SimCom SIM7000 Series Supplement
SIM7000 _Hardware Design_V1.04
SIMCOM CONFIDENTIAL FILE
Smart Machine Smart Decision
SIM7000 _Hardware Design _V1.04 2018-1-31
Document Title SIM7000 _Hardware Design
Version 1.04
Date 2018-1-31
Status Released
Document Control ID SIM7000 _ Hardware Design_V1.04
General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2018
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SIM7000 _Hardware Design _V1.04 2018-1-31
Contents
Contents .............................................................................................................................................3
Table Index ........................................................................................................................................5
Figure Index ......................................................................................................................................7
Revision History................................................................................................................................8
1Introduction................................................................................................................................9
1.1 Product Outline ...................................................................................................................10
1.2 Hardware Interface Overview .............................................................................................11
1.3 Hardware Block Diagram....................................................................................................12
1.4 Functional Overview...........................................................................................................13
2Package Information................................................................................................................15
2.1 Pin Assignment Overview...................................................................................................15
2.2 Pin Description....................................................................................................................17
2.3 Mechanical Information ......................................................................................................20
2.4 Footprint Recommendation.................................................................................................21
3Interface Application ...............................................................................................................22
3.1 Power Supply ......................................................................................................................22
3.1.1 Power Supply Design Guide ........................................................................................23
3.1.2 Recommended Power Supply Circuit ..........................................................................23
3.1.3 Voltage Monitor............................................................................................................24
3.2 Power on/Power off/Reset Function....................................................................................25
3.2.1 Power on.......................................................................................................................25
3.2.2 Power off ......................................................................................................................26
3.2.3 Reset Function..............................................................................................................28
3.3 UART Interface ...................................................................................................................29
3.3.1 UART Design Guide ....................................................................................................29
3.3.2 RI and DTR Behavior...................................................................................................30
3.4 USB Interface......................................................................................................................31
3.5 SIM Interface ......................................................................................................................32
3.5.1 SIM Application Guide ................................................................................................33
3.6 PCM Interface .....................................................................................................................34
3.6.1 PCM timing ..................................................................................................................34
3.6.2 PCM Application Guide ...............................................................................................36
3.7 I2C Interface........................................................................................................................36
3.8 Network status.....................................................................................................................37
3.9 Other interface.....................................................................................................................38
3.9.1 ADC .............................................................................................................................38
3.9.2 LDO..............................................................................................................................38
4RF Specifications......................................................................................................................39
4.1 GSM/LTE RF Specifications...............................................................................................39
4.2 GSM/LTE Antenna Design Guide.......................................................................................42
4.3 GNSS ..................................................................................................................................43
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4.3.1 GNSS Technical specification ......................................................................................43
4.3.2 GNSS Application Guide .............................................................................................43
4.4 RF traces note......................................................................................................................45
4.4.1 RF traces layout ................................................................................................................45
4.4.2 LTE ANT and other system ANT decoupling ...................................................................46
5Electrical Specifications...........................................................................................................47
5.1 Absolute maximum ratings .................................................................................................47
5.2 Operating conditions ...........................................................................................................48
5.3 Operating Mode ..................................................................................................................49
5.3.1 Operating Mode Definition ..........................................................................................49
5.3.2 Sleep mode ...................................................................................................................50
5.3.3 Minimum functionality mode and Flight mode............................................................50
5.3.4 Power Saving Mode (PSM)..........................................................................................50
5.3.5 Extended Mode DRX (e-DRX)....................................................................................51
5.4 Current Consumption ..........................................................................................................52
5.5 ESD Notes...........................................................................................................................54
6SMT Production Guide ...........................................................................................................55
6.1 Top and Bottom View of SIM7000 .....................................................................................55
6.2 Label Information................................................................................................................56
6.3 Typical SMT Reflow Profile ...............................................................................................57
