GARZ&FRICKE SANTARO Core User manual

SOLUTIONS THAT COMPLETE!
SANTARO core
ARM Cortex A9 Single Board Computer
The Garz & Fricke business class: Flexible, powerful all-rounder for
any demanding applications.
Product Manual

Revision Date Author Description
V 1.0 19.08.2014 LK Initial document release for PCB revision 1.1.1
V 1.1 17.12.2014 LK
Addition M variant (Singlecore M)
4. Technical data:
Changes concerning Singlecore:
- RAM Standard: 512 MB to 1 GB
- Interfaces External (Serial): added 1x
RS-485, nonisolated; added CAN Fieldbus, ad-
ded Keypad/SPI/I2C multiplexed, added Digital
I/O
Changes concerning all variants:
- High-Speed USB 2.0: 1x480 Mbit/s Host
(Typ A) to 2x 480 Mbit/s Host (1x Type A, 1x
internal Molex connector)
- Speaker output: 1 W RMS to 1.5 W
- Added consumption (W): Typ 2.6
- Humidity (%): 5 ~ 95 to 5 ~ 90
- added Lifetime (h): 50,000
6.3 Power:
- Level: Max. 16V ~ 36V to Max 9V ~ 30V
6.15 Speaker:
- 1 W RMS to 1.5 W
6.16 Speaker internal:
- 1 W RMS to 1.5 W
Change of Article Number:
- Singlecore: 900-2627R to 900-2935R
- added: Singlecore M: 900-2627R
V 2.0 13.02.2017 CG Initial release, revision 1.1 to 1.2 SBC
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Document Revision History
The information in this document is subject to change without prior notice in order to improve reliability, design
and function and does not represent a commitment on the part of the manufacturer.
Online support on www.garz-fricke.com

PRODUCT MANUAL
SANTARO core
Table of Contents
1. Introduction ....................................................................................... 4
2. Safety Hints........................................................................................ 5
3. Product Introduction ......................................................................... 6
3.1 Type Plate and Device Information..........................................................6
3.2 Related Documents and Online Support.................................................7
4. Technical Data.................................................................................... 8
4.1 Block Diagram SBC.................................................................................9
4.2 Technical Drawing ...................................................................................10
4.3 Conectors.................................................................................................11
5. Installation and Start Up.................................................................... 13
5.1 Connection Scheme.................................................................................13
6. Internal and External Interfaces........................................................ 14
6.1 Ethernet (X24)..........................................................................................14
6.2 Power (X1)................................................................................................15
6.3 Digital I/O (X14)........................................................................................16
6.4 CAN/RS-485 Interface (X39) ....................................................................17
6.5 Speaker (X9).............................................................................................18
6.6 Keypad/SPI (X21) .....................................................................................19
6.7 RS-232/RS-232 (X13)...............................................................................21
6.8 USB Host (X34).........................................................................................22
6.9 USB OTG (X20) .........................................................................................22
6.10 SD Card Reader (X31) ..............................................................................22
6.11 Reset Switch (SW1)..................................................................................23
6.12 Bootselect Switch (SW2)..........................................................................23
6.13 Power LED (D30)......................................................................................23
6.14 HDMI (X111) .............................................................................................24
6.15 USB intern (X11) ......................................................................................25
6.16 Battery-Holder (X2) *...............................................................................26
6.17 Speaker Internal (X10).............................................................................27
6.18 Power over Ethernet (X17 / X18)*............................................................28
6.19 Display LVDS (X105, X109) ......................................................................29
6.20 Backlight (X108) ......................................................................................30
6.21 I2C (X106).................................................................................................30
6.22 Resistive 4 - wire Touch (X4 / X7).............................................................31
6.23 Capacitive Touch (X16).............................................................................32
6.24 Capacitive Touch (X102) ...........................................................................32
7. Battery............................................................................................... 33
7.1 Battery Specifications X1 / X2 .................................................................33
7.2 Battery Specifications X4.........................................................................33
7.3 Replacement of the Internal Battery ......................................................34
Annex A: Hardware Revision Information ......................................................... 35
Annex B: Assembly Options .............................................................................. 36
B-1 Wi-Fi / Bluetooth .....................................................................................36
Annex C: Guidelines and Standards ................................................................. 37
C-1 RoHS Declaration ....................................................................................37
C-2 Supplier Declaration – Directive EG 1907/2006 REACH .........................37
C-3 UL Certification........................................................................................37
C-4 Garz & Fricke Conformity Statement......................................................38
Annex D: Common Documentation.................................................................... 39
D-1 Warranty Hints.........................................................................................39
D-2 Field of Application..................................................................................40
Annex E: Technical Support ............................................................................. 41
Annex F: General Information .......................................................................... 42
* alternative assembly upon request

