Murata SN2100 User manual

SN2100
Bluetooth Class 1 Module
User Manual
And Datasheet
Version: 1.1
June 25, 2013
Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The
information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed
by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license
is generated under any rights of SyChip or its supporters unless specifically agreed.

SyChip/Murata Confidential Page 2 of 31 SN2100 Datasheet Ver. 1.1
Revision History
Revision Date Author Change Description
0.1 Jul-07-2011 Release the first datasheet.
0.5 Nov-15-2011 N. Nagayama Update the block diagram / BT IC product number
Update the SyChip Part Number
0.6 Jan-05-2012 Viet H. Update the spec table
0.61 Jan-31-2012 Y Fang Added disclaimer
0.62 Apr-10-2012 JAG Added packaging, labeling and regulatory information
0.63 May-22-2012 Viet H. Update the spec table
1.0 Aug-10-2012 Y Fang Added Software and Development Tool sections
1.1 Jun-25-2013 Y Fang Added Recommended host (customer) circuit board PCB
pattern

SyChip/Murata Confidential Page 3 of 31 SN2100 Datasheet Ver. 1.1
Table of Contents
1SYSTEM DESCRIPTIONS.....................................................................................................................................6
1.1APPLICATIONS........................................................................................................................................................6
1.2MODULE SUMMARY ...............................................................................................................................................6
1.3BLOCK DIAGRAM ...................................................................................................................................................7
2MECHANICAL SPECIFICATIONS.....................................................................................................................8
2.1MODULE DIMENSION..............................................................................................................................................8
2.2MODULE TOP AND SIDE VIEW .................................................................................................................................8
2.3MODULE BOTTOM VIEW..........................................................................................................................................9
2.4DETAILED MECHANICAL DATA (TOP VIEW)...........................................................................................................10
2.5MODULE PIN-OUT.................................................................................................................................................11
3DC ELECTRICAL SPECIFICATIONS..............................................................................................................13
3.1TYPICAL POWER CONSUMPTION...........................................................................................................................13
3.2DIGITAL IO SPECIFICATION..................................................................................................................................13
4RF SPECIFICATIONS..........................................................................................................................................14
4.1BLUETOOTH SPECIFICATION.................................................................................................................................14
4.2RF CHARACTERISTICS (TX).................................................................................................................................14
4.3RF CHARACTERISTICS (RX).................................................................................................................................16
5ENVIRONMENTAL SPECIFICATIONS...........................................................................................................17
5.1ABSOLUTE MAXIMUM RATINGS ............................................................................................................................17
5.2OPERATION CONDITIONS ......................................................................................................................................17
6APPLICATION INFORMATION........................................................................................................................18
6.1RECOMMENDED HOST (CUSTOMER)CIRCUIT BOARD PCB PATTERN .....................................................................18
6.2HOST PCB LAYOUT RECOMMENDATIONS .............................................................................................................18
6.3MODULE LOCATION .............................................................................................................................................19
6.3.1Location in x-y plane...............................................................................................................................19
6.3.2Location in z-plane..................................................................................................................................21
7SOFTWARE...........................................................................................................................................................22
7.1SOFTWARE ARCHITECTURE..................................................................................................................................22
7.2BLUETOOTH PROFILE STACKS..............................................................................................................................22
8DEVELOPMENT TOOLS....................................................................................................................................23
9ASSEMBLY INFORMATION .............................................................................................................................24
9.1LEAD-FREE SOLDERING REFLOW PROFILE.............................................................................................................24
10PACKAGING AND MARKING INFORMATION............................................................................................25
10.1CARRIER TAPE DIMENSIONS............................................................................................................................25
10.2MODULE MARKING INFORMATION ..................................................................................................................25
11ORDERING INFORMATION .............................................................................................................................26
12ROHS DECLARATION........................................................................................................................................26
13REGULATORY INFORMATION.......................................................................................................................26
13.1FCC NOTICE (USA) ........................................................................................................................................26
13.2FCC LABELING REQUIREMENTS......................................................................................................................27

SyChip/Murata Confidential Page 4 of 31 SN2100 Datasheet Ver. 1.1
13.3RF EXPOSURE..................................................................................................................................................27
13.4IC NOTICE (CANADA)......................................................................................................................................27
13.5IC LABELING REQUIREMENTS .........................................................................................................................28
13.6CE NOTICE (EUROPE)......................................................................................................................................28
13.7CE LABELING REQUIREMENTS ........................................................................................................................28
14TECHNICAL SUPPORT CONTACT .................................................................................................................29
15DISCLAIMER.........................................................................................................................................................29