6.4 Moisture Sensitivity Level (MSL) ......................................................................................58
6.5 Baking .................................................................................................................................59
6.6 Stencil Foil Design Recommendation.................................................................................60
7Packaging..................................................................................................................................61
7.1 Tray packaging....................................................................................................................61
Appendix..........................................................................................................................................64
A. Reference Design......................................................................................................................64
B. Design check list.......................................................................................................................65
C. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................67
D. Related Documents...................................................................................................................69
E. Terms and Abbreviations..........................................................................................................71
F. Safety Caution ...........................................................................................................................73
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SIM7000 _Hardware Design _V1.04 2018-1-31
Table Index
Table 1: SIM7000 frequency bands and air interface......................................................................................... 10
Table 2: General features ................................................................................................................................... 13
Table 3: Pin definition........................................................................................................................................ 16
Table 4: IO parameters definition....................................................................................................................... 17
Table 5: Pin description...................................................................................................................................... 17
Table 6: VBAT pins electronic characteristic ..................................................................................................... 22
Table 7: Recommended TVS diode list.............................................................................................................. 23
Table 8: Power on timing and electronic characteristic...................................................................................... 25
Table 9: Power off timing and electronic characteristic ..................................................................................... 27
Table 10: RESET pin electronic characteristic................................................................................................... 28
Table 11: UART electronic characteristic........................................................................................................... 30
Table 12: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) ........................................................32
Table 13: SIM electronic characteristic 3.0V mode (SIM_VDD=2.95V) ..........................................................32
Table 14: PCM format........................................................................................................................................ 34
Table 15: PCM timing parameters ..................................................................................................................... 35
Table 16: NETLIGHT pin status........................................................................................................................ 37
Table 17: ADC electronic characteristics ........................................................................................................... 38
Table 18: Electronic characteristic ..................................................................................................................... 38
Table 19: Conducted transmission power .......................................................................................................... 39
Table 20: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3 ........................................39
Table 21: Operating frequencies ........................................................................................................................ 40
Table 22: E-UTRA operating bands................................................................................................................... 40
Table 23: Conducted receive sensitivity............................................................................................................. 40
Table 24: CAT-M1 Reference sensitivity (QPSK).............................................................................................. 41
Table 25: CAT-NB1 Reference sensitivity (QPSK)............................................................................................ 41
Table 26: Trace loss ........................................................................................................................................... 42
Table 27: Recommended TVS ........................................................................................................................... 42
Table 28: Absolute maximum ratings................................................................................................................. 47
Table 29: Recommended operating ratings ........................................................................................................ 48
Table 30: 1.8V Digital I/O characteristics*........................................................................................................ 48
Table 31: Operating temperature........................................................................................................................ 48
Table 32: Operating mode Definition................................................................................................................. 49
Table 33: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 52
Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.) ............................ 54
Table 35: The description of label information .................................................................................................. 56
Table 36: Moisture Sensitivity Level and Floor Life ......................................................................................... 58
Table 37: Baking conditions............................................................................................................................... 59
Table 38: Tray size ............................................................................................................................................. 62
Table 39: Small Carton size ............................................................................................................................... 62
Table 40: Big Carton size................................................................................................................................... 63
Table 41: Schematic Check List......................................................................................................................... 65
Table 42: PCB Layout Check List...................................................................................................................... 65
Table 43: Coding Schemes and Maximum Net Data Rates over Air Interface...................................................67
Table 44: Related Documents ............................................................................................................................ 69
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SIM7000 _Hardware Design _V1.04 2018-1-31
Table 45: Terms and Abbreviations.................................................................................................................... 71
Table 46: Safety Caution.................................................................................................................................... 73
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SIM7000 _Hardware Design _V1.04 2018-1-31
Figure Index
