Laird BL600 Series Quick setup guide

Single Mode Bluetooth Low
Energy (BLE) Module
Part # BL600-SA, BL600-SC, BL600-ST
HARDWARE INTEGRATION GUIDE
VERSION 1.0
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CONN-UM-BL600_v1_0
REVISION HISTORY
Version
Revision Date
Change History
Version 1.0
16April13
Initial Release

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CONN-UM-BL600_v1_0
CONTENTS
Revision History...............................................................................................................................................2
Contents.........................................................................................................................................................3
Overview and Key Features.......................................................................................................................51
Specification.............................................................................................................................................62
Hardware Specifications ...........................................................................................................................93
3.1 Block Diagram and Pin-out .........................................................................................................9
3.1 Pin Definitions ..........................................................................................................................10
3.1 Electrical Specifications .............................................................................................................12
Power Consumption...............................................................................................................................154
4.2 Measured peak current waveforms during advertising and connection.....................................17
4.3 Peripheral block current consumption.......................................................................................20
Functional Description ............................................................................................................................215
5.1 Power management (includes brown-out and power on reset).................................................21
5.2 Clocks ......................................................................................................................................22
5.3 Memory for smart BASIC application code ...............................................................................22
5.4 RF.............................................................................................................................................22
5.5 UART Interface .........................................................................................................................22
5.6 SPI Bus .....................................................................................................................................23
5.7 I2C Interface.............................................................................................................................24
5.8 General Purpose I/O, ADC and Quadrature Decoder.................................................................24
5.9 nRESET pin ...............................................................................................................................25
5.10 nAutoRUN pin ..........................................................................................................................25
5.11 Miscellaneous (Hidden JTAG)....................................................................................................25
5.12 BL600-SA on-board chip antenna characteristics ......................................................................26
Hardware Integration Suggestions..........................................................................................................276
6.1 Circuit ......................................................................................................................................27
6.2 PCB Layout on Host PCB - General ...........................................................................................28
6.3 PCB Layout on Host PCB for BL600-SA.....................................................................................28
6.4 50-Ohms RF trace on Host PCB for BL600-ST ...........................................................................30
6.5 External Antenna Integration with BL600-SC and BL600-ST .....................................................32
Mechanical Details .................................................................................................................................337
Application Note for Surface Mount Modules.........................................................................................358

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CONN-UM-BL600_v1_0
8.1 Introduction .............................................................................................................................35
8.2 Shipping...................................................................................................................................35
8.3 Reflow Parameters ...................................................................................................................36
FCC and IC Regulatory Statements .........................................................................................................379
Japan (MIC) Regulatory ..........................................................................................................................4010
CE Regulatory.........................................................................................................................................4011
EU DECLARATIONS OF CONFORMITY ....................................................................................................4112
Ordering Information .............................................................................................................................4213
Bluetooth SIG Approvals.........................................................................................................................4314

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CONN-UM-BL600_v1_0
OVERVIEW AND KEY FEATURES1
Every BL600 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy (BLE) to
small, portable, power –conscious devices. The BL600 modules are enabled with Laird’s smart BASIC, an
event-driven programming language that enables OEMs to make their BLE product development quicker, and
simpler, significantly reducing time to market. smart BASIC enables customers to develop a complete
embedded application inside the compact BL600 hardware, connecting to a wide array of external sensors via
its I2C, SPI, UART, ADC or GPIO interfaces.
Based on the world-leading Nordic Semiconductor nRF51822 chipset, the BL600 modules provide ultra-low
power consumption with outstanding wireless range via 4dBm of transmit power. A broad range of BLE
profiles including Temperature and Heart Rate are available and smart BASIC provides the ideal mechanism to
support any BLE profile development of your choice.
Features & Benefits
Application Areas
Bluetooth v4.0 - Single Mode
External or Internal Antennas
 smart BASIC programming language
Full Bluetooth EPL
Compact Footprint
Programmable TX power 4 dBm to -20 dBm
TX whisper mode (-30 dBm, -55 dBm)
RX sensitivity: -91 dBm
Ultra low power consumption
TX: 11.6 mA peak (at +4 dBm)
RX: 8.8 mA peak
Standby Doze: 3.5 uA
Deep Sleep: 0.4 uA (refer to Note4 in Power Consumption
section)
UART, GPIO, ADC, I2C, and SPI interfaces
Fast Time to Market
FCC, CE, IC, and Japan certified; other regulatory
certifications on request
No external components required
Medical devices
Wellness devices
iOS “appcessories”
Fitness sensors
Location Awareness
Home automation

