SHENZHEN HI-LINK HLK-RM08S User manual

SHENZHEN HI-LINK ELECTRONIC CO.,LTD
HLK-RM08S USER MANUAL
Version：V1.0 Issuing date：2017-2-17 copy right@Hi-Link

CONTENTS
1. BRIEF INTRODUCTION............................................................................................................................................ 1
1.1. BASIC PARAMETERS.................................................................................................................................... 1
2. BLOCK DIAGRAM...................................................................................................................................................... 2
2.1. TYPICAL APPLICATION..............................................................................................................................3
2.2. SPECIFICATIONS........................................................................................................................................ 4
3. ELECTRICAL CHARACTERISTICS ..........................................................................................................................4
3.1. INPUT VOLTAGE.......................................................................................................................................... 4
3.2. RF CHARECTERISTICS................................................................................................................................ 5
3.2.1. 802.11B 11M.................................................................................................................................. 5
3.2.2. 802.11G 54M.................................................................................................................................. 5
3.2.3. 802.11N MCS7(HT20)....................................................................................................................6
3.2.4. 802.11N_MCS7(HT40)....................................................................................................................6
4. PINS DEFINITION.................................................................................................................................................. 7
4.1. PINS DIFINITION DIAGRAM......................................................................................................................7
4.2. DEFAULT PINS DIFINITION......................................................................................................................8
5. DIMENSIONS.......................................................................................................................................................... 10

1
HLK-RM08S
1. Brief Introduction
HLK-RM08S based on MT7688KN is a low cost and low power consumption IOT module developed by
Hi-Link.The module has rich interfaces and powerful processor and could be widely used in smart devices and
cloud service applications.
1.1. Basic parameters
High data processing ability，MCU frequency 580MHz
150M Mbps
Support 802.11b/g/n mode
20/40 channel bandwidth
Support 802.11v
Support AP,STA and AP,STA mixed
Fifth 10/100M adaptive com port
One USB2.0 host interface
Multiple interfaces SPI/SD-XC/eMMC
Rich peripheral interfaces，SPI,I2C,I2S,PCM,UART,JTAG,GPIO
Widely used in IOT
Inbuilt powerful PMU
Support 16 Multiple BSSID
Support multiple encryption WEP64/128, TKIP, AES, WPA, WPA2, WAPI
Support QoS，WMM，WMM-PS

2
HLK-RM08S
2. Block diagram
HLK-RM08S Block Diagram
EINT
Ethernet
UART
GPIO
PWM
USB_HOST
SPI
SPIS
I2C
I2S
JTAG
SDXC
MT7688KN
3.3V
40MHz
SPI Flash(32MB)
IPEX Connector

3
HLK-RM08S
2.1. Typical application
HLK-RM08S typical peripheral interfaces diagram
HLK-RM08S

4
HLK-RM08S
2.2. Specification
Item
Parameter
Model
HLK-RM08S
Main Chip
MT7688KN
I-Cache，D-Cache
64KB,32KB
Kernel
MIPS24KEc
Main frequency
580MHz
RAM
64Mb
Flash
32Mb
RF
1T1R 802.11n 2.4GHz
USB2.0
1
UART
2
Temperature
Environmental temperature：-40℃~85℃
Humidity
working：10~95%（noncondensing）
Storage：5~95%（noncondensing）
Size
17.4mm×25.8mm×2.8mm
3. Electrical characteristics
3.1. Input voltage
Name
Function
Min voltage（V）
Typical
voltage（V）
Max Voltage
（V）
VBAT
Supply voltage
3.2
3.3
3.4
I/O
I/O Voltage
3.2
3.3
3.4

5
HLK-RM08S
3.2. RF Characteristics
3.2.1. 802.11b 11M
802.11b Transmit (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Tx Power Level
DQPSK
18
20
22
dBm
Frequency Tolerance
-15
0
15
ppm
Spectral Mask
11MHz→22MHz
40
dBr
＞22MHz
53
dBr
Modulation Accuracy
All Data Rate
15
%
802.11b Receiver (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Min. Input
11Mbps PER<8%
-91.5
-89.5
-87.5
dBm
3.2.2. 802.11g 54M
802.11g Transmit (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Tx Power Level
OFDM
15
17
19
dBm
Frequency Tolerance
-15
0
15
ppm
Modulation Accuracy
All Data Rate
-31
-28
%
802.11g Receiver (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Min. Input
54Mbps PER<10%
-78.0
-76.0
-74.0
dBm