Figure 1: SIM7000 block diagram ..................................................................................................................... 12
Figure 2: Pin assignment overview .................................................................................................................... 15
Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 20
Figure 4: Footprint recommendation (Unit: mm)............................................................................................... 21
Figure 5: VBAT voltage drop during burst emission (EDGE/GPRS) ................................................................ 22
Figure 6: Power supply application circuit......................................................................................................... 23
Figure 7: Linear regulator reference circuit ....................................................................................................... 24
Figure 8: power supply reference circuit (NB only)........................................................................................... 24
Figure 9: Reference power on/off circuit ........................................................................................................... 25
Figure 10: Power on timing sequence................................................................................................................ 25
Figure 11: Power off timing sequence................................................................................................................ 27
Figure 12: Reference reset circuit ...................................................................................................................... 28
Figure 13: UART full modem ............................................................................................................................ 29
Figure 14: UART null modem ........................................................................................................................... 29
Figure 15: Reference circuit of level shift.......................................................................................................... 30
Figure 16: RI behaviour（SMS and URC report）........................................................................................... 30
Figure 17: USB reference circuit ....................................................................................................................... 31
Figure 18: SIM interface reference circuit ......................................................................................................... 33
Figure 19: PCM_SYNC timing.......................................................................................................................... 34
Figure 20: External codec to module timing...................................................................................................... 34
Figure 21: Module to external codec timing ...................................................................................................... 35
Figure 22: Audio codec reference circuit ........................................................................................................... 36
Figure 23: I2C reference circuit ......................................................................................................................... 36
Figure 24: NETLIGHT reference circuit............................................................................................................ 37
Figure 25：Power on sequence of the VDD_EXT ............................................................................................ 38
Figure 26: Antenna matching circuit (MAIN_ANT).......................................................................................... 42
Figure 27: Active antenna circuit ....................................................................................................................... 43
Figure 28: Passive antenna circuit (Default) ...................................................................................................... 44
Figure 29: RF trace should be far away from other high speed signal lines....................................................... 45
Figure 30: The distance between GND to the inner conductor of SMA............................................................. 45
Figure 31: e-DRX diagrammatic sketch............................................................................................................. 51
Figure 32: Top and bottom view of SIM7000.................................................................................................... 55
Figure 33: Label information ............................................................................................................................. 56
Figure 34: The ramp-soak-spike reflow profile of SIM7000 ............................................................................. 57
Figure 33: stencil recommendation (Unit: mm) ................................................................................................. 60
Figure 35: packaging diagram............................................................................................................................ 61
Figure 36: Tray drawing..................................................................................................................................... 61
Figure 37: Small carton drawing........................................................................................................................ 62
Figure 38: Big carton drawing ........................................................................................................................... 62
Figure 39: Reference design .............................................................................................................................. 64
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Revision History
Data Version Description of change Author
2017-05-23 1.00 Original Tu Hongjun
Li Ya
2017-07-13 1.01 1. Update the data of Table 1, Table 23 and Table 24
2. Update figure 3 and figure 4 Li Ya
2017-08-29 1.02
1. Update the description of RI and DTR.
2. Update the description of voltage monitor.
3. Update the description of power off function.
4. Update the description of the remarks
of some
nonsupport function in existing software, such as PCM,
I2C, SIM_DET.
5. Update the mechanical information.
6. Update the data of Table 1.
7. Update the data of Table 32.
8. Add ESD testing condition.
Tu Hongjun
2017-09-18 1.03 Update the data of Table 32.
Tu Hongjun
2018-1-31 V1.04
1. Change the description GSM to GPRS and EDGE.
2. Update the table related documents.
3. Update the picture block diagram.
4. Update the picture Pin assignment overview.
5. Add comment for Galileo.
6. Delete the recommended type of SIM card socket.
7. Update the baking information.
8. Add the PSM and e-DRX information.
9. Add the design check list information.
10. Add the table 41and table 42
Tu Hongjun
Li ya
SIMCOM CONFIDENTIAL FILE
1Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom SIM7000 series module. With the help of this
document and other SIM7000 series software application notes/user guides, users can understand
and use SIM7000 series module to design and develop applications quickly.
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1.1 Product Outline
The SIM7000 series modules support LTE CAT-M1、LTE CAT-NB1、GPRS and EDGE.
The physical dimension of SIM7000 is 24 ×24 ×2.6mm mm. And the physical dimension is
compatible with the packaging of SIM900, SIM800 and SIM800F.
Table 1: SIM7000 frequency bands and air interface
Standard Frequency
Variants
SIM7000
A
SIM7000
C
SIM7000
E
SIM7000
JC
SIM7000
C-N
SIM7000
E-N
SIM7000
G
GPRS
GSM850MHz
EGSM900MHz
DCS1800MHz
PCS1900MHz
LT E -FDD
HD-FDD
LT E -FDD B1
LT E -FDD B2
LT E -FDD B3
LT E -FDD B4
LT E -FDD B5
LT E -FDD B8
LT E -FDD B12
LT E -FDD B13
LT E -FDD B18
LT E -FDD B19
LT E -FDD B20
LT E -FDD B25
LT E -FDD B26
LT E -FDD B28
LT E -FDD B39
Category
LT E -M1
Category
LT E -NB1
GNSS
GPS
GLONASS
BeiDou
Galileo
*
*Note: Galileo is default closed in software. But users can open it via AT command
“AT+CGNSMOD”. For more information about these AT commands, please refer to
Document [1]
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1.2 Hardware Interface Overview
The interfaces are described in detail in the next chapters include:
●Power Supply
●USB Interface
●UART Interface
●SIM Interface
●ADC
●LDO Power Output
●PCM Interface
●I2C Interface
●GPIOs
●Antenna Interface
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1.3 Hardware Block Diagram
The block diagram of the SIM7000 module is shown in the figure below.
