Gigabyte MZ31-AR0 User manual

No. Code Descripon
1 SW_ID ID buon with LED
2 R_USB1 USB 2.0 ports
3 USB3_LAN Server managemnt LAN port (top)/USB 3.0 port (boom)
4 LED_LAN1 SFP+ LAN port #1 acve/link LEDs
5 SFP+_1/SFP+_2 SFP+ LAN port #1/SFP+ LAN port#2
6 LED_LAN2 SFP+ LAN port #2 acve/link LEDs
7 COM1_VGA Serial port (top) / VGA port (boom)
8 SYS_FAN3 System fan connector #3
9 PMBUS_SEL PMBus select jumper
10 S3_MASK S3 power on select jumper
11 PMBUS PMBus connector
12 LED_BMC1 BMC firmware readiness LED
13 TPM_LPC TPM connector
14 P2 2 x 12 pin main power connector
15 P4 2 x 4 pin power connector (for memory)
16 P3 2 x 4 pin power connector (for CPU)
17 CPU1_FAN CPU fan connector #1
18 CPU0_FAN CPU fan connector #0
19 BIOS_PWD Clearing Supervisor Password jumper
20 BIOS_RCVR BIOS recovery jumper
21 SLSAS_0 Slimline connector #0 (SATA 6Gb/s signal)
22 SLSAS_1 Slimline connector #1 (SATA 6Gb/s signal)
23 SLSAS_2 Slimline connector #2 (SATA 6Gb/s signal)
24 SLSAS_3 Slimline connector #3 (SATA 6Gb/s signal)
25 FP_1 Front panel header
26 BP_1 HDD back plane board header
27 M2_SK1 M.2 slot (Gen3/x4)
28 F_USB1 USB 3.0 header
29 SYS_FAN1 System fan connector #1
30 F_USB2 USB 2.0 header
31 SYS_FAN4 System fan connector #4
32 SYS_FAN5 System fan connector #5
33 SYS_FAN2 System fan connector #2
No. Code Descripon
34 COM2 Serial port cable connector
35 PCIE_1 PCIe x16 slot (Gen3/x16)
36 PCIE_2 PCIe x8 slot (Gen3/x8)
37 PCIE_3 PCIe x16 slot (Gen3/x16)
38 PCIE_4 PCIe x16 slot (Gen3/x16)
39 PCIE_5 PCIe x16 slot (Gen3/x8)
40 PCIE_6 PCIe x16 slot (Gen3/x16)
41 PCIE_7 PCIe x8 slot (Gen3/x8)
42 BAT Baery socket
43 IPMB IPMB connector
44 CLR_CMOS Clear CMOS jumper
Front Panel Header / 前面板
No. Pin Define
1 Power LED+
3 No Pin
5 Power LED-
7 HDD LED+
9 HDD LED-
11 Power Buon
13 GND
15 Reset Buon
17 GND
19 ID Buon
21 GND
23 NMI Switch
No. Pin Define
2 5V Standby
4 ID LED+
6 ID LED-
8 System Status LED+
10 System Status LED-
12 LAN1 Acve LED+
14 LAN1 Link LED-
16 SMBus Data
18 SMBus Clock
20 Case Open
22 LAN2 Acve LED+
24 LAN2 Link LED-
1
2423
2
HDD Back Plane Board Header/ 硬盤背板排針
No. Pin Define
1 HP_ALERT
3 GND
5 BPMI_LOAD
7 BPMI_CLK
9 GLED_AMB_N
11 FAN_IRQ_N
13 BP_SCL
15 BP_SDA
17 SMB_U2_TMP_SCL
19 SMB_U2_TMP_SDA
21 PH_HP_SCL0
23 PH_HP_SDA0
25 No Connect
27 No Connect
29 P_3V3_AUX
No. Pin Define
2 BPMI_DIN/OUT
4 BPMI_DIN/IN
6 GND
8 PLD_Program_ENABLE
10 GLED_GRN_N
12 No Connect
14 GND
16 BP_RST_N
18 GND
20 I2C_DEV_RST
22 GND
24 GND
26 GND
28 GND
30 P_3V3_AUX
1 2
29 30
ATX Power/ 电源
8 4
5 1
No. Pin Define
1 GND
2 GND
3 GND
4 GND
5 +12V
6 +12V
7 +12V
8 +12V
1
1224
13
No. Pin Define
1 3.3V
2 3.3V
3 GND
4 +5V
5 GND
6 +5V
7 GND
8 Power Good
9 5VSB
10 +12V
11 +12V
12 3.3V
No. Pin Define
13 3.3V
14 -12V
15 GND
16 PS_ON
17 GND
18 GND
19 GND
20 -5V
21 +5V
22 +5V
23 +5V
24 GND
1
5
PMBUS
No. Pin Define
1 PMBus Clock
2 PMBus Data
3 PMBus Alert
4 GND
5 3.3V Sense
Installing CPU/Heatsink
3
1
2
1
External cap
2
3
CPU
4
5
6
7
1
3
2
8
9
3
1
2
4NOTE!
