Rigaku MFM65S2RFFFLFL User manual

Metal Film Monitor
MFM65
(Model: MFM65S2RFFFLFL)
Instruction Manual
1. Operation Section
Manual No. ME12058B02
Rigaku Corporation

Thank you for your purchase of Rigaku’s product.
This manual describes the correct use of the product as well the usage precautions to be observed.
To obtain full, expected performance from the product, thoroughly read this manual.
Also, store this manual at an easily accessible place so that you can promptly refer to it whenever
necessary.
If you have any questions, problems, or emergencies, please contact the personnel in charge of
Service at Rigaku at one of the addresses below.
USA
Rigaku Americas Corporation
9009 New Trails Drive
The Woodlands, TX 77381
USA
Tel : [phone]
Fax: [phone]
URL:http://www.Rigaku.com
JAPAN
Rigaku Corporation
Semiconductor Instruments Division
3-9-12 Matsubara-cho,
Akishima-shi,
Tokyo 196-8666, JAPAN
Tel : [phone]
Fax: [phone]
URL:http://www.rigaku.co.jp
NOTICE
1. This manual may not be disclosed to a third party or copied, in whole or in part, without the
written consent of Rigaku.
2. As a rule, one set of the instruction manual has to be purchased for each product.
3. If there are any missing or incorrectly collated pages in the delivered instruction manual,
contact the nearest Rigaku branch office or sales office for a replacement manual.
4. In no event will Rigaku be responsible for the results of the use of this manual.
5. The contents of this manual are subject to change without prior notice.

ME12058B−i
Operation Section
Safety Notes
Potentially Dangerous Parts within the MFM65 system components.
Warning labels have been affixed on or near potentially dangerous parts. They are expressed with
universal safety pictographs as described in the next paragraph. A summary label containing the main
hazards from these potentially dangerous parts appears on the front panel of this instrument. Warning
labels concerning prevention of exposure to X-rays, high voltage or other hazards use the signal word
“WARNING” or “CAUTION”. The use of Warning does not imply there is a hazard during ordinary
measurements, but a potential danger may arise due to carelessness or mishandling during maintenance
work or the like.
(1) Classification of Warning Indication. The degree of possible danger or damage in the case of
mishandling and the urgency of warning are classified into the following levels:
a) DANGER
In the case of carelessness or mishandling, an operator may immediately be killed or suffer a serious
injury to cause later death.
This indication is used very limitedly, and it must be strictly observed.
b) WARNING
In the case of mishandling, an operator may be killed or suffer a serious injury. It is also used to
denote an action that could cause serious damage to system components of the MFM65.
c) CAUTION
In the case of mishandling, an operator may suffer a slight or medium injury or material damage
alone is expected. The serious injury mentioned above means loss of eyesight, an injury, a burn
(high temperature or low temperature), an electric shock, a fracture, poisoning or the like which
involves an aftereffect, hospitalization or going to hospital for a long-term for medical treatment.
The slight injury means an injury, a burn, an electric shock or the like which does not involve
hospitalization or going to hospital for a long-term for medical treatment. Material damage means
damage to related facilities or acquired data.
(2) Pictographs for Warning Indication. Pictographs prepared according to ISO and ANSI guidelines are
attached. For details, see the list of warning labels. When a warning label is damaged, please contact
Rigaku to obtain a replacement label.
NOTE : Please read the SAFETY chapter in this manual before operating the MFM65 system.

