LG 17LX1R User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : ML-041B
FACTORY MODEL : 17LX1R-MB
MODEL : 17LX1R
website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION........................................................................................6
TIMING CHART .......................................................................................10
ADJUSTMENT INSTRUCTION................................................................11
SVC REMOCON ......................................................................................12
TROUBLE SHOOTING............................................................................13
BLOCK DIAGRAM...................................................................................18
WIRING DIAGRAM..................................................................................20
EXPLODED VIEW .................................................................................. 21
EXPLODED VIEW PARTS LIST..............................................................22
REPLACEMENT PARTS LIST ............................................................... 23
SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
X-RAY Radiation
Warning:
To determine the presence of high voltage, use an accurate high
impedance HV meter.
Adjust brightness, color, contrast controls to minimum.
Measure the high voltage.
The meter reading should indicate
23.5 1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch,
29.0 1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch
If the meter indication is out of tolerance, immediate service and
correction is required to prevent the possibility of premature
component failure.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
The source of X-RAY RADIATION in this TV receiver is the High
Voltage Section and the LCD PANEL.
For continued X-RAY RADIATION protection, the replacement
panel must be the same type panel as specified in the
Replacement Parts List.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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1. Application range
This specification is applied to ML-041B chassis.
2. Requirement for Test
Testing for standard of each part must be followed in below
condition.
(1) Temperature : 25°C ± 2°C
(2) Humidity : 65% ± 10%
(3) Power : Standard input voltage (AC 100-240V, 50/60Hz)
(4) Measurement must be performed after heat-run more than
30min.
(5) Adjusting standard for this chassis is followed a special
standard.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
3.General Specification
1Maker
Type
ActiveDisplay Area
Pixel Pitch [mm]
Electrical Interface
Color Depth
Size [mm]
Surface Treatment
Operating Mode
Back light Unit
R/T Typ.
LPL
TFT Color LCD Module
17.0 inches(434.38mm) diagonal
0.291mm(H)x0.291mm(V)xRGB
LVDS
6BIT, 16,777,216 colors
400(H) x 258.7(V) x 22(D)
Anti Glare Hard Coating
Normally Black
4 CCFL(4 lamps)
R.T.:12ms + F.T.:13ms
Item Specification Remark
No.
LPL

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*Function
4. Mechanical specification
No Item Specification Remark
1 Teletext TOP, FLOF,LIST 10 page Top(option) / ONLY PAL
2 REMOCON NEC Code PAL/ NTSC
3 AV Input 2 Rear(option, NT), side(ONLY 50tool)
4 S-Vedio Input 1 Rear
5 Component input 1 Rear (option, NT)Except COMMERCIAL
6 PERI TV Connector Full SCART : 1 Rear (option,EU)
7 RGB(VGA)Input 1 D-sub 15 pin
8 H/p input 1
9 PC Sound input 1 Except COMMERCIAL
10 RS-232 YES ONLY COMMERCIAL
11 Discrete IR YES ONLY COMMERCIAL
12 2 Carrier Stereo BG, DK ONLY PAL
13 NICAM Stereo BG, I, LL' ONLY PAL
14 2 Carrier Dual BG, DK ONLY PAL
15 NICAM Dual BG, I, LL' ONLY PAL
16 DW(Double Window) Mode X
17 MW(Multi Window) Mode X
18 Film Mode X
19 Noise Reduction X
20 Progressive Scan 0
21 Motion Detection X
22 SRS WOW X
23 wivel Speaker X
24 Ez-pip X
25 ARC 0
26 DRP 0
27 DCDI X
28 HDCP X
29 LIGHTING LOGO 0 OLNY 17LX1R
No Item Content Remark
Product Width (W) Length (D) Height (H)
1Dimension Before Packing 553.5 181 365.7 With SPK, Stand
After Packing 577 280 490
2Product Only SET 7.7kg
Weight With BOX 9.8 kg

