SimTech SIMCom SIM5320J-TE Supplement

SIM5320J-TE_Hardware Design_V1.01

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Document Title SIM5320J-TE Hardware Design
Version 1.01
Date 2012-11-09
Status Release
Document Control ID SIM5320J-TE_Hardware Design_V1.01
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2012

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Contents
Revision History .......................................................................................................................................... 8
9
10
10
11
2Package Information.......................................................................................................................... 12
2.1 Pin Configuration........................................................................................................................... 12
2.2 Pin description ............................................................................................................................... 14
2.3 Package Dimensions...................................................................................................................... 17
2.4 Board-to-board connector .............................................................................................................. 17
2.5 RF connector and adapter cable..................................................................................................... 18
3Application Interface Specification................................................................................................... 20
3.1 Power Supply................................................................................................................................. 20
3.1.1 Power Supply Pin.................................................................................................................... 20
3.1.2 Design Guide .......................................................................................................................... 20
3.1.3 RTC Backup............................................................................................................................ 22
3.2 Power on/off Time Sequence ......................................................................................................... 24
3.2.1 Power on Sequence................................................................................................................. 24
3.2.2 Power off Sequence ................................................................................................................ 26
3.3 UART Interface.............................................................................................................................. 27
3.3.1 Pin Description........................................................................................................................ 28
3.3.2 Application Guide................................................................................................................... 28
3.4 Audio Interfaces............................................................................................................................. 29
3.4.1 Pin Description........................................................................................................................ 30
3.4.2 Design Guide .......................................................................................................................... 30
3.4.3 Audio Parameter Characteristic .............................................................................................. 32
3.5 USIM Interface .............................................................................................................................. 33
3.5.1 Pin description ........................................................................................................................ 33
3.5.2 Application Guide................................................................................................................... 33
3.5.3 Recommend Components ....................................................................................................... 34
3.6 I2C Interface .................................................................................................................................. 35
3.6.1 Pin Description........................................................................................................................ 36
3.6.2 Signal Description................................................................................................................... 36
3.6.3 Design Guide .......................................................................................................................... 36
3.7 Keypad Interface............................................................................................................................ 36
3.7.1 Pin Description........................................................................................................................ 36
3.7.2 Application Guide................................................................................................................... 37
3.8 USB Interface ................................................................................................................................38
3.8.1 Application Guide................................................................................................................... 38
3.9 SPI Interface .................................................................................................................................. 39
1Introduction ..........................................................................................................................................
1.1 Product Outline................................................................................................................................9
1.2 Hardware Interface Overview........................................................................................................
1.3 Hardware Diagram.........................................................................................................................
1.4 Functional Overview.......................................................................................................................
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3.9.1 Pin Description........................................................................................................................ 39
40
40
41
43
43
3.11.2 Signal Description ............................................................................................................... 43
3.12 Global Positioning System ......................................................................................................... 46
3.12.1 Technical specification ........................................................................................................ 47
3.12.2 Operate Mode ...................................................................................................................... 47
3.12.3 Application Guide ............................................................................................................... 48
3.13 Multi-functional interface........................................................................................................... 48
3.13.1 Sink Current Source ............................................................................................................ 48
3.13.2 Reset Function ..................................................................................................................... 49
3.13.3 ADC..................................................................................................................................... 49
3.13.4 LDO..................................................................................................................................... 50
4RF Specification.................................................................................................................................. 51
4.1 RF Specification ............................................................................................................................ 51
4.2 Operating Specification ................................................................................................................. 52
4.3 Antenna Design Guide................................................................................................................... 53
5Reliability and Operating Characteristics........................................................................................ 54
5.1 Electronic Characteristics .............................................................................................................. 54
5.2 Operating Mode ............................................................................................................................. 54
5.2.1 Operating Modes Overview.................................................................................................... 55
5.2.2 Minimize Power Consumption ............................................................................................... 56
5.3 Current Consumption..................................................................................................................... 56
5.4 EMC and ESD Notes ..................................................................................................................... 58
Appendix .................................................................................................................................................... 60
A. SIM5320J-TE GPIOs List................................................................................................................... 60
B. Digital I/O Characteristics................................................................................................................... 60
C. Related Documents.............................................................................................................................. 61
D. Terms and Abbreviations .................................................................................................................... 63
E. Safety Caution ..................................................................................................................................... 65
3.10 GPIO Interface ...........................................................................................................................
