Philips MCD2010/12/93 User manual

Published by Sophie-KM 1135 AVM Printed in the Netherlands
MCD2010/12/93/98
Subject to modi cation EN
Micro Audio System
Contents Page Contents Page
©Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Version 1.0
1 Technical Specification and Connection Facilities
2 Laser Beam Safety Precautions......................................... 2-1
3 Important Safety Precautions .................................. 3-1 to 3-2
4 Safety Check After Servicing ............................................. 4-1
6 Standard Notes For Servicing,Lead Free Requirements
& Handling Flat Pack IC .......................................... 6-1 to 6-4
5 Safety Information General Notes & Lead Free
7 Direction of Use ....................................................... 7-1 to 7-4
8 Cabinet Disassembly Instructions ........................... 8-1 to 8-2
12 Headphone Board
9 Troubleshooting ....................................................... 9-1 to 9-2
10 Block Diagram .................................................................10-1
11 Wiring Diagram ...............................................................11-1
13 Display Board
14 Power Board
Layout Diagram.................................................12-5
16 Exploded View...................................................................13-1
17 Revision List .......................................................................14-1
15 Decoder Board
Circuit Diagram ......................................... 12-6 to 12-11
Layout Diagram ............................................... 12-12
.................................................1-1 to 1-10
Circuit Diagram ....................................................12-1
Layout Diagram ...................................................12-1
Circuit Diagram ................................................12-2
Circuit Diagram .................................................12-4
Layout Diagram ...............................................12-3
Requirements .................................................................... 5-1
Features
RDS
Voltage Selector
ECO Standby
DTS
Feature
Different /12 /93 /98
/10
3141 785 36600

Location of PC Boards
Version Variations
Type /Versions:
Features
Board in used:
MCD2010
Service policy
Display Board
Decoder Board
Power Board
Headphone Board
* TIPS : C -- Component Lever Repair.
M -- Module Lever Repair
-- Used
/55
/55
/58
/58
/61
/61
/79
/79
/93
/93
/94
/94
/96
/96
/98
/98
/51
/37
/12
/12
/10
/10
Feature diffrence
RDS
DTS
VOLTAGE SELECTOR
ECO STANDBY - DARK
Type /Versions
MCD2010
Technical Specification and Connection Facilities
1-1
C
C
M
M
C
C
M
M
C
C
M
M
Decoder Board
CD Loader
Display Board
Headphone Board
Power Board

2. General Information and Requirement
2.1 Product Family Features
2.1.1 Identity and Key Features
MCD2010 series are Micro DVD Audio system,DVD/CD/MP3 play,USB,Tuner FM(20presets)
Elements to include as generic requirements:
1. Detachable mains cord
2. Safety certification (cUL/FCC and CB/EMC/CE)
Following is a list of key features:
1. DVD disc player (MTK_MT1389J)
2. USB true source
a) MSC/MTP device
b) USB High Speed
3. MP3 Link (via headphones jack from PC or MP3 player)
4. Headphone Out (in front of the set)
5. Tuner FM(Silicon Lab SI4705/w RDS)
6. Digital Amplifier
7. Rated output power @10%THD table 2
Set Type Number Stroke Versions Power Remark
MCD2010 All version 2x10W
2.1.2 Styling, Forms and Functions
MCD2010 appearances are defined in their respective MUS.MUS is the leading document
where product appearance is applicable..
Features Products MCD2010
Stroke versions llA
Design Refer to MUS[3] for
details
Front
Optical Drive Loading Tray
elddiMnoitacoLyarT
Tray Orientation HORIZONTAL
PUDCL
Dimension
mm3teeffothgieH
Apparatus tray closed
W x D x H (mm)
Weight tesniaM
rekaeps
Technical Specification and Connection Facilities
1-2