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5-1.General Specification(TV)
5.Engineering Specification
No. ITEM CONTENTS REMARK
ENERGE SYNC(V/H) VIDEO POWER CONSUMPTION LED COLOR
1Normal On/On Active
≤ 65W Green
Stand By, Off/On
≤ 1W(110 V) Red
≤ 2W
Cut-off Switch off - - 0W OFF
PBP SWAP ON/OFF
ITEM Specification Remark
2 D-SUB 1 : RED 2 : Green
Pin configuration 3 : Blue 4 : ID2 (GND)
5 : S.T (GND) 6 : RED GND
7 : Green GND 8 : Blue GND 10: Digital GND
9 : N.C 10: D-GND
11: ID0(GND) 12:SDA
13: H-Sync 14: V-Sync
15: SCL Shell: GND
3 Control Function 1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
RESET
4 Comoponent Jack 1 : Y Middle east
3 : Pb / NTSC Area
5 : Pr
5 D4 Jack 1 : Y 2 : Y GND
(525i,525p,750p,1125i) 3 : Pb 4 : Pb GND
5 : Pr 6 : Pr GND
7 : Line1 Ready 8 : LINE1 JAPAN Only
9 : LINE2 10:Line2 Ready
11: LINE3 12:SWITCH GND
13: Line3 Ready 14: SWITCH

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6. Signal Timing(Resolution)
7. Optical Character
6-1. PC Mode
[Table 7] Timming chart of Receivable Mode * H [dot] / V [line]
Mode VGA-60 VGA-67 VGA-75 SVGA-56 SVGA-60 SVGA-72 SVGA-75 XGA-60 XGA-70 XGA-75 WXGA-60
H_display 640 640 640 800 800 800 800 1024 1024 1024 1280
V_display 480 480 480 600 600 600 600 768 768 768 768
V frequency 60 67 75 56 60 72 75 60 70 75 60
H_total 800 864 840 1024 1056 1040 1056 1344 1328 1312 1680
H_blanking 160 224 200 224 256 240 256 320 304 288 400
H_sync 96 64 64 72 128 120 80 136 136 96 136
H Polarity NEG. NEG. NEG POS POS POS POS NEG NEG POS NEG
H_bp 48 96 120 128 88 64 160 136 144 176 200
H_fp 16 64 16 24 40 56 16 160 24 16 64
H-freq[kHz] 31.469 35.0 37.5 35.156 37.879 48.077 46.875 48.363 56.476 60.023 47.693
/Clk[MHz] 25.175 30.24 31.5 36.0 40.0 50.0 49.5 65.0 75.0 78.75 80.125
V_total 525 525 500 625 628 666 625 806 806 800 795
V_blanking 45 45 20 25 28 66 25 38 38 32 27
V_sync 2 3 3 2 4 6 3 6 6 3 7
V Polarity NEG NEG NEG POS POS POS POS NEG NEG POS POS
V_bp 33 39 16 22 23 23 21 29 29 28 19
V_fp 10 3 1 1 1 37 1 3 3 1 1
No Item Specification Remark
LPL
1 Viewing Angle R/L 88/88
<CR 10> U/D 88/88
2 Luminance Luminance (cd/m2) 450 Typical
Variation 1.3 MAX
3 Contrast Ratio 400 All white / All black
4 CIE Color Coordinates White WX Typ. 0.289 Min = Typ. - 0.03
WY Typ. 0.303 Max = Typ. + 0.03
RED Xr Typ. 0.633
Yr Typ. 0.341
Green Xg Typ. 0.280
Yg Typ. 0.069
Blue Xb Typ. 0.145
Yb Typ. 0.069

TIMING CHART
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VIDEO
SYNC DB
C
E
A
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
H + 31.469 800 640 16 96 48
V–59.94 525 480 10 2 33
H–37.5 840 640 16 64 120
V–75 500 480 1 3 16
H–35.156 1024 800 24 72 128
V–56.25 625 600 1 2 22
H–35 864 640 64 64 96
V + 66.667 525 480 3 3 39
H + 37.879 1056 800 40 128 88
V + 60.317 628 600 1 4 23
H + 48.077 1040 800 56 120 64
V + 72.188 666 600 37 6 23
H+/–46.875 1056 800 16 80 160
V+/–75.0 625 600 1 3 21
H–48.363 1344 1024 24 136 160
V–60.004 806 768 3 6 29
H + 56.476 1328 1024 24 136 144
V + 70.069 806 768 3 6 29
H + 60.023 1312 1024 16 96 176
V–75.029 800 768 1 3 28
H + 47.776 1664 1280 64 128 192
V - 59.870 798 768 3 7 20
Mode H/V
Sort
1
2
3
4
5
6
7
8
9
10
11
25.175
30.240
31.5
36
40.0
50.0
49.5
65.0
75
78.75
79.50
640x480
640x480
800x600
640x480
800x600
800x600
800x600
1024x768
1024x768
1280x768
1280x768
Sync
Polarity Frequency
Dot
Clock Total Period
(E)
Video Active Time
(A)
Sync Duration
(D)
Back Porch
(F)
Front Porch
(B)
Resolution