 When installing the heatsink to CPU,
use T20-Lobe driver to ghten 4 capve nuts
in sequence as 1-4.
 The screw ghtening torque:
16.1 ± 1.2 kgf-cm (14.0± 1.0 lbf-in)
Memory Populaon Configuraon/ 安装内存
NOTE!
 1R: 1 package rank of SDP DRAMs
 2R: 2 package rank of SDP DRAMs
 2DR: 2 package rank of DDP DRAMs
 4DR: 4 package rank of DDP DRAMs
 1S2R/1S4R/1S8R: 1 package rank of 2/4/8 high 3DS DRAMs
 2S2R/2S4R/2S8R: 2 package rank of 2/4/8 high 3DS DRAMs
 DIMM must be populated in sequenal alphabec order, starng with bank A.
 When only one DIMM is used, it must be populated in memory slot A1.
DIMMs
Populated
DIMM
1R
2
1-- --
2 --
1
--
--
-- --
-- Not Supported
2666
2666
Not Supported
Not Supported
2133
1
1
--
--2
1
1
--
-- --
--
--
2133
Not Supported
2133
1
11
1
2
4DR 1.2V 2S4R
Frequency (MT/s)
RDIMM Maximum Frequency Supported Table
DDR Populaon Table
LRDIMM Maximum Frequency Supported Table
DIMMs
Populated DIMM0 DIMM1
-- 11
1 12
DIMM
DIMMs
Populated 1R
-- --
--
2 --
--
-- --
--
--
--
--
2666
2400
Not Supported
2133
2133
2133
1
1
2
1
1
1
-- --
--
--
Not Supported
Not Supported
Not Supported
1
11
1
2
4DR 1.2V
2R
2DR
2S2R
2S4R
Frequency (MT/s)
2
1
10
Rear I/O Connector/ 后面板接口
No. Desripon
1 Serial port
2 VGA port
3 SFP+ LAN port #2 acve/link LEDs
4 SFP+ LAN port #2
5 SFP+ LAN port #1
6 SFP+ LAN port #1 acve/link LEDs
7 10/100/1000 Server Management LAN port
8 USB 3.0 ports
9 USB 2.0 ports
10 ID buon with LED
Off
State Description
Yellow On
Green On
1Gbps data rate
100Mbps data rate
10Mbps data rate
10/100/1000 LAN LED:
Speed LED Link/Acvity
LED
2
4 5 6
7
8
9
3
1
ID buon/LED:
Blue On System identifcation is active.
Off System identifcation is disabled.
State Description
Description
State
Yellow On 1 Gbps data rate
Green On 10 Gbps data rate
SFP+ LAN Link and Speed LED:
State Description
Green On Link between system and network or no access.
Green Blink Data transmission or receiving.
Off No data transmission or receiving.
SFP+ LAN Acve LED:
Green/Yellow Link LED
Green Acve LED
TPM Connector/ 可信平台模块
1
2
13
14
No. Pin Define
1 Clock
2 P_3V3_AUX
3 LPC_RST
4 P3V3
5 LPC_LAD0
6 IRQ_SERIAL
7 LPC_LAD1
No. Pin Define
8 No Connect
9 LPC_LAD2
10 No Pin
11 LPC_LAD3
12 GND
13 LPC_FRAME_N
14 GND
3
IPMB
1
No. Pin Define
1 Clock
2 GND
3 Data
COM2 Connector
21
109
No. Pin Define
1 NDCD-
2 NSIN
3 NSOUT
4 NDTR-
5 GND
No. Pin Define
6 NDSR-
7 NRTS-
8 NCTS-
9 NRI-
10 No Pin
CPU/System FAN/ 风扇
4
1
1
4No. Pin Define
1 GND
2 +12V
3 Sense
4 Speed Control
10
2
9
1
USB 2.0 Header
No. Pin Define
1 Power (5V)
2 Power (5V)
3 USB DX-
4 USB DY-
5 USB DX+
No. Pin Define
6 USB DY+
7 GND
8 GND
9 No Pin
10 No Connect
USB 3.0 Header
120
1011
No. Pin Define
1 Power
2 IntA_P1_SSRX-
3 IntA_P1_SSRX+
4 GND
5 IntA_P1_SSTX-
6 IntA_P1_SSTX+
7 GND
8 IntA_P1_D-
9 IntA_P1_D+
10 NC
No. Pin Define
11 IntA_P2_D+
12 IntA_P2_D-
13 GND
14 IntA_P2_SSTX+
15 IntA_P2_SSTX-
16 GND
17 IntA_P2_SSRX+
18 IntA_P2_SSRX-
19 Power
20 No Pin
BMC Firmware Readiness LED
State Descripon
On BMC firmware is inial
Blink BMC firmware is ready
Off AC loss
MZ31-AR0 Quick Reference Guide/ 快速测试参考指南
Jumper Sengs/ 跳线设置
No. Desripon
1 Clear CMOS Jumper
1-2 Closed: Normal operaon (Default seng)
2-3 Closed: Clear CMOS data.
