LG OLED55E7 series User manual

P/NO : MFL70063101 (1711-REV02)
CHASSIS : ED71F
MODEL : OLED55E7* OLED55E7*-Z
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
OLED TV
SERVICE MANUAL
CONFIDENTIAL
Copyright © 2017 LG Electronics Inc. All rights reserved. Only training and service purposes.

- 2 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
SOFTWARE UPDATE .............................................................................10
BLOCK DIAGRAM .................................................................................. 11
EXPLODED VIEW .................................................................................. 17
DISASSEMBLY GUIDE .......................................................................... 18
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the OLED TV with ED71F
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100~240 V, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
- Wireless : Wireless HD Specification (Option)
4. Model General Specification
No. Item Specication Remarks
1 Market EU(PAL Market-36Countries)/CIS
+ Morocoo(Africa)
DTV & Analog (Total 37 countries)
DTV (MPEG2/4, DVB-T) : 26 countrie
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, , Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus
DTV (MPEG2/4, DVB-T2) :11 countries
UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan,
Russia, Italy, Croatia, Serbia
DTV (MPEG2/4, DVB-C) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croa-
tia, Turkey, Morocco, Ireland, Latvia, Estonia, Lithuania, Poland, Portugal,
Romania, Albania, Bosnia, Serbia, Slovakia, Belarus, UK, Sweden, Den-
mark, Finland, Norway, Ukraine, Kazakhstan
DTV (MPEG2/4,DVB-S) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain,Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus, UK(Ireland), Sweden, Denmark, Finland, Nor-
way, Ukraine, Kazakhstan,Russia, Italy, Croatia, Serbia
Supported satellite : 35 satellites
ABS1 75.0E, AMOS 4.0W, ASIASAT3S 105.5E, ASTRA 19.2E, ASTRA
23.5E, ASTRA 28.2E, ASTRA 4.8E, ATLANTIC BIRD2 8.0W, ATLAN-
TIC BIRD3 5.0W, BADR 26.0E, DIRECTV-1R 56.0E, EUROBIRD 9A
9.0E, EUROBIRD3 33.0E, EUTELSAT 36 A/B 36.0E, EUTELSAT W2A
10.0E, EUTELSAT W3A 7.0E, EUTELSAT7WA 7.3WEUTELSAT 16.0E,
EXPRESS AM1 40.0E, EXPRESS AM3 140.0E, EXPRESS AM33 96.5E,
HELLASSAT 39.0E, HISPASAT 1CDE 30.0WHOTBIRD 13.0E, INTEL-
SAT10&7 68.5E, INTELSAT15 85.2E, INTELSAT1R 50.0W, INTEL-
SAT903 33.5W, INTELSAT904 60.0E, NILESAT 7.0W, NSS12 57.0E,
THOR 0.8W, TURKSAT 42.0E, YAMAL201 90.0E, OTHER

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Only for training and service purposes.
No. Item Specication Remarks
2 Broadcasting system
(1) Digital TV
- DVB-T
- DVB-T2*
- DVB-C
- DVB-S/S2*
(2) Analogue TV
- PAL/SECAM B/G/I/D/K
- SECAM L
*:Depending on country
3 Channel coverage
(1) Digital TV
1) DVB-T/T2
- VHF III : 174~230MHz
- UHF IV : 470~606MHz
- UHF V : 606~862MHz
- S Band II : 230~300MHz
- S Band III : 300~470MHz
2) DVB-C
- 46 ~ 890MHz
3) DVB-S/S2
- 950~2150MHz
(2) Analogue TV
- 46~862MHz
* Only DVB-T2/C/S2 support model only.
4 Receiving system Analog : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2 (Model : *L*V*-Z* (T2 only Model)
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation :
16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5Head phone out
Antenna,
HDMI1, HDMI2, HDMI3, HDMI4 USB1, USB2,
USB3
6HDMI Input (3EA)
HDMI1-DTV
HDMI2-DTV
HDMI3-DTV
7SPDIF out (1EA) SPDIF out
8USB (3EA) EMF, For SVC (download) JPEG, MP3
9Ethernet Connect (1EA) Ethernet Connect STP cable
10 PCMCIA Card slot (1EA) PCMCIA slot

