Zte MG2639 User manual

MG2639 User Manual
Version：V1.0

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Copyright Statement
Copyright ©2010 by ZTE Corporation
All rights reserved.
No part of this publication may be excerpted, reproduced, translated or utilized in any form or by
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written permission of ZTE Corporation.
is the registered trademark of ZTE Corporation. All other trademarks appeared in
this manual are owned by the relevant companies.
ZTE Corporation reserves the right to make modifications on print errors or update specifications
in this manual without prior notice.
ZTE Corporation keeps the right to make the final explanation to this manual.

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Descriptions of version update
Product version Document version Document No. Descriptions of
document update
MG2639 V1.0
Release for the first
time
Author
Document
version Date Written by Checked by Approved by
1.0 2011-8-22 Zhou Tao

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With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module
customers with the following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.;
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports
through telephone, website, instant communication, E-mail, etc.

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Preface
Summary
This document introduces MG2639 module’s product principle diagram, PINs, hardware interface
and module’s mechanical design, which can instruct the users how to quickly and conveniently
design different kinds of wireless terminals based on this type of module.
Target Readers
This document mainly applies to the following engineers:
System designing engineers
Mechanical engineers
Hardware engineers
Software engineers
Test engineers

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Contents
1GENERAL DESCRIPTION OF MODULE........................................................................1
1.1INTRODUCTION OF MODULE’S FUNCTIONS.....................................................1
1.2MODULE’S PRINCIPLE DIAGRAM .......................................................................2
1.3ABBREVIATIONS...................................................................................................3
2DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES ........................................5
2.1DEFINITIONS OF MODULE’S INTERFACES........................................................5
2.2ANTENNA INTERFACE .........................................................................................6
3MODULE’S ELECTRICAL CHARACTERISTICS ...........................................................8
3.1DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS.....................................8
3.1.1RESET..........................................................................................................8
3.1.2SIM CARD INTERFACE ...............................................................................8
3.1.3AUDIO INTERFACE .....................................................................................9
3.1.4NETWORK SIGNAL INDICATION................................................................9
3.2MODULE POWER CONSUMPTION....................................................................10
3.3RELIABILITY CHARACTERISTICS .....................................................................10
4INTERFACE CIRCUIT DESIGN ....................................................................................11
4.1RESET AND POWER DESIGN ............................................................................11
4.2UART INTERFACE...............................................................................................12
4.3SIM CARD INTERFACE .......................................................................................13
4.4AUDIO INTERFACE .............................................................................................14
5MECHANICAL DIMENSIONS .......................................................................................15
5.1APPEARANCE DIAGRAM ...................................................................................15
5.2MODULE ASSEMBLY DIAGRAM ........................................................................15
5.3PCB DIMENSIONS ..............................................................................................16
6ANTENNA INTERFACE................................................................................................16
6.1ANTENNA INSTALLATION ..................................................................................17
6.2ANTENNA PAD ....................................................................................................17
6.3ANTENNA CONNECTOR ....................................................................................17

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6.4ANTENNA SUBSYSTEM .....................................................................................18
6.4.1ANTENNA SPECIFICATIONS....................................................................18
6.4.2CABLE LOSS..............................................................................................19
6.4.3ANTENNA GAIN MAXIMUM REQUIREMENTS .........................................19
6.4.4ANTENNA MATCHING...............................................................................19
6.4.5PCB DESIGN CONSIDERATIONS.............................................................19
ANTENNA INTERFACE.................................................................................................19
7OEM/INTEGRATORS INSTALLATIONS ......................................................................20

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Figures
Figure 1-1 Module’s principle diagram ............................................................................................ 2
Figure 2-1 Antenna interface diagram............................................................................................. 6
Figure 5-1 MG2639 module’s appearance.................................................................................... 15
Figure 5-2 Module’s assembly diagram ........................................................................................ 15
Figure 5-3 Relevant PCB dimensions ........................................................................................... 16
Tables
Table 1-1 Module’s functions .......................................................................................................... 1
Table 1-1 28Pin stamp-hole definition............................................................................................. 5
Table 4-1 Voltage characteristics.................................................................................................. 11

