Panasonic CT-27SL13MUG User manual

MTNC030943A1
B05
Color Television
CT-27SL13MG / CT-27SL13MUG / CT-27SL33MG / CT-
27SL33MUG
NA10
Thissimplified service manual isissued to add listed modelsto the
simplified service manual order No. MTNC030733A1(CT-27SL33G).
Modelsincluded inthissimplified service manual are identical to the
versions included on simplified service manualorder No.
MTNC030733A1(CT-27SL33G)except for the differences included in
thissimplied service manual. Adifference parts list and unique
schematics to these modelsare included inthissimplified service
manual. Please fileand use thissimplifiedservice manual together
with the simplified service manual order No. MTNC030733A1(CT-
27SL33G).
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Copyright 2003 Matsushita ElectricCorporation of America. All
rights reserved. Unauthorized copying and distribution isa
violation of law.
1. Safety precautions
General guidelines
Anisolation transformershouldalways be usedduring the servicing of a receiverwhose
chassis is not isolatedfromAC powerline. Use a transformerof adequate powerrating as this
protects the technicianfromaccidents resulting inpersonal injuryfromelectrical shocks. It will
alsoprotect the receiverfrombeing damagedbyaccidental shorting that mayoccurduring
servicing.
Whenservicing, observe the original leaddress, especiallyinthe high voltage circuit. Replace
all damagedparts (alsoparts that showsigns of overheating.)
Always replace protective devices, suchas fishpaper, isolation resistors and capacitors, and
shields afterservicing the receiver. Use onlymanufacturer’s recommendedrating forfuses,
circuits breakers, etc.
High potentials are present whenthis receiveris operating. Operation of the receiverwithout
the rearcoverintroduces dangerforelectrical shock. Servicing shouldnot be performedby
anyone who is not thoroughlyfamiliarwiththe necessaryprecautionswhenservicing high
voltage equipment.
Extreme care shouldbe practicedwhenhandling the picture tube. Rough handling maycause it
toimplode due toatmospheric pressure. (14.7 lbs persq. in.). Donot nick orscratchthe glass
orsubject it toanyundue pressure. Whenhandling, usesafetygoggles and heavygloves for
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protection. Discharge the picture tube byshorting the anode tochassis ground (not tothe
cabinet ortoothermounting hardware). Whendischarging connect coldground (i.e. dag
ground lead) tothe anode witha wellinsulatedwire oruse a grounding probe.Avoidprolonged
exposure at close range tounshieldedareas of the picture tube toprevent exposure tox ray
radiation.
The test picture tube usedforservicing the chassis at the benchshouldincorporate safety
glass and magnetic shielding. The safetyglass provide shielding forthe tube viewing area
against x rayradiation as well as implosion. The magnetic shieldlimits the x rayradiation
around the bell of the picture tube inaddition tothe restricting magnetic effects. Whenusing a
picture tube test jigforservice, ensure that the jigis capable of handling 50kV without causing
x rayradiation.
Before returning a servicedreceivertothe owner, the service technicianmust thoroughlytest
the unit toensure that is completelysafe tooperate. Donot use a line isolation transformer
whentesting.
Leakage current coldcheck
Unplug the A.C. cordand connect a jumperbetweenthe twoplug prongs.Measure the
resistance betweenthe jumperedAC plug and expose metallic parts suchas screwheads,
antenna terminals, control shafts, etc. If the exposedmetallic part has a returnpathtothe
chassis, the reading shouldbe between240k and 5.2M . If the exposedmetallic part does
not have a returnpathtothe chassis, the reading shouldbe infinite.
Leakage current hot check
Plug the AC corddirectlyintothe AC outlet. Donot use anisolation transformerduring the
check.
Connect a 1.5k 10 watt resistorinparallel witha 0.15 Fcapacitorbetweenanexposed
metallic part and ground. Use earthground, forexample a waterpipe.
Using a DVM witha 1000 ohms/volt sensitivityorhigher, measure the AC potential across the
resistor.
Repeat the procedure and measure the voltage present withall otherexposedmetallic parts.