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CONN-UM-BL600_v1_0
SPECIFICATION2
2.1 Specification Summary
Table 1: Specifications
Categories
Feature
Implementation
Wireless Specification
Bluetooth®
V4.0 –Single Mode
Slave (in base FW v1.1.50.0)
Frequency
2.402 - 2.480 GHz
Maximum Transmit Power
Setting
4 dBm
Conducted BL600-SA
4 dBm
Conducted BL600-SC
~2.5 dBm
Conducted BL600-ST (RSMA
connector on dev board)
Minimum Transmit Power
Setting
-20 dBm (in 4 dB steps) with smart BASIC command
-16 dBm
-12 dBm
- 8 dBm
- 4 dBm
0 dBm
TX Whisper Mode1
Transmit Power
-30 dBm (min) with smart BASIC command
TX Whisper Mode2
Transmit Power
-55 dBm (min) with smart BASIC command
Receive Sensitivity
(0.1% BER)
-91 dBm typical
Link Budget
95 dB (@ 1 Mbps)
Range
Up to 150 m in free space
TX Whisper Modes
Range (TX Whisper
Mode2)
Range reduction feature with TX Whisper Modes
with smart BASIC command.
~30 cm
Raw Data Rates
1 Mbps (over the air)
Host Interface
TOTAL
28 x Multifunction I/O lines
UART
TX, RX, CTS, RTS
DCD, RI, DTR, DSR, CTS, RTS (Note1)
Default 9600, n,8, 1
From 1,200 to 115,200bps
GPIO
Up to 28 lines
ADC
6 lines
8, 9, 10 bit resolution
1.2 V internal reference
1/1, 2/3, 1/3 pre-scaling
I2C
2 lines (Note2)

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CONN-UM-BL600_v1_0
Categories
Feature
Implementation
SPI
3 lines (Note 3)
Profiles
Services supported
(Note 4)
(FW v1.1.50.0)
Heart Rate Service
Health Thermometer Service
Battery Alert Service
Blood Pressure Service
Device Information Service
Immediate Alert Service
IOPT (Interoperability)
Link Loss Service
Transmit Power Service
FW upgrade
smart BASIC runtime
engine FW(Note5)
upgrade
smart BASIC application
script upgrade
Via JTAG (until further notice). Using the supplied
J-link programmer.
Via UART (in future FW).
Via UART.
Programmability
smart BASIC
On-board Programming language similar to BASIC.
Control Protocols
Any
User defined via smart BASIC
Operating Modes
Self-contained Run mode:
Interactive / development
mode:
Selected by nAutoRun pin status:
LOW (0V). Then runs $autorun$ ( smart BASIC
application script) if it exists.
HIGH (VCC). Then runs via at+run (and “file name”
of smart BASIC application script).
Supply Voltage
Supply (VCC)
2.1 –3.6 V –internal DCDC converter
1.8 –3.6 V –internal LDO
DCDC switched on if VCC>2.1V at power-up.
Power Consumption
Active Modes Peak
Current (for Max TX PWR
4 dBm)
Advertising or
Connected mode
11.6 mA peak TX
8.9 mA peak RX
Active Modes Peak
Current for TX Whisper
mode2 PWR -55 dBm)
Advertising or
Connected mode
5 mA peak TX
8.5 mA peak RX
Active Modes Average
Current
Depends on many factors, refer to section Power
Consumption.
Ultra Low Power Modes
Standby Doze
Deep Sleep
3.5 uA
400 nA (Note 5)
Antenna Options
Internal
Ceramic chip monopole antenna –on-board
BL600-SA
External –Option 1
Dipole antenna (with IPEX connector)
Dipole PCB antenna (with IPEX connector)
Connection via IPEX MH4 –BL600-SC
External –Option 2
Dipole antenna (with RSMA connector)
Connection via Trace Pads –BL600-ST

