Telit Wireless Solutions ME910G1 Guide

[04.2016]
Mod. 0805 2016-08 Rev.5
ME910G1
HW Design Guide
1VV0301593 Rev. 3 –2020-03-24

ME910G1 HW Design Guide
1VV0301593 Rev.3 Page 2 of 97 2020-03-24
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligationto notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE
PRODUCTS
ME910G1-W1
ME910G1-WW

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Contents
NOTICE 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
I. License Agreements..................................................................... 3
II. Copyrighted Materials................................................................... 3
III. High Risk Materials....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights......................................................................... 3
APPLICABILITY TABLE................................................................................ 4
CONTENTS.................................................................................................... 5
1. INTRODUCTION.......................................................................... 9
Scope........................................................................................... 9
Audience....................................................................................... 9
Contact Information, Support........................................................ 9
Text Conventions........................................................................ 10
Related Documents.................................................................... 10
2. GENERAL PRODUCT DESCRIPTION ...................................... 11
Overview..................................................................................... 11
Product Variants and Frequency Bands...................................... 11
Target Market............................................................................. 12
Main features.............................................................................. 12
TX Output Power........................................................................ 12
2.5.1. ME910G1-W1............................................................................. 12
2.5.2. ME910G1-WW............................................................................ 13
RX Sensitivity ............................................................................. 13
2.6.1. ME910G1-W1............................................................................. 13
Mechanical Specifications........................................................... 16
2.7.1. Dimensions................................................................................. 16
2.7.2. Weight........................................................................................ 16
Temperature Range.................................................................... 16

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3. PINS ALLOCATION................................................................... 17
Pin-out........................................................................................ 17
LGA Pads Layout........................................................................ 27
4. POWER SUPPLY....................................................................... 28
Power Supply Requirements....................................................... 28
Power Consumption ................................................................... 30
General Design Rules................................................................. 31
4.3.1. Electrical Design Guidelines of the power supply........................ 31
4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 31
4.3.1.2. +12V Source Power Supply Design Guidelines .......................... 32
4.3.1.3. Battery Source Power Supply Design Guidelines........................ 33
4.3.2. Thermal Design Guidelines......................................................... 34
4.3.3. Power Supply PCB layout Guidelines......................................... 34
VAUX Power Output................................................................... 37
RTC Supply................................................................................ 37
5. DIGITAL SECTION .................................................................... 38
Logic Levels................................................................................ 38
Power On.................................................................................... 39
Power Off.................................................................................... 43
Wake from deep sleep mode...................................................... 45
Unconditional Shutdown............................................................. 45
Fast power down ........................................................................ 48
5.6.1. Fast Shut Down by Hardware..................................................... 49
5.6.2. Fast Shut Down by Software....................................................... 49
Communication ports.................................................................. 50
5.7.1. USB 2.0 HS................................................................................ 50
5.7.2. SPI.............................................................................................. 51
5.7.3. Serial Ports................................................................................. 52
5.7.3.1. Modem serial port 1.................................................................... 52
5.7.3.2. Modem serial port 2.................................................................... 54
5.7.3.3. RS232 level translation............................................................... 55
General purpose I/O................................................................... 56
5.8.1. Using a GPIO as INPUT............................................................. 57
5.8.2. Using a GPIO as OUTPUT ......................................................... 58
5.8.3. Indication of network service availability ..................................... 58
External SIM Holder.................................................................... 59
ADC Converter........................................................................... 59

