GARZ&FRICKE NESO LT core User manual

NESO LT core Manual
For PCB revision 0.7 or for HW 1.1 or later

NESO LT core Manual
2
Content
1Introduction 3
2Safety Hints 4
3Product Introduction 5
Product introduction 53.1 Type plate and device information 53.2 Related documents and online support 63.3
4Technical data 7
Block diagram 94.1 PCB design and Pin assembly 104.2
5Installation and start up 11
Connection Scheme 115.1
6Internal and external interfaces and Schematics 12
Ethernet (X8) 126.1 Power/Digital out (X1) 126.2 RS-232/RS-485/CAN (X9) 136.3
6.3.1 Option: RS-232/RS-485 13
6.3.2 Option: RS-232/CAN 13
USB - Host (X12) 146.4 External USB - OTG (X14) 146.5 Speaker (X5/X6) 146.6 Line out (X20) 156.7 S/PDIF (X7) 156.8 Keypad/SPI (X16) 166.9
6.9.1 Standard: Keypad/SPI 16
6.9.2 Option: Keypad/SPI/I²C 16
Extension (X18) 176.10 Internal USB - Host (X13) 186.11 Internal audio (X4) 186.12 PCT Controller (X19) 196.13 Battery-Holder (X2) 206.14 RGB Display Interface (X10/X11) 21
6.15 I2C (X17) 226.16
7Document revision history 23
8Technical support 23
Annex A: Assembly options and accessory 25
A-1 NESO LT Core Version M 25
Annex B: Hardware revision information 26
Annex C: Battery 27
C-1 Battery Specifications 27
C-2 Replacement of the internal battery 28
Annex D: Guidelines and Standards 29
D-1 RoHS Declaration 29
Annex E: Common documentation 30
E-1 Warranty hints 30
E-2 Application notes 31
E-3 Trademarks and service marks 31

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1 Introduction
Thank you very much for purchasing a Garz & Fricke product. Our products are dedicated to professional use
and therefore we suppose extended technical knowledge and practice in working with such products.
The information in this manual is subject to technical changes, particularly as a result of continuous
product upgrades. Thus this manual only reflects the technical status of the products at the time of
printing. Before design-in the device into your or your customer’s product, please verify that this
document and the therein described specification is the latest revision and matches to the PCB
version. We highly recommend contacting our technical sales team prior to any activity of that kind.
The attached documentation does not entail any guarantee on the part of Garz & Fricke GmbH with
respect to technical processes described in the manual or any product characteristics set out in the
manual. We do not accept any liability for any printing errors or other inaccuracies in the manual
unless it can be proven that we are aware of such errors or inaccuracies or that we are unaware of
these as a result of gross negligence and Garz & Fricke has failed to eliminate these errors or
inaccuracies for this reason.
Garz & Fricke GmbH expressly informs that this manual only contains a general description of
technical processes and instructions which may not be applicable in every individual case. In cases of
doubt, please contact our technical sales team.
In no event, Garz & Fricke is liable for any direct, indirect, special, incidental or consequential
damages arising out of use or resulting from non-compliancy of therein conditions and precautions,
even if advised of the possibility of such damages.
Before using a device covered by this document, please carefully read
Annex E-1 Warranty hints
Annex G-2 Application notes
Embedded systems are complex and sensitive electronic products. Please act carefully and ensure
that only qualified personnel will handle and use the device at the stage of development. In the event
of damage to the device caused by failure to observe the hints in this manual and on the device
(especially the safety instructions), Garz & Fricke shall not be required to honour the warranty even
during the warranty period and shall be exempted from the statutory accident liability obligation.
Attempting to repair or modify the product also voids all warranty claims.