SyChip/Murata Confidential Page 5 of 31 SN2100 Datasheet Ver. 1.1
LIST OF FIGURES
FIGURE 1SN2100 MODULE BLOCK DIAGRAM ..................................................................................................................7
FIGURE 2MODULE TOP AND SIDE VIEW ............................................................................................................................8
FIGURE 3MODULE BOTTOM VIEW .....................................................................................................................................9
FIGURE 4DETAILED MECHANICAL DATA (TOP VIEW).......................................................................................................10
FIGURE 5RECOMMENDED HOST (CUSTOMER)PCB PATTERN........................................................................................18
FIGURE 6RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE................................................19
FIGURE 7RECOMMENDED LOCATIONS IN XY-PLANE .......................................................................................................20
FIGURE 8LOCATIONS NOT RECOMMENDED IN XY-PLANE ...............................................................................................20
FIGURE 9RECOMMENDED LOCATIONS IN Z-PLANE..........................................................................................................21
FIGURE 10 LOCATIONS NOT RECOMMENDED IN XY-PLANE .............................................................................................21
FIGURE 11 REFLOW PROFILE PATTERN ..........................................................................................................................24
FIGURE 12 CARRIER TAPE DIMENSIONS..........................................................................................................................25
FIGURE 13 MODULE MARKING DETAIL.............................................................................................................................25
LIST OF TABLES
TABLE 1MODULE CONNECTOR SIGNAL DESCRIPTION....................................................................................................11
TABLE 2TYPICAL POWER CONSUMPTION........................................................................................................................13
TABLE 3DIGITAL IO SPECIFICATION ................................................................................................................................13
TABLE 4RF SPECIFICATIONS...........................................................................................................................................14
TABLE 5RF SPECIFICATIONS...........................................................................................................................................16
TABLE 6ABSOLUTE MAXIMUM RATING ............................................................................................................................17
TABLE 7RECOMMENDED OPERATING CONDITIONS ........................................................................................................17
TABLE 8BLUETOOTH STACK AVAILABILITY .....................................................................................................................22
TABLE 9DEVELOPMENT TOOLS ........................................................................................................................................23
TABLE 10 REFLOW PROFILE RECOMMENDATION ...........................................................................................................24
TABLE 11 ORDERING INFORMATION.................................................................................................................................26

SyChip/Murata Confidential Page 6 of 31 SN2100 Datasheet Ver. 1.1
1 System Descriptions
1.1 Applications
SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on-
board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO
and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s
design. The SN2100 offers total 110 dB link budget, which is significantly better than most
of the Bluetooth® modules do in the market. This makes it a good fit for industrial control
application that usually requires longer distance coverage. The module offers extended
product life and industrial standard operating temperature range to fit the industrial usage.
The SN2100 offers standard HCI interface to the host CPU.
1.2 Module Summary
•Bluetooth V2.0
•Power Grade: Class 1
•Dimensions: 17.5mm x 16.0mm x 2.0 mm
•Supply voltage: 2.2V to 3.3V
•Antenna: on-module
•32kHz clock circuit : on-module
•Host Interface : UART/PCM
•RoHS compliant
•MSL JEDEC level 3
•FCC/IC certified; CE compliant

SyChip/Murata Confidential Page 7 of 31 SN2100 Datasheet Ver. 1.1
1.3 Block Diagram
Figure 1 SN2100 Module Block Diagram

SyChip/Murata Confidential Page 8 of 31 SN2100 Datasheet Ver. 1.1
2 Mechanical Specifications
2.1 Module Dimension
Parameter Typical Unit
Dimension (LxWxH) 17.5 x 16.0 x 2.0 mm
Dimension tolerances (LxWxH) +/- 0.2 mm mm
2.2 Module top and side view
UNIT : mm
Figure 2 Module Top and Side View

SyChip/Murata Confidential Page 9 of 31 SN2100 Datasheet Ver. 1.1
2.3 Module bottom view
Figure 3 Module Bottom View

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2.4 Detailed mechanical data (top view)
Figure 4 Detailed Mechanical Data (top view)