Sony CDP-561 User manual

CDP-961/961E
SERVICE
MANUAL
AEP
Mode!
CDP-561
UK Model
CDP-561E
Photo : CDP-561
Model Name Using Similar Mechanism | CDP-715/715E
CD Mechanism Type CDM25D-5BD20
Base Unit Type BU-5BD20
Optical Pick-up Type KSS-213BA
SPECIFICATIONS
Compact disc player General
Laser — Semiconductor laser Power requirements 220 V - 230 V AC, 50/60 Hz
Wavelength 780 —- 790 nm Power consumption 13 W
Frequency
response
2
Hz
to
20
kHz
+
0.5
dB
Dimensions
(approx.)
430
x
110
x
295
mm
Signal-to-noise
ratio
More
than
108
dB
(w/h/d)
(17
x
43/8
x
11
5/8
in.)
incl.
projecting
Dynamic
range
More
than
99
dB
pee
Harmonic distortion Less than 0.0027% Massilappiox:) Senos
Channel separation More than 103 dB Supplied accessories
Outputs
Audio
cord
(2
phono
plugs
~
2
phono
plugs)
(1)
Jack Maximum Load Sony SUM-3 (NS) batteries (2)
type output impedance
level
Design
and
specifications
are
subject
to
change
without
notice.
LINE OUT Phono 2V Over 10 kilohms
(FIXED) jacks (at 50 kilohms)
LINE OUT Phono 2V Over 50 kilohms
(VARIABLE) jacks (at 50 kilohms)
DIGITAL Optical -18dBm Wave length: 660 nm
OUT output
(OPTICAL) connector
PHONES Stereo - 10mW 32 ohms
phone
=
COMPACT
DISC
PLAYER
SONY.

CAUTION
Use of controls or adjustments or performance of |
procedures other than those specified herein may result in
hazardous radiation exposure.
The laser component in this product is
capable of emitting radiation exceeding
the limit for Class 1.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASERLAITE
KLASS 1 LASERAPPARAT
This appliance is classified as a CLASS 1.
LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear
exterior.
The following caution label is located
inside the unit.
CAUTION : INVISIBLE LASER RADIATION WHEN OPEN,
AVOID EXPOSURE TO BEAM.
A L: USYNLIG LASERSTRALING VED ABNING NAR
RONARSE SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION.
UNDGA UDS AETTELSE FOR STRALING
VARO! : AVATTAESSA JA SUOJALUKITUS OHITETTAESSA
DLET ALTTINA LASERSATEILYLLE.
» LASERSTRALING NAR DENNA DEL AR OPPNAD
Map eute * OCH SPARREN AR URXOPPLAD
DVERSEL: USYNLIG LASERSTRALING NAR DEKSEL APNES
ARVERSEL UNNGA EKSPONERING FOR STRALEN
Notes on chip component replacement
¢ Never reuse a disconnected chip component.
* Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK A\ OR DOTTED
LINE WITH MARK A\ ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
Section Title Page
SECTION 1. SERVICING NOTE... cceeceeeeeeeeeees 3
SECTION! 2: (GENERAL sis cometst geascc vival adeasenvenceumckawenae) 4
SECTION 3. DISASSEMBLY
3-1. Loading Panel .0..... ee eeescecessesseecesessrsceeeessseesesesesessaeees 5
3-2. MD (BU-5BD20) BIOCK occ eessecsssessssssssecssssenecenseeees 5
SECTION 4. ELECTRICAL BLOCK CHECKING............ 6
SECTION 5. DIAGRAMS
5-1. IC Pin Functions
*1C101 (CX D25450). ccs sstirsswetacotiecteass soa ateoeraiads 8
* 1C801 (CXP82316-055Q) oo... ee ccssseceseteeeessseeesseeenes 11
5-2. Circuit Boards Location o00....... ccc cccsscescessseeecesssssseeeesees 12
5-3. Printed Wiring Board — BD Section — ......... cece 13
5-4. Schematic Diagram — BD Section — .........ccceeeeseeeeeeees 15
5-5. Schematic Diagram — Main Section — ......... eee 18
5-6. Printed Wiring Board — Main Section — 00... ceeee 21
SECTION 6. EXPLODED VIEWS
6-1. Case and Front Panel Section oo... cceeeescccccceeneeees 25
6-2. Chassis Section oo... eccccecccescccccccceccesceccccceceescecseeusseessess 26
6-3. Mechanism Section (CDOM25D-5BD20) oo... eeeeeceeseee 27
6-4. Base Unit Section (BU-5BD20) uu... ee eeseseeeseecereeeees 28
SECTION 7. ELECTRICAL PARTS LIST uuu... eee 29
MODEL IDENTIFICATION
— BACK PANEL —
LLLLLLILL,
CDP-561 (AEP Model) : 4-962-202-50
CDP-561 (German Model) : 4-962-202-60
CDP-561E (UK Model) : 4-962-202-70

SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer
electrostatic break-down because of the potential difference
generated by the charged electrostatic load, etc. on clothing and
the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled
with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be
focused on the disc reflective surface by the objective lens in
the optical pick-up block. Therefore, when checking the laser
diode emission, observe from more than 30 cm away from the
objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
1. Make POWER switch on with no disc inserted and disc
table closed.
2. Confirm that the following operation is performed while
observing the objective lens.
Front Panel side
@ Confirm that laser beam is spread.
@ Up and down motion of the objective lens. (3 times)
HOW TO OPEN THE DISC TRAY WHEN POWER
SWITCH TURNS OFF
Insert a tapering driver into the aperture of the unit bottom,
and turn in the direction of arrow.
* To close the disc tray, turn the driver in the reverse direction.
Front Panel

Identifying the Parts
SECTION 2
GENERAL
314 ]15]i6](7}18) [9]
S| &) SISCIS) &
—{} {NO
S| lol[Slols
Power switch
Disc tray
TIME button
[4] REPEAT button
FADER button
[6] AUTO SPACE button
PEAK SEARCH button
EDIT/TIME FADE button
[9] Number buttons
>20 (over 20) button
(>10 (over 10) button on the
remote commander)
[1] CHECK (Program check) button
CLEAR (Program clear) button
MUSIC SCAN button
LINE OUT/PHONE LEVEL control
(LINE OUT LEVEL +/- buttons
on the remote commander)
PHONES jack
Play mode buttons
CONTINUE button
SHUFFLE button
PROGRAM button
<4</>— (manual search) buttons
IKK/>t>1 (AMS*) buttons
@ (stop) button
Il (pause) button
t> (play) button
& OPEN/CLOSE button
Display
DISPLAY OFF button
A «> B button
o]
— 1] [3]
>} [al
SI (S} fe} fel [SI
* AMS is the addreviation of
Automatic Music Sensor.

SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-1. LOADING PANEL
© Remove the loading panel in the
direction shown by the arrow.
Bottom chassis
@ Use a tapering driver
to turn the cam by in the
direction of the arrow.
:
@ Pull-out of disc table. a
3-2. MD (BU-5BD20) BLOCK
© Remove the yoke bracket.
@ Turn the cam to the direction
of arrow (Counter clock wise)
by tapering driver.
@ Remove the MD (BU-5BD20)
to the direction of arrow.

SECTION 4
ELECTRICAL BLOCK CHECKING
Note :
1. CD Block is basically designed to operate without
adjustment. Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise
indicated.
3. Use an oscilloscope with more than 10OMQ impedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S Curve Check
oscilloscope
BD board
a,
TP(FE) O«m——oF
TP(VC) O«—-o-
Procedure :
1. Connect oscilloscope to test point TP (FE) on BD board.
2. Connect between test point TP (FEI) and TP (VC) by lead
wire.
3. Turned Power switch on.
4. Put disc (YEDS-18) in and turned Power switch on again
and actuate the focus search. (actuate the focus search when
disc table is moving in and out.)
5. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within
31 Vp-p.
S-curve waveform
symmetry
within 341 Vp-p
6. After check, remove the lead wire connected in step 2.
Note : + Try to measure several times to make sure than the
ratio of A: B or B: A is more than 10: 7.
* Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
oscilloscope
BD board
a,
TP(RF) O«—-oF
TP(VC) o«—Lo-
Procedure :
1. Connect oscilloscope to test point TP (RF) on BD board.
2. Turned Power switch on.
3. Put disc (YEDS-18) in to play the number five track.
4. Confirm that oscilloscope waveform is clear and check RF
signal level is correct or not.
Note :
A clear RF signal waveform means that the shape “()” can
be clearly distinguished at the center of the waveform.
VOLT/DIV : 200mV
TIME/DIV : 500nS
VV)
NY
level : 1.2 *82° Vp-p
RF signal waveform
OY
RR
CARR
E-F Balance Check
oscilloscope
BD board
ff
TP(TE) O«—0F
TP(VC) o«—Lo-
Procedure :
Connect test point TP (ADJ) to ground with lead wire.
Connect oscilloscpe to test point TP (TE) on BD board.
Turned Power switch on.
Put disc (YEDS-18) in to play the number five track.
Press the CHECK button. (The tracking servo and the
sledding servo are turned OFF.)
Check the level B of the oscilloscope’s waveform and the
A (DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than + 20%.
i ee
mn
Traverse waveform
Center of the waveform
|
A (DC voltage)
level : 1.5+0.7 Vp-p
7. Press the CLEAR button. (The tracking servo and sledding
servo are turned ON.) Confirm the C (DC voltage) is
almost equal to the A (DC voltage) in step 6.
Traverse waveform
C (DC
voltage)
Sledding servo
OFF
Sledding servo
ON
Tracking servo | Tracking servo
8. Disconnect the laed wire of TP (ADJ) connected in step 1.

