Fortec Star COMe-mBT10 User manual

The information contained in this document has been carefully researched and is, to the best
of our knowledge, accurate. However, we assume no liability for any product failures or
damages, immediate or consequential, resulting from the use of the information provided
herein. Our products are not intended for use in systems in which failures of product could
result in personal injury. All trademarks mentioned herein are property of their respective
owners. All specifications are subject to change without notice.
Manual
COMe-mBT10
Kontron
Our company network supports you worldwide with offices in Germany, Austria,
Switzerland, Great Britain and the USA. For more information please contact:
FORTEC Elektronik AG
Hauptniederlassung
Lechwiesenstr. 9
86899 Landsberg am Lech
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortecag.de
FORTEC Elektronik AG
Büro West
Hohenstaufenring 55
50674 Köln
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortecag.de
FORTEC Elektronik AG
Büro Wien
Nuschinggasse 12
A-1230 Wien
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.fortec.at
ALTRAC AG
(Tochter der FORTEC):
Bahnhofstraße 3
CH-5436 Würenlos
Telefon: [phone]
Telefax: [phone]
E-Mail: [email protected]
Internet: www.altrac.ch

COMe-mBT10
Document Revision 120 valid for Rev. 02.00 and higher
www.kontron.com

» Table of Contents «
1User Information..................................................................................
1.1 About This Document....................................................................................................................
1.2 Copyright Notice..........................................................................................................................
1.3 Trademarks.................................................................................................................................
1.4 Standards...................................................................................................................................
1. Warranty.................................................................................................................................... 6
1.6 Technical Support......................................................................................................................... 6
2Introduction........................................................................................7
2.1 Product Description...................................................................................................................... 7
2.2 Naming clarification..................................................................................................................... 7
2.3 Understanding COM Express® Functionality.......................................................................................8
2.4 COM Express® Documentation.........................................................................................................9
2. COM Express® Benefits.................................................................................................................. 9
3Product Specification..........................................................................10
3.1 Module definition....................................................................................................................... 10
3.2 Functional Specification............................................................................................................... 12
3.3 Block Diagram............................................................................................................................ 16
3.4 Accessories............................................................................................................................... 16
3. Electrical Specification................................................................................................................ 17
3. .1 Supply Voltage........................................................................................................................... 17
3. .2 Power Supply Rise Time................................................................................................................17
3. .3 Supply Voltage Ripple.................................................................................................................. 17
3. .4 Power Consumption.....................................................................................................................17
3. . ATX Mode.................................................................................................................................. 18
3. .6 Single Supply Mode..................................................................................................................... 18
3.6 Power Control............................................................................................................................ 19
3.7 Environmental Specification......................................................................................................... 20
3.7.1 Temperature Specification............................................................................................................ 20
3.7.2 Humidity................................................................................................................................... 20
3.8 Standards and Certifications.........................................................................................................21
3.9 MTBF........................................................................................................................................ 23
3.10 Mechanical Specification..............................................................................................................24
3.11 Module Dimensions..................................................................................................................... 2
3.12 Onboard Fan Connector................................................................................................................ 2
3.13 Thermal Management, Heatspreader and Cooling Solutions.................................................................26
4Features and Interfaces.......................................................................27
4.1 Onboard eMMC Flash.................................................................................................................... 27
4.2 Secure Digital Card...................................................................................................................... 27
4.3 S Eco Mode.............................................................................................................................. 28
www.kontron.com

COMe-mBT10 /
4.4 LPC.......................................................................................................................................... 29
4. Serial Peripheral Interface (SPI).................................................................................................... 30
4.6 SPI boot.................................................................................................................................... 30
4.7 M.A.R.S.................................................................................................................................... 32
4.8 UART........................................................................................................................................ 33
4.9 Fast I2C.................................................................................................................................... 34
4.10 Dual Staged Watchdog Timer.........................................................................................................3
4.11 Speedstep Technology................................................................................................................. 36
4.12 C-States.................................................................................................................................... 37
4.13 Graphics Features....................................................................................................................... 38
4.14 ACPI Suspend Modes and Resume Events..........................................................................................39
4.1 USB......................................................................................................................................... 40
System Resources................................................................................41
.1 Interrupt Request (IRQ) Lines........................................................................................................41
.2 Memory Area.............................................................................................................................. 41
.3 I/O Address Map......................................................................................................................... 41
.4 Peripheral Component Interconnect (PCI) Devices.............................................................................42
. LPC addresses............................................................................................................................ 43
.6 I2C Bus..................................................................................................................................... 43
.7 System Management (SM) Bus.......................................................................................................43
6Pinout List.........................................................................................44
6.1 General Signal Description........................................................................................................... 44
6.2 Connector X1A Row A................................................................................................................... 4
6.3 Connector X1A Row B................................................................................................................... 47
7BIOS Operation...................................................................................49
7.1 Determining the BIOS Version.......................................................................................................49
7.2 BIOS Update.............................................................................................................................. 49
7.3 POST Codes................................................................................................................................ 49
7.4 Setup Guide............................................................................................................................... 49
7. BIOS Setup................................................................................................................................ 1
7. .1 Main......................................................................................................................................... 1
7. .2 Advanced..................................................................................................................................
7. .3 Security.................................................................................................................................... 77
7. .4 Boot........................................................................................................................................ 78
7. . Exit.......................................................................................................................................... 79
4