USB
(U) SIM Card
Wireless
Base- band
Processor
Power Management Unit
Memory
RF
Transceiver
26MHz
GNSS
RF
GPRS/LTE
RF PA
GPRS/LTE
RF SWITCH
receive
transmit
GNSS
ANT
Main
ANT
PWRKEY
NRESET USB_ VBUS
VBAT( Supply)
SIM_VDD
UART
GPIO(s)
I2C
PCM
ADC
VDD_EXT
Figure 1: SIM7000 block diagram
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1.4 Functional Overview
Table 2: General features
Feature
Implementation
Power supply
Power supply voltage 3.0
～
4.3V.
Power saving Current in sleep mode: 1.2mA (@DRX=2.56s).
Current in PSM mode: 9uA.
Radio frequency bands
Please refer to the table 1
Transmitting power
GPRS power class:
--EGSM900: 4 (2W).
--DCS1800: 1 (1W).
EDGE power class:
--EGSM900: E2 (0.5W).
--DCS1800: E1 (0.4W).
LT E power class: 3 (0.25W).
Data Transmission
Throughput
GPRS multi-slot class 12.
EDGE multi-slot class 12.
LT E C AT M1 : 300Kbps (DL).
LT E C AT M1 : 375Kbps (UL).
LT E CAT NB1: 34Kbps (DL).
LTE CAT NB1: 66Kbps (UL).
Antenna GPRS/EDGE/LTE main antenna.
GNSS antenna.
GNSS GNSS engine (GPS, GLONASS, BD and Galileo).
Protocol: NMEA.
SMS MT, MO, CB, Text and PDU mode.
SMS storage: SIM card or ME (default).
SIM interface Support identity card: 1.8V/ 3V.
SIM application toolkit Support SAT class 3, GSM 11.14 Release 98.
Support USAT.
Audio feature
Support PCM interface.
Only support PCM master mode and short frame sync, 16-bit linear data
formats.
UART interface
A full modem serial port by default.
Baud rate: 300bps to 3686400bps. Default rate is 0bps (auto baud rate).
Support auto baud rate, but only limited to 9600, 19200, 38400, 57600
and 115200 bps.
Can be used as the AT commands or data stream channel.
Support RTS/CTS hardware handshake.
USB USB 2.0 high speed interface.
Firmware upgrade Firmware upgrade over USB interface
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Physical characteristics
Size:24
×
24
×
2.6mm
Weight:3g
Temperature range
Normal operation temperature: -30°C to + 80°C
Extended operation temperature: -40°C to + 85°C*
Storage temperature -45°C to + 90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/EDGE/LTE traffic in -40℃~ +85℃. The performance will be reduced slightly from the
3GPP specifications if the temperature is outside the normal operating temperature range and
still within the extreme operating temperature range.
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2Package Information
2.1 Pin Assignment Overview
All functions of the SIM7000 will be provided through 68 pads that will be connected to the
customers’ platform. The following Figure is the pin assignment of the SIM7000.
Figure 2: Pin assignment overview
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Table 3: Pin definition
Pin No. Pin Name Pin No. Pin Name
1 PWRKEY 2 GND
3 DTR 4 RI
5 DCD 6 BOOT_CFG
7
CTS
8
RTS
9 TXD 10 RXD
11 PCM_CLK 12 PCM_SYNC
13 PCM_DIN 14 PCM_DOUT
15 VDD_EXT 16 NRESET
17 GND 18 GND
19 NC 20 NC
21 NC 22 NC
23 MDM_LOG_TX 24 USB_VBUS
25
ADC
26
NC
27 USB_DP 28 USB_DM
29 GND 30 SIM_VDD
31 SIM_D ATA 32 SIM_CLK
33 SIM_RST 34 SIM_DET
35 NC 36 NC
37
I2C_SDA
38
I2C_SCL
39 GND 40 NC
41
NC
42
NC
43
NC
44
NC
45 GND 46 GND
47 NC 48 GPIO4
49 GPIO1/UART3_RXD 50 GPIO0/UART3_TXD
51
NC
52
NETLIGHT
53
GNSS_ANT
54
GND
55 VBAT 56 V B AT
57 VBAT 58 GND
59 GND 60 RF_ANT
61 GND 62 GND
63
GND
64
GND
65 GND 66 S TAT U S
67 GPIO2 68 GPIO3
NOTE: Before the normal power up, BOOT_CFG cannot be pulled up.