RF PLL Free-run Frequency Check
Procedure :
1. Connect frequency counter to test point (PLCK) with lead
wire.
frequency counter
ae
TP(PLCK) o«———o +
2. Turned Power switch on.
3. Put the disc (YEDS-18) in to play the number five track.
Confirm that reading on frequency counter is 4.3218MHz.
Main board
anne
Adjustment Location :
[ MAIN BOARD ] — Component Side —
fo TP (ADJ)
[ BD BOARD J] — SIDE A—
1C103| (RF) (FEI)
See al? site)
re}
°
(VC)
fe)
(PLCK)

SECTION 5
DIAGRAMS
5-1. IC PIN FUNCTIONS
° 1C101 (CXD2545Q)
Pin Name VO
Sled drive output (Not used)
Sled drive output
SRON
SRDR
SFON
TFDR
TRON
TRDR
TFON
FFDR
FRON
FRDR
FFON
VCOO
VCOI
ES
DVss
Sled drive output (Not used)
Tracking drive output
Tracking drive output (Not used)
Tracking drive output
7 Tracking drive output (Not used)
Focus drive output (Not used)
Focus drive output
Analog power supply
12
13
1
15
—~
4 a)
= oh
N
TES3
19 VPCO
20 VCKI
21 AVD2
22 IGEN
23 AVS2
24 ADIO
25 RF
26 RFDC
Power supply pin for operational amplifiers
Analog GND
QO
Foetus)
Center voltage input pin
Ni
law! ™
n ™
i)
in 3)
m
30
31
32
<
O
FILO
FILI
PC
CLTV
AVS1
RFAC
BIAS
ASYI
ASYO
AVDI1
Filter output for master PLL
Filter input for master PLL
je)
tes)
NO N _ —_
©)
Charge-pump output for master PLL
34
35
36
37
38
39
40
Control voltage input for master VCO
Analog GND
EFM signal input
Asymmetry circuit constant current input
Asymmetry comparate voltage input
EFM full swing output
Analog power supply

G
a
DA 14 output when PSSL=1. 64-bit slot data when PSSL=0 (Not used)
DA 13 output when PSSL=1. 64-bit slot data wheh PSSL=0 (Not used)
DA 12 output when PSSL=1. 64-bit slot data when PSSL=0 (Not used)
DA 11 output when PSSL=1. GTOP output when PSSL=0 (Not used)
DA 10 output when PSSL=1. XUGF output when PSSL=0 (Not used)
DA 09 output when PSSL=1. XPLCK output when PSSL=0
0
Pin Name
DVpp
ASYE
PSSL
WDCK
LRCK
DATA
BCLK
64DATA
64BCLK
64LRCK
GTOP
XUGF
XPLCK
GFS
PFCK
C2PO
XRAOF
MNT3
MNT2
MNTI1
MNTO
62 XTAI
63 XTAO
64 XTSL
65 DVss
FSTI
67 FSTO
FSOF
C16M
MD2
DOUT
EMPH
WFCK
SCOR
75 SBSO
76 EXCK
77 SUBQ
78 SQCK
MUTE
SENS
XRST
DIRC
SCLK
DFSW
ATSK
41
42
43
44
45
46
47
48
49
50
Si
52
53
nN oN
55
56
57
58
59
DA 08 output when PSSL=1. GFS output when PSSL=0
DA 07 output when PSSL=1. RFCK output when PSSL=0
DA 05 output when PSSL=1. XRAOF output when PSSL=
DA 04 output when PSSL=1. MNT3 output when PSSL=0
DA 03 output when PSSL=1. MNT2 output when PSSL=0
DA 02 output when PSSL=1. MNT1 output when PSSL=0
DA 01 output when PSSL=1. MNTO output when PSSL=0
Digital-out ON/OFF control pin (+5V)
Digital-out output pin
DA 06 output when PSSL=1. C2PO output when PSSL=0 (Not used)
I
f=)
“NI
—
72
73
74
Playback disc output in emphasis mode (Not used)
Sub-Q 80-bit output
~ ‘oO
Used in 1-track jump mode (+5V)
SENS serial data read-out clock
DFCT selection pin (GND)
Input pin for anti-shock (GND)
81
82
83
84
85