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6. RF SECTION.............................................................................. 61
Bands Variants........................................................................... 61
TX Output power......................................................................... 61
RX Sensitivity ............................................................................. 61
Antenna requirements................................................................. 61
6.4.1. PCB Design guidelines............................................................... 62
6.4.2. PCB Guidelines in case of FCC Certification .............................. 63
6.4.2.1. Transmission line design ............................................................ 64
6.4.2.2. Transmission Line Measurements .............................................. 65
6.4.2.3. Antenna Installation Guidelines................................................... 67
7. AUDIO SECTION....................................................................... 68
Electrical Characteristics............................................................. 68
Codec examples......................................................................... 68
8. GNSS SECTION......................................................................... 69
GNSS Signals Pin-out................................................................. 69
RF Front End Design.................................................................. 69
8.2.1. Guidelines of PCB line for GNSS Antenna.................................. 69
GNSS Antenna Requirements.................................................... 70
8.3.1. GNSS Antenna specification....................................................... 70
8.3.2. GNSS Antenna –Installation Guidelines..................................... 70
8.3.3. Powering the External LNA (active antenna)............................... 70
GNSS Characteristics................................................................. 71
9. MECHANICAL DESIGN............................................................. 72
Drawing ...................................................................................... 72
10. APPLICATION PCB DESIGN .................................................... 73
Recommended footprint for the application................................. 73
PCB pad design.......................................................................... 75
Recommendations for PCB pad dimensions............................... 76
Thermal performance.................................................................. 77
Stencil......................................................................................... 77
Solder paste ............................................................................... 78
Solder Reflow............................................................................. 78
Inspection................................................................................... 80
11. PACKAGING.............................................................................. 81
Tray............................................................................................ 81
Reel............................................................................................ 83

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Carrier Tape detail...................................................................... 83
Reel detail................................................................................... 84
Packaging detail ......................................................................... 85
Moisture sensitivity ..................................................................... 85
12. CONFORMITY ASSESSMENT ISSUES .................................... 86
Approvals.................................................................................... 86
13. SAFETY RECOMMENDATIONS................................................ 93
READ CAREFULLY.................................................................... 93
14. ACRONYMS............................................................................... 94
15. DOCUMENT HISTORY.............................................................. 96

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1. INTRODUCTION
Scope
Scope of this document is to give a description of some hardware solutions useful for
developing a product with the Telit ME910G1 module.
Audience
This document is intended for Telit customers, who are integrators, about to implement
their applications using our ME910G1 modules.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
•TS-AMERICAS@telit.com
•TS-APAC@telit.com
•TS-SRD@telit.com
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.

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Text Conventions
Danger –This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning –Alerts the user to important points about
integrating the module, ifthese points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information –Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
Related Documents
80000NT10001A - SIM INTEGRATION DESIGN GUIDES Application Note
80000NT10060A - xE910 Global Form Factor Application Note
80000NT10002A - ANTENNA DETECTION
80000NT10003A - Rework procedure for BGA modules
80000NT10028A - Event Monitor Application Note

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2. GENERAL PRODUCT DESCRIPTION
Overview
The ME910G1 module is a CATM / NBIoT communication product which allows integrators
to plan on availability for even the longest lifecycle applications, highly recommended for
new designs specified for coverage worldwide.
The product is fully voice capable, the digital audio interfaces make it suitable for
applications such as voice enabled alarm panels, mHealth patient monitors and specialty
phones such as those for the elderly or sensory-impaired.
The ME910G1 operates with 1.8 V GPIOs, minimizing power consumption and making it
even more ideally suited for battery powered and wearable device applications.
Product Variants and Frequency Bands
Product
2G Band (MHz)
LTE CATM1
NBIoT
Region
ME910G1-W1
-
B1, B2, B3, B4,
B5, B8, B12,
B13, B18, B19,
B20, B25, B26,
B27, B28, B66,
B85
B1, B2, B3, B4,
B5, B8, B12,
B13, B18, B19,
B20, B25, B26,
B28, B66, B71,
B85
Worldwide
ME910G1-WW
850, 900, 1800,
1900
B1, B2, B3, B4,
B5, B8, B12,
B13, B18, B19,
B20, B25, B26,
B27, B28, B66,
B85
B1, B2, B3, B4,
B5, B8, B12,
B13, B18, B19,
B20, B25, B26,
B28, B66, B71,
B85
Worldwide
Refer to “RF Section” for details information about frequencies and bands.
NOTE:
Cellular technologies and frequency bands that are enabled may
vary based on firmware version and firmware configuration used.

