Telit Wireless Solutions LE920 Installation manual

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LE920
H
Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-21 (
(Preliminary)

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LE920 Hardware User Guide
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APPLICABILITY TABLE
PRODUCT
LE920
-
-EU
LE920
-
-NA

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2012.

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Contents
1.
Introduction ........................................................................................................... 9
1.1. Scope............................................................................................................................ 9
1.2. Audience....................................................................................................................... 9
1.3. Contact Information, Support ...................................................................................... 9
1.4. Document Organization ............................................................................................. 10
1.5. Text Conventions........................................................................................................ 11
1.6. Related Documents ................................................................................................... 11
2.
General Product Description................................................................................ 12
2.1. Overview..................................................................................................................... 12
2.2. LE920 Mechanical Dimensions.................................................................................. 13
2.3. Weight ........................................................................................................................ 13
2.4. Environmental requirements .................................................................................... 14
2.4.1. Temperature range........................................................................................................14
2.4.2. RoHS compliance...........................................................................................................14
2.5. Operating Frequency ................................................................................................. 15
2.5.1.1.
WCDMA1700 – B4 ..................................................................................................15
2.5.1.2.
(LE920-NA only)......................................................................................................15
2.5.1.3.
1710 ~ 1755..............................................................................................................15
2.5.1.4.
2110 ~ 2155..............................................................................................................15
2.5.1.5.
Tx: 1312 ~ 1513........................................................................................................15
2.5.1.6.
Rx: 9662 ~ 9938 .......................................................................................................15
2.5.1.7.
400 MHz ..................................................................................................................15
3.
LE920 Module Connections .................................................................................. 17
3.1. PIN-OUT ..................................................................................................................... 17
3.1.1. LGA Pads Layout ............................................................................................................24
4.
Hardware Commands .......................................................................................... 25
4.1. Turning ON the LE920................................................................................................ 25
4.2. Initialization and Activation state............................................................................... 25
4.3. Turning OFF the LE920 .............................................................................................. 27
4.3.1. Shutdown by Software Command..................................................................................28

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4.3.2. Hardware Shutdown ......................................................................................................29
4.3.3. Hardware Unconditional Restart ...................................................................................30
4.3.4. Hardware Unconditional Shutdown............................................................................... 31
4.4. Summary of Turning ON and OFF the module.......................................................... 32
5.
Power Supply ....................................................................................................... 33
5.1. Power Supply Requirements ..................................................................................... 33
5.2. General Design Rules ................................................................................................ 35
5.2.1. Electrical Design Guidelines..........................................................................................35
5.2.1.1. + 5V Input Source Power Supply Design Guidelines ..............................................35
5.2.1.2. + 12V Input Source Power Supply Design Guidelines.............................................36
5.2.1.3. Battery Source Power Supply Design Guidelines...................................................38
5.2.2. Thermal Design Guidelines............................................................................................39
5.2.3. Power Supply PCB Layout Guidelines ...........................................................................40
6.
Antenna(s) ........................................................................................................... 42
6.1. GSM/WCDMA/LTE Antenna Requirements ............................................................... 42
6.2. GSM/WCDMA/LTE Antenna – PCB line Guidelines ................................................... 43
6.3. GSM/WCDMA/LTE Antenna – Installation Guidelines............................................... 44
6.4. Antenna Diversity Requirements............................................................................... 44
6.5. GPS/GNSS Antenna Requirements ........................................................................... 45
6.5.1. Combined GPS/GNSS Antenna ......................................................................................45
6.5.2. Linear and Patch GPS/GNSS Antenna ...........................................................................46
6.5.3. Front End Design Considerations..................................................................................46
6.5.4. GPS/GNSS Antenna - PCB Line Guidelines ...................................................................46
6.5.5. GPS/GNSS Antenna – Installation Guidelines ...............................................................47
7.
Logic Level Specifications.................................................................................... 48
8.
USB Port.............................................................................................................. 49
9.
Serial Ports.......................................................................................................... 50
9.1. Modem Serial Port 1 .................................................................................................. 51
9.2. Modem Serial Port 2 .................................................................................................. 52
9.3. RS232 Level Translation............................................................................................ 52
10.
Audio Section Overview ..................................................................................... 54