fe) —_
=~
Pin Name
DATA
87 XLAT
88
Serial data input, supplied from CPU
Latch input, supplied from CPU
Q 5 A
Serial data transfer clock input, supplied from CPU
COUT
DVpp
MIRR
DFCT
FOK
Numbers of track counted signal output (Not used)
Digital power supply
91
92
Mirror signal output
v]
efect signal output
\o Ww
Focus OK output
94
FSW
Output
to
select
spindle
motor
output
filter
(Not
used)
95
MON
Output
to
control
ON/OFF
of
spindle
motor
(Not
used)
MDP
Output
to
control
spindle
motor
servo
97
MDS
Output
to
control
spindle
motor
servo
(Not
used)
9)
FS is sampled by 460 Hz. H when GFS is H (Not used)
SSTP
Input
signal
to
detect
disc
inner
most
track
SFDR
-
100 Sled drive output

e 1C801 (CXP82316-055Q)
Cr
a
TIMER | = | Connected to +5V.
RM (BUSIN) | 1 | Audio bus input.
5V
+.
;
Qa
° 5 5 & Q cal 2 a ee ° + nN
<
Q
ee nw
Not used. (open)
Latch signal output to digital filter (IC303).
Serial clock output.
/SENSE sd SENSE signal input.
Serial data output.
Read out clock output for subcode Q data.
a
| 14 |AMUTE «| | Analog muting control signal output.
| 15 |{LpoN =——<(isi—s™Y CO Cd Optical pickup laser diode control output.
Ee ae Serial data latch signal output.
[a7 [orn dC
a
a
=» [wor Sid
a [ow Cd
RST
EXTAL
32 XTAL
33 Vss
34 to 41 OPEN
42 to 62 SEGI to SEG21
VEDP 200)
2 VDD (+5V)
3
74
1
76
77
78
79
Reset signal input.
31
Oo
o rs) n =
S
€ fas
Pty
i
a0
wy
Not used. (open)
FL segment output.
FL grid output.
—30V pin for FL display tube.
“I
~]
SELI
IN PORT
IN PORT
IN PORT
SCOR
SEL2
SEL3
Connected to GND.
Connected to +5 V.
Read out timing signal input for subcode Q data.
Connected to GND.
Connected to GND.

CDP-561/561E
5-2. CIRCUIT BOARDS LOCATION 5-3. PRINTED WIRING BOARD — BD SECTION —
i
i
i
cE
ee
oe
dee
TRANSFORMER board
[BD BOARD] (SIDE A) [BD BOARD] (SIDE B)
BD board
LOADING board
MAIN board
SW board
DISP board
MVR board
MAIN BOARD
CN301
« Semiconductor
Location
[tno [Loeston
C-2
C-7
B-2
A-8
Note:
* o—— : parts extracted from the components side.
* wu : parts extracted from the conductor side.
. ©: Through hole.
: Pattern from the side which enable seeing.
(The other layer's patterns are not indicated.)
OPTICAL
PICK-UP
BLOCK
KSS-2I3BA/F-N
cat
Wea
eo
cael

5-4. SCHEMATIC DIAGRAM — BD SECTION —
¢ See page 8 for IC Pin Function. (IC101)
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NOTE
e All capacitors are in #F unless otherwise noted. pr: gpF
SOW or less are not indicated except for electrolytics
and tantalums,
*All resistors are in Q and 1/4W or less unless otherwise
specified,
Note:The components identified by mark ANor dotted
line with mark AXare critical for safety,
Replace only with parf number specified,
« [B+] :Bt Line.
«Voltages and waveforms are de with respect to ground
under no-Signa!l conditions,
no mark:SIQP
«Voltages are taken with a VOM(Input impedance 10MQ).
Voltage variations may be noted due to norma! produc-
tion tolerances,
e Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to norma! produc-
tion tolerances,
*Circled numbers refer to waveforms,
e Waveformes
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CH2 F IN (3) 2
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IC101 CXD2545Q
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XLAT
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SENS
SRON, SROR
TFDR, TFON
TRON, TROAR
FFOAR, FFON
FRON, FROR