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1 General description of module
This chapter mainly provides a general description of the module, including basic functions and
logic block diagram.
1.1 Introduction of module’s functions
The maximum operating ambient temperature of the equipment declared by the manufacturer is
75℃
Table 1-1 Module’s functions
Parameter MG2639
General Features
Frequency Bands GSM850/EGSM900/DCS1800/PCS1900
Dimensions 30.0×25.0x2.68mm
Weight 7g
Operating Temperature Range -30°C~+75°C
Storage Temperature Range -40°C~+85°C
Performance
Operating Voltage Range 3.6V~4.2V/Typical: 3.9V
Current Consumption Typically
Idle Current: 2mA
Call Current: 128mA
Max Current: 300mA
TX Power GSM850/EGSM900: Class 4 (2W)
DCS1800/PCS1900: Class 1 (1W)
RX Sensitivity <-106dBm
Interfaces
Connector 28Pin Stamp Holes
Antenna SMT 50ΩAntenna Connector
Antenna Solder Pad
Integrated Full Duplex UART AT/Data
SIM Card Interface 1.8V/3.0V
Data Features
GPRS Class 10
Mobile Station Class B
Max Downlink 85.6kbps
Max Uplink 42.8kbps
Protocol Internal TCP/IP&UDP
Embedded FTP
SMS Features

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Parameter MG2639
Support TEXT/PDU Mode
Point-to-point MO/MT
SMS Cell Broadcast
Voice Features
Vocoders HR/FR/EFR/AMR
Echo Cancellation/Volume Control/DTMF
AT Command Set
GSM 07.05/GSM 07.07/ZTE Proprietary AT Commands
1.2 Module’s principle diagram
The block diagram is used to describe the module’s major logic functions:
Figure 1-1 Module’s principle diagram

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1.3 Abbreviations
A
ADC Analog-Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
B
BER Bit Error Rate
BTS Base Transceiver Station
C
CDMA Code Division Multiple Access
CDG CDMA Development Group
CS Coding Scheme
CSD Circuit Switched Data
CPU Central Processing Unit
D
DAI Digital Audio interface
DAC Digital-to-Analog Converter
DCE Data Communication Equipment
DSP Digital Signal Processor
DTE Data Terminal Equipment
DTMF Dual Tone Multi-Frequency
DTR Data Terminal Ready
E
EDGE Enhanced Data Rate for GSM Evolution
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
EMI Electro Magnetic Interference
ESD Electronic Static Discharge
ETS European Telecommunication Standard
F
FDMA Frequency Division Multiple Access
FR Full Rate
G
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
H
HR Half Rate
I
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
L

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LCD Liquid Crystal Display
LED Light Emitting Diode
M
MCU Machine Control Unit
MMI Man Machine Interface
MS Mobile Station
MTBF Mean Time Before Failure
P
PCB Printed Circuit Board
PCL Power Control Level
PCS Personal Communication System
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
R
RAM Random Access Memory
RF Radio Frequency
ROM Read-only Memory
RMS Root Mean Square
RTC Real Time Clock
S
SIM Subscriber Identification Module
SMS Short Message Service
SMT Surface Mount Technology
SRAM Static Random Access Memory
T
TA Terminal adapter
TDMA Time Division Multiple Access
TE Terminal Equipment also referred it as DTE
U
UART Universal asynchronous receiver-transmitter
UIM User Identifier Management
USB Universal Serial Bus
USIM Universal Subscriber Identity Module
V
VSWR Voltage Standing Wave Ratio
Z
ZTE ZTE Corporation

