Murata SN2100 User manual

SN2100
Bluetooth Class 1 Module
User Manual
And Datasheet
Version: 1.1
June 25, 2013
Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.

SyChip/Murata Confidential Page 2 of 31 SN2100 Datasheet Ver. 1.1
Revision History
Revision Date Author Change Description
0.1 Jul-07-2011 Release the first datasheet.
0.5 Nov-15-2011 N. Nagayama Update the block diagram / BT IC product number
Update the SyChip Part Number
0.6 Jan-05-2012 Viet H. Update the spec table
0.61 Jan-31-2012 Y Fang Added disclaimer
0.62 Apr-10-2012 JAG Added packaging, labeling and regulatory information
0.63 May-22-2012 Viet H. Update the spec table
1.0 Aug-10-2012 Y Fang Added Software and Development Tool sections
1.1 Jun-25-2013 Y Fang Added Recommended host (customer) circuit board PCB
pattern

SyChip/Murata Confidential Page 3 of 31 SN2100 Datasheet Ver. 1.1
Table of Contents
1SYSTEM DESCRIPTIONS.....................................................................................................................................6
1.1APPLICATIONS........................................................................................................................................................6
1.2MODULE SUMMARY ...............................................................................................................................................6
1.3BLOCK DIAGRAM ...................................................................................................................................................7
2MECHANICAL SPECIFICATIONS.....................................................................................................................8
2.1MODULE DIMENSION..............................................................................................................................................8
2.2MODULE TOP AND SIDE VIEW .................................................................................................................................8
2.3MODULE BOTTOM VIEW..........................................................................................................................................9
2.4DETAILED MECHANICAL DATA (TOP VIEW)...........................................................................................................10
2.5MODULE PIN-OUT.................................................................................................................................................11
3DC ELECTRICAL SPECIFICATIONS..............................................................................................................13
3.1TYPICAL POWER CONSUMPTION...........................................................................................................................13
3.2DIGITAL IO SPECIFICATION..................................................................................................................................13
4RF SPECIFICATIONS..........................................................................................................................................14
4.1BLUETOOTH SPECIFICATION.................................................................................................................................14
4.2RF CHARACTERISTICS (TX).................................................................................................................................14
4.3RF CHARACTERISTICS (RX).................................................................................................................................16
5ENVIRONMENTAL SPECIFICATIONS...........................................................................................................17
5.1ABSOLUTE MAXIMUM RATINGS ............................................................................................................................17
5.2OPERATION CONDITIONS ......................................................................................................................................17
6APPLICATION INFORMATION........................................................................................................................18
6.1RECOMMENDED HOST (CUSTOMER)CIRCUIT BOARD PCB PATTERN .....................................................................18
6.2HOST PCB LAYOUT RECOMMENDATIONS .............................................................................................................18
6.3MODULE LOCATION .............................................................................................................................................19
6.3.1Location in x-y plane...............................................................................................................................19
6.3.2Location in z-plane..................................................................................................................................21
7SOFTWARE...........................................................................................................................................................22
7.1SOFTWARE ARCHITECTURE..................................................................................................................................22
7.2BLUETOOTH PROFILE STACKS..............................................................................................................................22
8DEVELOPMENT TOOLS....................................................................................................................................23
9ASSEMBLY INFORMATION .............................................................................................................................24
9.1LEAD-FREE SOLDERING REFLOW PROFILE.............................................................................................................24
10PACKAGING AND MARKING INFORMATION............................................................................................25
10.1CARRIER TAPE DIMENSIONS............................................................................................................................25
10.2MODULE MARKING INFORMATION ..................................................................................................................25
11ORDERING INFORMATION .............................................................................................................................26
12ROHS DECLARATION........................................................................................................................................26
13REGULATORY INFORMATION.......................................................................................................................26
13.1FCC NOTICE (USA) ........................................................................................................................................26
13.2FCC LABELING REQUIREMENTS......................................................................................................................27