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2 Safety Hints
Please read this section carefully and observe the instructions for your own safety and correct use of the
device. Observe the warnings and instructions on the device and in the manual. Garz & Fricke embedded
systems have been built and tested by us and left the company in a perfectly safe condition.
In order to maintain this condition and ensure safe operation, the user must observe the instructions and
warnings contained in this manual.
I. General handling
Don’t drop or strike the unit: The PCB, display and/or other parts might be damaged.
Keep away from water and other liquids, the unit is not protected against.
Operate the unit under electrical and environmental conditions according to the technical
specification.
The electrical installations in the room must correspond to the requirements of the local (country-
specific) regulations.
Take care that there are no cables, particularly power cables, in areas where persons can trip
over them.
Do not place the device in direct sunlight, near heat sources or in a damp place.
All plugs on the connection cables must be screwed or locked to the housing.
Repairs may only be carried out by qualified specialist personnel authorized by Garz & Fricke
GmbH or their local distributors.
Maintenance or repair on the open device may only be carried out by qualified personnel
authorized by Garz & Fricke GmbH which is aware of with the associated dangers.
II. LCD and touch handling
If equipped with, the soft surface of a resistive touch screen is not suitable for use with stencils
and/or other devices for touch operation. There are special plastics pens available in commercial
shops. A projective capacitive touch screen might be protected by a heat strengthened glass or
acrylic or polycarbonate cover lens. These are dedicated for use with finger tips. There are very
special pens available which might work with a PCT touch.
Protect the LCD/touch/cover lens against scratches and sharp edges. The warranty does not
cover pixel failures resulting from non-compliant handling.
Clean the LCD/touch/cover lens with a soft cotton cloth with alcohol. Don’t use organic solvents,
acid or alkali solutions.
Water drops, finger fat or any similar fouling should be removed immediately from the LCD,
cover lens and metal frame to avoid any staining.
III. Electricity
The embedded systems may only be opened in accordance with the description in this user’s
manual for
replacing of the (rechargeable, where applicable) lithium battery and/or
configuration of interfaces, where applicable
These procedures have to be carried-out only by qualified specialist personnel.
When accessing internal components the device must be switched off and disconnected from the
power source.
When purchased core or basic versions without protecting back cover, don’t touch the PCB
directly with your fingers. Especially these products need to be handled very carefully.
Don’t operate or handle the unit without typical ESD protection measures, such as ground
earthing.
Operate the unit according to the technical specification only.
IV. Damage or permanent malfunction
It must be assumed that a safe operation is no longer possible, in case
the device has visible damage or
the display is dark or shows strange pattern for longer period
the device doesn’t react after a reset
In these cases the device must be shut down and secured against further use

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3 Product Introduction
This document is applicable for hardware revisions 1.0 or later of the NESO LT SERIES.
Please find the hardware version grid in Annex B:
Product introduction3.1
NESO LT is an Embedded System to be used as human machine interface (HMI) in various applications.
Please refer to Annex E-2 Application notes for further information. The system is equipped with a large
number of industrial interfaces. A wide variety of options is available as well.
Type plate and device information3.2
For service and later identification of the device, the type plate contains important information.
Barcode for batch traceability

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Related documents and online support3.3
This document contains product specific information. The following additional documentations are available:
Title
Link to Garz & Fricke Website
Description
RedBoot User Manual
GF_RedBoot_User_Manual_V.0.7.pdf
Contains relevant information about
BIOS, boot logo, display settings, etc.
Windows OS Manual
GF_WindowsCE_Manual_Vn.n.pdf
Contains information about Windows
Embedded CE, the tool chain, the
development environment Visual
Studio, Garz & Fricke tools, etc.
Linux PTX OS Manual
GF_Linux_PTX_Manual_Vn.n.pdf
Contains information about Linux BSP,
the tool chain, Qt, etc.
Support for your Garz & Fricke embedded device is available on the Garz & Fricke website. You may find a list
of the documents available, as well as their latest revision and updates for your system:
Product
Link to Garz & Fricke Website
NESO LT core
http://www.garz-fricke.com/nesolt-core_en.html?ptab=1

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4 Technical data
CPU
Class
ARM9R ARM926EJ-S™i.MX257
Type/Clock
400 MHz
RTC
Depending on ambient temperature
Standard time´s deviation: +/- 30 ppm at 25°C
Memory
NAND Flash
256 MByte NAND Flash
RAM
Standard
128 MByte DDR-SDRAM
Option
256 MByte DDR-SDRAM
Micro SD Card Slot
4 bit MicroSD (HC)
Interfaces External
Network
1x 10/100 Mbit/s Ethernet (RJ45)
Serial
1x RS-232 (RX/TX/CTS/RTS)
1x RS-485
CAN Fieldbus
CAN Option
1x CAN (ISO/DIS 11898) instead of RS-485
USB 2.0
1x 12 Mbit/s Full-Speed Host
1x 480 Mbit/s High-Speed OTG
Keypad/SPI/I²C
multiplexed
Default
1x 7x7 Keypad, 1x I²C
Mode 1
1x 4x4 Keypad, 1x I²C, 1x SPI
Mode 2
1x 8x8 Keypad
Mode 3
1x 5x5 Keypad, 1x SPI
Speaker
1x external speaker (connector) 1.5 W RMS (8Ω)
Digital I/O
1x Digital Out (0.7 A)
Audio
S/PDIF, Line Out
Extension
1-wire, SDIO, UART, I²C, SPI
Interfaces Internal
USB
1x 480 Mbit/s High-Speed instead of USB OTG Option:
Audio
Speaker, Mic In, Line In, Line Out
Display
TTL up to 24 bit (RGB)
Backlight
Backlight driver TPS61161. Current depending on assembly; Typ: 35mA
Touch
4-wire resistive touch interface, PCT Interface
Power Supply and Consumption
Supply [V DC]
Nom. 12
Max. 9 ~ 16
Consumption [W]
Typ. 1.2 W
Internal Backup Battery
Type
3 V lithium manganese dioxide Type CR1220
Lifetime (RTC only)
Approximately 8 years, depending on application
Approximate Dimensions
W x H x D [mm]
113.0 x 16.0 x 47.0
Weight [g]
51

