Rigaku MFM65S2RFFFLFL User manual

Metal Film Monitor
MFM65
(Model: MFM65S2RFFFLFL)
Instruction Manual
1. Operation Section
Manual No. ME12058B02
Rigaku Corporation

Thank you for your purchase of Rigaku’s product.
This manual describes the correct use of the product as well the usage precautions to be observed.
To obtain full, expected performance from the product, thoroughly read this manual.
Also, store this manual at an easily accessible place so that you can promptly refer to it whenever
necessary.
If you have any questions, problems, or emergencies, please contact the personnel in charge of
Service at Rigaku at one of the addresses below.
USA
Rigaku Americas Corporation
9009 New Trails Drive
The Woodlands, TX 77381
USA
Tel : [phone]
Fax: [phone]
URL:http://www.Rigaku.com
JAPAN
Rigaku Corporation
Semiconductor Instruments Division
3-9-12 Matsubara-cho,
Akishima-shi,
Tokyo 196-8666, JAPAN
Tel : [phone]
Fax: [phone]
URL:http://www.rigaku.co.jp
NOTICE
1. This manual may not be disclosed to a third party or copied, in whole or in part, without the
written consent of Rigaku.
2. As a rule, one set of the instruction manual has to be purchased for each product.
3. If there are any missing or incorrectly collated pages in the delivered instruction manual,
contact the nearest Rigaku branch office or sales office for a replacement manual.
4. In no event will Rigaku be responsible for the results of the use of this manual.
5. The contents of this manual are subject to change without prior notice.

ME12058B−i
Operation Section
Safety Notes
Potentially Dangerous Parts within the MFM65 system components.
Warning labels have been affixed on or near potentially dangerous parts. They are expressed with
universal safety pictographs as described in the next paragraph. A summary label containing the main
hazards from these potentially dangerous parts appears on the front panel of this instrument. Warning
labels concerning prevention of exposure to X-rays, high voltage or other hazards use the signal word
“WARNING” or “CAUTION”. The use of Warning does not imply there is a hazard during ordinary
measurements, but a potential danger may arise due to carelessness or mishandling during maintenance
work or the like.
(1) Classification of Warning Indication. The degree of possible danger or damage in the case of
mishandling and the urgency of warning are classified into the following levels:
a) DANGER
In the case of carelessness or mishandling, an operator may immediately be killed or suffer a serious
injury to cause later death.
This indication is used very limitedly, and it must be strictly observed.
b) WARNING
In the case of mishandling, an operator may be killed or suffer a serious injury. It is also used to
denote an action that could cause serious damage to system components of the MFM65.
c) CAUTION
In the case of mishandling, an operator may suffer a slight or medium injury or material damage
alone is expected. The serious injury mentioned above means loss of eyesight, an injury, a burn
(high temperature or low temperature), an electric shock, a fracture, poisoning or the like which
involves an aftereffect, hospitalization or going to hospital for a long-term for medical treatment.
The slight injury means an injury, a burn, an electric shock or the like which does not involve
hospitalization or going to hospital for a long-term for medical treatment. Material damage means
damage to related facilities or acquired data.
(2) Pictographs for Warning Indication. Pictographs prepared according to ISO and ANSI guidelines are
attached. For details, see the list of warning labels. When a warning label is damaged, please contact
Rigaku to obtain a replacement label.
NOTE : Please read the SAFETY chapter in this manual before operating the MFM65 system.