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CONN-UM-BL600_v1_0
Categories
Feature
Implementation
Physical
Dimensions
Weight
19 mm x 12.5 mm x 3 mm
<1 gram
Environmental
Operating
-25 ˚C to +75 ˚C
Storage
-40 ˚C to +85 ˚C
Miscellaneous
Lead Free
Lead-free and RoHS compliant
Warranty
1 Year
Development Tools
Development Kit
Development Kit DVK-BL600-Sx and
Free Software Tools
Approvals
Bluetooth®
End Product Listing (EPL)
FCC / IC / CE / MIC
All BL600 Series
Note 1: DSR, DTR, RI, and DCD can be implemented in smart BASIC Application.
Note 2: With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL MUST be
connected externally as per I2C standard.
Note 3: SPI CS is created by customer using any spare SIO pin within their smart BASIC application script
allowing multi-dropping
Note 4: BL600 module comes loaded with smart BASIC runtime engine FW, but does not come loaded with
any smart BASIC application script (as that is dependent on customer end application or use).
Laird provides many sample smart BASIC application scripts covering the services listed.
Additional BLE services being added every quarter.
Note 5: Current Nordic silicon ~1000nA (typical). In next silicon revision this figure is expected
to be within specification (400nA).

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CONN-UM-BL600_v1_0
HARDWARE SPECIFICATIONS3
3.1 Block Diagram and Pin-out
Figure 1: Functional HW and SW block Diagram for BL600 series BLE smart BASIC module
Figure 2: BL600-Sx module pin-out (top view).
Note: Pin 30 RF_ANT for BL600-ST only. On BL600-SA, BL600-SC, pin 30 is NC.

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CONN-UM-BL600_v1_0
3.1 Pin Definitions
Table 2: Pin definitions
Pin
#
Pin
Designation
Default
Function
Alternate
Function
Default
Direction
Notes
Comment
1
GND
2
SIO_1
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution. Voltage
scaling 1/1, 2/3, 1/3.
3
GND
4
SIO_2
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution. Voltage
scaling 1/1, 2/3, 1/3.
5
SIO_3
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling 1/1, 2/3, 1/3.
6
SIO_4
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling 1/1, 2/3, 1/3.
7
SIO_5
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling 1/1, 2/3, 1/3.
8
SIO_6
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling 1/1, 2/3, 1/3.
9
SIO_7
DIO
IN
1,2
10
VCC
11
GND
12
SIO_8
DIO
I2C SDA
IN
1,2,4,5,6
I2COPEN() in smart BASIC selects
I2C function
13
SIO_9
DIO
I2C SCL
IN
1,2,4,5,6
14
SIO_10
DIO
SPI MOSI
IN
1,2,4,5,6
SPIOPEN() in smart BASIC selects
SPI function, MOSI and CLK will
be outputs when in SPI master
mode. Note 11.
15
SIO_11
DIO
SPI MISO
IN
1,2,4,5,6
16
SIO_12
DIO
SPI CLK
IN
1,2,4,5,6
17
GND
18
SIO_13
DIO
IN
1,2
19
SIO_14
DIO
IN
1,2
20
SIO_15
DIO
IN
1,2
Laird Devkit : Buzzer output
21
SIO_16
DIO
IN
1,2
Laird Devkit : Button 0 input
22
nRESET
IN
9,10
System Reset (Active low)
23
NC
9
DO NOT CONNECT
24
SIO_17
DIO
IN
1,2
Laird Devkit : Button 1 input
25
SIO_18
DIO
IN
1,2
Laird Devkit : LED 0
26
SIO_19
DIO
IN
1,2
Laird Devkit : LED 1
27
SIO_20
NC
Reserved for future use
28
GND
29
GND
30
RF_ANT
8
Used on BL600-ST only.
31
GND
32
SIO_21
DIO
UART TX
OUT
1,2,4,6,7
UARTCLOSE() selects DIO