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Target Market
ME910G1 can be used for telematics applications where tamper-resistance,
confidentiality, integrity, and authenticity of end-user information are required, for example:
•Telematics services
•Road pricing
•Pay-as-you-drive insurance
•Stolen vehicles tracking
•Internet connectivity
Main features
Function
Features
Modem
•CATM and NBIoT technologies
•SMS support (text and PDU)
•Alarm management
•Real Time Clock
Intefaces
•Main UART is typically used for AT command access
•Secondary UARTused for Diagnostic monitoring and
debugging
•10 GPIOs
•Antenna port
TX Output Power
2.5.1. ME910G1-W1
Band
Mode
Class
RF power (dBm)
B1, B2, B3, B4, B5, B8, B12,
B13, B14, B18, B19, B20,
B25, B26, B27, B28, B66,
B85
(LTE) CAT-
M1
5
20 (+-2dB)
B1, B2, B3, B4, B5, B8, B12,
B13, B18, B19, B20, B25,
B26, B28, B66, B71, B85
(LTE) CAT-
NB2
5
20 (+-2dB)

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2.5.2. ME910G1-WW
Band
Mode
Class
RF power (dBm)
850/900MHz
GSM
4
33 (+-2dB)
1800/1900MHz
DCS/PCS
1
30 (+-2dB)
B1, B2, B3, B4, B5, B8, B12,
B13, B18, B19, B20, B25, B26,
B27, B28, B66, B85
(LTE) CAT-
M1
3
23 (+-2dB)
B1, B2, B3, B4, B5, B8, B12,
B13, B18, B19, B20, B25, B26,
B28, B66, B71, B85
(LTE) CAT-
NB2
3
23 (+-2dB)
RX Sensitivity
2.6.1. ME910G1-W1
Band
REFsens (dBm)
Typical
3GPP REFsens (dBm)*
CATM1 / Band1
-107.6
-102.7
CAT M1 / Band2
-108.0
-100.3
CAT M1 / Band3
-107.6
-99.3
CAT M1 / Band4
-107.8
-102.3
CAT M1 / Band5
-107.9
-100.8
CAT M1 / Band8
-107.8
-99.8
CAT M1 / Band12
-107.8
-99.3
CAT M1 / Band13
-108.0
-99.3

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CAT M1 / Band18
-108.0
-102.3
CAT M1 / Band19
-108.0
-102.3
CAT M1 / Band20
-107.8
-99.8
CAT M1 / Band25
-108.0
-
CAT M1 / Band26
-108.0
-100.3
CAT M1 / Band27
-108.0
-100.8
CAT M1 / Band28
-107.9
-100.8
CAT M1 / Band66
-107.8
-
CAT M1 / Band85
-107.6
-
CAT NB2 / Band1
-116.8
-108.2
CAT NB2 / Band2
-116.8
-108.2
CAT NB2 / Band3
-116.8
-108.2
CAT NB2 / Band4
-116.7
-
CAT NB2 / Band5
-116.7
-108.2
CAT NB2 / Band8
-116.4
-108.2
CAT NB2 / Band12
-116.8
-108.2
CAT NB2 / Band13
-116.8
-108.2
CAT NB2 / Band18
-116.8
-108.2

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CAT NB2 / Band19
-116.8
-108.2
CAT NB2 / Band20
-116.6
-108.2
CAT NB2 / Band25
-116.8
-
CAT NB2 / Band26
-116.8
-108.2
CAT NB2 / Band28
-116.9
-108.2
CAT NB2 / Band66
-116.6
-108.2
CAT NB2 / Band71
-115.4
-
CAT NB2 / Band85
-116.8
-
* 3GPP TS 36.521-1 Release 15

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Mechanical Specifications
2.7.1. Dimensions
The overall dimensions of ME910G1-W1 and ME910G1-WW are:
•Length: 28.2 mm
•Width: 28.2 mm
•Thickness: 2.4 mm
2.7.2. Weight
This information will be available in a next document revision.
Temperature Range
Note
Operating Temperature
Range
–20°C to +55°C
The module is fully functional(*)
within this 3GPP temperature
range and meets 3GPP
specifications.
Extended Temperature
Range
–40°C to +85°C
The module is fully functional (*)
within this temperature range.
The RF performance may
deviate from 3GPP
requirements in this extended
range. For example: receiver
sensitivity or maximum output
power may deviate by a few dB
due to limitations of physics like
higher thermal noise floor at
high temperature.
Storage Temperature
Range
–40°C to +85°C
-
(*) Functional: if applicable, the module is able to make and receive voice calls, data calls,
send and receive SMS and data traffic.