6
HLK-RM08S
3.2.3. 802.11n MCS7(HT20)
802.11n_HT20 Transmit (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Tx Power Level
OFDM
15
17
19
dBm
Frequency Tolerance
-15
0
15
ppm
Modulation Accuracy
All Data Rate
-31
-28
dB
802.11n_HT20 Receiver (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Min. Input
MCS7 PER<10%
-76.5
-74.5
-72.5
dBm
3.2.4. 802.11n_MCS7(HT40)
802.11n_HT40 Transmit (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Tx Power Level
OFDM
15.0
17.0
19.0
dBm
Frequency Tolerance
-15
0
15
ppm
Modulation Accuracy
All Data Rate
-31
-28
dB
802.11n_HT40 Receiver (Conductive)
Item
Condition
Min.
Typ.
Max.
Unit
Frequency Range
Channel 1
Channel 13
Min. Input
MCS7 PER<10%
-76.5
-74.5
-72.5
DBM

7
HLK-RM08S
4. PINS DEFINTION
4.1. Pins definition diagram
HLK-RM08S Default pins definition diagram

8
HLK-RM08S
4.2. Default pins definition
Pin
Name
（ Function
1）
Function 2
Function 3
Function 4
GPIO
Note
1
I2S_DI
PCMDRX
GPIO0
2
I2S_WS
PCMCLK
GPIO2
3
I2S_DO
PCMDTX
GPIO1
4
I2S_CLK
PCMFS
GPIO3
5
SPI_CS1
REF_CLKO
GPIO6
6
SPI_MOSI
GPIO8
7
SPI_CLK
GPIO7
8
SPI_MISO
GPIO9
9
UART_TXD0
GPIO12
Default is serial port
TR
10
UART_RXD0
GPIO13
Default is serial port
TR
11
GPIO0
REF_CLKO
PERST_N
GPIO11
12
MDI_RP_P0
GPIO24
13
MDI_RN_P0
GPIO23
14
MDI_TP_P0
GPIO22
15
MDI_TN_P0
GPIO21
16
MDI_TP_P1
SPIS_CS
PWM_CH0
GPIO14
17
MDI_TN_P1
SPIS_CLK
PWM_CH1
GPIO15
18
MDI_RP_P1
SPIS_MISO
UART_TXD2
GPIO16
19
MDI_RN_P1
SPI_MOSI
UART_RXD2
GPIO17
20
MDI_RP_P2
eMMC_D7
PWM_CH0
GPIO18
21
MDI_RN_P2
eMMC_D6
PWM_CH1
GPIO19
22
MDI_TP_P2
UART_TXD2
eMMC_D5
PWM_CH2
GPIO20
23
MDI_TN_P2
UART_RXD2
eMMC_D4
PWM_CH3
GPIO21
24
MDI_TP_P3
SD_WP
eMMC_WP
GPIO22
25
MDI_TN_P3
SD_CD
eMMC_CD
GPIO23
26
MDI_RP_P3
SD_D1
eMMC_D1
GPIO24

9
HLK-RM08S
27
MDI_RN_P3
SD_D0
eMMC_D0
GPIO25
28
MDI_RP_P4
SD_CLK
eMMC_CLK
GPIO26
29
MDI_RN_P4
SD_CMD
eMMC_CMD
GPIO28
30
MDI_TP_P4
SD_D3
eMMC_D3
GPIO29
31
MDI_TN_P4
SD_D2
eMMC_D2
GPIO27
32
USB_DP
Default not available
33
USB_DM
Default not available
34
EPHY_LED4_N
JTAG_RST_N
GPIO30
Com 4 status led
35
EPHY_LED2
JTAG_TMS
GPIO32
Com 2 status led
36
EPHY_LED0
JTAG_TDO
GPIO34
Com 0 status led
37
GND
38
GND
39
3.3V
Suggested external
power supply current≥
500mA
40
3.3V
41
WLED_N
GPIO35
WiFi status LED
42
EPHY_LED1
JTAG_TDI
GPIO33
Com 1status LED
43
EPHY_LED3
JTAG_CLK
GPIO31
Com 3status LED
44
PORST_N
WIFI reset
45
WDT_RST_N
GPIO37
Watchdog timeout reset
46
UART_TXD1
PWM_CH0
GPIO45
Default is serial port
TR
47
UART_RXD1
PWM_CH1
GPIO46
Default is serial port
TR
48
REF_CLK0
GPIO38
Reference clock output
49
PERST_N
GPIO36
PCIe device reset
50
I2C_SD
GPIO5
51
I2C_CLK
GPIO4
52
GND
53
ANT
Default not connected
54
GND

10
HLK-RM08S
Notes：
1，All pins default 1
2，IO drive current is 4mA
3，All TTL is 3.3V
5. Dimensions
HLK-RM08S Drawing
Introductions：
1，The size of the module is length 1mm,width 1mm,space 1.4mm , depth 1.8mm.
2，The thickness of the module is 1.8mm.
3, The noted numbers in the picture is the actual size of module,do recommended pad extension around
1mm, internal heat shrink 0.2mm pad, internal thermal pad grounding once do encapsulation.
Do when the package recommended pad extension around the 1mm, 3 internal heat shrink 0.2mm pad,
internal thermal pad grounding.