COMe-mBT10 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-201 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5

COMe-mBT10 / User Information
1.5 arranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6

COMe-mBT10 / Introduction
2 Introduction
2.1 Product Description
At the SPS/IPC/Drives show, Kontron unveiled the new credit card sized Computer-on-Modules based on the world’s
leading form factor standard COM Express®. The performance range of the new COM Express® mini modules is highly
scalable and covers the entire embedded range of Intel® Atom™ Processor E3800 and Intel® Celeron® Processor N2900
and J1900 Product Families, formerly codenamed ‘Bay Trail’. The most impressive feature of the new Kontron COMe-mBT10
Computer-on-Module family is the three times higher graphics performance compared to previous Intel® Atom™
processors coupled with unbeatable TDP (thermal design power) values. And although all the Intel® Atom™ processor
E3800 based modules are designed for the extended temperature range from -40 to +8 °C, they offer an extensive set of
features, including PCIe extension options, new security functions, and optional ECC memory . The rich, powerful and
flexible x86 featureset in combination with the low-power credit card-sized footprint make the new COM Express® mini
Computer-on-Modules a perfect fit for an extremely wide range of new, graphic-rich multi-touch applications.
Users in all markets will benefit from double the performance, significantly improved performance-per-watt ratios and
the long-term availability which the rugged new x86 modules offer. The range of applications includes everything from
slim but graphics-rich and open, programmable industrial tablets and handheld PCs to in-vehicle systems and stationary
HMIs and controllers. Targeted industries are POS/POI, infotainment, digital signage, gaming, and medical technology as
well as industrial automation, and machine and plant engineering. With the availability of the new COM Express® mini
Computer-on-Modules, developers can directly make use of the extensive x86 ecosystem and the world’s leading COM
Express® form factor standard.
The new Kontron COMe-mBT10 COM Express® mini Computer-on-Module family ( mm x 84 mm) with Type 10 pin-out is
equipped with Intel® Atom™ processor E3800 or Intel® Celeron® processors. Several module variants are included in the
range, offering wide scalability from low-power single-core Intel® Atom™ (1.46 GHz / W TDP) processor performance for
energy-sensitive applications through to genuine quad-core Intel® Atom™ (4x 1.91 GHz/ 10 W TDP) and Intel® Celeron®
(4x 2.42 GHz / 10 W TDP ) processor performance in high-end applications ). The new Intel® Gen 7 HD graphics integrated
on the SoC offer up to three times more graphical power, including DirectX 11, OpenGL 3.1, and OpenCL 1.1 support for two
independent displays with 1x DP++ (DP/HDMI/DVI) up to 2 60×1600@60Hz and 1x Single Channel LVDS 18/24bit with
DPtoLVDS up to 1920×1200 (optional eDP). New video HD technology additionally enables brilliant video reproduction
and stereoscopic 3D viewing for an immersive user experience. The modules come with options for data memory: two SATA
II 300 Mbps interfaces or versions with additional eMMC memory (up to 64 GB) . In addition to having two serial ports,
they include a Super Fast USB 3.0 interface, up to eight USB 2.0, Gigabit Ethernet, plus three Gen 2 PCI-Express x1 lanes
for customer specific expansions.
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (12 mm x 9 mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (9 mm x 9 mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor ( mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor ( =basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
7

COMe-mBT10 / Introduction
2.3 Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
G it Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO shared w/GPIO 1x optional 1x optional - 1x optional
UART (2-wire COM) - 2x - 2x
FAN PWM out - 1x - 1x
8

COMe-mBT10 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-mBT10. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9