CDP-561/561E
5-5. SCHEMATIC DIAGRAM — MAIN SECTION —
¢ See page 11 for IC Pin Function. (1C801)
1
2
|
3
4
|
5
6
7
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8
9
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10
11
12
13
14
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17
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* All copacitors are in uf unless otherwise noted, pF:uuF ® Waveformes
SOW or fess are not indicated except for electrolytics
and tontaluas,
*All resistors are in Q and 1/4W or fess unless otherwise
specified.
° 4 :internal component,
° [__] :Panel designation,
Note:The components identified by mark AN or dotted
tine with mark AN ore critical for safety.
Replace onty with port number specified.
¢ {Bt} :Bt Line.
¢ [B=] :B- Line.
¢ Voltages and waveforms are dc with respect to ground
under
no-signal
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conditions,
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eWoveforms are token with c oscilloscope,
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23
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5-6. PRINTED WIRING BOARD — MAIN SECTION —
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* ot. : Denotes that Jumper wire works as Test Point.
: : Pattern from the side which enable seeing.
—
22
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=
23
—
24
—

SECTION 6
EXPLODED VIEWS
NOTE:
e Items marked “ * ” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
® The mechanical parts with no reference number
in the exploded views are not supplied.
CASE AND FRONT PANEL SECTION
6-1.
Part No.
3-363-099-01 SCREW (CASE 3 TP2)
4-937-817-01 CASE
1-751-947-11 WIRE (FLAT TYPE) (21 CORE)
4-951-620-01 SCREW (2. 6X8), +BVTP
1-655-760-11 SW BOARD
4-947-034-01 BUTTON (POWER)
1-751-712-11 WIRE (FLAT TYPE) (11 CORE)
1-655-761-11 MVR BOARD
4-950-189-01 KNOB (A) (VOL)
Ref. No.
Description
«e
(9 CO ~1 09 Om WwRhr
e Hardware (# mark) list and accessories and
packing materials are given in the last of this
parts list.
¢ Abbreviation
G : German model
Remark | Ref. No.
Part No.
The components identified by mark
A\ or dotted line with mark A\ are
critical for safety.
Replace only with part number
specified.
not supplied
Supplied with J471
Description Remark
A-4673-498-A DISP BOARD, COMPLETE
X-4945-692-1 PANEL ASSY, FRONT (561E)
X-4945-975-1 PANEL ASSY, FRONT (561)
4-971-681-01 PANEL, LOADING
4-962-199-01 PLATE, INDICATION
1-750-162-61 JACK (LARGE TYPE) (PHONES)
1-223-875-11 RES, VAR, CARBON 10K/10K
(LINE OUT, PHONE LEVEL)

6-2. CHASSIS SECTION
CDM25D-5BD20
not supplied
The components identified by mark
A\ or dotted line with mark A\ are
critical for safety.
Replace only with part number
specified.
Ref.No. Part No.
* 51 4-944-316-01 HOLDER, PC BOARD
52 4-956-885-11 FOOT (F58175S2¥)
* 53 4-924-098-31 HOLDER, PC BOARD
* 54 3-349-025-41 HOLDER, PC BOARD
* 55 1-655-758-11 TRANSFORMER BOARD
56 2-383-566-00 SCREW
* 57 A-4673-497-A MAIN BOARD, COMPLETE (561)
* 57 A-4673-568-A MAIN BOARD, COMPLETE (561E)
58 1-696-760-11 WIRE (FLAT TYPE) (23 CORE)
* 59 4-962-202-51 PANEL (AL), BACK (561:AEP)
Description
Remark | Ref.No. Part No.
Description Remark
* 59 4-9§2-202-63 PANEL (AL), BACK (561:G)
* 59 4-962-202-71 PANEL (AL), BACK (561E)
60 3-703-244-00 BUSHING, CORD
* 61 3-681-263-11 SADDLE, WIRE
A\62 1-575-651-21 CORD, POWER (561)
Ab2 1-696-907-11 CORD, POWER (561E)
* 63 3-309-144-21 HEAT SINK
A\T901 = 1-449-925-11 TRANSFORMER, POWER