Verifythat anypotential does not exceed0.75 volt RMS. A leakage current tester(sucha
Simpson model 229, Sencore model PR57 orequivalent) maybe usedinthe above procedure, in
whichcase anycurrent measure must not exceed0.5 milliamp. Ifanymeasurement is out of the
specifiedlimits, there is a possibilityof a shock hazardand the receivermust be repairedand
recheckedbefore it is returnedtothe customer.
Hot check circuit
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Insulation test
Connect aninsulation testerbetweenanexposedmetallic part and A.C. line. Apply1080VAC/
60Hz for1 second. Confirm that the current measurement is 0.5mA ~ 2.0mA. Repeat test with
othermetallic exposedparts.
X rayradiation
WARNING
The potential source of x rayradiation inthe TV set is inthe high voltage section and the picture
tube.
NOTE
It is important touse anaccurate, calibratedhigh voltage meter.
Set the brightness, picture, sharpness and colorcontrols tominimum.
Measure the high voltage. The high voltage shouldbe 30.55 ± 1.25kV. If the upperlimit is out of
tolerance, immediate service and correction is requiredtoinsure safe operation and toprevent
the possibilityof premature component failure.
Horizontal oscillatordisable circuit test
This test must be performedas a final check before the receiveris returnedtothe customer.
See horizontal oscillatordisable circuit procedure check inthis manual.
2. Service notes
NOTE
These components are affixedwithglue. Be careful not tobreak ordamage anyfoil underthe
component orat the pins of the ICs whenremoving. Usuallyapplying heat tothe component for
a short time while twisting withtweezers will break the component loose.
Leadless chipcomponent (surface mount)
Chipcomponents must be replacedwithidentical chips due tocritical foil track spacing. There
are no holes inthe boardtomount standardtransistors ordiodes. Some chips capacitoror
resistorboardsolderpads mayhave holes through the board,howeverthe hole diameterlimits
standardresistorreplacement to1/8 watt. Standardcapacitormayalsobe limitedforthe same
reason. It is recommendedthat identical components be used.
Chipresistorhave a three digit numerical resistance code, 1st and 2nd significant digits and a
multiplier. Example: 162 = 1600 or1.6k resistor, 0 = 0 (jumper).
Chipcapacitors generallydo not have the value indicatedon the capacitor. The colorof the
component indicates the general range of the capacitance.
Chiptransistors are identifiedbya twolettercode. The first letterindicates the type and the
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second letter, the grade of transistor.
Chipdiodes have a twoletteridentification code as perthe code chart and are a dual diode pack
witheithercommon anode orcommon cathode. Check the parts list forcorrect diode number.
Component removal
1. Use solder wick to remove solder from component end caps or
terminal.
2. Without pulling up, carefullytwist the component with tweezers to
break the adhesive.
3. Donot reuse removed leadless or chipcomponents since they
are subject to stress fracture during removal.
Chipcomponent installation
1. Put asmall amount of solder on the board soldering pads.
2. Holdthe chipcomponent against the soldering pads with
tweezers or with aminiature alligator clipand applyheat to the
pad area with a30 watt iron until solder flows. Donot applyheat
for more than 3seconds.
Howtoreplace flat IC (requiredtools)
1. Remove the solder from all of the pins of aFlat ICbyusing a
desolder braid
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2. Put the iron wire under the pins of the Flat ICand pull itinthe
direction indicated whileheating the pins using asoldering iron.
Asmall awl can be used instead of the iron wire.
3. Remove the solder from all the pads of the Flat ICbyusing ade
solder braid
4. Position the new Flat ICinplace (applythe pins of the Flat ICto
the soldering pads where the pins need to be soldered). Properly
determine the positions of the soldering pads and pins by
correctlyaligning the polaritysymbol
5. Solder all pins to the soldering pads using afine tipped soldering
iron
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6. Check with amagnifier for solder bridge between the pins or for
dryjoint between pins and soldering pads. To remove asolder
bridge, use ade solder braidas showninthe figure below
IMPORTANT
To protect against possible damage tothe solidstate devices due toarching orstatic discharge,
make certainthat all ground wires and CRTDAG wire are securelyconnected.