2 PMBus Address Selecon Jumper
1-2 Closed: From core chipset.
2-3 Closed: From BMC. (Default seng)
3 S3 Power On Select Jumper
1-2 Close: Stop an inial power on when BMC is not ready.
2-3 Close: Keep inial power on. (Default seng)
4 Clearing Supervisor Password Jumper
1-2 Close: Normal operaon. (Default seng)
2-3 Close: Skip supervisor password.
5 BIOS Recovery Jumper
1-2 Close: Normal operaon. (Default seng)
2-3 Close: BIOS recovery mode.
DIMM_P0_D0 DIMM_P0_D1
DIMM_P0_A0 DIMM_P0_A1
DIMM_P0_B0 DIMM_P0_B1
DIMM_P0_C0 DIMM_P0_C1
DIMM_P0_E1 DIMM_P0_E0
CPU
DIMM_P0_H1 DIMM_P0_H0
DIMM_P0_G1 DIMM_P0_G0
DIMM_P0_F1 DIMM_P0_F0
1 2 3 4 5 6 7
8
9
10
12 11
14
15
16
13
18
17
1920
22
21
24
25
26
27
28
29
30
31
32
33
34
35 36 37 38 39 40 41
42
43 44
23
1
2
3
45
PN:25ME0-MZ3101-Q0H

Regulatory Noces Connect With Us
WEEE Symbol Statement
The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other
waste. Instead, the device should be taken to the waste collecon centers for acvaon of the treatment, collecon, recycling and
disposal procedure. The separate collecon and recycling of your waste equipment at the me of disposal will help to conserve
natural resources and ensure that it is recycled in a manner that protects human health and the environment.
For more informaon about where you can drop off your waste equipment for recycling, please contact your local government
office, your household waste disposal service or where you purchased the product for details of environmentally safe recycling.
 When your electrical or electronic equipment is no longer useful to you, "take it back" to your local or regional waste
collecon administraon for recycling.
 If you need further assistance in recycling, reusing in your "end of life" product, you may contact us at the Customer Care
number listed in your product's user's manual and we will be glad to help you with your effort.
GIGABYTE产品未故意添加和使用有害物质（Cd、Pb、Hg、Cr+6、PBDE和PBB）。所有部件和元件均经过严格挑选，符合RoHS要求。此
外，我们GIGABYTE一直致力于开发不使用国际上禁止的有毒化学品的产品。
GIGABYTE products have not intended to add and safe from hazardous substances (Cd, Pb, Hg, Cr+6, PBDE and PBB). The parts and components
have been carefully selected to meet RoHS requirement. Moreover, we at GIGABYTE are connuing our efforts to develop products that do not use
internaonally banned toxic chemicals.
Restricon of Hazardous Substances (RoHS) Direcve Statement
限制使用有害物质 (RoHS) 指令声明
California Proposion 65 Warning
WARNING:
This product can expose you to chemicals including Lead, which is known to the State of California to cause cancer, and Bisphenol A
(BPA), which is known to the State of California to cause birth defects or other reproducve harm. For more informaon go to
www.P65Warnings.ca.gov.
Baery Warning:
Incorrectly installing a baery or using incompable baery may increase the risk of ifre explosion. Replace the baery only with
the same or equivalent type.
 Do not disassemble, crush, punchture baeries.
 Do not store or place your baery pack next to or in a heat source such as a fire, heatgenerang appliance, can or exhaust
vent. Heang baery cells to temperatures above 65oC (149oF) can cause explosion or fire.
 Do not aempt to open or service baeries. Do not dispose of baeries in a fire or with household waste.
电池警告：
电池安装不当或使用不兼容的电池会增加火灾爆炸风险。更换电池时，只可使用相同或同等类型的电池。
 请勿拆解、挤压、刺破电池。
 请勿将电池存放或放置在热源中或旁边，如火源、产生热的设备、罐体或排气口。电池温度升至65oC (149oF)以上
可能导致爆炸或火灾。
 请勿尝试打开或维修电池。电池废弃时，请勿投入火中或者作为家庭废弃物进行处理。
依照中华人民共和国的有毒有害物质的限制要求(China RoHS)提供以下的表格：
中华人民共和国电子信息产品中有毒有害物质或元素的名称及含量标识格式
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