3.10.1 Pin Description ....................................................................................................................
3.10.2 Application Guide ...............................................................................................................
3.11 PCM Interface ............................................................................................................................
3.11.1 Pin Description ....................................................................................................................
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Table Index
Table 1: SIM5320J-TE series frequency bands................................................................................................................. 9
Table 2: General Feature ................................................................................................................................................. 11
13
14
20
25
Table 7: Power off timing ............................................................................................................................................... 26
Table 8: Pin description................................................................................................................................................... 28
Table 9: Logic level ........................................................................................................................................................ 28
Table 10: Pin description................................................................................................................................................. 30
Table 11: MIC input characteristics ................................................................................................................................30
Table 12: Audio output characteristics ............................................................................................................................ 30
Table 13: Speaker output characteristics ......................................................................................................................... 30
Table 14: Audio parameter .............................................................................................................................................. 32
Table 15: Electronic characteristic .................................................................................................................................. 33
Table 16: Pin description................................................................................................................................................. 33
Table 17: Amphenol USIM socket pin description ......................................................................................................... 35
Table 18: Pin description................................................................................................................................................. 36
Table 19: Pin description................................................................................................................................................. 37
Table 20: GPIO configuration......................................................................................................................................... 38
Table 21: Electronic characteristic .................................................................................................................................. 38
Table 22: Electronic characteristic .................................................................................................................................. 39
Table 23: Pin description................................................................................................................................................. 40
Table 24: Electronic characteristic .................................................................................................................................. 40
Table 25: Pin description................................................................................................................................................. 41
Table 26: LED status....................................................................................................................................................... 42
Table 27: Control status .................................................................................................................................................. 42
Table 28: Electronic characteristic .................................................................................................................................. 43
Table 29: Pin description................................................................................................................................................. 43
Table 30: Timing parameters........................................................................................................................................... 45
Table 31: Timing parameters........................................................................................................................................... 46
Table 32: Electronic characteristic .................................................................................................................................. 48
Table 33: Electronic Characteristics................................................................................................................................50
Table 34: Electronic characteristic .................................................................................................................................. 50
Table 35: Conducted transmission power ....................................................................................................................... 51
Table 36: Operating frequencies ..................................................................................................................................... 51
Table 37: Conducted receive sensitivity.......................................................................................................................... 51
Table 38: GPRS/EDGE data throughout ......................................................................................................................... 52
Table 39: HSDPA throughout.......................................................................................................................................... 52
Table 40: Absolute maximum ratings.............................................................................................................................. 54
Table 41: Recommended operating ratings..................................................................................................................... 54
Table 42: Operating temperature..................................................................................................................................... 54
Table 3: Board-to-Board Connector pin description .......................................................................................................
Table 4: Pin description...................................................................................................................................................
Table 5: Pin description...................................................................................................................................................
Table 6: Power on timing ................................................................................................................................................
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Table 43: Operating Modes Overview ............................................................................................................................ 55
57
59
6
0
6
0
61
Table 49: Terms and Abbreviations................................................................................................................................. 63
Table 50: Safety caution.................................................................................................................................................. 65
Table 44: Current consumption.......................................................................................................................................
Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ..........................................
Table 46: SIM5320J-TE GPIOs list ................................................................................................................................
Table 47: Digital I/O characteristics................................................................................................................................
Table 48: Related documents ..........................................................................................................................................