6-3. MECHANISM SECTION (CDM25D-5BD20)
BU-5BD20
Ref.No.
Part
No.
Description
Remark
|
Ref.No.
Part
No.
Description
Renmark
*
101
4-954-190-01
BASE
(MD)
112
4-954-195-01
SPRING, TORSION
*
102
1-646-970-11
LOADING BOARD
*
113
1-452-538-11
MAGNET
103
4-954~-193-01
ROLLER
(A)
*
114
4-954~192-11
HOLDER
(M)
104
4-933-109-01
CAM
115
4~933-134-01
SCREW
+PTPWH
M2.
6X6
105
4-927-649-01
BELT
116
4-959-996-01
SPRING
(932),
COMPRESSION
106
4-927-651-01
PULLEY
(S)
117
4~933-129-01
HOLDER
(BU)
107
4-967-268-01
GEAR
(C)
*
118
4~917-583-21
BRACKET,
YOKE
108
4-933-107-01
GEAR
(PL)
M151
A-4604-363-A
MOTOR
(L)
ASSY
(LOADING)
109
4-961-794-11
TABLE,
DISC
S151:
1-572-086-11
SWITCH,
LEAF
(LOAD
OUT)
110 4-954-194-01 ROLLER (B)
lll 4-954-199-01 PLATE, SLIDE
$152 1-572-086-11 SWITCH, LEAF (LOAD IN)

6-4. BASE UNIT SECTION (BU-5BD20)
155
(including
m A)
154
$101
The components identified by mark
A\ or dotted line with mark A\ are
critical for safety.
Replace only with part number
specified.
Ref.No. Part No. Description Remark | Ref.No. Part No. Description Remark
A151 8-848-367-11 OPTICAL PICK-UP BLOCK KSS-213BA/F-N 156 4-917-564-01 GEAR (P), FLATNESS
152 1~769-069-11 WIRE (FLAT TYPE) (16 CORE) 157 A-4673-511-A BD BOARD, COMPLETE
153 4-917-567-21 GEAR (M) M101 X-4917-523-4 BASE (OQUTSERT) ASSY (SPINDLE)
154 4~951-940-01 INSULATOR (BU) M102 X~-4917-504-1 MOTOR ASSY (SLED)
155 4-917-565-01 SHAFT, SLED S101 1-572-085-11 SWITCH, LEAF (LIMIT)