ME12058B−ii
Operation Section
Contents
1. OVERVIEW ..............................................................................................................................................1
2. SAFETY .....................................................................................................................................................2
2.1 Hazards and Risks..............................................................................................................................2
2.2 Hazard Indications .............................................................................................................................4
2.3 Interlock List......................................................................................................................................8
2.4 Lock-out / Tag-out...........................................................................................................................10
2.5 EMO ................................................................................................................................................11
2.6 Maintenance Keys............................................................................................................................12
3. CONFIGURATION ................................................................................................................................13
3.1 MFM65 External Figure ..................................................................................................................13
3.2 MFM65 Configuration Block Diagram ...........................................................................................16
3.3 Functions..........................................................................................................................................17
3.4 Software Configuration....................................................................................................................18
3.5 Hardware Specifications ..................................................................................................................19
3.6 Explanation of Software ..................................................................................................................21
4. START UP ...............................................................................................................................................22
4.1 Preparation of the Water Chiller......................................................................................................22
4.2 Power on the Equipment..................................................................................................................23
4.3 Start Up the Control Software .........................................................................................................24
4.4 Equipment Initialization and Aging.................................................................................................26
4.5 Equipment Diagnosis.......................................................................................................................28
5. SHUTDOWN ...........................................................................................................................................29
5.1 Unload Sample.................................................................................................................................29
5.2 Deactivate the Equipment................................................................................................................30
5.3 Sample Unloading in the Event of Emergency................................................................................33
6. DAILY CHECKS ....................................................................................................................................35
6.1 Initialization.....................................................................................................................................35
6.2 Beam Diagnosis ...............................................................................................................................37
6.3 Analysis of the Check Sample .........................................................................................................38
7. DAILY ANALYSIS.................................................................................................................................39
7.1 Confirm the Wafer Size ...................................................................................................................39
7.2 Set the Wafer Cassette .....................................................................................................................40
7.3 Set theCreate Jobs List.....................................................................................................................41
7.4 Start Measurement ...........................................................................................................................43
7.5 End Analysis....................................................................................................................................43
7.6 Unload the Cassette .........................................................................................................................43
8. ROUTINE CHECKUP LIST..................................................................................................................44
9. TROUBLE SHOOTING.........................................................................................................................45
9.1 Electric Power..................................................................................................................................45
9.2 Startup..............................................................................................................................................46
9.3 Beam Diagnosis ...............................................................................................................................48
9.4 Loadport...........................................................................................................................................49
9.5 Wafer Transfer.................................................................................................................................50
9.6 Sample Alignment ...........................................................................................................................51
9.7 XRR/XRD Measurement .................................................................................................................52
9.8 XRF Measurement...........................................................................................................................53

ME12058B−iii
Operation Section
9.9 X-ray Trouble ..................................................................................................................................54
APPENDIX 1 ..................................................................................................................................................55
A1.1 Explanation of XRR (X-ray reflectometry method) .....................................................................55
A1.2 Analysis/Measurement Flow.........................................................................................................58
APPENDIX 2 ..................................................................................................................................................60
A2.1 Training for Using Equipment ......................................................................................................60
APPENDIX 3 ..................................................................................................................................................61
A3.1 Power Circuit Diagram .................................................................................................................61
APPENDIX 4 ..................................................................................................................................................63
A4.1 List of Material Safety Database Sheet (MSDS) ..........................................................................63
A4.2 MSDS of Beryllium ......................................................................................................................64
A4.3 MSDS of Lead ..............................................................................................................................75
A4.4 MSDS of Lithium .........................................................................................................................76
A4.5 MSDS of Mercury.........................................................................................................................79
A4.6 MSDS of Mechanical Lubricating Grease ....................................................................................85
A4.7 MSDS of Ethanol..........................................................................................................................92
First Edition: December 20, 2005
Second Edition: March 5, 2008

−1 −
ME12058B
Operation Section
1. OVERVIEW
This manual is described the operation of MFM65 system (RFBFLFL Model).
This equipment can measure the thickness, density, and roughness of the surface and boundary of thin
films deposited on a wafer (max. of 12 inches (300 mm), or 8 inches).
This is a complex equipment that can estimate a crystalline by the X-ray diffraction (XRD), and the
compositions of multi-layer films by the X-ray fluorescence (XRF), in addition to measuring film
thickness by the X-ray reflectometry (XRR).
This equipment can be used in clean rooms, and meets a wide array of needs ranging from condition
estimation for semiconductor films (R&D) to process monitoring.
NOTE : In the case of modifying the MFM65 system without consulting RIGAKU, the system
may not satisfy the specifications of this system, and RIGAKU does not warrant the
system.
RIGAKU may change the specifications of the MFM65 system and the contents of the
printed materials including the manual without notice in the future.