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CONN-UM-BL600_v1_0
Pin
#
Pin
Designation
Default
Function
Alternate
Function
Default
Direction
Notes
Comment
33
SIO_22
DIO
UART RX
IN
1,2,4,6,7
functionality and UARTOPEN()
selects uart comms behaviour
34
SIO_23
DIO
UART RTS
OUT
1,2,4,6,7
35
SIO_24
DIO
UART CTS
IN
1,2,4,6,7
36
SIO_25
DIO
IN
1,2
Laird Devkit : UART_DTR via
CON12
37
GND
38
SIO_26
NC
Reserved for future use. Do NOT
connect.
39
SIO_27
NC
40
SIO_28
nAutoRUN
IN
In ONLY
Laird Devkit: UART_DSR via
CON12
41
SIO_29
DIO
IN
1,2
Laird Devkit : UART_DCD via
CON12
42
SIO_30
DIO
IN
1,2
Laird Devkit : UART_RI via
CON12
43
GND
44
SIO_0
DIO
IN
1,2
Note 1: Secondary function is selectable in smart BASIC application.
Note 2: DIO = Digital Input or Output. I/O voltage level tracks VCC.
Note 3: AIN = Analog Input
Note 4: DIO or AIN functionality is selected using the GpioSetFunc() function in smart BASIC.
Note 5: AIN configuration selected using GpioSetFunc() function.
Note 6: I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC.
Note 7: SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up.
Note 8: RF_ANT pin (pin30) is on theBL600-ST module only. Customer MUST use 50-Ohm trace from
RF_ANT pin to RSMA RF connector on host PCB. More details on 50-Ohm trace design refer to
section 50-OhmsRF Trace on Host PCB for BL600-ST.
Note 9: Hidden JTAG (2-wire interface), pin22 (SWDIO) and pin23 (SWDCLK). Used for upgrading
smart BASIC runtime engine FW only with Laird supplied J-link programmer. Using this hidden
JTAG requires 12K resistor to GND (on pin23 SWDCLK) on customers host PCB and header
connector Samtech FTSH-105-01-L-DV, refer to section Miscellaneous (hidden JTAG) for details.
Note 10: Pull the nRESET pin low for minimum 100 mS in order for the BL600 to reset.
Note11: SPI CS is created by customer using any spare SIO pin within their smart BASIC application script
allowing multi-dropping.
The BL600 module is delivered with the integrated smart BASIC runtime engine FW loaded (but no onboard
smart BASIC application script). Because of this, it starts up in AT command mode by default.
At reset, all SIO lines are configured as the defaults shown above.
SIO lines can be configured through smart BASIC Application script to be either inputs or outputs with weak or
strong pull-ups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware

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CONN-UM-BL600_v1_0
does not allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up
resistors on I2C SDA and I2C SCL MUST be connected externally as per I2C standard.
All the SIO pins (with “default function” of “DIO” are inputs (with no internal pull-up or pull-down), apart
from SIO_21 and SIO_23 which are outputs):
SIO_21 (alternative function UART_TX) is an output, set high (in FW).
SIO_23 (alternative function UART_RTS) is an output, set low (in FW).
SIO_22 (alternative function UART_RX) is an input, set with internal weak pull-up (in FW).
SIO_24 (alternative function UART_CTS) is an input, set with internal weak pull-down (in FW).
UART_RX, UART_TX, UART_CTS are 3.3 V level logic (if VCC is 3.3 V, i.e. SIO pin I/O levels track VCC). For
example, when RX and TX are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, for handshaking pins CTS
and RTS at 0 v are treated as assertions.
Pin 40 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL600-sx) it is connected so
that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to
select between the following two BL600 operating modes:
Self-contained Run mode (nAutoRUN pin held at 0 V).
Interactive / development mode (nAutoRUN pin held at VCC).
smart BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low
and if there is a smart BASIC application script named $autorun$ then the smart BASIC runtime engine FW
executes the application script automatically; hence the name S elf-contained Run Mode .
3.1 Electrical Specifications
3.1.1 Absolute Maximum ratings
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are
listed below; exceeding these values causes permanent damage.
Parameter
Min
Max
Unit
Voltage at VCC pin
-0.3
+3.6
V
Voltage at GND pin
0
V
Voltage at SIO pin
-0.3
VCC+0.3
V
Storage temperature
-40
+85
ºC
3.1.2 Recommended Operating Parameters
3.1.2.1 Power Supply
Parameter
Min
Typ
Max
Unit
VCC (with internal LDO)1
1.8
3
3.6
V
VCC (with internal DCDC enabled)1
2.1
3
3.6
V
VCC Maximum ripple or noise2
10
mV
VCC rise time (0 to 1.8V)3
60
mS
Operating Temperature Range
-25
25
+75
ºC