COMe-mBT10 / Product Specification
3 Product Specification
3.1 Module definition
The COM Express® mini sized Computer-on-Module COMe-mBT10 (MVV1) follows pin-out Type 10 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-mBT10, based on Intel's Bay Trail platform, is available in different variants
to cover the demand of different performance, price and power:
Industrial temperature grade modules (E2: -40°C to +85°C operating)
Part Num er Product Name Processor Memory ECC TPM eMMC Ethernet SDIO USB 2.0
34006-4016-19-4 COMe-mBTi10 E384 4E/16GB BayTrail-I Intel® Atom E384 4GB Yes Yes 16GB MLC Intel® i210IT shared w/GPIO 7x
34006-2000-19-4 COMe-mBTi10 E384 2GB BayTrail-I Intel® Atom E384 2GB - - - Intel® i210IT shared w/GPIO 7x
34006-2000-17-2 COMe-mBTi10 E3827 2GB BayTrail-I Intel® Atom E3827 2GB - - - Intel® i210IT shared w/GPIO 7x
34006-1040-17-2 COMe-mBTi10 E3827 1E/4S BayTrail-I Intel® Atom E3827 1GB Yes - 4GB SLC Intel® i210IT shared w/GPIO 7x
34006-2000-1 -2 COMe-mBTi10 E3826 2GB BayTrail-I Intel® Atom E3826 2GB - - - Intel® i210IT shared w/GPIO 7x
34006-2080-13-2 COMe-mBTi10 E382 2GB/8S BayTrail-I Intel® Atom E382 2GB - - 8GB SLC Intel® i210IT shared w/GPIO 7x
34006-2000-13-2 COMe-mBTi10 E382 2GB BayTrail-I Intel® Atom E382 2GB - - - Intel® i210IT shared w/GPIO 7x
34006-1020-1 -1 COMe-mBTi10 E381 1E/2S BayTrail-I Intel® Atom E381 1GB Yes - 2GB SLC Intel® i210IT shared w/GPIO 7x
Commercial temperature grade modules (0°C to +60°C operating)
Part Num er Product Name Processor Memory ECC TPM eMMC Ethernet SDIO USB 2.0
34007-4000-20-4 COMe-mBTc10 J1900 4GB BayTrail-D Intel® Celeron J1900 4GB - - - Intel® i211AT - 4x
34007-2000-18-4 COMe-mBTc10 N2930 2GB BayTrail-M Intel® Celeron N2930 2GB - - - Intel® i211AT - 4x
34007-2080-16-2 COMe-mBTc10 N2807 2GB BayTrail-M Intel® Celeron N2807 2GB - - 8GB SLC Intel® i211AT - 4x
34007-2000-16-2 COMe-mBTc10 N2807 2GB BayTrail-M Intel® Celeron N2807 2GB - - - Intel® i211AT - 4x
34007-1020-1 -1 COMe-mBTc10 E381 1GB/2S BayTrail-I Intel® Atom E381 1GB - - 2GB SLC Intel® i211AT - 4x
34007-1000-1 -1 COMe-mBTc10 E381 1GB BayTrail-I Intel® Atom E381 1GB - - - Intel® i211AT - 4x
10

COMe-mBT10 / Product Specification
Memory configurations: (3400x-MMFF-xx-x)
» MM = 10: 1024MB DDR3L Memory (8x1Gbit / 128Mx8)
» MM = 20: 2048MB DDR3L Memory (8x2Gbit / 2 6Mx8)
» MM = 40: 4096MB DDR3L Memory (8x4Gbit / 12Mx8)
On oard Flash configurations
» FF = 00: without eMMC Flash
» FF = 20: 2GB onboard eMMC Flash
» FF = 40: 4GB onboard eMMC Flash
» FF = 80: 8GB onboard eMMC Flash
» FF = 16: 16GB onboard eMMC Flash
» FF = 32: 32GB onboard eMMC Flash
» FF = 64: 64GB onboard eMMC Flash
Optional hardware features for E3800 Series CPU
» TPM
» ECC memory
» eMMC Flash
» eDP on COMe
» USB client PHY on USB7
» General Purpose SPI instead of Boot SPI
Optional hardware features for Celeron Series CPU
» TPM
» eMMC Flash
» eDP on COMe
» USB Hub for USB #4-6 support on COMe
» USB client PHY on USB7
» General Purpose SPI instead of Boot SPI
Optional BIOS/Software features:
» TXE Firmware with Encryption support (AES, PAVP …)
Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.
11