- 8 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
5. External Input Format
5.1. HDMI : EDID DATA : Refer to adjust specification.
5.1.1. DTV mode
No Resolution H-freq (kHz) V-freq (Hz) Pixel clock (MHz) Proposed Remarks
1 640*480 31.469 59.94 25.125 SDTV 480P
2 640*480 31.50 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display
4 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
5 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I)
50Hz
6 720*480 31.47 59.94 27.00 SDTV 480P
7 720*480 31.50 60.00 27.027 SDTV 480P
8 720*576 31.25 50.00 27.00 SDTV 576P
9 1280*720 44.96 59.94 74.176 HDTV 720P
10 1280*720 45.00 60.00 74.25 HDTV 720P
11 1280*720 37.50 50.00 74.25 HDTV 720P
12 1920*1080 28.125 50.00 74.25 HDTV 1080I
13 1920*1080 33.72 59.94 74.176 HDTV 1080I
14 1920*1080 33.75 60.00 74.25 HDTV 1080I
15 1920*1080 26.97 23.976 63.296 HDTV 1080P
16 1920*1080 27.00 24.000 63.36 HDTV 1080P
17 1920*1080 33.71 29.97 79.120 HDTV 1080P
18 1920*1080 33.75 30.00 79.20 HDTV 1080P
19 1920*1080 56.25 50.00 148.50 HDTV 1080P
20 1920*1080 67.432 59.94 148.350 HDTV 1080P
21 1920*1080 67.50 60.00 148.50 HDTV 1080P
22 1920*1080 135.00 120.00 297.00 HDTV 1080P
23 1920*1080 135.00 119.88 296.70 HDTV 1080P
24 1920*1080 112.50 100.00 297.00 HDTV 1080P
25 1920*1080 135.00 120.00 297.00 HDTV 1080P
26 1920*1080 135.00 119.88 296.70 HDTV 1080P
27 1920*1080 112.50 100.00 297.00 HDTV 1080P
28 3840*2160 53.95 23.98 296.703 UDTV 2160P
29 3840*2160 54.00 24.00 297.00 UDTV 2160P
30 3840*2160 56.25 25.00 297.00 UDTV 2160P
31 3840*2160 61.43 29.97 296.703 UDTV 2160P
32 3840*2160 67.50 30.00 297.00 UDTV 2160P
33 3840*2160 112.50 50.00 594.00 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
34 3840*2160 134.865 59.94 593.407 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
35 3840*2160 135.00 60.00 594.00 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON

- 9 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
36 4096*2160 53.95 23.98 296.703 UDTV 2160P
37 4096*2160 54.00 24.00 297.00 UDTV 2160P
38 4096*2160 56.25 25.00 297.00 UDTV 2160P
39 4096*2160 61.43 29.97 296.703 UDTV 2160P
40 4096*2160 67.50 30.00 297.00 UDTV 2160P
41 4096*2160 112.50 50.00 594.00 UDTV 2160P When HDMI1,2,3,4
UHD DEEP COLOUR ON
42 4096*2160 134.865 59.94 593.407 UDTV 2160P When HDMI1,2,3,4
UHD DEEP COLOUR ON
43 4096*2160 135.00 60.00 594.00 UDTV 2160P When HDMI1,2,3,4
UHD DEEP COLOUR ON
5.1.2. HDMI Input (PC)
No Resolution H-freq (kHz) V-freq (Hz) Pixel clock (MHz) Proposed Remarks
1 640*350 31.468 70.09 25.17 EGA
2 720*400 31.469 70.08 28.32 DOS
3 640*480 31.469 59.94 25.17 VESA(VGA)
4 800*600 37.879 60.31 40.00 VESA(SVGA)
5 1024*768 48.363 60.00 65.00 VESA(XGA)
6 1360*768 47.712 60.015 84.75 VESA(WXGA)
7 1152*864 54.348 60.053 80.00 VESA
8 1280*1024 63.981 60.020 109.00 SXGA Support to HDMI-PC
9 1920*1080 67.50 60.00 158.40 WUXGA(Reduced Blanking)
10 3840*2160 54.00 24.00 297.00 UDTV 2160P
11 3840*2160 56.25 25.00 297.00 UDTV 2160P
12 3840*2160 67.5 30.00 297.00 UDTV 2160P
13 4096*2160 53.95 23.97 296.703 UDTV 2160P
14 4096*2160 54.00 24.00 297.00 UDTV 2160P

