YUGE CLM920 NC2 LTE M.2 Parts list manual

Product Name
CLM920_NC2_LTE M.2 Module Hardware Usage Guide
Number of Pages
40
Produce Version
V1.1
Date
20180316
CLM920_NC2 LTE M.2
Module Hardware Usage Guide
V1.1
Shanghai Yuge Information Technology co., LTD
All rights reserved

CLM920_NC2_LTE M.2 Module Hardware Usage Guide
Shanghai Yuge Information Technology co., LTD
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Update records
Version
Date
Author
Description
V1.0
20170622
David
Initial
V1.1
20180316
David
Update image and GPS section

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Contents
Chapter 1. Introduction...........................................................................................................- 6 -
Chapter 2. Product review...................................................................................................... - 8 -
2.1 Product introduction................................................................................................. - 8 -
2.2 Module characteristics..............................................................................................- 8 -
2.3 Module function..................................................................................................... - 10 -
Chapter 3. Interface application description.........................................................................- 12 -
3.1 Chapter overview....................................................................................................- 12 -
3.2 Module interface.....................................................................................................- 12 -
3.2.1 75-pin gold finger........................................................................................ - 12 -
3.2.2 Interface definition...................................................................................... - 13 -
3.3 Power interface.......................................................................................................- 17 -
3.4 USB interface......................................................................................................... - 20 -
3.5 UART interface...................................................................................................... - 21 -
3.6 USIM interface....................................................................................................... - 23 -
3.6.1 USIM card reference circuit........................................................................ - 23 -
3.6.2 USIM_DET Hot Swap Reference Design...................................................- 24 -
3.7 General purpose GPIO interface............................................................................ - 25 -
3.8 Network indication interface.................................................................................. - 26 -
3.9 RF antenna interface...............................................................................................- 27 -
3.9.1 RF connector location..................................................................................- 27 -
3.9.2 RF connector size........................................................................................ - 28 -
Chapter 4. Overall technical indicators................................................................................ - 31 -
4.1 Chapter overview....................................................................................................- 31 -
4.2 Working frequency................................................................................................. - 31 -
4.3 Conducted radio frequency measurement.............................................................. - 32 -
4.3.1 Test environment......................................................................................... - 32 -
4.3.2 standard test................................................................................................. - 32 -
4.4 Conducted receiving sensitivity and transmit power......................................- 32 -
4.5 Antenna requirements.............................................................................................- 34 -
4.6 Power consumption characteristics........................................................................ - 35 -
Chapter 5. Interface electrical characteristics.......................................................................- 37 -
5.1 Working storage temperature..................................................................................- 37 -
5.2 Module IO level......................................................................................................- 37 -

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5.3 power supply.......................................................................................................... - 37 -
5.4 Electrostatic property..............................................................................................- 38 -
Chapter 6. Structural and mechanical properties..................................................................- 39 -
6.1 Exterior................................................................................................................... - 39 -
6.2 PCI Express M.2 connector....................................................................................- 39 -
6.3 Module fixing method............................................................................................ - 40 -
Graph index
Figure 2-1 Functional block diagram of the CLM920_NC2 M.2 module........................... - 11 -
Figure 3-1 TOP face gold finger interface pin......................................................................- 13 -
Figure 3-2 Detail of the gold finger TOP and BOTTOM AB.............................................. - 13 -
Figure 3-3 LDO power reference circuit.............................................................................. - 18 -
Figure 3-4 DCDC power supply reference circuit............................................................... - 19 -
Figure 3-5 MOS tube control power switch reference circuit..............................................- 19 -
Figure 3-6 GSM TDMA Burst Current Supply Voltage Drop..............................................- 20 -
Figure 3-7 USB connection design circuit diagram............................................................. - 21 -
Figure 3-8 UART serial port design..................................................................................... - 22 -
Figure 3-9 Level shifting circuit...........................................................................................- 22 -
Figure 3-10 USIM design circuit diagram............................................................................- 23 -
Figure 3-11 SIM card hot swap detection............................................................................ - 24 -
Figure 3-12 Reset Reference Circuit.................................................................................... - 25 -
Figure 3-13 Boot timing diagram......................................................................................... - 26 -
Figure 3-14 Network indicator circuit diagram....................................................................- 27 -
Figure 3-15 Distribution location of the RF connector........................................................ - 28 -
Figure 3-16 RF connector size chart.................................................................................... - 28 -
Figure 3-17 Matching coaxial RF line size.......................................................................... - 29 -
Figure 3-18 Main set, diversity, GPS antenna matching circuit...........................................- 30 -
Figure 6-1 Appearance of the CLM920_NC2...................................................................... - 39 -
Figure 6-2 APCI0026-P001A M.2 connector size................................................................- 40 -
Table index
Table 2-1 Module Specifications............................................................................................- 8 -
Table 2-2 Key Features...........................................................................................................- 8 -
Table 3-1 IO parameter definition........................................................................................ - 13 -