ME12058B−ii
Operation Section
Contents
1. OVERVIEW ..............................................................................................................................................1
2. SAFETY .....................................................................................................................................................2
2.1 Hazards and Risks..............................................................................................................................2
2.2 Hazard Indications .............................................................................................................................4
2.3 Interlock List......................................................................................................................................8
2.4 Lock-out / Tag-out...........................................................................................................................10
2.5 EMO ................................................................................................................................................11
2.6 Maintenance Keys............................................................................................................................12
3. CONFIGURATION ................................................................................................................................13
3.1 MFM65 External Figure ..................................................................................................................13
3.2 MFM65 Configuration Block Diagram ...........................................................................................16
3.3 Functions..........................................................................................................................................17
3.4 Software Configuration....................................................................................................................18
3.5 Hardware Specifications ..................................................................................................................19
3.6 Explanation of Software ..................................................................................................................21
4. START UP ...............................................................................................................................................22
4.1 Preparation of the Water Chiller......................................................................................................22
4.2 Power on the Equipment..................................................................................................................23
4.3 Start Up the Control Software .........................................................................................................24
4.4 Equipment Initialization and Aging.................................................................................................26
4.5 Equipment Diagnosis.......................................................................................................................28
5. SHUTDOWN ...........................................................................................................................................29
5.1 Unload Sample.................................................................................................................................29
5.2 Deactivate the Equipment................................................................................................................30
5.3 Sample Unloading in the Event of Emergency................................................................................33
6. DAILY CHECKS ....................................................................................................................................35
6.1 Initialization.....................................................................................................................................35
6.2 Beam Diagnosis ...............................................................................................................................37
6.3 Analysis of the Check Sample .........................................................................................................38
7. DAILY ANALYSIS.................................................................................................................................39
7.1 Confirm the Wafer Size ...................................................................................................................39
7.2 Set the Wafer Cassette .....................................................................................................................40
7.3 Set theCreate Jobs List.....................................................................................................................41
7.4 Start Measurement ...........................................................................................................................43
7.5 End Analysis....................................................................................................................................43
7.6 Unload the Cassette .........................................................................................................................43
8. ROUTINE CHECKUP LIST..................................................................................................................44
9. TROUBLE SHOOTING.........................................................................................................................45
9.1 Electric Power..................................................................................................................................45
9.2 Startup..............................................................................................................................................46
9.3 Beam Diagnosis ...............................................................................................................................48
9.4 Loadport...........................................................................................................................................49
9.5 Wafer Transfer.................................................................................................................................50
9.6 Sample Alignment ...........................................................................................................................51
9.7 XRR/XRD Measurement .................................................................................................................52
9.8 XRF Measurement...........................................................................................................................53

ME12058B−iii
Operation Section
9.9 X-ray Trouble ..................................................................................................................................54
APPENDIX 1 ..................................................................................................................................................55
A1.1 Explanation of XRR (X-ray reflectometry method) .....................................................................55
A1.2 Analysis/Measurement Flow.........................................................................................................58
APPENDIX 2 ..................................................................................................................................................60
A2.1 Training for Using Equipment ......................................................................................................60
APPENDIX 3 ..................................................................................................................................................61
A3.1 Power Circuit Diagram .................................................................................................................61
APPENDIX 4 ..................................................................................................................................................63
A4.1 List of Material Safety Database Sheet (MSDS) ..........................................................................63
A4.2 MSDS of Beryllium ......................................................................................................................64
A4.3 MSDS of Lead ..............................................................................................................................75
A4.4 MSDS of Lithium .........................................................................................................................76
A4.5 MSDS of Mercury.........................................................................................................................79
A4.6 MSDS of Mechanical Lubricating Grease ....................................................................................85
A4.7 MSDS of Ethanol..........................................................................................................................92
First Edition: December 20, 2005
Second Edition: March 5, 2008

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ME12058B
Operation Section
1. OVERVIEW
This manual is described the operation of MFM65 system (RFBFLFL Model).
This equipment can measure the thickness, density, and roughness of the surface and boundary of thin
films deposited on a wafer (max. of 12 inches (300 mm), or 8 inches).
This is a complex equipment that can estimate a crystalline by the X-ray diffraction (XRD), and the
compositions of multi-layer films by the X-ray fluorescence (XRF), in addition to measuring film
thickness by the X-ray reflectometry (XRR).
This equipment can be used in clean rooms, and meets a wide array of needs ranging from condition
estimation for semiconductor films (R&D) to process monitoring.
NOTE : In the case of modifying the MFM65 system without consulting RIGAKU, the system
may not satisfy the specifications of this system, and RIGAKU does not warrant the
system.
RIGAKU may change the specifications of the MFM65 system and the contents of the
printed materials including the manual without notice in the future.