Features Products MCD2010
Stroke versions llA
BLACK
GRAY
Cosmetics roloC
snottuB
2.1.3 External I/O Connections
Model MCD2010
Stroke Version All
iPod dock with
Authentication chip NA
USB √
MP3 Link
(3.5mm audio jack) √
Composite CVBS
(Yellow) √
Component Y Pb Pr √
Aux In
(RCA cinch) √
Aux Out
(RCA cinch) √
Tuner Socket
(for FM) √
Headphone Out
(3.5mm audio jack) √
2.1.4 Controls, Local Displa y and LED Indications(tbc)
Control keys on the set are:
1. Standby-On
2. Eject
3. Play/Pause
4. Next
5. Pre
6. FF
7. FB
8. Source (Disc, USB, Dock, FM, Aux, MP3)
9. Stop
10. Volume Knob
There is local display LCD(reuse DCD322 LCD). Standby LED colour: Red in Standby mode.
2.1.5 . ACCESSORIES (tbc)
Model MCD2010
Stroke Version All Version
noigeR
Power Cord 1.8M
Technical Specification and Connection Facilities
1-3

AV cable NA
Audio cable
(3.5mm audio) 0.5M
Tuner Antenna 1.5M 75ohm
Speaker cable
3M
AV cable(Video
out only) 1.5M
USB cable NA
Remote Control 40keys
Battery AAAx2
Quickly guide 1
IFU 1
2.2 Mechanical General Information
The product appearances and functions are defined in their respective MUS. Product management
approves the MUS and it is a leading document where product appearance is applicable.
Please refer to Sh560 for mechanical information.
2.3 Safety Standards
Where applicable:
For /12 (EU), /05 (UK), /51 (Russia) EN/IEC 60065 7th Edition
For /37 (US, Canada) UL 60065
For /55 (LATAM), /78 (Brazil) IEC 60065 7th Edition
For /98 (AP), /69 (Singapore), /75 (Australia) IEC 60065 7th Edition
For /93 (China) GB 8898 (IEC 60065 7th Edition)
For /61 (Korea) K 60065 6th Edition
For /96 (Taiwan) CNS 14408 (IEC 60065 7th Edition)
2.4 EMC Requirements
Where applicable:
For /12 (EU), /05 (UK), /51 (Russia) EN55013: 2001, EN55020: 2002
For /37 (US, Canada) FCC15
For /55 (LATAM), /78 (Brazil) CISPR13
For /98 (AP), /69 (Singapore), /75 (Australia) CISPR13
For /61 (Korea) CISPR13/20
For /93 (China) GB 13837 (CISPR13)
For /96 (Taiwan) CNS 13439 (CISPR13)
Technical Specification and Connection Facilities
1-4

2.5 ESD Requirements
The product shall withstand electro static discharges on all user accessible parts of the product.
Reference: IEC61000-4-2.
For contact discharges:
Level General (kV) USA (kV) Requirement
1 0-2 0-3 No deviations allowed.
2 >2-4 >3-4 Short perceptible deviations allowed
3 >4-5 >4-5 Normal recallable functions function changes allowed.
4 >5-7 >5-7 Control recallable functions function changes allowed.
5 - >7-8 No loss of stored data allowed.
For air discharge:
Level General (kV) USA (kV) Requirement
1 0-4 0-6 No deviations allowed.
2 >4-8 >6-8 Short perceptible deviations allowed.
3 >8-10 >8-10 Normal recallable functions function changes allowed.
4 >10-15 >10-15 Control recallable functions function changes allowed.
5 - >15-18 No loss of stored data allowed.
General requirement:
1. 10 arcs for positive and negative polarity for unit “on” and “off” for 1kV incremental steps.
2. Component or mechanical damage is not allowed. No loss of fixed stored data (stored in EEPROMs).
3. Hang-ups and malfunctions are allowed, as long as the customer can “recover” from the hang-up by
pressing the Standby or ON/OFF button of the set.
4. Failures that disappear only by unplugging the AC mains cord and/or power sources are not acceptable.
2.6 Environmental Condition
The environmental condition requirements and test method is according to UAN-D1590.
Ambient temperature : max. 40 ° C - all climates
Apparatus acc. to spec. : +5 to + 35 ° C
Vibration test (acc. IEC 60 068/2/6) : operational vibration test to be proceeded in operating position of the
set.
2.7
Quality
PQR-class: class 2 according to BLC A&MA PQR handbook V2.1 (2006-10-02)
Lifetime: 7 years
Tested According to: General Test Instruction UAN-D 1591
Measured According to: UAN_L 1059 unless otherwise stated
Technical Specification and Connection Facilities
1-5