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10.1. Digital Audio ........................................................................................................... 54
11.
General Purpose I/O.......................................................................................... 56
11.1. Logic Level Specifications ...................................................................................... 57
11.2. Using a GPIO Pad as Input...................................................................................... 57
11.3. Using a GPIO Pad as Output ................................................................................... 58
11.4. Using the Temperature Monitor Function ............................................................. 59
11.4.1. Short Description ...........................................................................................................59
11.5. Indication of Network Service Availability.............................................................. 59
11.6. RTC Bypass Out ...................................................................................................... 60
11.7. VAUX Power Output ................................................................................................ 60
12.
ADC section ...................................................................................................... 61
12.1. ADC Converter ........................................................................................................ 61
12.1.1. Description.....................................................................................................................61
12.1.2. Using ADC Converter .....................................................................................................61
13.
Mounting the module on your board.................................................................. 62
13.1. General ................................................................................................................... 62
13.2. Finishing & Dimensions ......................................................................................... 62
13.3. Recommended foot print for the application......................................................... 63
13.4. Stencil ..................................................................................................................... 64
13.5. PCB Pad Design...................................................................................................... 64
13.6. Recommendations for PCB Pad Dimensions (mm)............................................... 64
13.7. Solder Paste ........................................................................................................... 66
13.7.1. Solder Reflow.................................................................................................................66
14.
Application guide .............................................................................................. 68
14.1. Debug of the LE920 in production.......................................................................... 68
14.2. Bypass capacitor on Power supplies ..................................................................... 69
14.3. SIM interface........................................................................................................... 69
14.4. EMC recommendations (TBD)................................................................................ 70
14.5. Download and Debug Port...................................................................................... 71

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15.
Packing system................................................................................................. 72
15.1. Tray Drawing........................................................................................................... 73
15.2. Moisture Sensibility ................................................................................................ 74
16.
Safety Recommendations.................................................................................. 75
17.
Document History ............................................................................................. 76

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1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit LE920-EU/NA module. All the features and solutions detailed are
applicable to all LE920, whereas “LE920” is intended the modules listed in the applicability
table.
When a specific feature is applicable to a specific product, it will be clearly highlighted.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our LE920 module.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.

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1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “General Product Description” gives an overview of the features of the product.
Chapter 3: “LE920 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to control the module via hardware
Chapter 5: “Power Supply” deals on supply and consumption.
Chapter 6: “Antenna” The antenna connection and board layout design are the most important
parts in the full product design
Chapter 7: “Logic Level specifications” Specific values adopted in the implementation of
logic levels for this module.
Chapter 8: “USB Port”
Chapter 9: “Serial Ports”
Chapter 10: “Audio Section Overview”
Chapter 11: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 12 “DAC and ADC Section” Deals with these two kind of converters.
Chapter 13: “Mounting the module on your board”
Chapter 14: “Application Guides”
Chapter 15: “Packing System”
Chapter 16: “Conformity Assessments”
Chapter 17: “Safety Recommendations”
Chapter 18: “Document History”

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1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents
xLE920-EU/NA Product Description, 80407ST10118A
xLE920-EU/NA AT command reference guide, 80407ST10116A
xTelit EVK2 User Guide, 1vv0300704

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2.
General Product Description
2.1.
Overview
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit LE920 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace the whole hardware solutions and products that may be designed. The wrong
solutions to be avoided must be considered as mandatory, while the suggested hardware
configurations must not be considered mandatory, instead the information given must be used
as a guide and a starting point for properly developing your product with the Telit LE920
module.
.
NOTICE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE920 cellular module
within user application must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit Communication
S.p.A. other than for circuitry embodied in Telit products. This document is subject to change
without notice.

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2.2.
LE920 Mechanical Dimensions
The Telit LE920 module overall dimensions are:
Length: 34 mm
Width: 40 mm
Thickness: 2.9 mm
2.3.
Weight
The module weight of LE920-EU/NA is about 9.0 gram.

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2.4.
Environmental requirements
2.4.1.
Temperature range
Note
Operating Temperature
Range
–20°C ~ +55°C The module is fully functional (*) in all the
temperature range, and it fully meets the ETSI
specifications.
–40°C ~ +85°C The module is fully functional (*) in all the
temperature range. Temperatures outside of
the range –20°C ÷ +55°C might slightly
deviate from ETSI specifications.
Storage and non-operating
Temperature Range
–40°C ~ +85°C
(*)Functional: the module is able to make and receive voice calls, data calls and SMS.
2.4.2.
RoHS compliance
As a part of Telit corporate policy of environmental protection, the LE920 complies with the
RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive
2002/95/EG).