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Environment
Humidity [%]
5 ~ 90
Operating Temperature[°C]
0 ~ +60
Storage Temperature [°C]
-20 ~ +70
Max. Operating Altitude [m]
3,000
Max. Storage/Transit
Altitude [m]
10,000
Noise Level [db(A)] @ 1m
<<40 (fanless design)
Lifetime
MTBF1[h]
≥ 50,000
1
Electrical products use the industrial standard term Mean Time between Failure (MTBF) as a statistical prediction of the
elapsed time between failures in a large population of systems.
The MTBF of all Garz & Fricke HMI products shall be 50,000 hours
A failure is anything that causes the product not to function to its specifications
Reduction in brightness due to backlight lifetime is not a failure
If the LCD used in the system exceeds its pixel defect specification it is considered a failure.

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Block diagram4.1

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PCB design and Pin assembly 4.2
As this manual describes a core version, the internal and external interfaces will be mentioned in the following
chapter.
Pos.
Description
Pos.
Description
1
Ethernet (X8)
12
Power LED
2
Power/Digital out (X1)
13
SD card reader
3
RS-232/RS-485/CAN (X9)
14
Extension (X18)
4
USB - Host (X12)
15
Internal USB - Host (X13)
5
External USB - OTG (X14)
16
Speaker (X5/X6)
6
Speaker (X5/X6)
17
Internal audio (X4)
7
Line out (X20)
18
PCT Controller (X19)
8
S/PDIF (X7)
19
Battery-Holder (X2)
9
Keypad/SPI (X16)
20
RGB Display Interface (X10/X11)
10
Reset
21
S/PDIF (X7)
11
Clear all (Bootmode-Select)

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5 Installation and start up
The content of this document is limited to explain the device connectors and how to access NESO LT via FTP
over your local area network (LAN) within a few seconds. For advanced hardware specifications and software
support, please refer to chapter 3.3 Related documents and online support
Product
Link to Garz & Fricke Website
NESO LT core
http://www.garz-fricke.com/nesolt-core_en.html?ptab=1
Connection Scheme 5.1
(Exemplary illustration)

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6 Internal and external interfaces and Schematics
Ethernet (X8)6.1
Pin
Name
Description
Level
1
Tx+
2
Tx-
3
Rx+
4
SPARE1
5
6
Rx-
7
SPARE2
8
Header:
RJ45
Power/Digital out (X1)
6.2
Pin
Name
Description
Level
1
GND
Ground
2
GND
Ground
3
Vcc_In
Input voltage
9-16V
4
DIO_OUT
Digital Out
Vcc_In
Header:
Molex_43045-0400 Micro-Fit 4p
Plug:
Molex_43025-0400 Micro-Fit 4p, crimp contact
Molex 43030-0007