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2 Descriptions of module’s external interfaces
This chapter mainly describes the module’s external interfaces, such as B2B connector, MINI
PCI-E, stamp-hole connector, etc.
2.1 Definitions of module’s interfaces
Table 1-1 28Pin stamp-hole definition
No. Definition I/O Description Remarks
1 GND GND
2 RF_ANT I/O RF antenna
3 GND GND
4 RING O Ring signal
indication
Level varies upon an incoming call or
receipt of text message.
5 GND GND
6 VBAT I Work voltage
7 RSSI_LED O Network signal
indication
Internal pull-down, LED on at high
level, need add triode driver
externally.
-power-on status: LED off;
-network searching status: LED
blinks at 3Hz
-Idle status: LED blinks at 1Hz
-Traffic status (call, data): LED blinks
at 5Hz.
8 RTS I Request to send

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9 CTS O Clear to send
10 DCD O Carrier detection
11 CARD_RST O card reset
12 CARD_CLK O card clock
13 CARD_DATA I/O card data
14 V_CARD O Card voltage
15 RXD I Receive data
16 TXD O Transmit data
17 SYSRST_N I Reset signal Valid at low level, need connect an
open collector/drain switch.
18 SPK_2P O Headset Speaker +
19 SPK_1P O Microphone
speaker +
20 SPK_1N O Microphone
speaker -
21 MIC_2P I Headset
microphone +
22 MIC_1P I Receiver
microphone +
23 MIC_1N I Receiver
microphone -
24 PWRKEY_N I power on-off Valid at low level, need connect an
open collector/drain switch.
25 DTR I Data terminal ready
_WAKEUP
26 DSR O Data set ready
27 V_MSM O 2.8V
28 GND GND
2.2 Antenna interface
MG2639 module provides two kinds of antenna interface:
PCB welding pad
Antenna test socket
PCB welding pad adopts 50ΩRF shield cable to connect the module and the antenna, in order to
reduce the cost. However, using this method can’t completely shield the electromagnets, which
might have slight influence on RF signal quality. Please note that there should not be strong
radiation near the welding pad. Meantime, during the welding, make sure the core of RF shield
cable must connect with RF welding pad, and RF shield cable’s shield metal mask must be welded
to the module’s GND. During the welding, the GND must be welding securely, otherwise the core is
easily broken due to the shaking of shield cable. See figure 2-1 for RF welding pad antenna.
Figure 2-1 Antenna interface diagram

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3 Module’s electrical characteristics
This chapter mainly introduces the module’s electrical characteristics, including the level, power
consumption, reliability of module’s interfaces.
3.1 Descriptions of levels of interface signals
It describes the MAX, MIN and typical value of the level of module’s external interfaces.
3.1.1 Reset
SYSRST_N PIN is used to reset the module’s main chip, and SYSRST_N signal needs to be
pulled down 500ms to reset the module. Likewise, this pin is required to pull up 2.8V (Max: 2.9V,
Min: 2.7V, typical: 2.8V) through 4.7K resistor inside the module, and pull down 0.1uF capacitance
to GMD filtering, and it’s required to externally connect dynatron driver.
MG2639 module provides 1CH serial interface, supports 8-wire serial BUS interface or 4-wire
serial BUS interface or 2-wire serial interface. The module communicates with the external devices
and inputs AT commands through UART interface.
Classification Definition I/O Description Min.
voltage Typical voltage Max. voltage
UART RXD I Receive data 2.4V 2.8V 3.1V
/RTS I Request to send 2.4V 2.8V 3.1V
TXD O Transmit data 2.4V 2.8V 3.1V
/DTR I Data terminal
ready_WAKEUP
2.4V 2.8V 3.1V
/CTS O Clear to send 2.4V 2.8V 3.1V
RING O Ring signal
indication
2.4V 2.8V 3.1V
/DSR O Data set ready 2.4V 2.8V 3.1V
DCD O Carrier detection 2.4V 2.8V 3.1V
3.1.2 SIM Card Interface
MG2639 module baseband processor integrates SIM card interface conforming to ISO 7816-3
standard, and it’s compatible with SIM card with two voltages 1.8V/3.0V and reserves SIM card
interface signal on the stamp-hole PIN.
Users should note that SIM card’s electrical interface definitions are the same as SIM card socket’s
definitions.
Figure 3-1 Standard SIM card PIN Definitions Diagram