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CONN-UM-BL600_v1_0
Note 1: Internal DCDC is used if VCC >2.1 V on power-up; otherwise internal LDO is used. 4.7 uF internal to
module on VCC.
Note 2: The maximum VCC ripple or noise (at any frequency) that does not disturb the radio.
Note 3: The on-board power-on reset circuitry may not work properly for rise times outside the noted interval.
Time reset is active from VCC reaches 1.7 V with 50 mS rise time is 29 mS typical.
Time reset is active from VCC reaches 1.7 V with 1 uS rise time is 2.7 uS typical.
3.1.2.2 Signal Levels for Interface, SIO
Parameter
Min
Typ
Max
Unit
VIH Input high voltage
0.7VCC
VCC
V
VIL Input low voltage
VSS
3.6
V
VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA)1Note 2
VCC-0.3
VCC-0.3
VCC
VCC
V
V
VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA)1
VSS
VSS
0.3
0.3
V
V
Pull up resistance
11
13
16
kΩ
Pull down resistance
11
13
16
kΩ
Note 1: Maximum number of pins with 5 mA high drive is three.
3.1.2.3 SIO pin alternative function AIN (ADC) specification
Parameter
Min
Typ
Max
Unit
ADC Internal reference voltage
-1.5%
1.2 V
+1.5%
%
ADC pin input
internal selectable scaling
1/1
1/3
2/3
scaling
ADC input pin (AIN) voltage maximum
without damaging ADC w.r.t
VCC Prescaling
3.6 V 1/1
3.6 V 2/3
3.6 V 1/3
3.3 V 1/1
3.3 V 2/3
3.3 V 1/3
1.8 V 1/1
1.8 V 2/3
1.8 V 1/3
2.4
3.6
3.6
2.4
3.6
3.6
2.1
2.1
2.1
V
V
V
V
V
V
V
V
V

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CONN-UM-BL600_v1_0
Parameter
Min
Typ
Max
Unit
ADC input pin (AIN) voltage maximum
without saturating ADC (with 1.2V internal
reference)1
1/1 prescaling
2/3 prescaling
1/3 prescaling
1.2
1.8
3.6
V
V
V
Time required to convert single sample in
10bit mode
9bit mode2
8bit mode2
68
36
20
uS
uS
uS
Note 1: Stay within internal 1.2 V reference voltage with given prescaling on AIN pin and do not violate
ADC maximum input voltage (for damage) for a given VCC, e.g. If VCC is 1.8 V can only expose
AIN pin to 2.1 V (VCC+0.3).
Note 2: Current production smart BASIC runtime engine firmware (v1.1.50.0) allows only 10-bit mode.
3.1.3 nAutoRUN pin and Operating Modes
Operating modes (refer smart BASIC manual for details):
Self-contained mode
Interactive / Development mode
Signal Name
Pin No
I/O
Comments
nAutoRUN (SIO_28)
28
I
Input with active low logic.
Operating mode selected by nAutoRun pin status:
Low (0V), then runs $autorun$ if it exists;
High (VCC) then run via at+run (and “file name” of smart
BASIC application.
Pin 40 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BL600-sx) it is connected
so that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be externally held high or low
to select between the two BL600 operating modes:
Self-contained Run mode (nAutoRUN pin held at 0V).
Interactive / Development mode (nAutoRUN pin held at VCC).
smart BASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low
and if there is a smart BASIC application named $autorun$ then the smart BASIC runtime engine executes the
application automatically; hence the name self-contained run mode .