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1. Application
This document is applied to 17" Wide LCD TV which is
manufactured in Monitor Factory or is produced on the basis
of this data.
2. Adjustment
2.1 Adjustment Details
The machine can be adjusted by itself automatically
but even for self -adjustment it needs someone to
operate it.
2.2 Auto Gain/Offset adjustment
2.2.1 RF Mode adjustment
2.2.1.1 Adjustment preparation
Execution of RF no signal during Heat Run over
30min.
2.2.1.2 Auto Gain/Offset adjustment
Press IN-START Key by using the Remote Controller
(SVC), after converting to Adjustment-Mode,Press
VOL+ Key consecutively in Scaler Auto gain menu.
(RM-17LZ40/50/17LX1R press INSTART key two times )
After adjustment is complete, pressing enter key,
stores and completes the process.
2.2.2 Component Mode adjustment
(Model: Only RT/ RM-17LZ40/50/17LX1R which is possible to input Component signal )
2.2.2.1 Adjustment preparation
Execution of RF no signal during Heat Run over
30min.
The component jack(Y,Pb,Pr) of LCD TV is
connected to Y, Pb, Pr Output Signal of Pattern
Generator (MSPG-925 SERISE)
2.2.2.2 Auto Gain/Offset adjustment
Convert to Component Mode in Input-Mode.
Select MODEL : 228 (480p Mode, Y : 100%, Pb/Pr :
75%) in Pattern Generator
Select PATTERN : 33 (Color Bar Pattern signal) in
Pattern Generator
(MSPG-925 SERISE)
Press IN-START Key by using the Remote
Controller(SVC) , after converting to Adjustment-
Mode, press VOL+ Key consecutively in AutoGain
Menu.
After adjustment is complete, pressing enter key,
stores and completes the process.
2.2.3 PC Mode adjustment
2.2.3.1 Adjustment preparation
Execution of RF no signal during Heat Run over
30min.
15 Pin D-Sub Jack of LCD TV is connected to the
signal of Pattern Generator.
2.2.3.2 Auto Gain/Offset adjustment
Convert to PC Mode in Input-Mode.
mpress Resolution XGA (1024X768) and Pattern 16
Step Gray Signal ,or 16 Step (11 Step) Gray Signal
which follows in the VG819.
Press IN-START Key by using the Remote
Controller(SVC) , after converting to Adjustment-
Mode, press VOL+ Key consecutively in AutoGain
Menu.
After adjustment is complete, pressing enter key,
stores and completes the process
2.3
EDID (The Extended Display Identification Data) Adjustment
Connect 15 Pin D-Sub Cable to D-Sub Jac.
Set up the input mode of the SET to PC
For the DDC connect an automation equipment and
data is written on DDC.
(Refer to Working Order for relative setting up)
2.3.1 EDID DATA
ADJUSTMENT INSTRUCTION
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D F9 43 01 01 01 01
10 04 0F 01 01 20 39 21 78 EE 1D 32 A2 57 47 9A 25
20 11 4A 4D A5 CE 00 61 4F 45 4A 31 4F 01 01 01 01
30 01 01 01 01 01 01 0E 1F 00 80 51 00 1E 30 40 80
40 37 00 74 DF 10 00 00 1E 00 00 00 FD 00 38 4B 1F
50 41 09 00 0A 20 20 20 20 20 20 00 00 00 FC 00 31
60 37 4C 58 31 52 0A 20 20 20 20 20 20 00 00 00 FC
70 00 0A 20 20 20 20 20 20 20 20 20 20 20 20 00 C2