- 10 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
1. USB
(1) Insert the USB memory Stick to the USB port.
(2) Automatically detect the SW Version and show the below
message
(3) Click [YES]: initiate the download and install of the update.
(4) Click [Check Now]: move to “About This TV” page for
update.
(5) TV is updating.
(6) After finished the update, below Pop-up appear.
(7) Click [Yes] : TV will be DC OFF -> ON
(8) After TV turned on, Check the updated SW Version and
Tool Option.
2. NSU
(1) Menu -> All Settings -> General -> About This TV
(2) Click [CHEK FOR UPDATES] : system check newest
version
(3) Click [DOWNLOAD AND INSTALL]
(4) TV is updating
(5) After finished the update, below Pop-up appear
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option
SOFTWARE UPDATE

- 11 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
OCP
1.5A
Audio 2 AMP
Main SOC
IF (+/-)
USB1 (3.0)
OPTIC
LAN
DDR3 2133 X 16
(512MB X 2EA)
HDMI1 (2.0)
HDMI2 (2.0)
HDMI3 (2.0)
SYSTEM EEPROM
(256Kb)
USB2 (2.0)
USB3 (2.0)
eMMC
(8GB)
Sub Micom
DDR3 2133 X 16
(512MB X 2EA)
P_TS
X_TAL
24MHz
I2S Out
H/P
AV
D-Demod : I2C 2
R
E
A
R
S
I
D
E
R
E
A
R
(H)
HP
AMP
SPDIF OUT
BLUTOOTH
IR / KEY/EYE
WIFI
SUB
ASSY
IR
KEY
Tuner : I2C 5
X_TAL
25MHz
I2C
CVBS/SIF
Tuner
COMP
(ARC)
X_TAL
32.768kHz
OCP
1.5A
OCP
1.5A
AV / Component Spec Out
HDMI4 (2.0)
BLOCK DIAGRAM
1. SOC

- 12 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
2. Tuner + CI
MAIN
SOC
AC29 [TP_DVB_CLK]
AC30 [TP_DVB_SOP]
AB30 [TP_DVB_VAL]
AN31 [DMD_ADC_INP]
AN32 [DMD_ADC_INN]
TUNER
[FE_DEMOD1_TS_ERROR_TU] 14
[FE_DEMOD1_1_TS_CLK] 15
[FE_DEMOD1_TS_SYNC] 16
[FE_DEMOD1_TS_VAL] 17
FE_DEMOD1_TS_DATA[0] 18
FE_DEMOD1_TS_DATA[1] 19
FE_DEMOD1_TS_DATA[2] 20
FE_DEMOD1_TS_DATA[3] 21
FE_DEMOD1_TS_DATA[4] 22
FE_DEMOD1_TS_DATA[5] 23
FE_DEMOD1_TS_DATA[6] 24
FE_DEMOD1_TS_DATA[7] 25
+1.2V_Demod_Core
[+3.3V_LNA_TU] 3
+3.3V_TUNER
[I2C_SCL5_TU] 1
[I2C_SDA5_TU] 2
[IF_AGC_TU] 5
[/TU_RESET1_TU] 10
FILTER
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_DATA [0-7]
IF_P
IF_N
IF_AGC
ADC_I_INP
ADC_I_INN
I2C_SCL5
I2C_SDA5 33 ȳ
/TU_RESET1
AH25[SCL5]
AH26[SDA5]
AK14 [GPIO26]
AL31[IF_AGC]
FE_DEMOD1_TS_ERROR
[+3.3V_TUNER] 11
[D_Demod_Core] 13
[IF_P] 7
[IF_N] 8
AB28 [TP_DVB_DATA0]
AC28 [TP_DVB_DATA1]
AD28 [TP_DVB_DATA2]
AD29 [TP_DVB_DATA3]
AE29 [TP_DVB_DATA4]
AE30 [TP_DVB_DATA5]
AF29 [TP_DVB_DATA6]
AF30 [TP_DVB_DATA7]
+3.3V_TUNER
1.2Kȳ
33 ȳ
TPO_DATA[0-7] CI_IN_TS_DATA[0-7]
CI Slot
100 ȳ
TPI_DATA [0-7] CI_TS_DATA[0-7]
/PCM_WE
/PCM_OE
/PCM_IRQA
/PCM_REG
PCM_INPACK
/PCM_WAIT
PCM_RESET
CI_TS_DATA[0-7]
CI_ADDR[0-14]
/PCM_IORD
/PCM_IOWR
/PCM_CE1.2
CI_TS_VAL
/CI_CD1,2
CI 5V
Power detect
PCM_5V_CTL +5V_CI_ON
CI_IN_TS_SYNC
CI_IN_TS_VAL
CI_IN_TS_CLK
[TPO_DATA[ 0~7] CI_IN_TS_DATA[0-7]
[TPI_DATA 0~7] CI_TS_DATA[0~7]
/CI_CD1,2
C23[CAM_CD1_N]
B23[CAM_CD2_N]
CI_TS_VALG28[TPI_VAL]
B25[CAM_CE1_N]
B26[CAM_CE2_N]
/PCM_CE1.2
10K ȳ
B29 [EB_BE_N1]
E28 [EB_EB_N0]
/PCM_IOWR
/PCM_IORD
[EB_ADDR_0~14]
[EB_DATA_0~7]
CI_ADDR[0-14]
CI_DAT[0-7]
A24[CAM_RESET]
C24[CAM_WAIT_N]
A25[CAM_REG_N]
B24[CAM_IREQ_N]
A32 [EB_OE_N]
D28 [EB_WE_N]
P30 [TPO_CLK]
P29 [TPO_VAL]
N29 [TPO_SOP]
CI_IN_TS_CLK
CI_IN_TS_VAL
CI_IN_TS_SYNC
PCM_RESET
/PCM_WAIT
PCM_INPACK
/PCM_REG
/PCM_IRQA
/PCM_OE
/PCM_WE
VCC
C25 [CAM_VCCEN_N]
+5V_CI_ON +3.3V_NORMAL
47K ȳ