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Table 3-2 Interface definition............................................................................................... - 14 -
Table 3-3 Power pin definition............................................................................................. - 17 -
Table 3-4 Power supply circuit filter capacitor design is as follows....................................- 19 -
Table 3-5 USB interface pin definition................................................................................ - 20 -
Table 3-6 UART serial port signal definition....................................................................... - 22 -
Table 3-7 SIM card signal definition....................................................................................- 23 -
Table 3-8 SIM card hot swap detection pin definition......................................................... - 24 -
Table 3-9 General GPIO Pin Definitions..............................................................................- 25 -
Table 3-10 RESET pin parameters....................................................................................... - 25 -
Table 3-11 Boot timing parameters...................................................................................... - 26 -
Table 3-12 Network indicator pin definition........................................................................ - 27 -
Table 3-13 Network indication status...................................................................................- 27 -
Table 3-14 Main parameters of the RF connector................................................................ - 28 -
Table 4-1 RF frequency table............................................................................................... - 31 -
Table 4-2 Test instruments....................................................................................................- 32 -
Table 4-3 2G/3G RF Specifications..................................................................................... - 32 -
Table 4-4 4G RF sensitivity indicators.................................................................................- 33 -
Table 4-5 4G RF transmit power specifications................................................................... - 33 -
Table 4-6 Main set antenna indicator requirements............................................................. - 34 -
Table 4-7 GNSS antenna indicator requirements................................................................. - 34 -
Table 4-8 GSM power consumption.....................................................................................- 35 -
Table 4-9 WCDMA Power Consumption.............................................................................- 35 -
Table 4-10 LTE power consumption.................................................................................... - 36 -
Table 4-11 TD-SCDMA power consumption.......................................................................- 36 -
Table 5-1 CLM920_NC2 M.2 4G module working storage temperature............................ - 37 -
Table 5-2 Electrical Characteristics of CLM920_NC2 M.2 Module................................... - 37 -
Table 5- 3 CLM920_NC2 M.2 module operating voltage................................................... - 37 -
Table 5-4 CLM920_NC2 M.2 ESD Features....................................................................... - 38 -

CLM920_NC2_LTE M.2 Module Hardware Usage Guide
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Chapter 1. Introduction
This document is the wireless solution product CLM920_NC2 LTE M.2 module hardware
interface manual, designed to describe the hardware components and functional
characteristics of the module solution product, application interface definition and usage
instructions, electrical and mechanical characteristics, etc., for users based on this product
Application development provides hardware instructions.
Abbreviation:
Abbreviation
Description
ADC
Analog-Digital Converter
AFC
Automatic Frequency Control
AGC
Automatic Gain Control
ARFCN
Absolute Radio Frequency Channel Number
B2B
Board to Board Connector
BER
Bit Error Rate
CDMA
Code Division Multiple Access
DAI
Digital Audio interface
DAC
Digital-to-Analog Converter
DSP
Digital Signal Processor
DTR
Data Terminal Ready
EFR
Enhanced Full Rate
EMC
Electromagnetic Compatibility
EMI
Electro Magnetic Interference
ESD
Electronic Static Discharge
EVDO
Evolution Data Only
FR
Full Rate
GPRS
General Packet Radio Service
HR
Half Rate
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
PLL
Phase Locked Loop

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PPP
Point-to-point protocol
RAM
Random Access Memory
ROM
Read-only Memory
RTC
Real Time Clock
SMS
Short Message Service
UART
Universal asynchronous receiver-transmitter
UIM
User Identifier Management
USB
Universal Serial Bus
VSWR
Voltage Standing Wave Ratio

