be connected to the heat sink with a screw.
When mounting the MPCB to the frame or heatsink by means of a screw, metric
cylindrical head screws M1.4 can be used for the mounting and it is generally
recommended that a locking compound are used for each screw. When
mounting the screws (M1.4), it is recommended that you check on the maximum
torque with the screw supplier. Additionally, to avoid MPCB bending which can
have an adverse effect on the thermal interface material and the LED itself, a
maximum torque of 0.2 Nm should be used. There are 4 holes on the MPCB, and
it is recommended to use 2 diagonal holes for mounting and another 2 holes for
aligning them with the register pins.
Assembly of the connector
In order to be able to connect the individual components, the IMS provides pins
for assembling a connector. The recommended connector for each component
can be found in the respective data sheet. Figure 9 shows an assembled
connector.
Figure 9: Assembled connector
It is common in industry to use carriers or pallets for the entire SMT assembly
process (solder paste printing, connector placement, reflow soldering) when
processing PCB-based components. These carriers are typically made of highly
heat-resistant, fiber-reinforced material. The cut-outs, which fit the component
precisely, hold the components in place. This enables a stable and reproducible
assembly with a good soldering process. Figure 10 shows a sketch of a possible
carrier.

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Figure 10: Sketch of a possible carrier
In order to obtain an effective soldering process, it is recommended to place the
components with the pins opposite each other.
Before solder paste printing can be performed, the component must be masked
and the light-emitting part must be protected. Here it is recommended to use a
step-down stencil. This should have a suitable integrated cavity for the sensitive
LED part of the PCB to protect it during the process. Figure 11 shows a sketch
of a possible step-down stencil.
Figure 11: Sketch of a step-down stencil with integrated cavity
The use of special slit squeegee blades is required for solder paste printing.
Figure 12 shows a possible arrangement of the carrier and step-down stencil.
Step-down on
squeegee side
Integrated
cavity

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Figure 12: Arrangement of the carrier and step-down stencil
These are slotted and matched to the step-down stencil and the design of the
corresponding carrier (see Figure 13).
(Further information on this procedure can be requested from company Christian
Koenen GmbH, for example.)
Figure 13: Example of a special squeegee blade
A correct solder paste print is the basis for the assembly with the corresponding
SMT connector. This process can be performed manually, but it is
recommended that automated assembly with a pick-and-place machine is used
for mass production.
For the OSRAM OSTAR®Projection Power, a standard reflow soldering process
with forced convection can be applied. Since the soldering atmosphere and in
particular air reflow can cause degradation of optical parameters it is advisable
to use an N2atmosphere (<500 ppm O2). Figure 14 shows the temperature
profile for lead-free soldering with the recommended peak temperature of
245 °C. Due to the high thermal mass of the Cu based substrate it is not
recommended to perform manual soldering with a soldering iron or heating guns.
Slit squeegee blade
Step-down stencil

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Figure 14: Maximum and recommended solder temperature for soldering the
connector to the PCB in accordance with to JEDEC J-STD-020E
0 50 100 150 200 250 300
t [s]
0
50
100
150
200
250
300
25
T [°C]
up to 120 s
up to 30 s
up to 100 s
Ramp up
3 K/s (max)
Ramp down
6 K/s (max)
245 °C Recommended solder profile
(max 260 °C)
217 °C
240 °C
Profile Feature Symbol
Pb-Free (SnAgCu) Assembly
Unit
Min Recommended Max
Ramp-up rate to preheat[1]
25 °C to 150 °C
23K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak[1] TSmax to
TP
23K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the specified
peak temperature TP- 5 K
tP10 20 30 s
Ramp-down rate[1]
TPto 100 °C
36K/s
Time
25 °C to TP
480 s
All the temperatures refer to the center of the package, measured on the top of the component
[1]slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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D. OSRAM OSTAR®Projection Power SMT
OSRAM OSTAR® Projection Power SMT devices (LE x P0MQ/AQ) come with a
copper substrate which offers lowest thermal resistance. These devices also
comprise a large electrical isolated thermal pad for better thermal dissipation.
The amber and (deep) blue devices are windowless to avoid light losses due to
cover reflectivity and stray light. The converted green LED is cast in silicon to
ensure maximum system level efficiency.
OSRAM OSTAR®Projection Power SMT devices have a protective tape
covering the chip area (Figure 15) for the (deep) blue and amber devices. This
tape also protects the LED also during the soldering process and should be left
in place until initial operation.
Figure 15: Protective tape for (deep) blue and amber colored OSRAM OSTAR®
Projection Power
Figure 16 shows an overview of all the OSRAM OSTAR®Projection Power SMT
devices
Figure 16: Overview of OSRAM OSTAR®Projection Power SMT devices
LE CG P0AQLE A P0MQ
LE B P0MQ LE D P0MQ