SyChip/Murata Confidential Page 4 of 31 SN2100 Datasheet Ver. 1.1
13.3RF EXPOSURE..................................................................................................................................................27
13.4IC NOTICE (CANADA)......................................................................................................................................27
13.5IC LABELING REQUIREMENTS .........................................................................................................................28
13.6CE NOTICE (EUROPE)......................................................................................................................................28
13.7CE LABELING REQUIREMENTS ........................................................................................................................28
14TECHNICAL SUPPORT CONTACT .................................................................................................................29
15DISCLAIMER.........................................................................................................................................................29

SyChip/Murata Confidential Page 5 of 31 SN2100 Datasheet Ver. 1.1
LIST OF FIGURES
FIGURE 1SN2100 MODULE BLOCK DIAGRAM ..................................................................................................................7
FIGURE 2MODULE TOP AND SIDE VIEW ............................................................................................................................8
FIGURE 3MODULE BOTTOM VIEW .....................................................................................................................................9
FIGURE 4DETAILED MECHANICAL DATA (TOP VIEW).......................................................................................................10
FIGURE 5RECOMMENDED HOST (CUSTOMER)PCB PATTERN........................................................................................18
FIGURE 6RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE................................................19
FIGURE 7RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................20
FIGURE 8LOCATIONS NOT RECOMMENDED IN XY-PLANE ...............................................................................................20
FIGURE 9RECOMMENDED LOCATIONS IN Z-PLANE..........................................................................................................21
FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE .............................................................................................21
FIGURE 11 REFLOW PROFILE PATTERN ..........................................................................................................................24
FIGURE 12 CARRIER TAPE DIMENSIONS..........................................................................................................................25
FIGURE 13 MODULE MARKING DETAIL.............................................................................................................................25
LIST OF TABLES
TABLE 1MODULE CONNECTOR SIGNAL DESCRIPTION....................................................................................................11
TABLE 2TYPICAL POWER CONSUMPTION........................................................................................................................13
TABLE 3DIGITAL IO SPECIFICATION ................................................................................................................................13
TABLE 4RF SPECIFICATIONS...........................................................................................................................................14
TABLE 5RF SPECIFICATIONS...........................................................................................................................................16
TABLE 6ABSOLUTE MAXIMUM RATING ............................................................................................................................17
TABLE 7RECOMMENDED OPERATING CONDITIONS ........................................................................................................17
TABLE 8BLUETOOTH STACK AVAILABILITY .....................................................................................................................22
TABLE 9DEVELOPMENT TOOLS ........................................................................................................................................23
TABLE 10 REFLOW PROFILE RECOMMENDATION ...........................................................................................................24
TABLE 11 ORDERING INFORMATION.................................................................................................................................26

SyChip/Murata Confidential Page 6 of 31 SN2100 Datasheet Ver. 1.1
1 System Descriptions
1.1 Applications
SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on-
board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO
and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s
design. The SN2100 offers total 110 dB link budget, which is significantly better than most
of the Bluetooth® modules do in the market. This makes it a good fit for industrial control
application that usually requires longer distance coverage. The module offers extended
product life and industrial standard operating temperature range to fit the industrial usage.
The SN2100 offers standard HCI interface to the host CPU.
1.2 Module Summary
•Bluetooth V2.0
•Power Grade: Class 1
•Dimensions: 17.5mm x 16.0mm x 2.0 mm
•Supply voltage: 2.2V to 3.3V
•Antenna: on-module
•32kHz clock circuit : on-module
•Host Interface : UART/PCM
•RoHS compliant
•MSL JEDEC level 3
•FCC/IC certified; CE compliant

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1.3 Block Diagram
Figure 1 SN2100 Module Block Diagram