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CONN-UM-BL600_v1_0
POWER CONSUMPTION4
Data taken at VCC 3.3V (internal DCDC convertor ON) and 25ºC.
4.1 Power Consumption
Parameter
Min
Typ
Max
Unit
Active mode ‘peak’current –Note1
(Advertising or Connection)
TX only run peak current @TXpwr= +4 dBm
TX only run peak current @T pwr= 0 dBm
TX only run peak current @TXpwr= -4 dBm
TX only run peak current @TXpwr= -8 dBm
TX only run peak current @TXpwr= -12 dBm
TX only run peak current @TXpwr= -16 dBm
T X only run peak current @TXpwr= -20 dBm
TX Whisper mode 1(Note2)
TX only run peak current @TXpwr= -30 dBm
TX Whisper mode 2(Note2)
TX only run peak current @TXpwr= -55 dBm
11.6
8.4
7.1
6.9
6.4
6.1
5.5
5.4
5.0
mA
mA
mA
mA
mA
mA
mA
mA
Active Mode
RX only ‘peak’current(Note2)
8.9
mA
Ultra Low Power Mode1(Note3)
Standby Doze
3.5
uA
Ultra Low Power Mode2(Note4)
Deep Sleep (no RAM retention)
400 (Note 4)
nA
Active Mode Average current (Note5)
Advertising Average Current draw
Max, with advertising interval (min) 20 mS
Min, with advertising interval (max) 10240 mS
Connection Average Current draw
Max, with connection interval (min) 7.5 mS
with connection interval 67.5 mS
Min, with connection interval (max) 4000 mS
~800
~4.1
~400
~4.1
uA
uA
uA
uA
uA
Note1: With VCC 3.3V (internal DCDC ON). If VCC reduces to 2.1V (operating range of DCDC, the peak
current consumption would increase from 11.6mA to ~15.5mA for TX power setting of +4dBm.
Note2: Firmware version 1.1.50.0 (only) has an issue that TX PWR settings need to -40 dBm to produce -30
dBm and -65 dBm to produce -55 dBm.
Note3: Standby Doze is entered automatically (when waitevent statement is encountered within a
smart BASIC application script). In Standby Doze, all peripherals that are enabled stay on and may
re-awaken the chip. Depending on active peripherals, current consumption ranges from ~2-4 µA to
> 1 mA. See individual peripherals current consumption in tables in section Peripheral block current
consumption 4 .3.

BL600-Sx
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CONN-UM-BL600_v1_0
Note 4: In Deep Sleep, everything is disabled and the only wake-up sources are reset and changed on pins on
which sense is enabled. The current consumption seen is ~1000 nA typical. In next silicon revision
this figure is expected to be within specification (400nA). Current smart BASIC runtime engine
firmware (v1.1.50.0) allows coming out of deep sleep through HW reset only. Future firmware
releases allow coming out from Deep Sleep to Standby Doze through GPIO signal through the reset
vector. Deep Sleep mode is entered (with a command in smart BASIC application script).
Note 5: Data taken with TX power 4 dBm and all peripherals off (UART OFF after radio event), slave latency of
0 (in a connection).
Average current consumption depends on a number of factors [including TX power, VCC accuracy of
16 MHz and 32.768 kHz). With these factors fixed, the largest variable is the advertising or
connection interval set.
Advertising Interval range:
20 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_IND and ADV_DIRECT_IND.
100 ms to 10240 ms in multiples of 0.625 ms for Advert type=ADV_SCAN_IND and
ADV_NONCONN_IND.
For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to 1.28
seconds (1280 ms).
For an advertising event,
- the minimum average current consumption is when the advertising interval is large 10240 mS
(although this may cause long discover times (for the advertising event) by scanners.
- the maximum average current consumption is when the advertising interval is small 20 mS.
Other factors that are also related to average current consumption include the advertising payload
bytes in each advertising packet and whether continuously advertising or periodically advertising.
Connection Interval range: 7.5 ms
to 4000 ms in multiples of 1.25 ms.
For a connection event,
- the minimum average current consumption is when the connection interval is large 4000 mS.
–the maximum average current consumption is with the shortest connection interval of 7.5 ms; no
slave latency.
Other factors that are also related to average current consumption include whether transmitting 6
packets per connection interval & each packet contains 20 bytes (which is the maximum for each
packet) and an inaccurate 32 kHz master clock accuracy would increase the average current
consumption.