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1. Introduction
Thank you very much for purchasing a Garz & Fricke product. Our products are dedicated to professional use
and therefore we suppose extended technical knowledge and practice in working with such products.
The information in this manual is subject to technical changes, particularly as a result of
continuous product upgrades. Thus this manual only reflects the technical status of the
products at the time of printing. Before design-in the device into your or your customer’s
product, please verify that this document and the therein described specification is the latest
revision and matches to the PCB version. We highly recommend contacting our technical sales
team prior to any activity of that kind.
The attached documentation does not entail any guarantee on the part of Garz & Fricke GmbH
with respect to technical processes described in the manual or any product characteristics set
out in the manual. We do not accept any liability for any printing errors or other inaccuracies in
the manual unless it can be proven that we are aware of such errors or inaccuracies or that we
are unaware of these as a result of gross negligence and
Garz & Fricke has failed to eliminate these errors or inaccuracies for this reason.
Garz & Fricke GmbH expressly informs that this manual only contains a general description of
technical processes and instructions which may not be applicable in every individual case. In
cases of doubt, please contact our technical sales team.
In no event, Garz & Fricke is liable for any direct, indirect, special, incidental or consequential
damages arising out of use or resulting from non-compliancy of therein conditions and
precautions, even if advised of the possibility of such damages.
Before using a device covered by this document, please carefully read
Annex „D-1 Warranty Hints“
Annex „D-2 Field of Application“
Embedded systems are complex and sensitive electronic products. Please act carefully and
ensure that only qualified personnel will handle and use the device at the stage of development.
In the event of damage to the device caused by failure to observe the hints in this manual
and on the device (especially the safety instructions), Garz & Fricke shall not be required to
honour the warranty even during the warranty period and shall be exempted from the statutory
accident liability obligation. Attempting to repair or modify the product also voids all warranty
claims.

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2. Safety Hints
Please read this section carefully and observe the instructions for your own safety and correct use of the device.
Observe the warnings and instructions on the device and in the manual. Garz & Fricke embedded systems have
been built and tested by us and left the company in a perfectly safe condition.In order to maintain this condition
and ensure safe operation, the user must observe the instructions and warnings contained in this manual.
I. General Handling
Don’t drop or strike the unit: The PCB, display and/or other parts might be damaged.
Keep away from water and other liquids, the unit is not protected against.
Operate the unit under electrical and environmental conditions according to the technical
specification.
The electrical installations in the room must correspond to the requirements of the local
(country-specific) regulations.
Take care that there are no cables, particularly power cables, in areas where persons can trip
over them.
Do not place the device in direct sunlight, near heat sources or in a damp place.
All plugs on the connection cables must be screwed or locked to the housing.
Repairs may only be carried out by qualified specialist personnel authorized by
Garz & Fricke GmbH or their local distributors.
Maintenance or repair on the open device may only be carried out by qualified personnel
authorized by Garz & Fricke GmbH which is aware of with the associated dangers.
II. Electricity
The embedded systems may only be opened in accordance with the description in this user’s
manual for
- replacing of the (rechargeable, where applicable) lithium battery and/or
- configuration of interfaces, where applicable
These procedures have to be carried-out only by qualified specialist personnel.
When accessing internal components the device must be switched off and disconnected from
the power source.
When purchased core or basic versions without protecting back cover, don’t touch the PCB
directly with your fingers. Especially these products need to be handled very carefully.
Don’t operate or handle the unit without typical ESD protection measures, such as ground
earthing.
Operate the unit according to the technical specification only.
III. Damage or Permanent Malfunction
It must be assumed that a safe operation is no longer possible, in case
-the device has visible damage or
-the display is dark or shows strange pattern for longer period
-the device doesn’t react after a reset
In these cases the device must be shut down and secured against further use