3. Technical Specifications
3.1 Power Supply
3.1.1 Type and versions
Build-inSMPS will be used for all models and stroke versions.
All using figure '8' socket, will cater for all versions:
Versions Region/Country SMPS Detachable mains cords
12 / 05 EUROPE / UK 1) 100 ~240Vac nom. (wide
range from 90V~264Vac limit)
used in all versions except
India.
Frequency: 47~63Hz.
EU (/12) round 2-pin & UK (/05) 3-pin
37 NAFTA UL flat pin (non-polarized)
nip-2dnuordeifitrecORTEMNIMATAL55
nip-2dnuorUECAPA89
94 India
2) 100 ~310Vac limit (India
compatible with up cost) used
only for India.
Frequency: 47~63Hz.
EU (/12) round 2-pin
All requirements per defined for each country should be met with sufficient testing.
3.1.2 Surge Immunity (Lightning Test)
The product shall withstand mains interference’s of:
Differential mode:
2kV/2 ohm criteria C for Europe.
6kV/12 ohm criteria C for NAFTA.
Parameters:
Bi-wave
Open circuit voltage: 2/50us
Short circuit current: 8/20us
From +/1kV to +/-2kV (for Europe) or +/-6kV (for Nafta) in steps of 1kV.
10 shots per combination.
One shot per minute.
Serial impedance: 2 Ohm for Europe, 12Ohm for Nafta.
Polarity and phase: Positive (phase 90º) & Negative (phase 270º)
Technical Specification and Connection Facilities
1-6

Common mode:
6kV/2 ohm criteria C for Europe.
6kV/12 ohm criteria C for Nafta.
Parameters:
Ring-wave (100kHz)
From +/3kV to +/-6kV in steps of 1 kV.
10 shots per combination.
One shot per minute.
Serial impedance: 2 Ohm for Europe, 12Ohm for Nafta
Polarity and phase: Positive (phase 90º) & Negative (phase 270º)
Reference: IEC61000-4-5 and for USA: 3135 019 8029 Reliability evaluation.
Requirements:
Apparatus should fulfil the leakage current requirements of IEC60065 point 9.1.1 (UAN-D1631)
Defects or permanent deviations are not allowed.
3.1.3 Mains Drop-out Immunity
The product shall withstand mains failures of:
Variation 0% (=100% dip) at T-event = 50 mSec. Performance criterion B
Variation 40% (=60% dip) at T-event = 100 mSec. Performance criterion B
Variation 0% (=100% dip) at T-event = 5 Sec. Performance criterion C
Additional for USA apparatus: See 3135 019 8029 Reliability evaluation.
Variation 0% (=100% dip) at T-event = 100 mSec in standby mode. Performance criterion B
Requirement:
No misoperation and no interference of user in order to guarantee continuation of performed function.
Reference: IEC61000-4-11 For measuring method refer to UAN-D1724, as far as applicable.
Performance criterions according to IEC61000-4-4 Amendment 1
Performance Requirement
Criterion A - No any degradation of specification.
Criterion B - Temporary degradation / self recoverable.
Criterion C - No damage, resolvable hang-up.
Criterion D - Not recoverable loss of function.
3.1.4 Power Consumption
Power consumption at nominal AC input:
1. CD play mode at 1/8 P-rated output power
MCD2010: ≤ W
2. Low Power Standby Mode : ≤ 0.5
10
W
Technical Specification and Connection Facilities
1-7