−2 −
ME12058B
Operation Section
2. SAFETY
Please read the following safety information before operating the MFM65 system.
2.1 Hazards and Risks
The MFM65 system has potentially hazards and risks as follows.
WARNING Don’t use the maintenance keys in the daily operation, because these keys must
be used for the purpose of maintenance only.
These keys must be in safekeeping strictly with the maintenance manager of this
system.
(1) X-ray Hazards
NOTE:
The red lamps turn on during X-ray generation. The MFM65 system has no risk of
X-ray exposure during normal operation, because this system has a shielded radiation
enclosure and interlocks to prevent X-ray exposure. (Refer to “2.3 Interlock List”.)
Pay attention to the warning labels affixed on the enclosure of this system.
The border of the radiation-controlled area is defined at the outside surface of the enclosure. The dose
equivalent limit at the border of the radiation-controlled area is 1.3 mSv / 3 months by Publication 60
issued by the International Commission on Radiological Protection (ICRP). The dose equivalent limit
on the MFM65 is designed to be 2 micro Sv/H, that is based on Rigaku’s design standards. (1.3 mSv /
13 weeks / 6 days / 8 hours = 2 micro Sv/H)
NOTE: In fact, the dose of X-ray radiation outside the enclosure is almost zero.
(2) Electrical Hazards
NOTE : The MFM65 system has no electric hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(3) Laser Hazards
NOTE : The MFM65 system has no laser hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.

−3 −
ME12058B
Operation Section
(4) Mechanical Hazards
WARNING When squatting down to work, example for turning on the PC, take due care to
avoid injury from hitting your head against the mechanical projections.
Pay attention to the warning labels to be affixed on the enclosure of this
system.
NOTE : The MFM65 system has no mechanical hazard to catch your finger in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(5) Material Hazards
NOTE : The MFM65 system has no material hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(6) Fire Hazards
WARNING Plastics and electric cables used in the MFM65 are class V0 or V1.
If smoke occurs from the equipment, push an EMO Switch.
(7) Hot Surface Hazards
NOTE : The MFM65 system has no hot surface hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(8) Trip Hazards
NOTE : The MFM65 system has no trip hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.

−4 −
ME12058B
Operation Section
2.2 Hazard Indications
(1) Labels for hazard indications
The MFM65 system has the following labels for hazard indications.
4 Electric Hazard
Can shock, burn or cause
death.
Turn power off before
removing the cover.
HAZARDOUS
VOLTAGE INSIDE
SF002-10E
10E
5 Mechanical Hazard
PHYSICAL HAZARD
May result in severe
injury.
Watch your head.
SF007-10E
10E
1 X-ray Hazard
X-ray Hazard
Exposure to harmful
overriding safety interlock.
Please observe appropriate
safety guidelines.
Access should be limited
to authorized personnel
only.
radiation possible by
2 X-ray Hazard
harmful or fatal.
X-ray Hazard
This radiation can be
Please observe appropriate
radiation safety.
3 Mechanical Hazard
Mechanical Hazard
Moving parts insidemay
cause serious injury.
Access should be limited
tto authorized personnel
only.
6 Material Hazard
Material Hazard
(Beryllium)
Skin contact may be
hazardous to your health.
Wear safety gloves.
Fig. 2-2-1 Hazard Labels 1

−5 −
ME12058B
Operation Section
8 Hot Hazard
HOT SURFACE
INSIDE
Contact may result in
severe burns.
Open only after safe
temperature is reached.
SF016-2C
Fig. 2-2-2 Hazard Labels 2
7 Material Hazard
Material Hazard
(Mercury)
Skin contact may be
hazardous to your health.
Wear safety gloves.
9 Caution