Sony ICD-B17 - Ic Recorder Instruction manual

1
SERVICE MANUAL
US Model
AEP Model
Tourist Model
ICD-B17
IC RECORDER
Recording media Built-in flash memory, Monaural recording
Recording time 300 minutes
Speaker approx. 3.2 cm (1 5/16 in.) dia.
Power output 150 mW
Input/Output • Earphone jack (minijack) for 8 - 300 ohms
earphone/headphones
•Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements Two LR03 (sizeAAA) alkaline batteries: 3V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 ×105.3 ×14.0 mm (1 13/16 ×4 1/4 ×9/16 in.)
Mass (incl. batteries) 68 g (2.4 oz)
Design and specifications are subject to change without notice.
SPECIFICATIONS
Ver 1.0 2003. 05
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-877-327-01
2003E0400-1
© 2003. 05

2
TABLE OF CONTENTS
1. SERVICE NOTE ................................................................ 3
2. GENERAL
Index to Parts and Controls ..................................................... 4
3. DISASSEMBLY
3-1. Upper Lid Assy ................................................................... 5
3-2. F-SW Board, P-SW Board .................................................. 6
3-3. Main Board ......................................................................... 6
4. DIAGRAMS
4-1. IC Pin Description............................................................... 7
4-2. Block Diagram .................................................................... 9
4-3. Printed Wiring Board – Main Section – ............................ 11
4-4. Printed Wiring Board – F-SW Section – ........................... 12
4-5. Printed Wiring Board – P-SW Section – ........................... 13
4-6. Schematic Diagram – Main Section –............................... 14
4-7. IC Block Diagrams............................................................ 15
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 16
5-2. Main Board Section .......................................................... 17
6. ELECTRICAL PARTS LIST ........................................ 18
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ICD-B17
•UNLEADED SOLDER
Boardsrequiring useof unleaded solder are printedwith the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:Some printedcircuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleadedsolder meltsat a temperature about 40°Chigher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

3
ICD-B17
SECTION 1
SERVICE NOTE
1-1. CAUTIONS OF FLASH MEMORY (IC701)
EXCHANGE
[Precaution when the flash memory (IC701) is replaced]
When the flash memory (IC701) is replaced, be sure to perform the
BAD BLOCK check* and writing of the model code. If they are not
completed, the unit will not operate normally.
* BAD BLOCK check is to check the flash ROM memory
area (the BAD BLOCK area) where data cannot be
guaranteed. The resultant information of this check is stored
in the TOC-AREA so that the BAD BLOCK area should
not be used.
[BAD BLOCK Check Procedure]
1. When the power is turned on after the flash memory (IC701) is
replaced, the BAD BLOCK check starts automatically and the
OPR (D701) lights in orange.
2. In about 30 seconds after start of the check, the OPR (D701)
changes the color to green indicating that the check is
completed.
TP701
TP702
TP708
TP110
TP102
TP501
TP106
TP101
TP107
R727 R726
FB104 FB103
C120
C101
R102 R103
C129 C128
FB102
FB101
R135
R104
C106
C105
RED(REC)
D701
GRN
(PLAY)
Q701
C
C
B
B
E
C104
C103
X101
J102
EAR
J101
MIC
(PLUG IN POWER)
MAIN BOARD (SIDE A)
–1
–2

4
ICD-B17 SECTION 2
GENERAL This section is extracted
from instruction manual.

5
ICD-B17
Note : This set can be disassemble according to the following sequence.
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-1. UPPER LID ASSY
3-1. UPPER LID ASSY
(Page 5)
3-2. F-SW BOARD,
P-SW BOARD
(Page 6)
SET
3-3. MAIN BOARD
(Page 6)
1 B 1.7x10
4 claw
2 B 1.7x7
7 screws 1.7x2.5
8 speaker (SP101)
3 claws
5 claws
9 upper lid assy
case ass
y
6
claw