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ME12058B
Operation Section
2. SAFETY
Please read the following safety information before operating the MFM65 system.
2.1 Hazards and Risks
The MFM65 system has potentially hazards and risks as follows.
WARNING Don’t use the maintenance keys in the daily operation, because these keys must
be used for the purpose of maintenance only.
These keys must be in safekeeping strictly with the maintenance manager of this
system.
(1) X-ray Hazards
NOTE:
The red lamps turn on during X-ray generation. The MFM65 system has no risk of
X-ray exposure during normal operation, because this system has a shielded radiation
enclosure and interlocks to prevent X-ray exposure. (Refer to “2.3 Interlock List”.)
Pay attention to the warning labels affixed on the enclosure of this system.
The border of the radiation-controlled area is defined at the outside surface of the enclosure. The dose
equivalent limit at the border of the radiation-controlled area is 1.3 mSv / 3 months by Publication 60
issued by the International Commission on Radiological Protection (ICRP). The dose equivalent limit
on the MFM65 is designed to be 2 micro Sv/H, that is based on Rigaku’s design standards. (1.3 mSv /
13 weeks / 6 days / 8 hours = 2 micro Sv/H)
NOTE: In fact, the dose of X-ray radiation outside the enclosure is almost zero.
(2) Electrical Hazards
NOTE : The MFM65 system has no electric hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(3) Laser Hazards
NOTE : The MFM65 system has no laser hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.

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ME12058B
Operation Section
(4) Mechanical Hazards
WARNING When squatting down to work, example for turning on the PC, take due care to
avoid injury from hitting your head against the mechanical projections.
Pay attention to the warning labels to be affixed on the enclosure of this
system.
NOTE : The MFM65 system has no mechanical hazard to catch your finger in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(5) Material Hazards
NOTE : The MFM65 system has no material hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(6) Fire Hazards
WARNING Plastics and electric cables used in the MFM65 are class V0 or V1.
If smoke occurs from the equipment, push an EMO Switch.
(7) Hot Surface Hazards
NOTE : The MFM65 system has no hot surface hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.
(8) Trip Hazards
NOTE : The MFM65 system has no trip hazards in the daily operation.
Pay attention to the warning labels to be affixed on the enclosure of this system.

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ME12058B
Operation Section
2.2 Hazard Indications
(1) Labels for hazard indications
The MFM65 system has the following labels for hazard indications.
4 Electric Hazard
Can shock, burn or cause
death.
Turn power off before
removing the cover.
HAZARDOUS
VOLTAGE INSIDE
SF002-10E
10E
5 Mechanical Hazard
PHYSICAL HAZARD
May result in severe
injury.
Watch your head.
SF007-10E
10E
1 X-ray Hazard
X-ray Hazard
Exposure to harmful
overriding safety interlock.
Please observe appropriate
safety guidelines.
Access should be limited
to authorized personnel
only.
radiation possible by
2 X-ray Hazard
harmful or fatal.
X-ray Hazard
This radiation can be
Please observe appropriate
radiation safety.
3 Mechanical Hazard
Mechanical Hazard
Moving parts insidemay
cause serious injury.
Access should be limited
tto authorized personnel
only.
6 Material Hazard
Material Hazard
(Beryllium)
Skin contact may be
hazardous to your health.
Wear safety gloves.
Fig. 2-2-1 Hazard Labels 1

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ME12058B
Operation Section
8 Hot Hazard
HOT SURFACE
INSIDE
Contact may result in
severe burns.
Open only after safe
temperature is reached.
SF016-2C
Fig. 2-2-2 Hazard Labels 2
7 Material Hazard
Material Hazard
(Mercury)
Skin contact may be
hazardous to your health.
Wear safety gloves.
9 Caution

−6 −
ME12058B
Operation Section
The location of the hazard indication labels is the following figure.
Fig. 2-2-3 Location of Hazard Indication Labels

−7 −
ME12058B
Operation Section
(2) Signal Towers and Buzzers
Front View
Left View
Right View
Fig. 2-2-4 Signal Towers and Buzzers
Maintenance Buzzer Maintenance Lamp
X-ray ON Lamp 1
X-ray ON Lamp 2
X-ray ON Lamp 3
EMO
Maintenance Buzzer Maintenance Lamp
X-ray ON Lamp 1
X-ray ON Lamp 2
X-ray ON Lamp 3
EMO
EMO Signal Tower