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RS-232/RS-485/CAN (X9)6.3
6.3.1 Option: RS-232/RS-485
Pin
Name
Description
Level
1
GND
Ground
2
RS232_TXD1
Port#1: Transmit data (Output)
3
RS232_RXD1
Port#1: Receive data (Input)
4
RS232_RTS1
Port#1: Request-to-send (Output)
5
RS232_CTS1
Port#1: Clear-to-send (Input)
6
Vref
Vref out
5V
7
GND
Ground
8
RS485_Y
TX+
9
RS485_Z
TX-
10
RS485_A
RX+
To enable Half-Duplex: bridge with RS485_Y
11
RS485_B
RX-
To enable Half-Duplex: bridge with RS485_Z
12
RS485_TERM
To enable RS485-Termination: bridge with
RS485_A
Header: Molex_43045-1200_Micro-Fit_12p
Plug: Molex_43025-1200_Micro-Fit_12p, crimp contact Molex 43030-0007
6.3.2 Option: RS-232/CAN
Pin
Name
Description
Level
1-5
RS-232
Identical to RS-485 option (s. 4.3.1.)
6
Vref
Vref out
5V
7
GND
Ground
8
CAN1_H
CAN bus 1 high
9
CAN1_L
CAN bus 1 low
10
CAN1_TERM
To enable CAN1-Termination, bridge with
CAN1_L
11
n.a.
12
n.a.

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USB - Host (X12)6.4
Pin
Name
Description
Level
1
Vcc
Power supply
5 V /500mA
2
D-
Data minus
3
D+
Data plus
4
GND
Ground
Header: USB Type A
External USB - OTG (X14)6.5
Pin
Name
Description
Level
1
Vcc
Power supply
5 V /500mA
2
D-
Data minus
3
D+
Data plus
4
ID
Device ID
5
GND
Ground
+Header: Micro-USB Type AB
Speaker (X5/X6)6.6
external (X5)
Pin
Name
Description
Level
1
VO+
External speaker out +
Max. 1.5 W @ 8 Ω or 3 W @ 4 Ω
(X5 internally connected to X6)
2
VO-
External speaker out -
Header: JST S2B-PH-SM3-TB, side entry, RM = 2.0, 2-pin
Plug: JST PHR-2, crimp contact BPH-002T-P0.5S
internal (X6)
Pin
Name
Description
Level
1
VO+
Internal speaker out +
Max. 1.5 W @ 8 Ω or 3 W @ 4 Ω
(X5 internally connected to X6)
2
VO-
Internal speaker out -
Header: JST B2B-ZR-SM4-TF, top entry, RM = 1.5, 2-pin
Plug: JST ZHR-2, crimp contact SZH-002T-P0.5

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Line out (X20)6.7
Pin
Name
Description
Level
1
GND
Ground shielding
2
LINE_OUT_L
Line out, left channel
Max 1V RMS
3
LINE_OUT_R
Line out, right channel
S/PDIF (X7)6.8
Pin
Name
Description
Level
1
GND
Ground shielding
2
TXOUT
Signal out
Max 1Vpp, R = 75Ohm

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Keypad/SPI (X16)6.9
6.9.1 Standard: Keypad/SPI
Pin
Name
Description
Level
Standard mode
Multiplexed mode 1
1
GND
Ground
Ground
2
GND
Ground
Ground
3
KP_COL7_SS2
Keypad column 7
SPI 3 Slave Select 2
3,3V
4
KP_ROW7_SLK
Keypad row 7
SPI 3 Serial Clock
3,3V
5
KP_COL6_MOSI
Keypad column 6
SPI 3 Master out Slave
in
3,3V
6
KP_ROW6_MISO
Keypad row 6
SPI 3 Master in Slave
out
3,3V
7
KP_COL5_SS3
Keypad column 5
SPI 3 Slave Select 3
3,3V
8
KP_ROW5_DMA
Keypad row 5
SPI 3 Interrupt Request
3,3V
9
KP_COL4
Keypad column 4
Keypad column 4
3,3V
10
KP_ROW4
Keypad row 4
Keypad row 4
3,3V
11
KP_COL3
Keypad column 3
Keypad column 3
3,3V
12
KP_ROW3
Keypad row 3
Keypad row 3
3,3V
13
KP_COL2
Keypad column 2
Keypad column 2
3,3V
14
KP_ROW2
Keypad row 2
Keypad row 2
3,3V
15
KP_COL1
Keypad column 1
Keypad column 1
3,3V
16
KP_ROW1
Keypad row 1
Keypad row 1
3,3V
17
KP_COL0
Keypad column 0
Keypad column 0
3,3V
18
KP_ROW0
Keypad row 0
Keypad row 0
3,3V
19
GND
Ground
Ground
20
GND
Ground
Ground
Header: JST SM20B-SRDS-G-TF, side entry, RM = 1.00
Plug: JST SHDR-20V-S-B, crimp contact: SSH-003GA-P0.2
6.9.2 Option: Keypad/SPI/I²C
Pin
Name
Description
Level
Multiplexed mode 2
Multiplexed
mode 3
1-10
Identical to standard (pls. see 6.9.1)
11
KP_COL3
I²C SDA
I²C SDA
12
KP_ROW3
I²C SCL
I²C SCL
13
KP_COL2
Keypad column 2
Keypad column 2
14
KP_ROW2
Keypad row 2
Keypad row 2
15
KP_COL1
Keypad column 1
Keypad column 1
16
KP_ROW1
Keypad row 1
Keypad row 1
17
KP_COL0
Keypad column 0
Keypad column 0
18
KP_ROW0
Keypad row 0
Keypad row 0
19
GND
Ground
Ground
20
GND
Ground
Ground