CLM920_NC2_LTE M.2 Module Hardware Usage Guide
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Chapter 2. Product review
2.1 Product introduction
The CLM920_NC2 LTE M.2 module is a PCI Express M.2 1.0 standard module that
integrates multiple network formats such as FDD-LTE/TDD-LTE/TD-SCDMA/WCDMA/
EVDO/CDMA/EDGE/GSM and Wireless terminal products for GPS location services. The
module baseband chip adopts Qualcomm's MDM9X07, supports the three major network
standards of China Mobile Unicom Telecom, and supports OS: Windows 7/Windows
8/Windows 10/Android 4.0 and above. The CLM920_N2 module can be used in the following
situations:
Car Equipment
Wireless POS machine
Wireless advertising, media
Remote monitoring
Smart meter reading
Mobile broadband
automated industry
Other wireless terminals, etc.
2.2 Module characteristics
Table 2-1 Module Specifications
Table 2-2 Key Features
characteristic
description
Physical characteristics
size(L*W*H):42mmx30mmx2.22mm
fixed way
Ground screw hole
product name
description
CLM920_NC2
LTE for CMCC,CUCC and CTCC, support SRLTE,GPS
CLM920_TB2
LTE for CMCC,CUCC and CTCC, support GPS
CLM920_TE2
LTE for EU,CMCC and CUCC, support GPS

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Application processor
Single core ARM Cortex-A7 processor, clocked at 1.2GHZ,
256kB level 2 cache
Working frequency band
(CLM920_NC2)
LTE(FDD):B1/B3/B5/B8
LTE(TDD):B38/B39/B40/B41
WCDMA/HSDPA/HSUPA/HSPA+:B1/B5/B8
TD-SCDMA B34/B39
GSM/GPRS/EDGE Tri Band 850/900/1800
CDMA2000 1X/EVDO BC0
Working frequency band
(CLM920_TB2)
LTE(FDD)B1/B3/B5/B8
LTE (TDD) B38/B39/B40/B41
WCDMA Band B1/B5/B8
TD-SCDMA B34/B39
GSM/GPRS/EDGE Dual Band 900/1800
Working frequency band
(CLM920_TE2)
LTE (FDD)B1/B3/B5/B7/B8/B20
LTE (TDD) B38/B39/B40/B41
WCDMA B1/B3/B5/B8
TD-SCDMA B34/B39
GSM/GPRS/EDGE Tri Band 850/900/1800
Operating Voltage
3.3V - 4.2V Typical voltage 3.3V
Operating temperature
Normal operating temperature–35°C to +75°C
Extreme working temperature –40°C to +85°C
storage temperature:-45°C to +90°C
Application interface
Standard SIM interface, support 3.0V/1.8V, support hot swap
function
USB2.0 (High-Speed)
Hardware reset interface
UART serial interface
Power interface
Network status indication interface
General purpose GPIO interface
Antenna connector
Main antenna connector (MM4829-2702)
Diversity Antenna Connector (MM4829-2702)
GPS antenna connector (MM4829-2702)

CLM920_NC2_LTE M.2 Module Hardware Usage Guide
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Data service
GPRS: DL 85.6 kbps/UL 85.6 kbps
EDGE: DL 236.8 kbps/UL 236.8 kbps
WCDMA CS: DL 64 kbps/UL 64 kbps
WCDMA PS: DL 384 kbps/UL 384 kbps
TDD-HSPA: DL 2.8Mbps/UL 2.2Mbps
TDD-HSPA+: DL 4.2Mbps/UL 2.2Mbps
HSPA+: DL 21.6 Mbps/UL 5.76 Mbps
DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps
CDMA 1X: DL 153.6kbps/UL 153.6kbps
CDMA 1xEVDOr0: DL 2.4Mbps/UL 153kbps
CDMA 1xEVDOrA: DL 3.1Mbps/UL 1.8Mbps
LTE FDD:DL 150Mbps/UL 50Mbps@20M BW cat4 (optional
LTE Cat.4)
LTE TDD:DL 130Mbps/UL 35Mbps@20M BW cat4(optional
LTE Cat.4)
LTE FDD:DL 10Mbps/UL 5Mbps@20M BW cat1(optional
LTE Cat.1)
LTE TDD:DL 10Mbps/UL 5Mbps@20M BW cat1(optional
LTE Cat.1)
Satellite positioning
GPS/BEIDOU/GLONASS
Diversity antenna
Support LTE diversity antenna
AT command
Support standard AT instruction set
(Hayes 3GPP TS 27.007 和
27.005)
Virtual network card
Support USB virtual network card
Module function
distinction
On the label paper, M stands for the main set, D takes the table
diversity, and G stands for GPS.
2.3 Module function
The CLM920_NC2 M.2 module mainly contains the following circuit units:
Baseband processing unit
Power management unit
Memory unit

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RF transceiver unit
RF front end unit
GPS RF receiving unit
The functional block diagram of the CLM920_NC2 M.2 module is as follows:
Figure 2-1 Functional block diagram of the CLM920_NC2 M.2 module

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Chapter 3. Interface application description
3.1 Chapter overview
This chapter mainly describes the interface definition and application of this module.
Contains the following sections:
75-pin gold finger
Interface definition
Power interface
USB interface
USIM interface
UART interface
WWAN control interface
PCM/analog voice interface
RF antenna interface
3.2 Module interface
3.2.1 75-pin gold finger
The CLM920_NC2 M.2 module module uses a 75-pin gold finger interface, of which 67
pin is the signal interface and 8 pin is the gap. For the M.2 naming convention, the
CLM920_NC2 M.2 module uses Type 3042-XX1-B (30mmx42mm, Top surface component
layer thickness is 2.0mm, PCB thickness is 0.8mm, Key ID is B).