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2.5.
Operating Frequency
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes are conformed to the 3GPP specifications.
Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX - RX
offset
GSM850 824 ~ 849 869 ~ 894 128 ~ 251 45 MHz
EGSM900
890 ~ 915 935 ~ 960 0 ~ 124 45 MHz
880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz
DCS1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95MHz
PCS1900 1850 ~ 1910 1930 ~ 1990 512 ~ 810 80MHz
WCDMA2100 – B1
(LE920 both models) 1920 ~ 1980 2110 ~ 2170
Tx: 9612 ~ 9888
Rx: 10562 ~ 10838 190MHz
WCDMA1900 – B2
(LE920-NA only) 1850 ~ 1910 1930 ~ 1990
Tx: 9262 ~ 9538
Rx: 9662 ~ 9938 80MHz
WCDMA1800 – B3
(LE920-EU only)
1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288
Rx: 1162 ~ 1513
95MHz
WCDMA1700 – B4
(LE920-NA only) 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513
Rx: 9662 ~ 9938 400 MHz
WCDMA850 – B5
(LE920-NA only) 824 ~ 849 869 ~ 894
Tx: 4132 ~ 4233
Rx: 4357 ~ 4458 45MHz
WCDMA800 – B6
(LE920-NA only) 830 ~ 840 875 ~ 885
Tx: 4162 ~ 4188
Rx: 4387 ~ 4413 45MHz
WCDMA900 – B8
(LE920-EU only) 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863
Rx: 2937 ~ 3088 45MHz
LTE2100 – B1
(LE920 both models) 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599
Rx: 0 ~ 599 190MHz

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LTE1900 – B2
(LE920-NA only) 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199
Rx: 600 ~ 1199 80MHz
LTE1800 – B3
(LE920-EU only)
1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949
Rx: 1200 ~ 1949
95MHz
LTE1700 – B4
(LE920-NA only) 1710~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399
Rx: 1950 ~ 2399 400MHz
LTE850 – B5
(LE920-NA only) 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649
Rx: 2400 ~ 2649 45MHz
LTE2600 – B7
(LE920-EU only) 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449
Rx: 2750 ~ 3449 120MHz
LTE900 – B8
(LE920-EU only) 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799
Rx: 3450 ~ 3799 45MHz
LTE700 – B17
(LE920-NA only) 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849
Rx: 5730 ~ 5849 30MHz
LTE800 – B20
(LE920-EU only) 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449
Rx: 6150 ~ 6449 -41MHz

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3.
LE920 Module Connections
3.1.
PIN-OUT
PAD Signal I/O Function Type COMMENT
USB HS 2.0 Communication Port
D19 USB_D+ I/O USB differential Data(+)
F19 USB_D- I/O USB differential Data(+)
A18 USB_VBUS AI Power sense for the internal USB transceiver Power
Asynchronous UART – Prog. / data +HW Flow Control
AH19 C103/TXD I Serial data input (TXD) from DTE 1.8V
AF19 C104/RXD O Serial data output to DTE 1.8V
AC18 C108/DTR I Input for Data terminal ready signal (DTR) from DTE 1.8V
AA18 C105/RTS I Input for Request to send signal (RTS) from DTE 1.8V
AK19 C106/CTS O Output for Clear to send signal (CTS) to DTE 1.8V
AE18 C109/DCD O Output for Data carrier detect signal (DCD) to DTE 1.8V
AG18 C107/DSR O Output for Data set ready signal (DSR) to DTE 1.8V
AJ18 C125/RING O Output for Ring indicator signal (RI) to DTE 1.8V
Asynchronous Auxiliary UART
AB19 TXD_AUX O Auxillary UART (TX Data to DTE) 1.8V
AD19 RXD_AUX I Auxillary UART (RX Data from DTE) 1.8V
SIM Card Interface 1
A10 SIMCLK1 O External SIM signal – Clock 1.8/2.85V
B11 SIMRST1 O External SIM signal – Reset 1.8/2.85V
B9 SIMIO1 I/O External SIM signal - Data I/O 1.8/2.85V
B7 SIMIN1 I External SIM signal - Presence (active low) 1.8V
A8 SIMVCC1 - External SIM signal – Power supply for the SIM 1.8/2.85V
Audio
B5 EAR1_MT+ AO Earphone signal output1, phase + Audio
A4 EAR1_MT- AO Earphone signal output1, phase - Audio
B3 MIC1_MT+ AI Mic signal input1, phase + Audio
A2 MIC1_MT- AI Mic signal input1, phase - Audio
E2 EAR2_MT+ AO Earphone signal output2, phase + Audio
D1 EAR2_MT- AO Earphone signal output2, phase - Audio
C2 MIC2_MT+ AI Mic signal input2, phase + Audio
B1 MIC2_MT- AI Mic signal input2, phase - Audio
Digital Voice interface (DVI)
D11 DVI_WA0 O Digital Voice interface (WA0 master output) 1.8V
C8 DVI_RX I Digital Voice interface (RX) 1.8V
D9 DVI_TX O Digital Voice interface (TX) 1.8V