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Figure Index
Figure 1: SIM5320J-TE functional architecture.............................................................................................................. 10
12
17
17
18
18
Figure 7: RF connector MM9329-2700 .......................................................................................................................... 19
Figure 8: RF adapter cable MXTK88TK2000 ................................................................................................................ 19
Figure 9: VBAT voltage drop during burst emission (GSM/GPRS) ............................................................................... 20
Figure 10: Reference circuit of the LDO power supply .................................................................................................. 21
Figure 11: Reference circuit of the DCDC power supply ............................................................................................... 22
Figure 12: RTC supply from capacitor............................................................................................................................ 23
Figure 13: RTC supply from non-chargeable battery...................................................................................................... 23
Figure 14: RTC supply from rechargeable battery .......................................................................................................... 23
Figure 15: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 24
Figure 16: Power on Timing Sequence ........................................................................................................................... 25
Figure 17: Power off timing sequence ............................................................................................................................ 26
Figure 18: Full modem.................................................................................................................................................... 27
Figure 19: Null modem................................................................................................................................................... 28
Figure 20: RI behaviour in NULL Modem ..................................................................................................................... 29
Figure 21: RI behaviour in FULL Modem ...................................................................................................................... 29
Figure 22: Speaker interface configuration ..................................................................................................................... 31
Figure 23: Receiver interface configuration.................................................................................................................... 31
Figure 24: Microphone interface configuration .............................................................................................................. 31
Figure 25: USIM interface reference circuit ................................................................................................................... 34
Figure 26: Amphenol SIM card socket ........................................................................................................................... 35
Figure 27: Reference circuit............................................................................................................................................ 37
Figure 28: USB interface ................................................................................................................................................ 39
Figure 29: Application circuit ......................................................................................................................................... 41
Figure 30: Flight mode switch ........................................................................................................................................ 42
Figure 31: Synchrony timing .......................................................................................................................................... 44
Figure 32: EXT CODEC to MODULE timing................................................................................................................ 44
Figure 33: MODULE to EXT CODEC timing................................................................................................................ 44
Figure 34: Synchrony timing .......................................................................................................................................... 45
Figure 35: EXT CODEC to MODULE timing................................................................................................................ 45
Figure 36: MODULE to EXT CODEC timing................................................................................................................ 46
Figure 37: Current drive.................................................................................................................................................. 49
Figure 38: Reset circuit................................................................................................................................................... 49
Figure 39: Reference circuit............................................................................................................................................ 50
Figure 2: Pin view...........................................................................................................................................................
Figure 3: Top dimensions (Unit: mm).............................................................................................................................
Figure 4: Side dimensions (Unit: mm)............................................................................................................................
Figure 5: Panasonic AXK580147YG board-to-board connector pin side .......................................................................
Figure 6: Panasonic AXK680347YG board-to-board connector pin side .......................................................................
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Revision History
Data Version Description of change Author
2012-11-09 1.01 Original Libing
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1Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5320J-TE module. With the help of this
document and other SIM5320J-TE software application notes, user guides, users can quickly understand
and use SIM5320J-TE module to design and develop applications quickly.
1.1 Product Outline
Designed for global market, SIM5320J-TE is a quad-band GSM/GPRS/EDGE and dual-band UMTS
/HSDPA that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz
and WCDMA 2100/850MHz...In this document, the entire radio band configuration of SIM5320J-TE
series is described in the following table.
Table 1: SIM5320J-TE series frequency bands
Standard Frequency SIM5320J-TE
GSM 850MHz 
EGSM 900MHz 
DCS1800MHz 
GSM
PCS1900MHz 
WCDMA 850MHz 
WCDMA 900MHz
WCDMA 1900MHz
WCDMA
WCDMA 2100MHz 
HSDPA 
HSPA
HSUPA
With a tiny configuration of 47.5*35*4 mm and integrated functions, SIM5320J-TE can meet almost any
space requirement in users’ application, such as industrial handhelds, machine-to-machine, vehicle
applications, etc..
The SIM5320J-TE provides RF and GPS antenna interface with two alternatives: antenna connector and
antenna pad. The antenna connector is MURATA MM9329-2700. And customer’s antenna can be soldered
to the antenna pad.
There are 80 pins on SIM5320J-TE, which provide most application interfaces for customers’ board.
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1.2 Hardware Interface Overview
The physical interface to the mobile application is made through a 80 pins board-to-board connector,
which provides all hardware interfaces between the module and customers’ boards except the RF antenna
interface. Sub-interfaces are described in detail in the next chapter, which includes:
● Power Supply
● USB Interface
● Serial Interface
● Analog Audio Interfaces
● SIM Interface
● GPIO
● ADC
● LDO Power Output
● Sink Current Source
● PCM Interface
● Keypad Interface
● SPI Interface
● RTC
● I2C Interface
1.3 Hardware Diagram
The global architecture of the SIM5320J-TE Embedded module is described in the figure below.