−8 −
ME12058B
Operation Section
2.3 Interlock List
The interlock list in the following table helps operators and maintenance personnel avoid hazard risks.
NOTE : Refer to the “A3.1 Power Circuit Diagram” for the interlock circuit.
InterLockNameNo. Ariskofbeingprotected
MC1
none
TheworkingMCs/Thestoppingparts
MC5MC3 MC4 MC2
EMOcircuit
PC(UPS)
UPS
Display
LoadPort
Bar-code
Reader
FAN
I/O
PLC
AirValve
Light
SignalLamp
ROBOT
PatternNavi
MoterDriver
MoterController
MoterDriver
X-Ray(A)
HighVoltage
PowerSupply
X-Ray(B)
HighVoltage
PowerSupply
X-Ray(C)
HighVoltage
PowerSupply

InterLockName
99999
No. Ariskofbeingprotected
1 UpperDooratPowerBox Electricshock
&Fire
99999 9 999999 9
2EMO
Unexpecteddanger
9 99 9 999999 9
3Electricprotectionpanel
inthelowerrightofEFEM Electricshock
9 99 9 999999 9
4
Electricprotectionpanel
atthePowerdistribution
Box Electricshock
9 99 9 999999 9
5Electricprotectionpanel
attheMotordriverBox Electricshock
9 99 9 999999 9
6
Electricprotectionpanel
atthePatternNAVIBox Electricshock
9 99 9 999999 9
7Electricprotectionpanel
attheX-raypowersupply Electricshock
9 99 9 999999 9
8
Electricprotectionpanel
inthelowerof
PowerBox Electricshock
9 99 9 999999 9
9 Waterleaksensor Electricshock
9 99 9 999999 9
10
RearsideDoorof
mainmodule Theinjuryby theoperationpart
9 99 9 999999 9
11 RightsideDoorofEFEM Theinjuryby theoperationpart.
ExposureofX-rays
9
RightsideDoorofEFEM
(GateandCoveratWafer
alignerclosed) Theinjuryby
theoperationpart
9
12
LeftsideDoorofEFEM Theinjuryby theoperationpart.
ExposureofX-rays
9
LeftsideDoorofEFEM
(GateandCoveratWafer
alignerclosed) Theinjuryby
theoperationpart
9
13 RightsideDoorof
Mainmodule Theinjuryby
theoperationpart.
ExposureofX-rays
9
RightsideDoorof
Mainmodule
(GateandCoveratWafer
alignerclosed)
Theinjuryby
theoperationpart.
ExposureofX-rays
14
LeftsideDoorof
Mainmodule Theinjuryby
theoperationpart.
ExposureofX-rays
9
LeftsideDoorof
Mainmodule
(GateandCoveratWafer
alignerclosed)
Theinjuryby
theoperationpart.
ExposureofX-rays
15 RobotArmSensor (Therobotarmcomesin
contactwiththegate.) Theinjuryby
theoperationpart
9
16
LoadPort
(Remove) Theinjuryby theoperationpart
9
9
9
9
9999
9
9
9
9
9
9
999
99
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
999
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
999
9
999
9
9
9
9
9
9
9
9
9
9
9
999

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ME12058B
Operation Section
[Interlock location]
NOTE : The measurement software
displays the messages
during interlock operation.
Interlock Name
1 Upper Door at Power
Box
2 EMO
3
Electric protection panel
in the lower right of
EFEM
4
Electric protection panel
at the Power distribution
Box
5 Electric protection panel
at the Motor driver Box
6 Electric protection panel
at the Pattern NAVI Box
7
Electric protection panel
at the X-ray power
supply
8
Electric protection panel
in the lower of
Power Box
9 Water leak sensor
10 Rear side Door of
Main module
11 Right side Door of
EFEM
Right side Door of
EFEM
(Gate and Cover at
wafer aligner closed)
12 Left side Door of EFEM
Left side Door of EFEM
(Gate and Cover at
wafer aligner closed)
13 Right side Door of
Main module
Right side Door of
Main module
(Gate and Cover at
wafer aligner closed)
14 Left side Door of
Main module
Left side Door of
Main module
(Gate and Cover at
wafer aligner closed)
15
Gate Sensor
(The robot arm comes in
contact with gate)
16 Load Port
(Removed)
9 : The sensor line is in the main module.
2
16
Fig. 2-3-1 Interlock Locations
12
87
910
15
Rear View
Right View
Left View
Front View
14
6
2
12
4
3
2
5
11
13