6
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SANTARO core
3. Product Introduction
This document is applicable for hardware revisions 1.0 or later of the SANTARO series.
Please find the hardware version grid in „Annex A: Hardware Revision Information“:
SANTARO is an Embedded System to be used as human machine interface (HMI) in various applications. Please
refer to Annex „D-2 Field of Application“ for further information. The system is equipped with a large number
of industrial interfaces. A wide variety of options is available as well.
3.1 Type Plate and Device Information
For service and later identification of the device, the type plate contains important information.
code defines the serial number

Flash-N-Go
http://mx31.de/b
Contains information about the usage of the G&F Flash-N-Go solution
which consists of three submodules:
Flash-N-Go Boot (A tiny boot loader)
Flash-N-Go System (A maintenance os)
Flash-N-Go Update (A GUI based update solution for all os)
Windows CE 7
http://mx31.de/6
Contains information about Windows Embedded CE 7, the tool chain, the
development environment Visual Studio, Garz & Fricke tools, etc.
Windows CE 2013
http://mx31.de/7
Contains information about Windows Embedded CE 2013, the tool chain,
the development environment Visual Studio, Garz & Fricke tools, etc.
Linux Yocto Daisy
http://mx31.de/8
Contains information about Linux BSP with development environment
Linux Embedded System Yocto (Codename: Daisy, Version 1.6.1)
includes first information about the bootloader Flash N Go
Linux Yocto Jethro
http://mx31.de/9
Contains information about Linux BSP with
development environment Linux Embedded System Yocto (Codename:
Jethro, Version 3.0) includes first information about the bootloader
Flash-N-Go
Android 4.2.2
http://mx31.de/a
Contains information about Android 4.2.2 including the SDK
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3.2 Related Documents and Online Support
This document contains operating system specific information. The following additional documentations are
available:
OPERATING SYSTEMS
UPDATE / BOOT / SYSTEM

CPU x1 x2 x4
CPU Type i.MX6Solo i.MX6Dual i.MX6Quad
Core Class ARM Cortex - A9
Core Clock 800 MHz 1 GHz
Features
NEON for SIMD media acceleration and VFP operations; Multi-format HD 1080p video decoder and HD
720p video encoder hardware engine; L1 cache, 32 KB for instruction, 32 KB for data
512 KB L2 cache 1 MB L2 cache
HW Accelerators Open VG 1.1 (Emulated on 3D GPU) OpenVG 1.1
RTC Accuracy: +/- 30 ppm at 25°C
Memory
eMMC Flash 4 GB MLC eMMC
RAM Standard 1 GB 32 bit DDR3L 1 GB 64 bit DDR3L
SRAM 512 KB
SD Card Slot 4 bit MMC/SDIO/SD/SDHC
Operating Systems
Supported OS
Windows Embedded Compact 7/2013, Linux Yocto, Android
Communication Interfaces
Digital I/O 2x In, 2x Out (0.7 A)
Network
1x 10/100 Mbit/s Ethernet (RJ-45)
USB 2.0 1x 480 Mbit/s Host (Type A)
1x 480 Mbit/s OTG (Type Micro-AB)
CAN Fieldbus/ RS-485 1x CAN (ISO/DIS 11898) + 1x
RS-485 1x CAN (ISO/DIS 11898) + 1x RS-485 galvanic isolated
RS-232 2x RS-232 (RX/TX/CTS/RTS)
MDB /1x MDB (Master / Slave optional) instead of 2nd external RS-232
Synchronous
Serial Interfaces
SPI up to 12 chip selects; I²C; Matrix keypad up to 8 x 8
Video
Video output
Full HD micro HDMI
Audio
Speaker output 1x speaker (connector), 1.5 W RMS (8)
Audio Internal 1x speaker connector parallel to external
output, Line In, Line Out, MIC In
Display and Touch
Display Interface
Dual Channel 24bpp LVDS
Touch Interface 4-wire analog resistive; PCAP I²C
Backlight Interface
+12 V, +5V, on/off, PWM
Device Dimensions
W x H x D 138.0 x 18.0 x 80.0 mm
Weight 97g
Power Supply
Supported OS
Nom. 13 to 32 V DC
Consumption
Typ. 2.6 W; max. 19.6 W
Internal Backup Battery (RTC) Type: 3 V Lithium battery Type CR1220:
Lifetime (RTC only): Approximately 8 years, depending on application
Type: 3 V Lithium battery Type CR
2032: Lifetime(RTC+SRAM):
10 years
Typical Environmental Conditions
Storage Temp. -20 to +70 °C
Operating Temp. 0 to +60 °C
Humidity 5 to 90 % RH
Max. Operating Altitude ty 3.000 m
Max. Storage/Transit Altitude 10.000 m
Noise Level [db(A)] @ 1m <<40 (fanless design)
Lifetime
MTBF ≥400.000 h
Expansion Connector
Serial / USB USB / RS 232 /(TTL) internal
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4. Technical Data
Mechanically the Micro-USB interface has not been designed for frequent contact operations. Please use an
adapter cable with a strain relief.
Option
The selection of a variant eliminates the other.