Figure 1: SIM5320J-TE functional architecture
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1.4 Functional Overview
Table 2: General Feature
Feature Implementation
Power supply Single supply voltage 3.3～4.2V
Transmission data
● Dual-mode UMTS/HSDPA/EDGE/GPRS operation
● GPRS Class B, multislot class 12 operation, Supports coding scheme:
CS1-4
● EDGE multislot class 12 operation, Supports coding schemes
MSC1-9
● UMTS R99 data rates-384 kbps DL/UL
● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
● CSD feature: 9.6, 14.4, 64 kbps UL/DL
GPS
● Mobile-Assisted mode
● Mobile-based mode
● Standalone mode
SMS
● MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
SIM interface Support identity card: 1.8V, 3V.
Audio features(optional)
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● AMR+QCP (GSM)
● A5/1, A5/2, and A5/3 ciphering
Serial interface ● Serial Port standard or null modem mode on Serial Port Interface
● Serial Port can be used to control module by sending AT command
USB Support USB2.0 Slave mode
Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit Support SAT class 3, GSM 11.14 Release 98
Support USAT
Real Time Clock Support RTC
Timer function Programmable by AT command
Physical characteristics Size:47.5*35*4mm
Weight:10g
Firmware upgrade Firmware upgrade over USB interface
PCM Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (-law or A-law)
and 16 bit (linear).
Temperature range ● Operation temperature: -30°C to +80°C
● Storage temperature -40°C to +85°C
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2Package Information
2.1 Pin Configuration
All hardware interfaces which connect SIM5320J-TE to customers’ application platform are through 80
pins Board-to-Board Connector . Figure 2 is SIM5320J-TE outline diagram.
Figure 2: Pin view
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Table 3: Board-to-Board Connector pin description
Pin No. Define Pin No. Define
1 VBAT 80 GND
2 VBAT 79 GND
3 VBAT 78 GND
4 VBAT 77 GND
5 VBAT 76 GND
6 VBAT 75 GND
7 VBAT 74 GND
8 VBAT 73 GND
9 VRTC 72 GPIO44
10 VREG_AUX 71 GPIO40
11 CURRENT_SINK 70 GPIO43
12 ADC2 69 GPIO41
13 ADC1 68 GPIO1
14 KEYSENSE_N4 67 GPIO42
15 KEYPAD_3 66 GPIO4
16 KEYPAD_4 65 I2C_SCL
17 KEYPAD_1 64 I2C_SDA
18 KEYSENSE_N3 63 UART_RTS
19 KEYSENSE_N2 62 UART_CTS
20 KEYPAD_2 61 UART_RXD
21 KEYPAD_0 60 UART_RI
22 KEYSENSE_N0 59 UART_DCD
23 KEYSENSE_N1 58 UART_TXD
24 GND 57 UART_DTR
25 RESERVED 56 GND
26 RESERVED 55 PCM_DOUT
27 USIM_RESET 54 PCM_DIN
28 USIM_CLK 53 PCM_SYNC
29 USIM_DATA 52 PCM_CLK
30 V_USIM 51 USB_DP
31 POWER_ON 50 USB_DM
32 GND 49 USB_VBUS
33 EAR1P 48 GND
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34 EAR1N 47 RESET
35 MIC1N 46 SPI_CS_N
36 MIC1P 45 SPI_MOSI_DATA
37 SPK_P 44 SPI_MISO_DATA
38 SPK_M 43 SPI_CLK
39 GND 42 GND
40 GND 41 GND
2.2 Pin description
Table 4: Pin description
Pin name I/O Description Comment
Power Supply
VBAT Power supply voltage
VRTC I/O Power supply for RTC
VREG_AUX O LDO power output
If it is unused, keep open.
GND Ground
Power on/off
POWER_ON I
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
Audio interface
MIC1P
MIC1N
I Differential audio input
If it is unused, connect to
ground through a 100N
capacitor.
EAR1P
EAR1N
O
SPK_P
SPK_N
O
Differential audio output If these pins are unused，
keep open.
USIM interface
V_USIM O Voltage Supply for SIM card
Support 1.8V or 3V SIM card
USIM_DATA I/O SIM Data Output/Input
USIM_CLK O SIM Clock
USIM_RESET O SIM Reset
All signals of SIM
interface should be
protected against
ESD/EMC.
SPI interface
SPI_CLK O SPI clock
SPI_CS_N O SPI chip-select
If it is unused, keep open.