3.2 Technical Description
3.2.1 Audio Performance
traPlarenreG
Output Stage Protection: NA Temperature : Yes Short Circuit: Yes
srotacidnI
evitcAyalpsiDkcolC:rotacidnIedoMybdnatS
ffOsnruTDEL:edoMybdnatSrewoP
Electrical Data
Normal Limit
DSC: Y Channel Difference: ± 3dB -
DBB: Y Hum (Volmin --- Volma
x
-20dB) 150nW -
Bass: NA Residual Noise(Volume Minimum) 40nW -
Treble: NA Channel Seperation: 1kHz/10kHz 40dB/35dB
%0.1%8.0lamixaM,DHTAN:ssenduoL
Signal to Noise Ratio(A-weighted): 82dBA 77dBA
Bd55Bd06:klatsorC
Amplification Reserve 3dB 2dB
Audio Inputputs
Audio Input Sensitivity(± 3dB) rated output power at 1kHz Audio Output(*1)
Tuner FM 67.5kHz, Modulation (Limit:-6dB) Line Out(Left/Right) 2000mV±200mV
CD/MP3 -3dB track (Audio Disc 1, Track 1) Headphone 15mW ± 2 dB, RL
= 32Ω
)SH0.2(evaweniszHK1Bd3-BSU
AUX1(back) 1V; Rin ≥ 22kΩ
MP3_link(front) 750mV; Rin ≥ 22kΩ
IPOD Docking 750mV; Rin ≥ 22kΩ
Output Power(*1) At THD=10%, 1kHz
sinewave MCD2010
Main Operation for / all version (rms) 10W± 1dB ( At Cold Condition with 10% THD )
Tuner output power(rms) 10W± 1dB ( At Cold Condition with 10% THD )
Frequency Response(± 3dB) 30Hz-20kHZ
Loudspeaker(Boxes): Separable speaker
box
Refer to package document of Speaker Box Assy
Speaker driver Impedance: Right/Left: 6Ω @ 30 Hz ~ 20kHz(-3db)
:refoowbuS
REMARKS:
Electrical Parameters are to be measured at Speaker Terminals across rated impedance Load(6ohm) with
Rated Input Signal in CD Mode setting in DBB/Loudness Off and Pre-eq at Flat unless specified otherwise.
Technical Specification and Connection Facilities
1-8

3.2.2 Video Performance
3.2.2.1 CVBS
Description Test Signal Specification
NTSC PAL
Amplitude output 100% White 1Vpp ± 10% 1Vpp ± 10%
%01±Vm007%01±Vm417etihW%001rabetihW
%01±Vm003%01±Vm682etihW%001edutilpmA.cnyS
Burst Amplitude 75% Color bar 286mV, +1dB / -
4dB
300mV, +1dB / -
4dB
Burst / chroma ratio 100% Color bar ± 5% ± 5%
S/N luminance 100% White ≥
≥
≥
≥≥
≥
≥
≥60 dB 60 dB
S/N chroma
AM
PM
100% Red
57 dB
57 dB
60 dB
57 dB
Video Bandwidth
0.5MHz – 4MHz
4.8MHz
5.8MHz
Multi-burst
-1.5dB
-5dB
+1dB/-1dB
-2dB
-5dB
Chroma Subcarrier Frequency 75% Color bar 3.579545 MHz ±
25ppm 4.433618MHz ±
30ppm
Chroma / luminance delay 2T pulse 20ns ≤≤
≤≤
≤≤
≤≤
20ns
Subcarrier locked/unlocked 75% Color bar locked locked
kcalB%0leveLCD 1V 1V
3.2.2.2 Component Video (Y/Pb/Pr)
Description Test Signal Specification
Interlace/Progressive
NTSC PAL
%01±Vm0001%01±Vm0001etihW%001tuptuoedutilpmA
%01±Vm007%01±Vm417etihW%001rabetihW
PbPr peak to peak 75% Color bar 525mV ± 10% 535mV ± 10%
PbPr Output unbalance 75% Color bar 3% 3%
%01±Vm003Vm04±Vm682etihW%001edutilpmA.cnyS
S/N on outputs
Y
Pb / Pr
100% White
75% Color bar 60 dB 60 dB
Video Bandwidth
4.2MHz
5.8MHz
Multi-burst -1.5dB
-5dB
-1.5dB
-5dB
Video Bandwidth (Progressive)
8.4MHz
9.6MHz
Multi-burst -1.5dB
-5dB
-1.5dB
-5dB
kcalB%0leveLCD 1V 1V
Technical Specification and Connection Facilities
1-9