6
ICD-B17
3-2. F-SW BOARD, P-SW BOARD
3-3. MAIN BOARD
2 CN701
3
case assy
5 F-SW board
6 P-SW board
4 Removal the five solders.
1 Removal the solder.
4 claw
5 claw
case assy
1 Removal the two solders.
6 MAIN board
2 speaker (SP101)
3 B 1.7x
4

7
ICD-B17
4-1. IC PIN DESCRIPTION
• IC703 µPD780308GC-A66-8EU (MEMORY CONTROL, SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1 – 3 KEY0 – KEY2 I Key signal input
4XHOLD I Hold switch signal input
5AMPPOW O Power down control signal output to the power amplifier IC (IC103)
6AVREFON I A/D reference voltage input
7 XFMCE O Chip enable signal output to the flash memory IC (IC701)
8VDD0 — Power supply pin (+3.3V)
9AVREF — A/D reference voltage
10 XFMWE O Write enable signal output to the flash memory IC (IC701)
11 XFMALE O ALE signal output to the flash memory IC (IC701)
12 VSS1 — Ground pin
13 XFMR/B I Ready/Busy signal input from the flash memory IC (IC701)
14 XFMCLE O CLE signal output to the flash memory IC (IC701)
15, 16 NC O Not used. (Open)
17 XFMRE O Read enable signal output to the flash memory IC (IC701)
18 XFMSE O SE signal output to the flash memory IC (IC701)
19 XFMWP O WP signal output to the flash memory IC (IC701)
20 CLKOUT O Not used in this set. (Open)
21 BEEP O Beep signal output (2.4 kHz)
22 LIGHT O LCD back light control output Not used in this set. (Open)
23 – 26 COM0 – COM3 O LCD common signal output
27 BIAS O Connect to VDD. (LCD bias)
28 – 30 VLC0 – VLC2 — LCD drive power supply pin
31 VSS0 — Ground pin
32 – 61 S0 – S29 O LCD segment signal output
62 NC I Not used. (Open)
63 NC O Not used. (Open)
64 XTEST I Test pin
65 DSPPOW O Digital signal processor registor control I/F enable signal output
66 LEDREC O OPR (REC) LED (D701: red) ON/OFF signal output
67 LEDPB O OPR (PLAY) LED (D701: green) ON/OFF signal output
68 RTCCE O Real time clock chip enable signal output
69 XDSPIFRQ O I/F request signal output to the DSP IC (IC101)
70 DSPIFRW O I/F data read/write signal output to the DSP IC (IC101)
71 XDSPRST O Reset signal output to the A/D, D/A converter, DSP IC (IC101)
72 SI0 I I/F data signal input to the DSP IC (IC101)
73 SO0 O I/F data signal output to the DSP IC (IC101)
74 SCK0 O I/F signal clock output to the DSP IC (IC101)
75 RTCDI I Real time clock data signal input
76 RTCDO O Real time clock data and digital signal processor registor control data output
77 RTCCLK O Real time clock I/F data and digital signal processor registor control clock output
78 IC — Connect to ground.
79 X2 O System clock output (5 MHz)
80 X1 I System clock input (5 MHz)
81 VDD1 — Power supply pin
82 XT1 — Sub clock input (32.768 kHz)
83 XT2 — Not used in this set. (Open)
84 XRESET I Reset signal input
85 NC — Not used. (Open)
SECTION 4
DIAGRAMS

8
ICD-B17
Pin No. Pin Name I/O Pin Description
86 WAKEUP I WAKE UP signal input
87 RTCINT I Real time clock (2 Hz) signal input
88 FLMPOW O Flash memory power ON/OFF signal output
89 DSPIFACK I I/F acknowledge signal input to the DSP IC (IC101)
90 LMUTE O Line mute ON/OFF signal output
91 – 98 FMI01 – FMI07 I/O Data bus signal input/output
99 AVSS — Ground pin
100 BATT I Power supply voltage detection signal input