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SVC REMOCON
1 POWER
2 POWER ON
3 MUTE
4 P-CHECK
5 S-CHECK
6 ARC
7 CAPTION
8 TXT
9 TV/AV
10 TURBO SOUND
11 TURBO PICTURE
12 IN-START
13 ADJ
14 MPX
15 EXIT
16 APC(PSM)
17 ASC(SSM)
18 MULTIMIDIA
19 FRONT-AV
20 CH
21 VOL
22 ENTER
23 PIP CH-(OP1)
24 PIP CH+(OP2)
25 PIP SWAP(OP3)
26 PIP INPUT(OP4)
27 EYE
28 MENU
29 IN-STOP
30 STILL
31 TIME
32 SIZE
33 MULTI PIP
34 POSITION
35 MODE
36 PIP
37 TILT
38 0~9
To turn the TV on or off
To turn the TV on automatically if the power is supplied to the TV. (Use the
POWER key to deactivate): It should be deactivated when delivered.
To activate the mute function.
To check TV screen image easily.
To check TV screen sound easily
To select size of the main screen (Normal, Spectacle, Wide or Zoom)
Switch to closed caption broadcasting
To toggle on/off the teletext mode
To select an external input for the TV screen
To start turbo sound
To start turbo picture
To enter adjustment mode when manufacturing the TV sets.
To adjust the screen voltage (automatic):
In-start mute Adjust AV(Enter into W/B adjustment mode)
W/B adjustment (automatic):
After adjusting the screen W/B adjustment Exit two times (Adjustment completed)
To enter into the adjustment mode. To adjust horizontal line and sub-brightness.
To select the multiple sound mode (Mono, Stereo or Foreign language)
To release the adjustment mode
To easily adjust the screen according to surrounding brightness
To easily adjust sound according to the program type
To check component input
To check the front AV
To move channel up/down or to select a function displayed on the screen.
To adjust the volume or accurately control a specific function.
To set a specific function or complete setting.
To move the channel down in the PIP screen.
To use as a red key in the teletext mode
To move the channel in the PIP screen
To use as a green key in the teletext mode
To switch between the main and sub screens
To use as a yellow key in the teletext mode
To select the input status in the PIP screen
To use as a blue key in the teletext mode
To set a function that will automatically adjust screen status to match
the surrounding brightness so natural color can be displayed.
To select the functions such as video, voice, function or channel.
To set the delivery condition status after manufacturing the TV set.
To halt the main screen in the normal mode, or the sub screen at the PIP screen.
Used as a hold key in the teletext mode (Page updating is stopped.)
Displays the teletext time in the normal mode
Enables to select the sub code in the teletext mode
Used as the size key in the PIP screen in the normal mode
Used as the size key in the teletext mode
Used as the index key in the teletext mode (Top index will be
displayed if it is the top text.)
To select the position of the PIP screen in the normal mode
Used as the update key in the teletext mode (Text will be
displayed if the current page is updated.)
Used as Mode in the teletext mode
To select the simultaneous screen
To adjust screen tilt
To manually select the channel.
Shortcut keys
Shortcut keys
Shortcut keys
Use the AV
key to enter
the screen
W/B
adjustment
mode.
Shortcut keys
Shortcut keys
Shortcut keys

- 13 -
TROUBLESHOOTING
No power
(LED indicator off)
Check short of main B/D
or Change Lips
Change IC1107, IC1104
Change LED Assy
Check 15V or 5V
of Lips
Check Output of
IC1107, IC104
Check LED Assy
Check P1100, P210 Connector
Fail
Fail
Change Q1100
Check Output of
Q1100 Fail
Pass
Fail
Pass
Pass
Pass
:[A]Process

- 14 -
No Raster
Check LED Status
on display unit
Check the input/
Output of IC901
Check L900,L901
L902,L903
Check inverter
Connector or inverter
Check input source cable and jack
Repeat A PROCESS
Fail
Change L900,L901,
L902,L903
Fail
Change IC901
Fail
Change inverter
connector or inverter
Fail
Change panel link
cable or module
Fail
Change module
Fail
Check panel link
Cable or module
Pass
Pass
Pass
Pass
:[B]Process