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2.2 Pin Description
Table 4: IO parameters definition
Pin type Description
PI
Power input
PO
Power output
AI
Analog input
AIO
Analog input/output
I/O
Bidirectional input /output
DI
Digital input
DO
Digital output
DOH
Digital output with high level
DOL
Digital output with low level
PU
Pull up
PD
Pull down
Table 5: Pin description
Pin name Pin No.
Default
status
Description Comment
Power supply
VBAT
55
、
56
、
57
PI
Power supply, voltage range:
3.0
～
4.3V.
VDD_EXT 15 PO
LDO power output 1.8V for
other external circuits with Max
50mA current output.
This power supple
only use for external
GPIO pulling up or
level shift circuit.
If unused, keep it
open.
GND
2
、
17
、
18、29、
39、45、
46、54、
58、59、
61、62、
63、64、
65
Ground
System Control
PWRKEY 1 DI,PU
System power on/off control
input, active low. The efficient
input level must be below 0.5V.
The level is 0.8V when
this PIN is floating;
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NRESET 16 DI, PU System reset control input,
active low.
NRESET has been
pulled up to 1.8V via
40Kohm resistor
internally.
SIM interface
SIM_D ATA 31 I/O,PU
SIM Card data I/O, which has
been pulled up via a 10KR
resistor to SIM_VDD
internally. Do not pull it up or
down externally.
All lines of SIM
interface should be
protected against ESD.
SIM_RST
33
DO
SIM Reset
SIM_CLK 32 DO SIM clock
SIM_VDD 30 PO
Power output for SIM card, its
output Voltage depends on SIM
card type automatically. Its
output current is up to 50mA.
SIM_DET 34 DI SIM card detecting input.
If used, keep a 10kΩ
resistor pulling up to
the VDD_EXT
USB*
USB_VBUS 24 DI,PD Valid USB detection input with
3.5~5.25V detection voltage
Software download
interface.
USB_DP 27 I/O
Positive line of the differential,
bi-directional USB signal.
USB_DM 28 I/O Negative line of the differential,
bi-directional USB signal.
UART interface
DTR 3 DI,PU DTE get ready
If unused, keep them
open.
RI 4 DOH Ring Indicator
DCD
5
DOH
Carrier detects
CTS
7
DOH
Clear to Send
RTS 8 DI,PU Request to send
TXD 9 DOH Transmit Data
RXD
10
DI,PU
Receive Data
I2C interface
I2C_SDA 37 I/O I2C clock output If unused, keep open,
or else pull them up
via 2.2KΩ resistors to
the VDD_EXT.
I2C_SCL 38 DO I2C data input/output
PCM interface
PCM_CLK
11
DO
PCM data bit clock.
If unused, please keep
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PCM_SYNC
12
DO
PCM data frame sync signal.
them open.
PCM_DIN
13
DI
PCM data input.
PCM_DOUT
14
DO
PCM data output.
GPIO
NETLIGHT 52 DO
LED control output as network
status indication.
If unused, keep them
open.
S TAT U S 66 DO
Operating status output.
High level: Power on and
firmware ready
Low level: Power off
GPIO0 50 IO
Default: GPIO
Optional: UART3_TXD in
DAM application
GPIO1 49 IO
Default: GPIO
Optional: UART3_RXD in
DAM application
GPIO2 67 IO GPIO
GPIO3 68 IO GPIO
GPIO4
48
IO
GPIO
RF interface
GNSS_ANT 53 AI GNSS antenna soldering pad
RF_ANT 60 AIO MAIN antenna soldering pad
Other interface
BOOT_CFG 6 DI,PD
If it needs to enter into forced
USB download mode, it must
be pulling up this pin to
VDD_EXT before press the
P W R K E Y.
If it needs to boot up normally,
please keep this pin open.
Reserve a test points
for it. Keep it open.
DO NOT PULL UP
DURING NORMAL
POWER UP!
MDM_LOG_T
X 23 DO Module
log output for SW
debug. (only used for platform)
Reserve a test point for
it.
ADC 25 AI
Analog-digital converter input.
voltage range: 0
～
V B AT.
If unused, keep them
open.
NC
19
、
20
、
21、22
、
26、35、
36、40、
41、42
、
43、44
、
47
、
51、
No connection. Keep it open
Note: Please reserve a test point for BOOT_CFG, VDD_EXT and MDM_LOG_TX. If
there is no USB connector, please also reserve a test point for USB_VBUS, USB_DP,
and USB_DM for Firmware upgrade.
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2.3 Mechanical Information
The following figure shows the package outline drawing of SIM7000.
Figure 3: Dimensions (Unit: mm)
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