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PAD Signal I/O Function Type COMMENT
C10 DVI_CLK O Digital Voice interface (CLK master output) 1.8V
Digital I/O
F9 GPIO_01 I/O GPIO_01 1.8V
E10 GPIO_02 I/O GPIO_02 1.8V
F11 GPIO_03 I/O GPIO_03 1.8V
E12 GPIO_04 I/O GPIO_04 1.8V
F13 GPIO_05 I/O GPIO_05 1.8V
E14 GPIO_06 I/O GPIO_06 1.8V
R18 GPIO_07 I/O GPIO_07 1.8V
S19 GPIO_08 I/O GPIO_08 1.8V
U19 GPIO_09 I/O GPIO_09 1.8V
W19 GPIO_10 I/O GPIO_10 1.8V
RF Section
AD1 Antenna I/O GSM/EDGE/UMTS/LTE Antenna (50 Ohm) RF
AU9 ANT_DIV I UMTS/LTE Antenna Diversity Input (50 Ohm) RF
GPS Section
S1 ANT_GPS I GPS Antenna (50 Ohm) RF
Miscellaneous Function
AP1 RESET# I Reset Input Active Low
AS1 ON_OFF# I Input Command for Power ON Active Low
AN12 SHDN_N I Unconditional Shut down Input Active Low
F17 VRTC AI VRTC Backup Capacitor Power
To be used to
back up the
RTC section
P17 VAUX/PWRMON O Supply Output for External Accessories / Power ON
Monitor 1.8V
D5 ADC_IN1 AI Analog/Digital Converter Input 1 Analog
E6 ADC_IN2 AI Analog/Digital Converter Input 2 Analog
F7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog
AU3 STAT_LED O Status Indicator LED 1.8V
AN10 SW_RDY O Indicates that the boot sequence completed successfully 1.8V
Power Supply
AP17 VBATT - Main Power Supply (Digital Section) Power
AP19 VBATT - Main Power Supply (Digital Section) Power
AR18 VBATT - Main Power Supply (Digital Section) Power
AS17 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power
AS19 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power
AT18 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power
AU17 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power
AU19 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power
A6 GND - Ground

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PAD Signal I/O Function Type COMMENT
A12 GND - Ground
B13 GND - Ground
B15 GND - Ground
B17 GND - Ground
C4 GND - Ground
C6 GND - Ground
D3 GND - Ground
D7 GND - Ground
E18 GND - Ground
F1 GND - Ground
G18 GND - Ground
H19 GND - Ground
M1 GND - Ground
N2 GND - Ground
P1 GND - Ground
P3 GND - Ground
R2 GND Ground
T2 GND Ground
T18 GND - Ground
U1 GND - Ground
V18 GND - Ground
W1 GND - Ground
X2 GND - Ground
X18 GND - Ground
Y1 GND - Ground
Y19 GND Ground
AA2 GND - Ground
AB1 GND - Ground
AC2 GND - Ground
AE2 GND - Ground
AF1 GND - Ground
AG2 GND - Ground
AH1 GND - Ground
AJ2 GND - Ground
AK1 GND - Ground
AK17 GND - Ground
AL18 GND - Ground
AM17 GND - Ground
AM19 GND - Ground
AN16 GND - Ground
AN18 GND - Ground

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PAD Signal I/O Function Type COMMENT
AP3 GND - Ground
AP5 GND - Ground
AP7 GND - Ground
AP9 GND - Ground
AP11 GND - Ground
AP13 GND - Ground
AP15 GND - Ground
AR2 GND - Ground
AR4 GND - Ground
AR6 GND - Ground
AR8 GND - Ground
AR10 GND - Ground
AR12 GND - Ground
AR14 GND - Ground
AR16 GND - Ground
AS5 GND - Ground
AS7 GND - Ground
AS9 GND - Ground
AS11 GND - Ground
AS13 GND - Ground
AS15 GND - Ground
AT4 GND - Ground
AT6 GND - Ground
AT8 GND - Ground
AT10 GND - Ground
AT12 GND - Ground
AT14 GND - Ground
AT16 GND - Ground
AU1 GND - Ground
AU5 GND - Ground
AU7 GND - Ground
AU11 GND - Ground
AU15 GND - Ground
Reserved
C12 Reserved - Reserved
A14 Reserved - Reserved
A16 Reserved - Reserved
M17 Reserved - Reserved
AN6 Reserved - Reserved
V2 Reserved - Reserved
C14 Reserved - Reserved
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