9
USB
10-pole Molex
USB Hub
2x Speaker
2-pole JST Audio
Amplifier
Audio
10-pole Molex
USB
Type A
Block Diagram SANTARO
i.MX6
Backlight
12-pole Molex
USB-OTG
Micro AB
SD-Card
Connector
I2C-3
USB H1
EIM
USDHC4
DRAM
SRAM
eMMC
DDR3L
Audio
Codec AUD4
MDIO/RMII
Keypad
20-pole JST Keypad
port
Res.Touch
4-pole Molex
SD2
Digital I/O
8-pole Molex
I/O
Driver GPIO
LVDS0
LVDS1
2x Display LVDS
20-pole Hirose
GPIO
PWM1_OUT
12V Supply
5V Supply
USB OTG
Touchscreen
Controller
Cap.Touch
4-pole Molex
HSIC
I2C-1 I²C
8-pole JST
24 V
2-pole Molex Step Down
Converter
PMIC Power
HDMI
Battery
RTC RC 1
FlexCAN-1
UART-1
FlexCAN-2
RS-232/MDB
10-pole Molex
RS-232
Transceiver
RS-232
Transceiver
UART-2
UART-5
HDMI
Type D
RJ-45
Jack
Ethernet
Phy
Battery
CR1220
CAN/RS-485
12-pole Molex
Galv. Isol.
x2 & x4
CAN
Transc.
CAN
Transc.
RS-485
Transc.
MDB
PRODUCT MANUAL
SANTARO core
4.1 Block Diagram SBC

10
138
135
95,5
13,4
2,9
5x
2,7
40,4
77
80
13,5
15,5
18
SANTARO core
Missing dimensions according to 3D CAD files
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SANTARO core
4.2 Technical Drawing

Pos. Description
1Ethernet (X24)
2Power (X1)
3Digital I/O (X14)
4CAN/RS-485 Interface (X39)
optional with galvanic isolation
5 Speaker (X9)
6Keypad/SPI (X21)
7RS-232/MDB (X13)
8USB Host (X34)
9USB OTG (X20)
10 SD card reader (X31)
11 Reset Switch (SW1)
12 Bootselect Switch (SW2)
13 Power LED (D30)
Pos. Description
14 HDMI (X111)
15 USB intern (X11)
16 Battery (X2/X112)
17 Audio (X8)
18 Speaker internal (X10)
19 Power over Ethernet (X17/X18) Optional
20 Display LVDS (X105 / X109)
21 Backlight (X108)
22 IC (X106)
23 Resistive Touch (X4 / X7)
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4.3 Conectors
As this manual describes a core version, the internal and external interfaces will be mentioned in the following
chapter.
(Exemplary Illustration front side. The illustration shows the fully equipped SANTARO Quadcore light. It shows
no heatsink to provide a better overview.)
For the function of this switch please refer in the future to the Flash N Go User Manual.

