
Directions for Use EN 5TES1.1E PA 3.
workshops should be avoided because paste is not easy to
store and to handle.
• Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilise the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilised at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to
avoid mixed regimes. If this cannot be avoided, carefully
clear the solder-joint from old tin and re-solder with new tin.
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be
purchased at external companies.
• For sets produced before 1.1.2005, containing leaded
soldering tin and components, all needed spare parts will
be available till the end of the service period. For the repair
of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with
mixed technologies), you can use the following method:
• Always use the highest temperature to solder, when using
SAC305 (see also instructions below).
• De-solder thoroughly (clean solder joints to avoid mix of
two alloys).
Caution: For BGA-ICs, you must use the correct temperature-
profile, which is coupled to the 12NC. For an overview of these
profiles, visit the website www.atyourservice.ce.philips.com
(needs subscription, but is not available for all regions)
You will find this and more technical information within the
"Magazine", chapter "Repair downloads".
For additional questions please contact your local repair help
desk.
2.3.4 Alternative BOM identification
In September 2003, Philips CE introduced a change in the way
the serial number (or production number, see Figure 2-1) is
composed. From this date on, the third digit in the serial
number (example: AG2B0335000001) indicates the number of
the alternative B.O.M. (Bill Of Materials) that has been used for
producing the specific TV set. In general, it is possible that the
same TV model on the market is produced with e.g. two
different types of displays, coming from two different suppliers.
This will then result in sets which have the same CTN
(Commercial Type Number; e.g. 28PW9515/12) but which
have a different B.O.M. number.
By looking at the third digit of the serial number, the service
technician can identify which B.O.M. is used for the TV set he
is working with.
If the third digit of the serial number contains the number 1
(example: AG1B033500001), then the TV set has been
manufactured according to B.O.M. number 1. If the third digit is
a 2 (example: AG2B0335000001), then the set has been
produced according to B.O.M. no. 2. Information about this is
important for ordering the correct spare parts!
For the third digit, the numbers 1...9 and the characters A...Z
can be used, so in total: 9 plus 26 = 35 different B.O.M.s can
be indicated by the third digit of the serial number.
2.3.5 Exchanging a Defective PDP
If a PDP has defective or "dead" pixels, do the following:
1. Locate the defective pixels.
2. Indicate their positions by means of a marker (with
erasable ink!).
3. Indicate the positions of the defective pixels in the Defects
Description Form (DDF), which is published in the PDP
manuals.
4. After this, remove the PDP and return it to your Service
organisation.
If a PDP has to be removed from the TV set, always keep in
mind that the PDP parts can easily be damaged by ESD, so
take the following protective measures:
• Do not damage the flex foils (they are located on the left,
right, upper and lower sides of the PDP).
• Do not scratch the glass plate.
• Avoid fingerprints.
2.3.6 Board Level Repair (BLR) or Component Level Repair
(CLR)
If a board is defective, consult your repair procedure to decide
if the board has to be exchanged or if it should be repaired on
component level.
If your repair procedure says the board should be exchanged
completely, do not solder on the defective board. Otherwise, it
cannot be returned to the O.E.M. supplier for back charging!
2.3.7 Practical Service Precautions
•It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
•Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
3. Directions for Use
You can download this information from the following websites:
http://www.philips.com/support
http://www.p4c.philips.com