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Classification Definition I/O Description Remarks
SIM V_CARD O Card voltage 1.8V/3V; maximum
output current 20mA
CARD_RST O Card reset
GND GND
CARD_CLK O Card clock
CARD_DATA I/O Card data
3.1.3 Audio Interface
MG2639 module supports 2CH audio signal inputs/outputs. It features in handheld microphone,
handheld receiver or hands-free speaker and earpiece microphone/receiver function. These two
MIC inputs are coupled in AC domain and the offset voltage is added inside, and they should
directly connect with the receiver. The two receiver interfaces SPK_1 and SPK_2 are both
differential interfaces with 32Ωresistance; SPK_2 is single-ended interface with 32Ωresistance.
See the audio interface signals in the table below:
Classification Definition I/O Description Remarks
AUDIO MIC_1N I Receiver’s Microphone- The first differential receiver
used for the default audio
input/output and the second
receiver used for headset
audio input/output.
MIC_1P I Receiver’s Microphone+
MIC_2P I Headset microphone +
SPK_1N O Receiver’s speaker-
SPK_1P O Receiver’s speaker+
SPK_2P O Headset speaker +
3.1.4 Network Signal Indication
RSSI_LED Internal pull-down, LED turns on at high level, and need add triode driver externally.
-Power-on status: LED off;
-Network searching status: LED blinks at 3Hz
-Idle status: LED blinks at 1Hz
-Traffic status (call, data): LED blinks at 5Hz.

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SIG_LED PIN output status is defined according to the software protocol, and users could judge
the module’s work status according to SIG_LED status. SIG_LED PIN is common I/O port, which
can’t directly drive LED, and it needs to work with dynatron.
3.2 Module Power Consumption
It describes the module’s power consumption under each status:
No. Test items
Typical value（mA）
1 Power-off leakage current
(Normal power-off)
50uA
2 Average standby current (no
operation after power-on)
2mA
3 Average standby current (after
talk)
2mA
4 Talk current 128mA
3.3 Reliability Characteristics
It describes the temperature, including working temperature and storage temperature.
Working temperature: -30°C~+75°C
Storage temperature: -40°C~+85°C

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4 Interface circuit design
It provides the reference design circuit of the interface and precautions according to the module’s
functions.
4.1 Reset and power design
See the reference design principle of power and reset circuit in figure 4-1:
Figure 4-1 Power and reset circuit reference design principle diagram
Power design
MG2639 module is powered by VBAT. See the voltage characteristics in table 4-1.
Table 4-1 Voltage characteristics
Classification MIN Typical MAX
Input voltage 3.4V 3.9V 4.25V
Input current 2mA（average）-- 300mA（depends on the
network signal）
D1 is an enabled LDO with 6V~9V input voltage. Through adjusting R31and R41, it could make
V_MAIN at 3.9V to power the module, and it’s required to place at least one 1000uF tantalum
capacitor at V-Main input pin. The module is very strict with the requirements on power and GND,
therefore it’s requested that filtering must be performed to power and GND, and the power ripple
must be controlled under 50Mv. Do not use LDO to power any other part in the system because it
might affect the RF performance. Finally, select the power cables with at least 80mil traces during
the layout and keep the integrality of ground line.
If MG2639 module uses other LDO, make sure the output current is larger than 2A.
Power on
The module is under power-off status after it’s normally powered on. To turn on the module,
provide a 2s-5s low level pulse to PWRKEY_N pin when the module is OFF. If one 1K resistance is
connected with PWRKEY_N, the module can be turned on after power supply.
Note: ON/OFF and /Reset need to connect an open collector/drain gate.
It’s not required to operate /RESET signal upon power-on.