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CONN-UM-BL600_v1_0
4.2 Measured peak current waveforms during advertising and connection
Figure 3: Typical peak current consumption profile during advertising in slave mode @ TX PWR +4dBm. UART is
OFF. Last spike is DCDC being turned off.
Figure 4: Typical peak current consumption profile during data connection event in slave mode @ TX PWR
+4dBm. UART is ON. Last spike is DCDC being turned off.
TX
11.6mA
TX
11.6mA
TX
11.6mA
RX
8.9mA
RX
8.9mA
RX
8.9mA
Standby Doze mode
4uA
0.5mS
2mA
0.5mS
2mA
RX
9.4mA
TX
11.1mA

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CONN-UM-BL600_v1_0
4 dBm
0 dBm
-4 dBm
-8 dBm
-12 dBm
-16 dBm
-20 dBm
Figure 5: Typical peak current consumption profile during advertising in slave mode versus TX PWR
Advertising (with Whisper Mode TX powers)
-30dBm
-55dBm
Figure 6: Typical peak current consumption profile during advertising in slave mode with TX Whisper Mode TX PWR -30
dBm (TX Whisper Mode1) and -55 dBm (TX Whisper Mode2).
Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square).

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CONN-UM-BL600_v1_0
4dBm
0dBm
-4dBm
-8dBm
-12dBm
-16dBm
-20dBm
Figure 7: Typical peak current consumption profile during connection event in slave mode versus TX PWR.
-30dBm
-55dBm
Figure 8: Typical peak current consumption profile during connection event in slave mode with TX Whisper mode TX
PWR -30 dBm (TX Whisper Mode1) and -55 dBm (TX Whisper Mode2).
Note: In the above pictures, UART is ON. X-axis time (1 mS per square), Y-axis current (2 mA per square).

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CONN-UM-BL600_v1_0
4.3 Peripheral block current consumption
The values below are calculated for a typical operating voltage of 3 V.
Table 3: UART Power Consumption
Parameter
Min
Typ
Max
Unit
UART Run current @ 115200 bps
220
uA
UART Run current @ 1200 bps
210
uA
UART Baud rate
1.2
115.2
kbps
Table 4: SPI Power Consumption
Parameter
Min
Typ
Max
Unit
SPI Master Run current @ 125 kbps
180
uA
SPI Master Run current @ 8 Mbps
220
uA
SPI bit rate
0.125
8
Mbps
Table 5: I2C Power Consumption
Parameter
Min
Typ
Max
Unit
I2C Run current @ 100 kbps
380
uA
I2C Run current @ 400 bps
400
uA
I2C Bit rate
100
400
kbps
Table 6: ADC
Parameter
Min
Typ
Max
Unit
ADC current during conversion
290
uA
The above current consumption is for the particular peripheral only and to operate that peripheral requires
some other internal blocks which consume fixed amount of base current (~740uA). Current Nordic silicon
this fixed base current is bit higher (by ~400uA).
This base current of ~1140 uA (= ~740uA+400uA) is consumed when the UART, SPI, I2C, or ADC is opened
(operated).
For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the
UART (on BL600) must kept open (by a command in smart BASIC application script) resulting in the base
current consumption penalty.
For synchronous interface like the I2C or SPI (since BL600 side is the master), the interface can be closed and
opened only (by a command in smart BASIC application script) when needed, resulting in current saving (no
base current consumption penalty). Similar argument for ADC (open ADC when needed).