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Since the original M.2 protocol does not have a label with a TOP surface of 2.22mm height,
the CLM920_NC2 M.2 module uses Type. "XX" in 3042-XX-B is used to indicate that the
TOP surface component height is 2.22mm
Figure 3-1 TOP face gold finger interface pin
Figure 3-2 Detail of the gold finger TOP and BOTTOM AB
3.2.2 Interface definition
The CLM920_NC2 M.2 module interface is a standard PCI Express M.2 interface. The
module interface definitions are shown in the following table:
Table 3-1 IO parameter definition

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Symbol
Description
IO
Two-way input and output
PI
power input
PO
Power Output
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
Table 3-2 Interface definition
Pin
Standard pin
definition
Module pin
definition
IO
Functional
description
Remarks
1
CONFIG3
NC
-
-
-
2
3.3Vaux
VBAT
PI
power input
Supply voltage
3.3-4.2V, typical 3.3V
3
GND
GND
-
Ground
-
4
3.3Vaux
VBAT
PI
power input
Supply voltage
3.3-4.2V, typical 3.3V
5
GND
GND
-
Ground
-
6
POWER_ON_
OFF
POWER_ON
DI
Power on signal
Active high
7
USB_D+
USB_DP
IO
USB2.0
differential signal
+
-
8
W_DISABLE
#
W_DISABL
E#
DI
WWAN shutdown
control signal
Active low
9
USB_D-
USB_DM
IO
USB2.0
differential signal
-
-
10
LED#
STATUS_LE
D
DO
System status
indicator
OD output
11
NOTCH
-
-
-
-

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12
NOTCH
-
-
-
-
13
NOTCH
-
-
-
-
14
NOTCH
-
-
-
-
15
NOTCH
-
-
-
-
16
NOTCH
-
-
-
-
17
NOTCH
-
-
-
-
18
NOTCH
-
-
-
-
19
NOTCH
-
-
-
-
20
RESERVED
SPI_CLK
DO
SPI clock output
-
21
CONFIG_0
VCC_EXT
PO
1.8V power output
Reserved optional
22
RESERVED
SPI_CS
DO
SPI chip selection
-
23
WAKE_ON_
WWAN#
WAKEUP_O
UT
DO
OC output
Module wakes up
host, PWM output
24
RESERVED
SPI_MISO
IO
SPI master input
slave output
-
25
BODYSAR_N
NC
-
-
-
26
W_DISABLE
2#
NC
-
-
-
27
GND
GND
-
Ground
-
28
NC
SPI_MOSI
IO
SPI main output
from input
-
29
NC
NC
-
-
-
30
UIM_RESET
UIM_RESE
T
DO
SIM card reset
signal
31
NC
NC
-
-
-
32
UIM_CLK
UIM_CLK
DO
SIM card clock
signal
33
GND
GND
-
Ground
-
34
UIM_DATA
UIM_DATA
IO
SIM card data
signal
35
NC
URAT_TXD
DO
Module serial port
sending
Reserved optional

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36
UIM_PWR
UIM_PWR
PO
SIM power supply
37
NC
UART_RXD
DI
Module serial port
receiving
Reserved optional
38
NC
NC
-
-
-
39
GND
GND
-
Ground
-
40
I2C_CLK
I2C_CLK
DO
I2C serial clock
-
41
NC
NC
-
-
-
42
I2C_SDA
I2C_SDA
IO
I2C serial data
-
43
NC
NC
-
-
-
44
I2C_IRQ
WAKEUP_I
N
-
Wake up input
Host wakes up
module, low effective
45
GND
GND
-
Ground
-
46
SYSCLK
MCLK
DO
Clock output
Reserved optional
47
NC
NC
-
-
-
48
TX_BLANKI
NG
NC
-
-
-
49
NC
NC
-
-
-
50
NC
NC
-
-
-
51
GND
GND
-
Ground
-
52
NC
NC
-
-
-
53
NC
NC
-
-
-
54
NC
NC
-
-
-
55
NC
NC
-
-
-
56
NC
NC
-
-
-
57
GND
GND
-
Ground
-
58
NC
NC
-
-
-
59
ANTCTL0
NC
-
-
-
60
NC
NC
-
-
-
61
ANTCTL1
NC
-
-
-
62
NC
NC
-
-
-
63
ANTCTL2
NC
-
-
-
64
NC
NC
-
-
-