SyChip/Murata Confidential Page 8 of 31 SN2100 Datasheet Ver. 1.1
2 Mechanical Specifications
2.1 Module Dimension
Parameter Typical Unit
Dimension (LxWxH) 17.5 x 16.0 x 2.0 mm
Dimension tolerances (LxWxH) +/- 0.2 mm mm
2.2 Module top and side view
UNIT : mm
Figure 2 Module Top and Side View

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2.3 Module bottom view
Figure 3 Module Bottom View

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2.4 Detailed mechanical data (top view)
Figure 4 Detailed Mechanical Data (top view)

SyChip/Murata Confidential Page 11 of 31 SN2100 Datasheet Ver. 1.1
2.5 Module Pin-out
Table 1 Module Connector Signal Description
Pin # Pin name I/O Description
1 GND - Ground
2 VIN I Module Power Supply
3 Reserved O Internal for debugging use only
4 HCI_CTS I
HCI UART Clear-To-Send.
Module is allowed to send data when HCI_CTS is
low.
5 HCI_TX O HCI UART data transmit
6 HCI_RTS O HCI UART Request-To-Send
Host is allowed to send data when RTS is low.
7 HCI_RX I HCI UART data receive
8 nRESET I Shutdown input (Active Low)
9 GND - Ground
10 AUD_IN I PCM Data Input
11 AUD_OUT O PCM Data Output
12 AUD_CLK I/O PCM Clock
13 AUD_SYNC I/O PCM Frame Sync
14 GND - Ground
15 GND - Ground
16 GND - Ground
17 GND - Ground
18 GND - Ground
19 GND - Ground
20 GND - Ground
21 GND - Ground
22 GND - Ground
23 GND - Ground
24 GND - Ground
25 GND - Ground
26 Reserved - Internal use only
27 GND - Ground
28 GND - Ground

SyChip/Murata Confidential Page 12 of 31 SN2100 Datasheet Ver. 1.1
Pin # Pin name I/O Description
29 GND - Ground
30 GND - Ground
31 GND - Ground
32 GND - Ground

SyChip/Murata Confidential Page 13 of 31 SN2100 Datasheet Ver. 1.1
3 DC Electrical Specifications
3.1 Typical Power Consumption
Table 2 Typical Power Consumption
Item Condition Values Units
Min Typ Max
Standby mode (after
send script) VIN = 3.0V, TEMP = 25°C - 3.5 - mA
TX maximum current VIN = 3.0V, TEMP = 25°C - 165 - mA
RX maximum current VIN = 3.0V, TEMP = 25°C - 50 - mA
3.2 Digital IO Specification
VIN = 3.0V, TEMP = 25°C, unless otherwise stated
Table 3 Digital IO Specification
Item Condition Symbol Min Max UNIT
High Level Input Voltage VIH 0.65 x VDD VDD V
Low Level Input Voltage VIL 0 0.35 x VDD V
High Level Output Voltage At 2/4/8 mA VOH 0.8 x VDD VDD V
At 0.1 mA VDD – 0.2 VDD V
Low Level output Voltage At 2/4/8 mA VOL 0 0.2 x VDD V
At 0.1 mA 0 0.2 V
VDD : 1.8V

SyChip/Murata Confidential Page 14 of 31 SN2100 Datasheet Ver. 1.1
4 RF Specifications
4.1 Bluetooth Specification
Parameter Contents
Bluetooth Specification Ver.2.0
Channel Spacing 1 MHz
The number of channel 79
Power Class 1
4.2 RF Characteristics (TX)
VIN = 3.0V, TEMP = 25°C, at 50terminal load connected to the RF connector
Table 4 RF Specifications
Parameter Min Typ Max BT Spec Units
Output Power - 18 - 20
(1)
dBm
Operation Frequency range (RX/TX) 2402 - 2480 - MHz
-20 dB bandwidth - 0.928 - 1 MHz
Adjacent Channel Power
[M-N] = 2 - -40 - <-20 dBm
[M-N] >= 3 - -43 - <-40 dBm
Modulation Characteristics
Modulation delta f1 avg - 159 - 140< <175 kHz
Modulation delta f2 max - 136 - 115< kHz
Modulation delta f2 avg/delta f1 avg - 0.9 - 0.8< -
Initial Carrier Frequency Tolerance - -2 - -75< <75 kHz
Carrier Frequency Drift
1 slot -25 2 - -25< <25 kHz
3 slot -40 1 - -40< <40 kHz
5 slot -40 1 - -40< <40 kHz
Maximum drift rate -20 0.5 - -20< <20 kHz/50 us
Out of Band Spurious Emissions
30 – 1000 MHz (Operation Mode) - -50 - <-36 dBm
1000 – 12750 MHz (Operation Mode) - -52 - <-30 dBm
1800 – 1900 MHz (Operation Mode) - -54 - <-47 dBm
5150 – 5300 MHz (Operation Mode) - -54 - <-47 dBm