- 15 -
No Raster on Component signal
Check JA1200 or
RCA CABLE
Check the signal of
L1200, L1202, L1203
Repeat
[A] Process
Check the input/
output of IC1
Check the input/
output of IC901
Check input source cable and jack
Fail
Re-soldering or
Change the defect part,
Check X11
Fail
Re-soldering or
Change the defect part,
Check X900
Fail
Pass
Pass
Pass
Check the input/output
of IC800, IC851 Re-soldering or
Change the defect part
Fail
Pass

- 16 -
No Raster on AV Signal
(Video, S-Video) No Raster on TV(RF) signal
Change L1209, L1210,
L1212
Check the signal of
L1209, L1210, L1212
Repeat
[A] Process Check the output of
TU1000
Check the input/output
of IC1
Check the input/output
of IC800, IC851
Check input source cable and jack
Fail
Fail Fail
Fail
Re-soldering or
Change the defect part
Chek X11
Fail Re-soldering or
Change the defect part
Check 5V, 33V of TU1000
Re-soldering or
Change the defect part
Pass
Pass
Pass
Check the input/output
of IC901 Fail
Re-soldering or
Change the defect part
Check X900
Pass
Pass

- 17 -
No Sound
Check the speaker wire
Change source input
Check the
input source Fail
Pass
Re-soldering or
Change the defect part
Check X11
Check the input/output
of IC1 Fail
Pass
Re-soldering or
Change the defect part
Check the input/output
of IC100,IC101 Fail
Pass
Change speaker
Check the speaker Fail
Pass

BLOCK DIAGRAM
- 18 -
Tuner
TU1000
VCTI
IC1
GM2221
IC901
AT49F
IC905
SM5301BS IC800
IC100 IC101
Audio Amp
AC IN
M52758FP
IC851
LA7222 IC2
TC90A65F
IC500
14066
IC202
D-SUB
AT24C16
IC4
DIGITAL SIGNAL
SOUND INPUT
IF +,- INPUT
ANALOG SIGNAL
SOUND OUTPUT
ML-041B Block Diagram
POWER
IF+,-
PC
SIDE_AV
L, R
SIDE_L,R
PC L,R
L,R AUDIO
S
A
W
Z1000
SCART V,L,R
S-VHS
H/P V
SCART R,G,B
SIDE V
YP
bPr
RGB OUT
TTL 1 OUT
TTL 2 OUT
LVDS1 OUT
PC RGB
COMPONENT

BLOCK DIAGRAM DESCRIPTION
- 19 -
1. Video Controller Unit & Display Data Conversion Unit
The video controller unit receives the video signals inputted through the tuner, AV port (AV1, AV2, S-Video,
component), and converts them into an analog RGB signal through the microcomputer (VCTI) combined with
the video decoder that integrates various functions in one chip.
Either the analog RGB, component YPbPr or PC RGB signal is selected by the switching IC and inputted to a
scaler (GM2221), which is sent to the LCD module after being modified to an LVDS signal through the
integrated LVDS IC.
Or, it is sent to the LCD module as a TTL output.
VCTi is the main microprocessor that handles video signal processing and sound signal processing. It also
manages the RF signals received from the tuner.
The scaler can control timing to fit into the LCD panel, and can also control the size and position of the input
signal.
2. Power Supply Unit
The power supply unit provides 15V and 5V DC power to the mainboard.
The PWM Step-Up DC/DC Converter circuit is used to generate the 33V used for the tuner.
15V power is directly used by the sound amplifier IC and is also used to generate 5V power through the
regulator. 12V power is used for the LCD panel power, and 5V power is converted to 3.3V and 1.8V power
through the regulator, which in turn supplies electrical power for ICs such as VCTI and scaler.

- 20 -
POWER BOARD MAIN BOARD
1
2
8
7
6
3
5
4
WIRING DIAGRAM
No. Part No.
1 2 3 4 5 6 7 8
Wiring Part List
6631T11012R 6631T20028G 6631T25019Y 6631T20033L 6631T20010Q 6631T11017R 6631T25019L 6631T25023W