3.3 TUNER
FM use Silicon Lab Si4704/4705(w/RDS)
GENARAL PART
WAVE RANGE VERSION TOLERANCE TUNING GRID
FM 87.5 – 108.00 MHz /12 QUARTZ PRECISION 50kHz
AERIAL
FM : PIG TAIL ANT WIRE 75Ω
ELECTRICAL DATA
tinUtimiLmoNMF
fBd6202tnioPgnitimiLBd3-
1453)edomoeretsta(ytivitisneSgninuThcraeS
Search time digital tuning
system. - 60 S
zHM7.01FI
Bd1584gniteiuQBd64-oeretS
5405muHnoitaludoM
5405oitaRN/S
Bd4-0esreveRnoitacifilpmA
%32)zHk57.veDqrF,Vm1FR(noitrotsiD
Overall Frequency Response: 63Hz –
12.5KHz - ±3 dB
Channel separation:400 / 1000 / 5000 Hz.
RF input: 68 dBf
26/30/
20
20/26/
18 dB
Frequency (MHz) Noise Limited
Sensitivity 26 dB
Image
Rejection IF Rejection Large Signal
Handling
Selectivity
S9/300 kHz
220001460381.moNMF
)1*(81005545222.miL0.88
220001460381.moNMF
)1*(81005545222.miL0.89
54fBd611060381.moNMF
52fBd801565222.miL0.701
Units dBf DB dB mV/m dB
Susceptibility to unwanted signals(CPU,SMPS,AMP,DSP …):
Limited(d
B)
Normal
(dB) Remark
-15dB -20dB Refer to selfpollution curve
Technical Specification and Connection Facilities
1-10

Laser Beam Safety Precautions
This Blu-Ray player uses a pickup that emits a laser beam.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Location: Inside Top of Blu-Ray mechanism.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
2-1

Electronics N.V. bears no responsibility
for improper wall mounting that results in
accident, injury or damage.
For speakers with stands, use only the
supplied stands. Secure the stands to
the speakers tightly. Place the assembled
stands on flat, level surfaces that can
support the combined weight of the
speaker and stand.
Never place the product or any objects
on power cords or on other electrical
equipment.
If the product is transported in
temperatures below 5°C, unpack the
product and wait until its temperature
matches room temperature before
connecting it to the power outlet.
Visible and invisible laser radiation when
open. Avoid exposure to beam.
Do not touch the disc optical lens inside
the disc compartment.
Risk of overheating!
Never install this product in a confined
space. Always leave a space of at least
four inches around the product for
ventilation. Ensure curtains or other
objects never cover the ventilation slots
on the product.
Risk of contamination!
Do not mix batteries (old and new or
carbon and alkaline, etc.).
Remove batteries if they are exhausted
or if the remote control is not to be used
for a long time.
Batteries contain chemical substances,
they should be disposed of properly.
Product care
Do not insert any objects other than discs
into the disc compartment.
Do not insert warped or cracked discs
into the disc compartment.
Remove discs from the disc compartment
ifyouarenotusingtheproductforan
extended period of time.
Only use microfiber cloth to clean the
product.
Important
Important Safety Precautions
Read and understand all instructions before you use
your home theater. If damage is caused by failure to
follow instructions, the warranty does not apply.
Safety
Riskof electricshock or fire!
Neverexposetheproductand
accessories to rain or water. Never place
liquid containers, such as vases, near the
product. If liquids are spilt on or into the
product, disconnect it from the power
outlet immediately. Contact Philips
Consumer Care to have the product
checked before use.
Never place the product and accessories
near naked ames or other heat sources,
including direct sunlight.
Never insert objects into the ventilation
slots or other openings on the product.
Where the mains plug or an appliance
coupler is used as the disconnect device,
the disconnect device shall remain readily
operable.
Disconnect the product from the power
outlet before lightning storms.
When you disconnect the power cord,
always pull the plug, never the cable.
Riskof short circuit or re!
Before you connect the product to the
poweroutlet,ensurethatthepower
voltage matches the value printed on the
back or bottom of the product. Never
connecttheproducttothepoweroutlet
if the voltage is different.
Risk of injury or damage to the home theater!
For wall-mountable products, use only
the supplied wall mount bracket. Secure
the wall mount to a wall that can support
the combined weight of the product
and the wall mount. Koninklijke Philips
3-1
Caution: These servicing instructions are for use by qualified service personnel only.To reduce the risk
of electric shock do not perform any servicing other than that contained in the operating
instructions unless you are qualified to do so.