Pos. Description
24 Capacitive Touch (X16 / X102)
12
X102
X16|X103
X109
PRODUCT MANUAL
SANTARO core
(Exemplary Illustration back side)

Pos.
Description
1
Ethernet
2
DC in
3
RS-232
4
USB-Device
5
USB Host (OTG)
Pos.
Description
6
Reset sw
7
Bootselect sw
8
SD card slot
9
Power LED
Exemplary Illustration
13
Ethernet (TCP/IP) via
cross over cable or switch
USB Accessory
Memory stick,
mouse
RS-232 (Serial)
Debug-PC / Periphery
SD/SDHC
USB-OTG
2x RS232SPI/KeypadSpeakerCAN/RS485Digital I/O
Power
LAN USB-Host
X9
USB (Active Sync)
to PC / Development
PRODUCT MANUAL
SANTARO core
5. Installation and Start Up
The content of this document is limited to explain the device connectors and how to access SANTARO via FTP
over your local area network (LAN) within a few seconds. For advanced hardware specifications and software
support, please refer to chapter „3.2 Related Documents and Online Support“
5.1 Connection Scheme
http://mx31.de/18

Pin Name Description Information
1Tx+
Rx/Tx might be swapped
(Auto-MDIX)
+/- might be swapped
(Autom. polarity correction)
PoE might also be injected via Rx/Tx lines
2TX-
3RX+
4SPARE 1 Power Supply (PoE)
5
6RX-
7SPARE 2 Power Supply (PoE)
8
Header: RJ45
14
1
1
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6. Internal and External Interfaces
6.1 Ethernet (X24)
Green LED (link) is default off and turns on when link is detected.
Yellow LED (act) flashes during sending/receiving packets.
Optional

Pin Name Description Level
1GND DC Ground 0 V
2Vcc_In DC Input voltage Nom. 9 to 32 V DC
Header: Molex 43045-0200 Micro-Fit 2p
Plug: Molex 43025-0200 Micro-Fit 2p,
crimp contact Molex 43030-0007
Shielding with 6,3 mm male spade terminal connector.
15
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6.2 Power (X1)
Caution:
Power supplies connected to this device must be compliant to the requirements of
“limited power sources” (LPS) to prevent the end-user from danger in case of a fault.
Vin- 12
Vin+ 12
RV 1
S10K30
DC_IN
X1
MO
LEX_43045-0200_Micro-Fit_02
p
DC_IN
1 2
F2
5A_Nano_S lo-Blo_Typ-454
DC_IN
1 2
RV 2
CN1812K30G
n.b.
DC_ IN

6.3 Digital I/O (X14)
Pin Name Description Level
1DIG_IN1 Input 1 0 V
3-36 V
Low
High Typ. 8,3 mA / 24 V
2DIG_IN2 Input 2 0 V
3-36 V
Low
High Typ. 8,3 mA / 24 V
3GND_DIO Ground for digital IO group
4GND
Common ground, can be bridged
with GND_DIO, when galvanic
isolation is not required
5DIG_OUT1 Output 1 0V
Vcc_DIO
Low
High Max. 800 mA / 24 V
6DIG_OUT2 Output 2
7Vcc_DIO Supply input for digital IO group <36 V, Nom. 9 to 32 V DC
8Vcc
Supply output, can be bridged with
Vcc_DIO, when galvanic isolation is
not required
Directly connected to the
supply (x1) without fuses
or surge protection!
Vcc_In
Header: Molex 43045-0800 Micro-Fit 8p
Plug: Molex 43025-0800 Micro-Fit 8p,
crimp contact Molex 43030-0007
Shielding with 6,3 mm male spade terminal connector
Digital I/O (X14) is not galvanic isolated from System-GND/Housing
16
1
5
1
5
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Pin Name Description Level
1GND_CAN_RS485 Ground for CAN and RS485 group
2CAN1_TERM To enable CAN1-Termination, bridge with CAN1_H
3CAN1_H CAN bus 1 high -24 +24 V
4CAN1_L CAN bus 1 low -24 +24 V
5CAN1_TERM To enable CAN1-Termination, bridge with CAN1_L
6RS485_TERM To enable RS485-Termination: bridge with RS485_A
7GND_CAN_RS485 Ground for CAN and RS485 group
8n.a.
9RS485_Y TX+ -7 +12 V
10 RS485_Z TX- -7 +12 V
11 RS485_A RX+, to enable Half-Duplex: bridge with RS485_Y
12 RS485_B RX- ,to enable Half-Duplex: bridge with RS485_Z
Header: Molex 43045-1200 Micro-Fit 12p
Plug: Molex 43025-1200 Micro-Fit 12p, crimp contact Molex 43030-0007
Shielding with 6,3 mm male spade terminal connector
CAN/RS-485 (X39) is not galvanic isolated from System-GND/Housing
Pin Name Description Level
1-5 Identical to standard
6n.a.
7GND_CAN_RS485 Ground for CAN group
8CAN2_TERM To enable CAN2-Termination, bridge with CAN2_H
9CAN2_H CAN bus 2 high -24 +24 V
10 CAN2_L CAN bus 2 low -24 +24 V
11 CAN2_TERM To enable CAN2-Termination, bridge with CAN2_L
12 n.a.
17
1
7
1
7
1
7
1
7
1
7
1
7
1
7
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SANTARO core
6.4 CAN/RS-485 Interface (X39)
CAN1 / CAN2 *
* alternative assembly upon request
CAN1 Termination
RS485 Termination
RS485 Half-Duplex
CAN1 Termination
CAN2 Termination