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SPI_MOSI_DATA O SPI (master only) master out/slave in
data
SPI_MISO_DATA I SPI (master only) master in/slave out
data
USB
USB_VBUS I USB power supply input
USB_DP I/O
Plus (+) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
USB_DM I/O
Minus (-) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
Serial interface
UART_RXD I Receive Data
UART_TXD O Transmit Data
UART_RTS O Request to send
UART_CTS I Clear to Send
UART_RI O Ring Indicator
UART_DTR I/O DTE get ready
UART_DCD O Carrier detects
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
I2C interface
I2C_SDA I/O I2C data
I2C_SCL O I2C clock output
Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
Keypad interface
KEYPAD_0 O Bit 0 drive to the pad matrix
KEYPAD_1 O Bit 1 drive to the pad matrix
KEYPAD_2 O Bit 2 drive to the pad matrix
KEYPAD_3 O Bit 3 drive to the pad matrix
KEYPAD_4 O Bit 4 drive to the pad matrix
KEYSENSE_N0 I Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1 I Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2 I Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3 I Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4 I Bit 4 for sensing key press on pad
matrix
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
PCM interface
PCM_DIN/GPIO0 I
General Input PIN with module
wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.
If it is unused, keep open.
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PCM_SYNC/GPIO2 I General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
PCM_CLK/GPIO3 O General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
PCM_DOUT/GPIO5 O General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1 O Output PIN as LED control for
network status.
GPIO4 I Input PIN as RF operating control.
GPIO40 O Output PIN as operating status
indicating of module.
GPIO41 I/O
General input/output PIN. It can be
used as wake/interrupt signal to host
from module
GPIO43 I/O
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
GPIO44 I/O General input/output PIN.
GPIO42 I/O General input/output PIN.
If it is unused, keep open.
Other interface
RESET I System reset in, active low.
CURRENT_SINK I Current source of ground-referenced
current sink Refer to 3.13.1
ADC1 I Analog Digital Converter Input
ADC2 I Battery temperature ADC input pin
Refer to 3.13.3
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2.3 Package Dimensions
The following figure shows mechanical dimensions of SIM5320J-TE.
Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)
2.4 Board-to-board connector
We recommend users to adopt Panasonic AXK770247G as the board to board connector in their own PCB
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to connect with SIM5320J-TE. These high density SMT connectors are designed for parallel PCB-to-PCB
applications. They are ideal for using in VCRs, notebook PCs, cordless telephones, mobile phones,
audio/visual and other telecommunications equipment where reduced size and weight are important.
Following are parameters of Panasonic AXK580147YG for more details, user can login
http://industrial.panasonic.com/ac/e/ for more information.
NOTE
： The height of Mated height is 3.0mm.
Mechanical dimensions of the Panasonic 80pin connector
Figure 5: Panasonic AXK580147YG board-to-board connector pin side
Figure 6: Panasonic AXK680347YG board-to-board connector pin side
NOTE
： The connectorAXK680347YG is used in SIM5320J-TE side and AXK580147YG is used in pin
side (host board side).
2.5 RF connector and adapter cable
The RF connector in module side is Murata Company RF Connectors MM9329-2700, it makes a pair with
Murata Company RF cable MXTK88TK2000. It has high performance with wide frequency range, surface
mountable and reflow solderable. Following are parameters. Certainly user can visit
http://www.murata.com/ for more information.
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Figure 7: RF connector MM9329-2700
Figure 8: RF adapter cable MXTK88TK2000
For more information about the connector, please visit http://www.murata.com/
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3Application Interface Specification
3.1 Power Supply
The power supply range of SIM5320J-TE is from 3.3V to 4.2V. For the VBAT, the ripple due to
GSM/GPRS emission burst (every 4.615ms）may cause voltage drop, and the current consumption rises
typically to peak of more than 2A. So the power supply must be able to provide sufficient current up to
more than 2A. The following figure is the VBAT voltage ripple wave at the maximum power transmit
phase.
The test condition: VBAT =4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor
(ESR=0.7Ω) and CB=1µF.
Figure 9: VBAT voltage drop during burst emission (GSM/GPRS)
3.1.1 Power Supply Pin
The VBAT pins are dedicated to connect the supply voltage.
Table 5: Pin description
Pin type Pin name Min Typ Max Unit
POWER VBAT 3.3 3.8 4.2 V
Note: When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.
3.1.2 Design Guide
Mostly, user connects the VBAT pins with one power supply. Make sure that the input voltage at the
VBAT pin will never drop below 3.3V even during a transmit burst when the current consumption rises up
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