- 13 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
3. Video & Audio IN/OUT
MAIN SOC
AM24 [CVBS_IN2]
AV_CVBS_IN
AV1
Phone JACK
Component 1
Phone JACK
AV1_CVBS_IN_SOC
AM20 [SOY1_IN]
AN20 [Y1_IN]
AL21 [PB1_IN]
AM22 [PR1_IN]
COMP2_Pb
COMP2_Y
COMP2_Pr
COMP2_SOG2_IN_SOC
COMP2_Y_IN_SOC
COMP2_Pb_IN_SOC
COMP2_Pr_IN_SOC
J
A
CK
A
V
A
A
1
A
CK
Jack Side SOC Side
SPDIF_OUT
SPDIF OUT
H/P JACK HP_LOUT_JACK
HP_ROUT_JACK
AM14 [IEC958OUT]
AL15 [AUDA_OUTL]
AM15 [AUDA_OUTR]
SPDIF_OUT_ARC
[PHY0_ARC_OUT]
COMP2/AV_L_IN
COMP2/AV_R_IN
AL18 [AUAD_L_CH2_IN
AM18 [AUAD_R_CH2_IN]
AUAD_L_CH2_IN
AUAD_R_CH2_IN
HP AMP
TPA6138
ARC OUT
(HDMI2)
Front Speaker
Woofer Speaker
MICOM
AMP_RESET
[SCK]
[LRCK]
[DACLRCH]
[I2C_SCL_0/SDA_0]
I2S
[GPIO23]
Audio
AMP
NTP7515
Audio
AMP
NTP7515
AMP_MUTE
(WOOFER_MUTE)
AV / Component Spec Out

- 14 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
4. HDMI 2.0
CEC_REMOTE
MICOM
Port_4
DDC_I2C_4
HDMI_HPD_4
HDCP1.4
HDCP2.2
HDMI 2
(2.0)_V
ARC
HDMI 1
(2.0)_V
CEC_REMOTE
Port_2
DDC_I2C_2
SPDIF_OUT_ARC
HDMI_HPD_2
CEC_REMOTE
Port_1
DDC_I2C_1
HDMI_HPD_1
HDMI2.0
LGE PHY
HDCP1.4
HDCP2.2
HDCP1.4
HDCP 2.2
HDMI2.0
LGE PHY
HDMI2.0
LGE PHY
+5V
+5V
+5V
HDMI 4
(2.0)_H
HDCP1.4
HDCP2.2
HDMI 3
(2.0)_V
CEC_REMOTE
Port_3
DDC_I2C_3
SPDIF_OUT_ARC
HDMI_HPD_3
HDMI2.0
LGE PHY
[HDMI2_3_HPD]
[HDMI2_3_SDA]
[HDMI2_3_SCL]
[HDMI2_2_HPD]
[HDMI2_2_SDA]
[HDMI2_2_SCL]
[HDMI2_1_HPD]
[HDMI2_1_SDA]
[HDMI2_1_SCL]
[HDMI2_0_HPD]
[HDMI2_0_SDA]
[HDMI2_0_SCL]
[PHY0_ARC_OUT]
+5V
MAIN SOC