NOTE:
The components identified by mark
SECTION 7
ELECTRICAL PARTS LIST
* Due to standardization, replacements in the parts
list may be different from the parts specified in
« SEMICONDUCTORS
In each case, u: uz , for example:
; : the diagrams or the components used on the set. uA...: WA..., UPA... WPA..., UPB...: «@PB...,
As or d eta, ath mark a\ate e -XX, -X mean standardized parts, so they may uPC...: “PC..., UPD...: & PD...
Replace only with part number have some difference from the original one. * CAPACITORS
specified. ¢ Items marked “*” are not stocked since they are uP: WP
seldom required for routine service. Some delay ¢ COILS
When indicating parts by reference should be anticipated when ordering these items. uH : “H
number, please include the board e RESISTORS e Abbreviation
name. All resistors are in ohms G : German model
METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
Ref.No. Part No. Description Remark | Ref.No. Part No. Description Remark
x A-4673-511-A BD BOARD, COMPLETE M102 X-4917-504~1 MOTOR ASSY (SLED)
KKAKKAKKAK AKER KEKE
< TRANSISTOR >
< CAPACITOR >
Q101 8-729-010-08 TRANSISTOR MSB710-R
C101 1-163-005-11 CERAMIC CHIP AT0PF 10% 50V
C102 1-163-038-91 CERAMIC CHIP 0. luF 25V < RESISTOR >
C103 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C105 1-135-155-21 TANTALUM CHIP 4. 7uF 10% 16V R101 1-216-077-00 METAL CHIP 15K bh 1/10¥
C106 1-163-038-91 CERAMIC CHIP 0. luF 25V Ri02 1-216-097-00 METAL CHIP 100K 5% 1/10¥
R103 =1-216-077-00 METAL CHIP 15K = 5% 1/10¥
C107 1-163-038~-91 CERAMIC CHIP 0. luF 25V R104 1-216-085-00 METAL CHIP 33K = 5b 1/104
C108 1-163-035-00 CERAMIC CHIP 0. O47uF 50V R105 1-216-097-00 METAL CHIP 100K 5% 1/10¥
C109 1-163-145-00 CERAMIC CHIP 0.0015uF 5% 50V
C110 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V R106 =1-216-061-00 METAL CHIP 3.3K 5% 1/104
C111 1-163-251-11 CERAMIC CHIP 100PF 5% 50V R107 ~=1-216-061-00 METAL CHIP 3.3K 5% 1/10¥
R108 1-216-073-00 METAL CHIP 10K 5% 1/10¥
C112 1-163~-038-91 CERAMIC CHIP 0. luF 25V R109 = 1-216-121-00 METAL CHIP 1M 5% 1/10¥
C113 1-163-038-91 CERAMIC CHIP 0. luF 25V R110 =1-216-025-91 METAL GLAZE 100 5% 1/10¥
C115 1-126-607-11 ELECT CHIP ATuF 20% AY
C116 1-126-607-11 ELECT CHIP ATuF 20% AV R112 1-216-049-91 METAL GLAZE 1K ny) 1/10¥
C117. =: 1-126-209-11 ELECT 100uF 20% AY R123: 1-216-073-00 METAL CHIP 10K = 5% 1/10¥
R124 1-216-097-00 METAL CHIP 100K 5% 1/10¥
C118 =1-163-275-11 CERAMIC CHIP 0.00luF 5% 50V R125 1-216~-049-91 METAL GLAZE 1K 5% 1/104
C119 1-163-097-00 CERAMIC CHIP 15PF 5% 50V R126 1-216-049-91 METAL GLAZE 1K 5% 1/10¥
C123. = 1-164-232-11 CERAMIC CHIP 0. OluF 50V
C124 1-164-005-11 CERAMIC CHIP 0. 47uF 25V R127 =: 1-216-049-91 METAL GLAZE 1K 5% 1/104
C151 =. 1-163-237-11 CERAMIC CHIP Z2TPF 5% 50V R131 = 1-216-037-00 METAL CHIP 330 = 5% 1/104
R135 = 1-216-295-91 CONDUCTOR, CHIP (2012)
C153 =. 1-163-038-91 CERAMIC CHIP 0. luF 25V R136 = 1-216-295-91 CONDUCTOR, CHIP (2012)
C154 1-164-336-11 CERAMIC CHIP 0. 33uF 25V R137 = 1-216-295-91 CONDUCTOR, CHIP (2012)
C156 =1-163-237-11 CERAMIC CHIP 27PF 5% 50V
C157 1-163-145~-00 CERAMIC CHIP 0.0015uF 5% 50V R138 1-216-295-91 CONDUCTOR, CHIP (2012)
C159 1-163-019-00 CERAMIC CHIP 0. 0068uF 10% 50V R141 =: 1-216-089-00 METAL CHIP ATK = 5% 1/10¥
R142 =: 1-216-081-00 METAL CHIP 22K ob 1/10¥
C161 1-163-038-91 CERAMIC CHIP Q. luF 25V R143 = 1-216-101-00 METAL CHIP 150K 5% 1/10¥
R144 ~=1-216-101-00 METAL CHIP 150K 5% 1/104
< CONNECTOR >
R146 =. 1-216-073-00 METAL CHIP 10K 5% 1/10¥
CN101 1-770-072-11 CONNECTOR (FFC) 23P R147 ~—- 1-216-081-00 METAL CHIP 22K ob 1/10¥
CN102 1~-770-014-11 CONNECTOR, FFC/FPC 16P R148 = 1-216-001-00 METAL CHIP 10 5% 1/104
R149 = 1-216-003-11 METAL GLAZE 12 5% 1/109
< IC > R158 =1-216-111-00 METAL CHIP 390K 5% 1/10¥
IC101 8-752-369-78 IC CXD2545Q R159 =1-216-101-00 METAL CHIP 150K 5% 1/10¥
C102 8-759-176-09 IC BA6392FP R160 = 1-216-295-91 CONDUCTOR, CHIP (2012)
IC103 8-752-072-45 IC CXA1821M-T6 R161 1-216-308-00 METAL CHIP 4,7 5% 1/108
R162 1-216-101-00 METAL CHIP 150K 5% 1/10¥
< MOTOR >
M101 X-4917-523-4 BASE (OUTSERT) ASSY (SPINDLE)