COMe-mBT10 / Product Specification
3.2 Functional Specification
Processor
The 32nm Intel® Atom™ E3800 / Celeron® (BayTrail-I/M/D) CPU family supports:
» Intel® 64
» Enhanced Intel SpeedStep® Technology
» Thermal Monitoring Technologies
» Execute Disable Bit
» Virtualization Technology VT-x
» 2 Display Pipes for dual independent displays
CPU specifications
Intel® Atom™ Atom™ Atom™ Atom™ Atom™ Atom™ Celeron® Celeron® Celeron®
- E3845 E3827 E3826 E3825 E3815 E3805 J1900 N2930 N2807
Stepping D0 D0 D0 D0 D0 D0 C0 C0 C0
# of Cores 4 2 2 2 1 2 4 4 2
# of Threads 4 2 2 2 1 2 4 4 2
CPU Nominal
frequency
1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz 1.33GHz 2.00GHz 1.83GHz 1.58GHz
CPU Burst
frequency
- - - - - - 2.42GHz 2.16GHz 2.16GHz
LFM/LPM
Frequency
33MHz 33MHz 33MHz 33MHz 33MHz 33MHz 1333MHz 00MHz 33MHz
Tjunction 110°C 110°C 110°C 110°C 110°C 110°C 10 °C 10 °C 10 °C
Thermal
Design Power
(TDP)
10W 8W 7W 6W W 3W 10W 7. W 4.3W
SDP - - - - - - - 4. W 2. W
C-States C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6 C1/C1E/C6/C7 C1/C1E/C6/C7
Smart Cache 2x1MB 2x 12kB 2x 12kB 2x 12kB 12kB 12kB 2x1MB 2x1MB 2x 12kB
Memory Type DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1066 DDR3L-1333 DDR3L-1333 DDR3L-1333
Max Memory
Size on Module
4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB
ECC
Memory(optio
nal)
Yes Yes Yes Yes Yes Yes No No No
Graphics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD® - Intel HD® Intel HD® Intel HD®
GFX Base
Frequency
42MHz 42MHz 33MHz 33MHz 400MHz - 688MHz 313MHz 313MHz
GFX Max
Dynamic Frequ.
792MHz 792MHz 667MHz - - - 8 4MHz 8 4MHz 7 0MHz
GFX
Technology
GT1 4EU GT1 4EU GT1 4EU GT1 4EU GT1 4EU - GT1 4EU GT1 4EU GT1 4EU
AES-NI
(optional)
Yes Yes Yes Yes Yes Yes No No No
Memory
Sockets memory down
Memory Type DDR3L-1066/1333
Maximum Size 1 - 4GB (ECC optional)
Technology Single Channel (64bit)
12

COMe-mBT10 / Product Specification
Graphics Core
The integrated Intel® HD Graphics (Gen 7) supports:
Graphics Core Render Clock Intel® HD Graphics (Gen 7), 311- 42MHz Clock, 667-8 4MHz Turbo
Execution Units / Pixel Pipelines 4
Max Graphics Memory 2048MB
GFX Memory Bandwidth (GB/s) up to 21.3
GFX Memory Technology DVMT
API (DirectX/OpenGL) 11 / 3.0 + OCL 1.1
Shader Model 3.0
Hardware accelerated Video H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray
Independent/Simultaneous Displays 2
Display Port DP 1.1a / eDP 1.3
HDCP support HDCP / PAVP 2 (optional)
Monitor output
CRT max Resolution -
TV out: -
LVDS
LVDS Bits/Pixel 1x18 / 1x24 (PTN3460 DP2LVDS)
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1366x768
PWM Backlight Control: YES
Supported Panel Data: EDID/DID
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 DP++
Digital Display Interface DDI2 -
Digital Display Interface DDI3 -
Maximum Resolution on DDI 2 60x1600@60Hz
Storage
on oard SSD 2-64GB eMMC
SD Card support 1x SDIO 3.0 shared with GPIO (w/E3800 CPU only)
IDE Interface -
Serial-ATA 2x SATA 3Gb/s
SATA AHCI AHCI with NCQ, HotPlug, Staggered Spinup,
SATA RAID -
Connectivity
USB up to 7x USB 2.0
USB 3.0 1x USB 3.0
USB Client 1x (Option)
PCI -
PCI External Masters -
PCI Express 3x PCIe x1 Gen2
Max PCI Express 4x PCIe x1 without LAN
PCI Express x2/x4 configuration YES
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® i210IT / i211AT
13