Pin Name Description Level
1Speaker + Parallel to X10 1.5W RMS 8 Ohm
2Speaker -
Header: JST S2B-PH-SM3-TB
Plug: ST PHR-2 with crimp contacts SPH-002GW-P0.5L-ND
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6.5 Speaker (X9)
1

Pin Name Description
Default Mode
Description
Mode 1 Level
1GND Ground Ground
3.3 V
2GND Ground Ground
3KP_ROW0 Keypad row 0 Keypad row 0
4KP_COL0 Keypad column 0 Keypad column 0
5KP_ROW1 Keypad row 1 Keypad row 1
6KP_COL1 Keypad column 1 Keypad column 1
7KP_ROW2 Keypad row 2 Keypad row 2
8KP_COL2 Keypad column 2 Keypad column 2
9KP_ROW3 Keypad row 3 Keypad row 3
10 KP_COL3 Keypad column 3 Keypad column 3
11 KP_ROW4 I²C2 SDA (without
internal pullups)
I²C2 SDA (without
internal pullups)
12 KP_COL4 I²C2 SCL (without
internal pullups)
I²C2 SCL (without
internal pullups)
13 KP_ROW5_DMA Keypad row 5 SPI Interrupt Request
14 KP_COL5_SS1 Keypad column 5 SPI Slave Select 1
15 KP_ROW6_MISO Keypad row 6 SPI Master in Slave out
16 KP_COL6_MOSI Keypad column 6 SPI Master out Slave in
17 KP_ROW7_SLK Keypad row 7 SPI Serial Clock
18 KP_COL7_SS0 Keypad column 7 SPI Slave Select 0
19 Aux_Out 500 mA (can be controlled by software) 5.0 V
20
Header: JST SM20B-SRDS-G-TF, side entry, RM = 1.00
Plug: JST SHDR-20V-S-B, crimp contact: SSH-003GA-P0.2
19
2
1
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6.6 Keypad/SPI (X21)
Keypad/SPI/I²C, multiplexed
Note: I²C2 Signals on Pin 11 and 12 are shared with HDMI. When HDMI ist populated, these signals cannot be used as GPIO and there are
4.7kOhm Pull-Up resistors applied.

Pin Name Description
Mode 2
Description
Mode 3 Level
1-10 Identical to standard Identical to standard
3.3 V
11 KP_ROW4 Keypad row 4 Keypad row 4
12 KP_COL4 Keypad column 4 Keypad column 4
13 KP_ROW5_DMA Keypad row 5 SPI Interrupt Request
14 KP_COL5_SS1 Keypad column 5 SPI Slave Select 1
15 KP_ROW6_MISO Keypad row 6 SPI Master in Slave out
16 KP_COL6_MOSI Keypad column 6 SPI Master out Slave in
17 KP_ROW7_SLK Keypad row 7 SPI Serial Clock
18 KP_COL7_SS0 Keypad column 7 SPI Slave Select 0
19 Aux_Out 500 mA (can be controlled by software) 5.0 V
20
20
2
1
PRODUCT MANUAL
SANTARO core
Keypad/SPI/I²C, multiplexed 1*
* alternative assembly upon request
This manual suits for next models
1
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