Intel H110 Express User manual

TECHNICAL MANUAL
Of
Intel H110 Express Chipset
Based Mini-ITX M/B
NO. G03-NF693-F
Revision: 3.0
Release date: July 19, 2017
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION......................................................................iii
USER’S NOTICE ..................................................................................................................iv
MANUAL REVISION INFORMATION..................................................................................iv
ITEM CHECKLIST................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................18
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................24
3-2 BIOS MENU SCREEN ................................................................................................25
3-3 FUNCTION KEYS .......................................................................................................25
3-4 GETTING HELP ..........................................................................................................26
3-5 MENU BARS...............................................................................................................26
3-6 MAIN MENU................................................................................................................27
3-7 ADVANCED MENU.....................................................................................................28
3-8 CHIPSET MENU..........................................................................................................39
3-9 SECURITY MENU.......................................................................................................42
3-10 BOOT MENU...............................................................................................................43
3-11 SAVE & EXIT MENU...................................................................................................44
TABLE OF CONTENT

iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition November 17, 2016
3.0 Third Edition July 19, 2017
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable(s)
I/O Back panel shield

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel®H110 express chipset
Support LGA 1151 CPU socket Intel®Core™ i7 processors / Intel®Core™ i5
processors / Intel®Core™ i3 processors / Intel®Pentium™ processors , Intel®
Celeron™ processors (TDP ≤65 W).
Support 2* DDR4 2133MHz SO-DIMM up to 32GB and dual channel function
Integrated with 2* Realtek Gigabit Ethernet LAN chip
Integrated with RealTek ALC662-VD-GR 6-channel HD Audio Codec
Support USB 3.0 data transport demand
Support 2 * SATAIII (6Gb/s) Devices
Support 1* Display port & 1* HDMI port
Support 1* PCIE 2.0 x16 slot
Support 1* full-size Mini-PCIE/MSATA slot
Support1* 1* M.2 Socket 3 slot for M-key type 2242/2260 SATA SSD
Support Smart FAN function
Supports ACPI S3 Function
Compliance with ErP Standard
Support Watchdog Timer Technology

2
1-2 Specification
Spec
Description
Design
Mini-ITX form factor 6 layers; PCB size: 17.0x17.0cm
Chipset

Intel H110 Express Chipset
CPU Socket

Support Intel®LGA 1151 Socket Core™ i7 processors, Intel®
Core™ i5 processors, Intel®Core™ i3 processors, Intel®
Pentium™ processors, Intel®Celeron™ processors
* for detailed CPU support information please visit our website
Memory Slot
2*DDR4 SO-DIMM slot
Support DDR4 2133 MHz SO-DIMM up to 32GB

Support dual channel function
Expansion Slot 1* PCIE x 16 slot

1* Full-size Mini-PCIE/ MSATA shared slot (MPE1)
Storage

2* SATA III 6G/s connector
1 * full-size Mini-PCIE/ MSATA shared slot (MPE1)
1* M.2 Socket 3 slot (M-key, support type 2242/2260
SATA
SSD)
Gigabit LAN Chip
Integrated with 2* Realtek RTL8111G Gigabit PCI-E LAN
chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip Realtek ALC662-VD-GR 5.1 channel Audio Codec integrated

Audio driver and utility included
BIOS

AMI 64Mb Flash ROM
Multi I/O
Rear Panel I/O:
4* Serial port connector(COM1_COM2/COM3_COM4,
COM1 supports RS232/422/485 function )
1* Display port
1* HDMI port
4* USB 3.0 port

3

2* RJ-45 LAN port
1*3-jack audio connector (Line-in, Line-out, MIC)
Internal I/O Connectors& Headers:
1 *24-pin main power connector
1 * 4-pin 12V power connector
1* CPUFAN connector & 1* SYSFAN connector
1*Front panel audio header
1* SPDIF-out header
1*Front panel header
2 * 9-Pin USB 2.0/1.1 header for 4* USB 2.0/1.1 ports
1 * PS2 Keyboard & Mouse header
1* SMBUS header
1* GPIO header
2* Serial port header (COM5/6,COM5 is optional to support
RS232/422/485)
1* Jumper & Header Combo Block (JP1)

1* EDP connector
1-3 Layout Diagram
Rear IO Diagram
Serial Port
(COM1)
Serial Port
(COM2)
Serial Port
(COM3)
Serial Port
(COM4)
Display Port
HDMI Port
RJ-45 LAN Ports
USB 3.0 Ports
Line-IN
Line-OUT
MIC-IN

4
Motherboard Internal Diagram-Front
Note: SIM card slot only work when compatible SIM card installed & 3G LAN card installed in MPE1Mini-PCIE slot.
Serial Ports
Serial Ports
RJ-45 LAN Ports
Over
USB 3.0 Ports
Display Port
over HDMI Port
Audio
Connectors
ATX Power
Connector
ATX 12V
Power Connector
CPUFAN Header
LGA 1151
CPU Socket
Intel H110 Chipset
PCI Express 2.0 x 16 Slot (PCIE1)
USB 2.0
Headers
Front Panel
Audio Header
Serial Port Headers
EDP
Connector
*DDR4 SODIMM Slot
(SODIMM1/2)
SATAIII Ports
(SATA1/2)
SYSFAN1 Header
Front Panel
Header
*SIM Card
Slot
*Full-size
Mini-PCIE/MSATA
Slot (MPE1)
SPDIF_OUT
Header
GPIO Header
JP1: Jumper & Header
Combo Block
PS/2 Keyboard & Mouse
Header
M.2 Socket 3
Connector
(MH1/2)
SUBUS Header

5
Motherboard Jumper Position
JCOMP2
JP2
JCOMP1
JCOMP3
JCOMP4
EDP_BKPWR
EDP_LCDPWR
JP1: Jumper & Header
Combo Block
MPE_PWR
JP_TEST