Disposal of your old product and
batteries
Your product is designed and manufactured
with high quality materials and components,
which can be recycled and reused.
When this crossed-out wheeled bin symbol
is attached to a product it means that the
product is covered by the European Directive
2002/96/EC.Pleaseinformyourselfaboutthe
local separate collection system for electrical
and electronic products.
Please act according to your local rules and
do not dispose of your old products with your
normal household waste.
Correct disposal of your old product helps to
prevent potential negative consequences for
the environment and human health.
Your product contains batteries covered by
the European Directive 2006/66/EC, which
cannot be disposed with normal household
waste.
Please inform yourself about the local rules
on separate collection of batteries because
correct disposal helps to prevent negative
consequences for the environmental and
human health.
Important Safety Precautions
3-2

4-1
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Note: This table is unofficial and for reference only. Be
sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
lower than or equal to the specified value in the table
below.
Measuring Method (Power ON):
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
AC Line Voltage Clearance Distance (d), (d’)
110V~220V 3.2 mm (0.126 inches)
AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:
110V~220V 0.15 µF CAP. & 1.5 k RES.
Connected in parallel i0.5 mA Peak Exposed accessible parts
Chassis or Secondary Conductor
Primary Circuit
Fig. 1
d' d
AC Voltmeter
(High Impedance)
Exposed Accessible Part
BEarth Ground
Power Cord Plug Prongs
Z
Fig. 2

1 Safety Instructions
1.1 General Safety
Safety regulations require that during a repair:
Connect the unit to the mains via an isolation transformer.
Replace safety components, indicated by the symbol ,
only by components identical to the original ones. Any
other component substitution (other than original type)
Safety regulations require that after a repair, you must return
the unit in its original condition. Pay, in particular, attention to
the following points:
Route the wires/cables correctly
mounted cable clamps.
damage.
Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the
two pins of the mains plug.
1.2 Laser Safety
This unit employs a laser
may remove the cover, or attempt to service this device (due
to possible eye injury).
Laser Device Unit
:AIGalnN(BD)
:AIGalnP(DVD)
: AIGalnP(CD)
epyT
Wavelength : 650 nm (DVD)
)DC/DCV(mn087:
405nm(BD):
Output Power : 20 mW
)gnitirwWR+DVD(
Wm8.0:
)gnidaerDVD(
Wm3.0:
)gnidaerDC/DCV(
Beam divergence : 60 degree
CLASS 1
LASER PRODUCT
1-2erugiF
Note: Use of controls or adjustments or performance of
procedure other than those speci ed herein, may result in
A
2 Warnings
2.1 General
All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD, ). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
4822 310 10671.
– Wristband tester 4822 344 13999.
Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is ‘off’!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A ‘lightning stroke’ and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
Never replace modules, or components, while the unit is
‘on’.
2.2 Laser
The use of optical instruments with this product, will
Only quali ed service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
Repair handling should take place as much as possible
with a disc loaded inside the player.
T
shield:
Figure 2-2
Safety Information, General Notes & Lead Free Requirements
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
5-1

6-1
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
3. The 1st pin of every male connector is indicated as
shown.
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 14-digit. Digit 5&6 shows the
YEAR, and digit 7&8 shows the WEEK.
So from onwards=from 1 Jan 2005 onwards
Important note : In fact also products of year 2004
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead-free). So best to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-
paste is required, please contact the manufacturer
of your solder-equipment. In general use of solder-
paste within workshops should be avoided because
paste is not easy to store and to handle.
Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
To reach at least a solder-temperature of 400°C,
To stabilize the adjusted temperature at the solder-
tip
To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around
360°C - 380°C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
Top View
Out In
Bottom View
Input
5
10
Pin 1
Pin 1
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
1 Jan 2005
0501
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicator-
label in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Donotre-useBGAsatall.
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
On our website
www.atyourservice.ce.Philips.com you find more
information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
Fig. S-1-1
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
6-2

3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
To Solid
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
6-3
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “ ” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Instructions for Handling Semi-
conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 M ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 M ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark. Fig. S-1-7
Presolder
CBA
Flat Pack-IC
Fig. S-1-8
<Incorrect>
CBA
Grounding Band
Conductive Sheet or
Copper Plate
1M
1M
<Correct>
CBA
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
6-4