- 15 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
5. USB / Wi-Fi / M-Remote / UART
IR + Wi-Fi /BT
Wafer 25P
[UART0_RXD/GPIO106]
USB3.0_1_TX_DP0 / DM0
USB3.0_1_RX_DP0 / DM0
USB3.0_1_DP0 / DM0
[USB3_0_TX0_P / M]
RS232 IC
WIFI_DP / DM
MICOM WOL/WIFI_POWER_ON
[USB2_2_DP0 / DM0]
SOC_RX/TX
[USB3_0_DP0 / DM0]
[USB3_0_RX0_P / M]
[USB2_1_DP0 / DM0] USB2.0_2_DP1 / DM1
USB2.0_3_DP0 / DM0
[USB2_0_DP0 / DM0]
[UART1_RXD / TXD] Debug Wafer
UART1_RX/TX
JK6200
RS232C phone Jack
SOC_RX/TX UART wafer
SOC_RX/TX
(*) US model only
USB 1
(3.0)_V
USB 2
(2.0)_H
USB 3
(2.0)_H
WIFI_EN
+3.5V_WIFI
OCP
[GPIO90] USB_CTL1
+5V_USB_1
OCP
[GPIO95] USB_CTL2
+5V_USB_2
OCP
[GPIO34] USB_CTL3
+5V_USB_3
[UART0_TXD/GPIO105]
MAIN SOC

- 16 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
6. I2C Map
+3.3V_NORMAL
ZUZr˟
NVRAM
ZUZr˟
+3.3V_NORMAL ZZ˟
+3.3V_NORMAL
ZUZr˟
AUDIO AMP 100 ˟
TUNER (Demod)
YU^r˟
+3.3V_TU ZZ˟
MAIN SOC
MICOM ZZ˟LNB
IR / KEY/EYE
XWW˟ZUZr˟
EYE_I2C_SDA
EYE_I2C_SCL
+3.5V_ST
33pF
18pF
Cap Ready
I2C_SCL4: AJ21[SCL4]
I2C_SDA4: AH21[SDA4]
I2C_SCL1: AK22[SCL1]
I2C_SDA1: AJ22[SDA1]
I2C_SCL3: AH24[SCL3]
I2C_SDA3: AJ24[SDA3]
I2C_SCL0: AK23[SCL0]
I2C_SDA0: AJ23[SDA0]
I2C_SCL2: AH23[SCL2]
I2C_SDA2: AH22[SDA2]
I2C_SCL5: AH25[SCL5]
I2C_SDA5: AH26[SDA5] Tuner
XUYr˟GOl|P
+3.3V_TU ZZ˟
47pF
+3.3V_NORMAL
ZUZr˟
PMIC (EPI)
WAFER (Vx1)
33 ˟
AUDIO AMP 100 ˟
33pF

- 17 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
120
811 812
125
710
900
LV1LV2
200
820
400
521
540
530
813
512
511
127
500
571
570
126
510 120L 501
128
502
120R
813
AR2 A10 700
130
200T
541
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

- 18 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
DISASSEMBLY GUIDE
FAB30016101 (M4*8mm, Black) 1EA
1. Disassemble Stand
2. Disassemble Power Cord Bracket
FAB30016103 (M4*12mm, Black) 4EA
(1) Remove the screws (4EA)
(2) Grasp the top&bottom side( ) and pull in the direction of arrow( )
(3) Separate the stand

- 19 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
FAB30016101 (M4*8mm, Black) 4EA
FAB30016103 (M4*12mm, Black) 4E
A
FAB32418704 (M3*5.5mm, Gray) 6EA
3. Disassemble Back Cover
4. Disassemble Speaker Box Assy
(1) Remove the screws (4EA)
(2) Grasp the left side of back cover and lift the back cover
(3) Separate the back cover
(1) Remove the screws (10EA)
(2) Separate the speaker box assy

- 20 - Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
FAB31639801(M4*10mm, Black) 4EA
FAB31639801(M4*10mm, Black) 1EA
2.
1. 3.
5. Disassemble Stand Supporter Bracket
6. Disassemble IR Bracket & Separate the Cable
(1) Remove the screws (4EA)
(2) Separate the stand supporter bracket
(1) Separate the cable
(2) Remove the screw (1EA)
(3) Separate the IR bracket
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