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ME12058B
Operation Section
2.4 Lock-out / Tag-out
WARNING When electrical power off and isolating the cooling water of facility, strictly follow
lock-out/tag-out of the instrument as follows.
In the daily operation, the lock-out/tag-out of the cooling water is normally
unnecessary.
(1) The main breaker lock-out handle
1. Pull down the lock-out handle.
2. Set the tag to the lock-out handle.
3. Lock the tag.
(2) The cooling water lock-out
1. Open the lower panel on the left side.
2. Remove the internal cover.
3. Close the bulbs.
(The third bulb is option.)
4. Lock-out the bulbs.
NOTE: Check and adjustment of the cooling water should be performed by the maintenance
personnel. Contact the maintenance personnel, if they need.
Refer the “8.ROUTINE CHECK”.
The power box on the rear side
Fig. 2-4-1 Lock-out Handle
Fig. 2-4-2 Water Lock-out

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ME12058B
Operation Section
2.5 EMO
When the EMO button is pushed, electric power is OFF immediately. (See “2.3 Interlock List”.)
Push this button, when an accidental event occurs, for example loss of mechanical control, water
leakage, or fire.
The MFM65 system has four EMO buttons, one on each side of the tool. (See “2.3 Interlock List”.)

−12 −
ME12058B
Operation Section
2.6 Maintenance Keys
The MFM65 system has many interlock functions for safety. When the enclosure covers of the
equipment are opened, electric power is OFF immediately. The X-ray generations are turned off, and
the mechanical systems, for example the goniometer, the robot, and so on, are turned off. But, some
items for maintenance need to be powered on with the covers open. In this case, maintenance keys are
used to release the interlock functions.
WARNING: There are two kinds of maintenance keys in the MFM65 system.
One is the key for mechanical maintenance. This key must be in safe keeping with
the maintenance personnel in charge, and only maintenance/service personnel can
use these keys for maintenance only.
Another is the key for X-ray maintenance. This key must be in safe keeping with
the service personnel in charge, and only the service personnel can use these keys
for maintenance only.
It is strictly prohibited to use these keys other than for maintenance operations.
If these keys are used, mechanical hazards, electric hazards and X-ray hazards
occur inside the main module or the EFEM.
[ Inside locations of the maintenance key switches ]
Mechanical key switch
for the goniometer
X-ray key switch Mechanical key switch
for the goniometer
Mechanical key switch
for the transfer robo
t
Right View
Fig. 2-6-1 Maintenance Key Locations
Left View

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ME12058B
Operation Section
3. CONFIGURATION
3.1 MFM65 External Figure
[External Figure]
Signal Tower
EMO
Load Por
t
LCD
Keyboard/Trackball
Power Box
EFEM
Main Module
Load Port
Keyboard/
Trackball
FFU
Maintenance Panel
for Main Module
Maintenance Doo
r
for Main Module
Maintenance Doo
r
for EFEM
FFU
EMO
Power Cable Inlet
Power ON/OFF
Buttons
Main Breake
r
(Inside)
Maintenance
p
anels
EMO
Utility
connections
Front View
Right View Rear View
Top View
Fig. 3-1-1 External Figure
Maintenance Doo
r
for Main Module
EMO
Maintenance Door
for EFEM
Maintenance Panel
for Main Module
Lock-out/Tag-out
Handle
PC
Left View
UPS for PC

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ME12058B
Operation Section
[Goniometer Figure]
Fig. 3-1-2 Gonimeter

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ME12058B
Operation Section
[EFEM Figure]
Fig. 3-1-4 EFEM Figure
Wafer Robot
Wafer Aligner
Load Port
Top View