ICD-B17
99
4-2. BLOCK DIAGRAM
47 MIP
46 MIN
LOUT0
23
EGPI011 EGPI014 EGPI013 EGPI015 BGPI02 EGPI014 RSTN
26 51
XOUT
52
34
XIN
25 27 58 24 54
72
SI0
90
21
5
76
75
77
68
87
82
9
8
65
88
84
80
1
67
66
79
LCD701
LIQUID
CRYSTAL
DISPLAY
PANEL
LED
DRIVER
Q701
13
17
7
14
11
10
19
64
86
1
2
3
4
7
8
9
16
17
18
19
91
I
98
73
SD0
74
SCK0
89
DSPIFACK
69
XDSPIFRQ
70
DSPIFRW
71
XDSPRST
29
I
32
•
41
I
44
23
I
26
32
I
61
RESET
IC702
MIC101
MIC
J101
MIC
J102
EAR
IC701
FLASH MEMORY
I/O1
I
I/O8
R/B
RE
CE
CLE
ALE
WE
WP
SL701
(TEST)
Q702
VDD
FMI00
I
FMI07
XFMR/B
XFMRE
XFMCE
XFMCLE
XFMALE
XFMWE
XFMWP
XTEST
WAKEUP
62 MGTEST
63 MGHIGH
KEY0
KEY1
KEY2
XHOLD
S703
HOLD
OFF ON
I/O
TIMER
COUNTER
CONTROL
OSC
INTERRUPT
CONTROL
RTCCE
RTCINT
RTCDI
RTCCLK
RTCDO
AMPPOW
BEEP
LMUTE
XT1
DSPPOW
FLMPOW
XRESET
X1
X2
LEDPB
LEDREC
COM0
I
COM3
S0
I
S29
SI
SO
SCLK
CE
INTB
32KOUT
4
3
2
7
6
1
+3.3V
(VCC C)
D701
OPR
(GRN)(PLAY)
(RED)(REC)
A/D,D/A CONVERTER
DSP IC101
(PLUG IN POWER)
X101
3.98MHz
X701
5MHz
MEMORY
CONTROL,
SYSTEM
CONTROL
IC703
S706-708,713
S710-712,714
S704,705,709,715
KEY-IN
DETECT
Q703-705
VCC
+3.3V
(VCCB)
VCC
VCCA +3.3V
(VCC A)
+3.3V
(VCC B)
RV101
VOL 48
5
1
3
2
-IN
+IN
BYPASS
VDD
VO1
VO2
SP101
SPEAKER
IC103
POWER AMP
X702
32.768kHz
REAL TIME CLOCK
IC704
VDD +3.3V
(VCC C)
+3.3V
(VCC A) 5 2
3
IC502
+3.3V REG
VOUT VIN
OSCIN
OSCOUT SHUTDOWN
DC-DC
CONVERTER
(3.7V)
+3.3V
(VCC B) 5 2
3
IC503
+3.3V REG
VOUT VIN
CE
+3.3V
(VCC C) 5 2
3
IC504
+3.3V REG
VOUT VIN
CE
IC505,Q501
VOLTAGE
DETECTOR
Q502
BUFFER
IC506
Q101
MUTE
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS,3V
KEY MATRIX
6
SHUTDOWN
Signal path
: PB
: REC

ICD-B17
1010
• Waveforms
1
IC101 ta (XOUT)
0.5V/div 0.1µsec/div
3.98MHz
2
IC704 1(32KOUT)
1.0V/div 10µsec/div
32.768kHz
3
IC704 8(OSCOUT)
0.5V/div 10µsec/div
4
IC703 ul (X2)
1.0V/div 0.2µsec/div
32.768kHz
5MHz
1.0Vp-p
2.2Vp-p
1.2Vp-p
3.2Vp-p
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
•Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : PB
():REC
•VoltagesaretakenwithaVOM(Inputimpedance10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
E: PB
a: REC
Common Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•z: Through hole.
•: Pattern from the side which enables seeing.
Lead layout of conventional IC
Caution:
Pattern face side: Partsonthepatternfacesideseenfrom
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) theparts face are indicated.
•Lead Layouts