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Extension (X18)6.10
Pin
Name
Description
Level
1
5P0
Power supply
5.0V
2
5P0
Power supply
5.0V
3
3P3_IO
Power supply
3.3V
4
3P3_IO
Power supply
3.3V
5
1-WIRE
1-Wire
3.3V
6
SD_DATA2
SD Card Data 2
3.3V
7
SD_DATA3
SD Card Data 3
3.3V
8
SD_CMD
SD Card Command
3.3V
9
GND
Ground
10
SD_CLK
SD Card Clock
3.3V
11
GND
Ground
12
SD_DATA0
SD Card Data 0 (LSB)
3.3V
13
SD_DATA1
SD Card Data 1
3.3V
14
18_SD_CD
SD Card Detection Signal
1.8V
15
UART4_TXD
UART 4 Transmit data
(Output)
3.3V
16
UART4_RXD
UART 4 Receive data (Input)
3.3V
17
GND
Ground
18
I2C2_SCL
I²C 2 Serial Clock
3.3V
19
I2C2_SDA
I²C 2 Serial Data
3.3V
20
GND
Ground
21
SPI1_MISO
SPI 1 Master in Slave out
3.3V
22
SPI1_MOSI
SPI 1 Master out Slave in
3.3V
23
SPI1_SS0
SPI 1 Slave Select 0
3.3V
24
SPI1_SS3
SPI 1 Slave Select 3
3.3V
25
SPI1_RDY
SPI 1 Interrupt Request
3.3V
26
GND
Ground
27
SPI1_SCLK
SPI 1 Serial Clock
3.3V
28
GND
Ground
29
NC
Not connected
30
GND
Ground
Header: FFC-ZIF
Plug: FFC Cable, 0.5 mm pitch, 30 pin

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Internal USB - Host (X13)6.11
Pin
Name
Description
Level
1
Vcc
Power supply
5 V /500mA
2
D-
Data minus
3
D+
Data plus
4
GND
Ground
5
GND
Ground
Header: STL 1x5p SMD 180 RM = 2.54
Internal audio (X4)6.12
Pin
Name
Description
Level
1
MIC_IN
Microphone signal
2
MIC_GND
Microphone ground
3
LINE_IN_L
Line in, left channel
Typ: 0,75 Vrms;
Impedance Min: 10kOhm
4
GND
Ground shielding
5
LINE_IN_R
Line in, right channel
Typ: 0,75 Vrms;
Impedance Min: 10kOhm
6
GND
Ground shielding
7
LINE_OUT_R
Line out, right channel
Typ 0.6Vrms
8
GND
Ground shielding
9
LINE_OUT_L
Line out, left channel
Typ 0.6Vrms
10
GND
Ground shielding
Header: Molex 53398-1071, top entry, RM = 1.25
Plug: Molex 51021-1000, cable crimp/open wire 06-66-0015

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PCT Controller (X19) 6.13
Pin
Name
Description
Level
1
GND
Ground
2
X3
X matrix drive line
3
X2
X matrix drive line
4
X1
X matrix drive line
5
X0
X matrix drive line
6
GND
Ground
7
Y5
Y matrix drive line
8
Y4
Y matrix drive line
9
Y3
Y matrix drive line
10
Y2
Y matrix drive line
11
Y1
Y matrix drive line
12
Y0
Y matrix drive line
13
GND
Ground
14
X7
X matrix drive line
15
X6
X matrix drive line
16
X5
X matrix drive line
17
X4
X matrix drive line
18
GND
Ground
Header: FFC-ZIF
Plug: FFC Cable 1mm Pitch

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Battery-Holder (X2) 6.14
Pin
Name
Description
Level
1
VCC
Supply
3 V
2
GND
Ground
Header: Keystone 1056
Battery: CR1220