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65
ANTCTL3
NC
-
-
-
66
SIM_DET
SIM_DET
DI
SIM card hot plug
detection
-
67
RESET#
RESET#
DI
Reset control
Active low
68
NC
NC
-
-
-
69
CONFIG_1
NC
-
-
-
70
3.3Vaux
VBAT
PI
power input
Supply voltage
3.3-4.2V, typical 3.3V
71
GND
GND
-
Ground
-
72
3.3Vaux
VBAT
PI
power input
Supply voltage
3.3-4.2V, typical 3.3V
73
GND
GND
-
Ground
-
74
3.3Vaux
VBAT
PI
power input
Supply voltage
3.3-4.2V, typical 3.3V
75
CONFIG_2
NC
-
-
-
The module typically has an IO port level of 1.8V (in addition to the SIM, the SIM card
port level supports 1.8V and 3.0V).
This module defines the RESERVED or NC pin to be left unconnected.
3.3 Power interface
The CLM920_NC2 M.2 module power connector consists of two parts:
VBAT is the working power of the module;
UIM_PWR is the working power supply for the SIM card;
The power interface of the CLM920_NC2 M.2 module is as follows:
Table 3-3 Power pin definition
Pin number
name
I/O
description
Minimum
voltage
Typical
voltage
Maximum
voltage
2,4,70,72,74
VBAT
PI
Module
power supply
3.3V
3.7V
4.2V

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36
UIM_PWR
PO
SIM power
supply
0V
1.8/2.85V
1.98/3.3V
21
VCC_EXT
PO
1.8V power
supply
0V
1.8V
1.85V
3,5,11,27,33,
39,45,51,57,
71,73
GND
PI
Ground
-
0
-
CLM920_NC2 M.2 module adopts single power supply mode, the module provides 5
power supply pins and 11 ground pins. In order to ensure the normal operation of the module,
all power and ground pins must be connected. The module power supply range is 3.3-4.2V,
and it is recommended to use 3.7V/2A power supply. The module will generate a peak current
of more than 2A when transmitting data or talking, resulting in a large ripple on the power
supply. Therefore, when designing the circuit, the power supply trace should be kept as short
as possible. It is recommended to reserve one 330uF capacitor near the power input.
Customers are advised to use DCDC or LDO to provide sufficient current. The VBAT is then
powered through the MOS transistor so that the module can be completely powered down.
For practical use, please refer to the following circuit design:
Figure 3-3 LDO power reference circuit

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Figure 3-4 DCDC power supply reference circuit
Figure 3-5 MOS tube control power switch reference circuit
Table 3-4 Power supply circuit filter capacitor design is as follows
Recommended
capacitance
application
Description
330uF
Power supply capacitor
Reduce power supply
fluctuations at high currents
1uF,100nF
Digital signal noise
Filter out digital signals such as
clocks to generate interference

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39pF,33pF
700,850/900MHZ Frequency band
Filter out RF interference
18pF,8.2pF,
6.8pF
1700/1800/1900,2100/2300,
2500/2600MHZ Frequency band
Filter out RF interference
To prevent damage to the module from surges and overvoltages, it is recommended to
connect a 5.1V/500mW Zener diode to the VBAT pin of the module.
It is recommended to add 3 ceramic capacitors (33pF, 10pF, 100nF) to the VBAT pin and
place them near the VBAT pin.
The minimum operating voltage of the module is 3.3V. Since the transmission data or
GSM call will generate more than 2A current, the ripple voltage drop will occur on the
power supply voltage, so the power supply voltage must not be lower than 3.3V.
Figure 3-6 GSM TDMA Burst Current Supply Voltage Drop
3.4 USB interface
CLM920_NC2 M.2 module USB interface supports USB2.0 high speed protocol, supports
slave mode, does not support USB charging mode. USB input and output traces must comply
with the USB2.0 feature. The USB interface is defined as follows:
Table 3-5 USB interface pin definition
Pin number
Signal name
IO
description
7
USB_DP
IO
USB2.0 differential signal +
9
USB_DM
IO
USB2.0 differential signal -
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