CAUTION
The power supplycircuitisabove earth ground and the chassis
cannot be polarized. Use an isolation transformer when servicing
the receiver to avoiddamage to the test equipment or to the
chassis. Connect the test equipment to the proper ground(hot) or
(cold) when servicing, or incorrect voltages will be measured.
2.1. X-RayProtection CircuitCheck &Adjustments
This test must be performedas final check before the receiveris returnedtothe customer. If
voltages are out of tolerance, immediate service and correction is requiredtoinsure safe
operation and toprevent the possibilityof premature componentfailure.
Equipment:
1. Isolation transformer.
2. High voltage meter.
3. D.C. Ammeter
4. Short jumper.
5. HHSjig(See figure below).
Diode Connection Jumper.
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Preparation:
1. Make sure the receiver isturned off.
2. Connect the receiver to an isolation transformer.
3. Connect the ammeter serial from the flyback anode lead to the
picture tube anode socket.
4. Prepare short jumper and HHSjig.
Procedure:
1. Connect the short jumper between TPD16 &TPD17.
2. Connect the jumper diode between TPD14 and TPD15 (anode
connected to TPD15 and cathode to TPD14).
3. Apply75VAC to AC input of isolation transformer.
4. Turn the receiver on.
5. Applyamonoscope pattern.
6. Set customer picture and brightness controlsto the minimum.
7. Set current within50 Ato 100 Abychanging the picture and
bright controls.
8. Slowlyincrease AC voltage at the input of the isolation
transformer and confirm HHSvoltage measure 34.5kV.
9. Turn power off and remove jigs.
3. EEPROM replacement
If a newEEPROM integratedcircuit is replacedforservicing, followthe next procedure once
that the memoryis properlyassembled:
1. Enter to service mode.
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2. Turn the TV set ON.
3. Once inside service mode the first image that appears on-screen
isthe ID1register with the respective address value (FF) like the
image below.
Note:
All 3registers (ID1,ID2,ID3) shouldappear with FF values ifanew
EEPROMisassembled.
4. With “VOL” keysadjust the correct value according with the
service adjustment table(see “Service Mode” section).
5. Change to the next IDswitch register with “CH”keysand repeat
the same procedure as step 4.
6. When replacing anew EEPROMbe sure to set the correct ID
switch values for each model.
7. Once that all 3registers are set with the correct address value,
perform all of the remaining adjustments and servicing.
IMPORTANT:
Correct IDswitch configuration shouldbe input when replacing
EEPROMfor each television model, otherwise ifwrong values are
configured, the television software will not function accordingly
and properly.
4. About lead free solder (PbF)
NOTE
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Leadis listedas (Pb) inthe periodic table of elements. / Inthe information below, Pbwill referto
leadsolder, and PbF will refertoLeadFree Solder. / The leadfree solderusedinour
manufacturing process and discussedbelowis (Sn+Ag+Cu). / Thatis Tin(Sn), Silver(Ag) and
Copper(Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
For/ service and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe / used. / PCBs manufacturedusing leadfree solderwill have the “PbF” ora leaf symbol
stampedon the / back of PCB.
CAUTION
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 °F (30 ~ 40 °C)higher. Please
use ahigh temperature soldering iron and set itto 700 ± 20 °F (370
± 10 °C).
-Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C). / Ifyou must use Pb solder, please completely
remove all of the Pb free solder on the pins or solder area before
applying Pb solder. Ifthisisnot practical, be sure to heat the Pb
free solder until itmelts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side.
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
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canalsobeused.