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3. PINS ALLOCATION
Pin-out
Pin
Signal
I/O
Function
Type
Comment
USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data)
B15
USB_D+
I/O
USB differential Data (+)
C15
USB_D-
I/O
USB differential Data (-)
A13
VUSB
I
Enable pin for the internal
USB transceiver.
5 / 3V
Internal PD
(100K)
Asynchronous Serial Port (FW upgrade and Data with Flow Control)
N15
C103/TXD
I
Serial data input from DTE
CMOS 1.8V
internal PU
(100K)
M15
C104/RXD
O
Serial data output to DTE
CMOS 1.8V
M14
C108/DTR
I
Input for (DTR) from DTE
CMOS 1.8V
internal PU
(100K)
L14
C105/RTS
I
Input for Request to send
signal (RTS) from DTE
CMOS 1.8V
internal PU
(100K)
P15
C106/CTS
O
Output for Clear to Send
signal (CTS) to DTE
CMOS 1.8V
N14
C109/DCD
O
Output for (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
O
Output for (DSR) to DTE
CMOS 1.8V
R14
C125/RING
O
Output for Ring (RI) to
DTE
CMOS 1.8V

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SIM Card Interface
A6
SIMCLK
O
External SIM signal –
Clock
1.8V
A7
SIMRST
O
External SIM signal –
Reset
1.8V
A5
SIMIO
I/O
External SIM signal –
Data I/O
1.8V
A4
SIMIN
I
External SIM signal –
Presence (active low)
CMOS 1.8
Internal PU
(470K)
A3
SIMVCC
-
External SIM signal –
Power supply for the SIM
1.8V
Digital Voice Interface (DVI)
B9
DVI_WA0
I/O
Digital Audio Interface
(WA0)
1.8V
B6
DVI_RX
I
Digital Audio Interface
(RX)
1.8V
B7
DVI_TX
I/O
Digital Audio Interface
(TX)
1.8V
B8
DVI_CLK
I/O
Digital Audio Interface
(CLK)
1.8V
SPI
D15
SPI_MOSI
I/O
SPI MOSI
CMOS 1.8V
E15
SPI_MISO
I/O
SPI_MISO
CMOS 1.8V
F15
SPI_CLK
I/O
SPI Clock
CMOS 1.8V
H14
SPI_CS
I/O
SPI Chip Select
CMOS 1.8V

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DIGITAL IO
C8
GPIO_01
I/O
GPIO_01 /STAT LED
CMOS 1.8V
STAT LED
is alternate
function
internal PD
(100K)
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
internal PD
(100K)
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
internal PD
(100K)
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
internal PD
(100K)
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
internal PD
(100K)
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
internal PD
(100K)
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
internal PD
(100K)
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
internal PD
(100K)
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
internal PD
(100K)
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
internal PD
(100K)
ADC
B1
ADC_IN
AI
Analog Digital Converter
input
RF SECTION

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K1
ANTENNA
I/O
LTE Antenna
(50 ohm)
RF
GNSS Section
R9
ANT_GNSS
I
GNSS Antenna
(50 ohm)
RF
R7
GNSS_LNA_EN
O
External GNSS LNA
Enable
CMOS 1.8V
Miscellaneous Functions
R13
HW_SHUTDOWN*
I
HW Unconditional
Shutdown
VBATT
Active low
R12
ON_OFF*/WAKE*
I
Input command for power
ON and to wake from deep
sleep mode
1.8V
Active low
R11
VAUX/PWRMON
O
Supply Output for external
accessories / Power ON
Monitor
1.8V
F14
FORCED_USB_BOO
T
I
Debug pin, connect to test
point
CMOS 1.8V
Active high,
internal PD
(100K)
Power Supply
M1
VBATT
-
Main power supply
(Baseband)
Power
M2
VBATT
-
Main power supply
(Baseband)
Power
N1
VBATT_PA
-
Main power supply (Radio
PA)
Power
N2
VBATT_PA
-
Main power supply (Radio
PA)
Power
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