COMe-mBT10 / Product Specification
Feature OS Support Matrix
- Windows 8 Windows 7 WEC Tizen Fedora/Yocto Android
- E3800 Celeron E3800 Celeron E3800 Celeron E3800 E3800 Celeron E3800 Celeron
eMMC Storage X X - - X - X X - - -
eMMC Boot X X - - X - X X - X X
SD Storage X X X - X - X X - X X
SD Boot - - X - X - X X - X X
MIPI-CSI - - - - - - - X - - -
PCI Express Configuration
By default, the COMe-mBT10 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe Port #0 Port #1 Port #2 Port #3
Default x1 x1 x1 LAN
Configuration 1 x2 x1 LAN
Configuration 2 x1 x1 x1 x1
Configuration 3 x2 x1 x1
Configuration 4 x2 x2
Configuration x4
Configuration 1,3,4, are available with customized BIOS versions only
Configuration 2,3,4, need hardware modification, remove LAN
Ethernet
The Intel® i210IT / i211AT ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Supported BIOS Size/Type 8MB SPI
Audio HD Audio
On oard Hardware Monitor Nuvoton NCT7802Y
Trusted Platform Module Atmel AT97SC3204 optional
Miscellaneous 2x UART / PWM FAN
Kontron Features
External I2C Bus Fast I2C, MultiMaster capable
M.A.R.S. support YES
Em edded API KEAPI3
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
14

COMe-mBT10 / Product Specification
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support YES
Supply Voltage 4.7 - 20V
ACPI ACPI 3.0
S-States S0, S3, S4, S
S5 Eco Mode YES
Misc Power Management DPST 4.0, iFFS
Power Consumption and Performance
Full Load Power Consumption .6 - 12.1W
Kontron Performance Index 9020 - 2 917
Kontron Performance/Watt 1 99 - 293
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP0 4 at EMD Customer
Section.
15

COMe-mBT10 / Product Specification
3.3 Block Diagram
16

COMe-mBT10 / Product Specification
3.4 Accessories
Product specific accessories
Product Num er Heatspreader and Cooling Solutions Comment
34006-0000-99-0 HSP COMe-mBT10 thread (11mm) For all CPUs and temperature grades
34006-0000-99-1 HSP COMe-mBT10 through (11mm) For all CPUs and temperature grades
34006-0000-99-2 HSP COMe-mBT10 slim thread (6. mm) For all CPUs and temperature grades
34006-0000-99-3 HSP COMe-mBT10 slim through (6. mm) For all CPUs and temperature grades
General accessories
Part Num er COMe pin-out Type 10 compati le
accessories
Project Code Comment
34104-0000-00-0 COM Express® Reference Carrier-i Type 10 ADAP nITX Carrier with 8mm COMe connector
34101-0000-00-1 COM Express® Eval Carrier Type 10 ADAN ATX Eval Carrier with 8mm COMe connector
To be used in combination with ADA-Type10-Mezzanine
only
34101-0000-00-2 COM Express® Eval Carrier Type 10 Gen2 ADAN ATX Eval Carrier with 8mm COMe connector
96007-0000-00-8 ADA-Type10-Mezzanine AMVV COMe basic sized stand-alone carrier or Adapter Card
for Eval Carrier Gen1
96006-0000-00-1 COMe POST T10 NFCB POST Code / Debug Card
38019-0000-00-1 ADA-COMe-Height-single EERC Height Adapter
34104-0000-00-S COMe Ref. Starterkit T10 ADAP Starterkit with COMe Reference Carrier T10
Part Num er Mounting Comment
34017-0000-00-0 COMe mMount Kit /8mm 1set Mounting Kit for 1 module including screws for mm &
8mm connectors
Part Num er Cooling Solutions Comment
34099-0000-99-0 COMe mini Active Uni Cooler for CPUs up to 10W TDP, to be mounted on HSP
34099-0000-99-1 COMe mini Passive Uni Cooler for CPUs up to W TDP, to be mounted on HSP
34099-0000-99-2 COMe mini Passive Uni Cooler Slim for CPUs with 3- W TDP, to be mounted on HSP
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COMe-mBT10 / Product Specification
3.5 Electrical Specification
3.5.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC: 4.7 - 20V
Stand y: V DC +/- %
RTC: 2. V - 3.47V
- V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.5.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.5.4 Power Consumption
The maximum Power Consumption of the different COMe-mBT10 variants is .6 - 12.1W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP0 4 available
on EMD Customer Section. Information there is available after registration.
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COMe-mBT10 / Product Specification
3.5.5 ATX Mode
By connecting an ATX power supply with VCC and VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.7 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.7 V the input voltage shall always be higher than V Standby (VCC > VSB).
State PWRBTN# PWR_OK V5_StdBy PS_ON# VCC
G3 x x 0V x 0V
S high low V high 0V
S S0 →PWRBTN Event low high →V high low →0 V VCC →
S0 high high V low VCC
3.5.6 Single Supply Mode
In single supply mode (or automatic power on after power loss) without V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.7 - 20V.
To power on the module from S state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State PWRBTN# PWR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 →high open / high x connecting VCC
S high open / high x VCC
S S0 →PWRBTN Event open / high x reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
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