5. Receiver feature table
FEATURE/MODEL CT-27SL13MG/MUG CT-27SL33MG/MUG
CHASSIS AP415 BP415
MICRO 128K
MENU LANGUAGE ENG/SPAN/FR
CLOSED CAPTION X
V-CHIP (USA/CANADA) X
CHANNELCOUNT 181
PIP (1T), 2TPIP (2T), 2TSPLIT not available 2T
CHANNELINFO BANNER X
VIDEO INPUTSKIP SKIP
75 OHM INPUT X
REMOTE CONTROL EUR7613Z60 EUR7713Z70
CRTSUPPLIER MDDA (FLAT)
FAMILY NA10
COMB FILTER 3 DIG
HEC/VEC (X=BOTH) X
VM X
V/A NORM (X=BOTH) V
COLOR TEMP X
PRESET/INPUTLABELING X
VIDEO INPUTPICTURE
MEMORY X
MTS/SAP/DBX X
BUILT-IN AUDIO POWER 5Wx2
No. OFSPEAKERS 2
BASS/BAL/TREBLE CONTROL X
AI SOUND X
SURROUND X
SPATIALIZER/BBE BBE
A/V IN (REAR/FRONT) 3(2/1)
AUDIO OUT(FAO: F, VAO: V) F, V
COMPONENTINPUT(Y, Pb, Pr) 1
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FEATURE/MODEL CT-27SL13MG/MUG CT-27SL33MG/MUG
S-VIDEO INPUT(REAR/FRONT) 1/0
EPJ/HPJ/MISC HPJ
DIMENSIONS(WxDxH) 754.3x534.3x601.6mm29.69x21.03x23.68in665.2x544.5x594.8mm26.18x21.43x23.41in
WEIGHT(Kg/Lbs) 35.4/78.04 34.5/76.05
Note:
Specifications are subject tochange without notice orobligation. Dimensions and weights are
approximate.
6. Board description table
CT-27SL13MG / CT-27SL13MUG
BOARD PARTNUMBER DESCRIPTION
ATNP2AH047MA MAIN BOARD
CTNP2AA157AA CRTBOARD
CT-27SL33MG / CT-27SL33MUG
BOARD PARTNUMBER DESCRIPTION
ATNP2AH047MB MAIN BOARD
CTNP2AA157AA CRTBOARD
YTNP2AA123 PIP BOARD
NOTE
Whenordering a replacement boardassembly, append an“S” tothe boardnumber
EXAMPLE
To orderthe A Board, forCT-27SL13MG the replacement boardis TNP2AH047MAS.
7. Reference for PDF colors
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8. Schematics
8.1. English schematicnotes
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8.2. Notas de esquem áticos en espa ol
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8.3. A-Board schematicTNP2AH047MA(1 of 4)
8.4. A-Board schematicTNP2AH047MA(2 of 4)
8.5. A-Board schematicTNP2AH047MA(3 of 4)
8.6. A-Board schematicTNP2AH047MA(4 of 4)
8.7. A-Board schematicTNP2AH047MB(1 of 4)
8.8. A-Board schematicTNP2AH047MB(2 of 4)
8.9. A-Board schematicTNP2AH047MB(3 of 4)
8.10. A-Board schematicTNP2AH047MB(4 of 4)
8.11. C-Board schematicTNP2AA157AA (1 of 2)
8.12. C-Board schematicTNP2AA157AA (2 of 2)
9. Parts list
9.1. Parts list notes
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9.2. Difference parts list
Ref. No. PartNo. PartName& Description Remarks
CAPACITORS
C565 ECKW3D221JBR CAPC 220PF-J-2KVDC
C568 ECQM4333JZW CAPP.039UF-J-400V
C563 ECWH20822JVB CAPP8200PF-2KV
INTEGRATED CIRCUITS
IC002 TVR2AJ179S ADJUSTED EEPROM/ CT-27SL13MG/UMG, CT-27SL33MG/UMG
COILS
L801 ELF21V018A COIL
L551 ELH5L7138 COIL
RESISTORS
R547 ERQ1CJP1R2S RES F 1.2-J-1W
OTHERS
M001 M68LZP195X CRT27” / CT-27SL13MG/UMG, CT-27SL33MG/UMG
DY TLY2AA033 DEFLECTION YOKE/ CT-27SL13MG/UMG, CT-27SL33MG/UMG
Note:
Use this difference parts list togetherwithparts list includedinsimplifiedservice manual order
No. MTNC030733A1 (CT-27SL33G).
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1 234 56 7 8
A
B
C
D
E
F
G
H
I
J
A-BOARD 3/4 TNP2AH047MA CT-27SL13MG, CT-27SL13MUG

1 234 56 7 8
A
B
C
D
E
F
G
H
I
J
A-BOARD 3/4 TNP2AH047MB CT-27SL33MG, CT-27SL33MUG