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Handling recommendations
Please be aware of ESD safety while handling the LED (see Application Note
“ESD protection while handling LEDs”). In addition to the general guidelines for
the handling of LEDs, additional care should be taken that mechanical stress
(e.g. sheering forces) on to the elastic silicone encapsulation is eliminated or
reduced to the greatest extent possible (see also application note “Handling of
silicone resin LEDs”).
Although manual handling and assembly is possible, automatic placement is
highly recommended. For manual assembly and placement — in the production
of prototypes, for example — the diligent use of tweezers is recommended. The
LED must not be lifted from the top, because this may cause damage to the
surface. In addition, it is recommended to hold the LED metal substrate by using
tweezers and applying any force equally to the entire LED package as shown in
Figure 17. If there is no alternative to the use of tweezers, the LED can be picked
and handled at the metal substrate using finger cots or anti-static plastic gloves.
In general, any type of sharp objects (e.g. forceps, fingernails, etc.) should be
avoided in order to prevent stress to, or penetration of, the encapsulation since
this can lead to the impairment of the component.
Figure 17: Recommended manual handling
When processing by means of automated placement machines, care should be
taken to use an appropriate pick-and-place tool and to ensure that the process
parameters comply with the package's characteristics. An example of a suitable
pick-and-place nozzle is given in the form of the ASM SIPLACE tool number
308199. Figure 18 shows the recommended nozzle.

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Figure 18: Recommended pick-and-place nozzle from ASM SIPLACE
Solder pad design
Since the solder pad effectively creates the direct contact between the LED and
the circuit board, the design of the solder pad contributes decisively to the
performance of the solder connection. The design has an influence on solder
joint reliability and heat dissipation, for example. In most cases, it is therefore
advantageous to use the recommended solder pad, since it is individually
adapted to the properties and conditions of the LED (Figure 19). The
corresponding solder pad can also be found in the data sheet of each LED.
Figure 19: Recommended solder pad design
Based on the given solder pad design, an optimized balance between good
processability, the smallest possible positioning tolerance and a reliable solder
connection can be achieved.
SIPLACE Nozzle 3081899
1.05 2.4
1.25
0.78
0.3
2.3
3
0.3

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Solder stencil
In the SMT process, solder paste is normally applied by stencil printing. The
design of the printing stencil and an accurate working process greatly influence
the applied amount and quality of the paste deposit. Figure 20 shows an
example of a printed circuit board with good solder paste printing.
Figure 20: Example of good solder paste printing
Proper solder paste printing increases the solder quality. Effects such as solder
bridges, solder balling, solder spray and/or other soldering defects are largely
determined by the design of the stencil apertures and the quality of the stencil
printing (e.g. positioning, cleanliness of the stencil, etc.). For the OSRAM
OSTAR®Projection Power a stencil thickness of 120 μm is recommended. A
uniform solder joint thickness is also recommended in order to produce reliable
solder joints and obtain an appropriate optical alignment.
For the paste printing process OSRAM Opto Semiconductors has successfully
used the standard SAC 305 Type 3 solder paste (HERAEUS F640 SAC 305
Type 3). For process evaluation, process control and failure prevention it is
recommended to check the solder paste volume with SPI (Solder Paste
Inspection) regularly.
Reflow soldering
Since the OSRAM OSTAR®Projection Power is generally compatible with
existing industrial SMT processing methods, current populating techniques can
be used for the mounting process. The individual soldering conditions for each
LED type in accordance with to JEDEC can be found in the respective data
sheet. A standard reflow soldering process with forced convection under
standard N2atmosphere (<500 ppm O2) is mandatory for mounting the
component, in which a typical lead-free SnAgCu metal alloy is used as solder.
Figure 21 shows the temperature profile for lead-free soldering with the
recommended peak temperature of 245 °C. In this context, it is recommended
to check the profile on all new PCB materials and designs. As a good starting
point, the recommended temperature profile provided by the solder paste
manufacturer can be used. The maximum parameters and temperature for the
profile as specified in the data sheet should not, however, be exceeded.