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(1) EIRP.

SyChip/Murata Confidential Page 16 of 31 SN2100 Datasheet Ver. 1.1
4.3 RF Characteristics (RX)
VIN = 3.0V, TEMP = 25°C, at 50terminal load connected to the RF connector
Table 5 RF Specifications
Parameter Min Typ Max BT Spec Units
Sensitivity (BER <= 0.1%) - -92 - < -70 dBm
C/I Performance (BER <= 0.1%)
Co-channel ratio (-60 dBm input) - 10 - < 11 dB
1MHz ratio (-60dBm input) - -7 - < 0 dB
2MHz ratio (-60dBm input) - -21 - < -30 dB
3MHz ratio (-67dBm input) - -44 - < -40 dB
Blocking Performance (BER <= 0.1%)
30MHz – 2000MHz -5 - - -10< dBm
2000MHz – 2400MHz -5 - - -27< dBm
2500MHz – 3000MHz -5 - - -27< dBm
3000MHz – 12750MHz -5 - - -10< dBm
Intermodulation Performance
(BER <= 0.1%, -64 dBm input) - -36 - -39< dBm
Maximum Input Level -4 - - -20< dBm

SyChip/Murata Confidential Page 17 of 31 SN2100 Datasheet Ver. 1.1
5 Environmental Specifications
5.1 Absolute maximum ratings
Table 6 Absolute Maximum Rating
Symbol Description Min Max Units
To
p
Operating temperature -40 85 °C
Tst Storage temperature -40 85 °C
VIN Power supply -0.3 5.0 V
MSL Moisture Sensitivity Level 3
RoHS Restriction of Hazardous Substances Compliant
5.2 Operation conditions
Table 7 Recommended Operating Conditions
Symbol Parameter Min Typ Max Units
VIN Power supply 2.2 3.0 3.3 V
To
p
Operating temperature -40 - 85 °C

SyChip/Murata Confidential Page 18 of 31 SN2100 Datasheet Ver. 1.1
6 Application Information
6.1 Recommended host (customer) circuit board PCB pattern
Figure 5 Recommended Host (customer) PCB Pattern
6.2 Host PCB layout recommendations
The SN3020 module has an onboard antenna therefore it requires some special host
PCB layout underneath the module such that the radio can achieve its best RF
performance. Refer to Figure 6 for the requirements.

SyChip/Murata Confidential Page 19 of 31 SN2100 Datasheet Ver. 1.1
Figure 6 Recommended Host Circuit Board Design underneath the Module
Notes:
1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of
the customer circuit board should be free of any metal objects. Specifically, there
should be no ground plane, traces, or metal shield case.
2. The area in ‘Zone2’ on the top layer of the customer circuit board should have
ground only with no signal traces.
6.3 Module Location
For optimum EIRP, customer is advised to use the recommended module location on
their respective PCB.
6.3.1Location in x-y plane
Zone 1
Zone 2

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Antenna Connector
Antenna
Shield Case
No GND in this area (See Fig.8)
Figure 7 Recommended Locations in xy-plane
Figure 8 Locations Not Recommended in xy-plane