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Figure 21: Temperature profile for lead-free reflow soldering in accordance with JEDEC
J-STD-020E
Vacuum reflow option. If a very low level (<10%) needs to be achieved, a
vacuum reflow soldering oven can be used.
To ensure optimized heat transfer from the integrated thermal pad to the PCB
and high board level reliability, it is recommended to control the solder joint
quality of the first assembled samples with an X-ray image. The X-ray images in
Figure 22 show good solder joint quality with no bridging and very low voiding.
Figure 22: X-ray images of the solder joint quality
0 50 100 150 200 250 300
t [s]
0
50
100
150
200
250
300
25
T [°C]
up to 120 s
up to 30 s
up to 100 s
Ramp up
3 K/s (max)
Ramp down
6 K/s (max)
245 °C Recommended solder profile
(max 260 °C)
217 °C
240 °C

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ABOUT OSRAM OPTO SEMICONDUCTORS
OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its subsidiary, OSRAM
Opto Semiconductors GmbH in Regensburg (Germany), offers its customers solutions based on semiconduc-
tor technology for lighting, sensor and visualization applications. OSRAM Opto Semiconductors has produc-
tion sites in Regensburg (Germany), Penang (Malaysia) and Wuxi (China). Its headquarters for North America
is in Sunnyvale (USA), and for Asia in Hong Kong. OSRAM Opto Semiconductors also has sales offices th-
roughout the world. For more information go to www.osram-os.com.
DISCLAIMER
PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE INFORMA-
TION SHOWN HEREIN. IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND CONDITIONS, DO
NOT USE THE INFORMATION.
The information provided in this general information document was formulated using the utmost care; howe-
ver, it is provided by OSRAM Opto Semiconductors GmbH on an “as is” basis. Thus, OSRAM Opto Semicon-
ductors GmbH does not expressly or implicitly assume any warranty or liability whatsoever in relation to this
information, including – but not limited to – warranties for correctness, completeness, marketability, fitness
for any specific purpose, title, or non-infringement of rights. In no event shall OSRAM Opto Semiconductors
GmbH be liable – regardless of the legal theory – for any direct, indirect, special, incidental, exemplary, con-
sequential, or punitive damages arising from the use of this information. This limitation shall apply even if
OSRAM Opto Semiconductors GmbH has been advised of possible damages. As some jurisdictions do not
allow the exclusion of certain warranties or limitations of liabilities, the above limitations and exclusions might
not apply. In such cases, the liability of OSRAM Opto Semiconductors GmbH is limited to the greatest extent
permitted in law.
OSRAM Opto Semiconductors GmbH may change the provided information at any time without giving notice
to users and is not obliged to provide any maintenance or support related to the provided information. The
provided information is based on special conditions, which means that the possibility of changes cannot be
precluded.
Any rights not expressly granted herein are reserved. Other than the right to use the information provided in
this document, no other rights are granted nor shall any obligations requiring the granting of further rights be
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It is prohibited to reproduce, transfer, distribute, or store all or part of the content of this document in any form
without the prior written permission of OSRAM Opto Semiconductors GmbH unless required to do so in ac-
cordance with applicable law.
OSRAM Opto Semiconductors GmbH
Head office:
Leibnizstr. 4
93055 Regensburg
Germany
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