PXIe-700 User Guide Rev. 1.7
Sundance Digital Signal Processing Inc.
4790 Caughlin Parkway 233, Reno, NV 89519-0907, U.S.A.
Tel: +1 (775) 827-3103, Fax: +1 (775) 827-3664, email: sales@sundancedsp.com
www.sundancedsp.com © Sundance Digital Signal Processing Inc 2016.
Table of Contents
1Introduction.............................................................................................................................. 1
1.1 Hardware features............................................................................................................ 1
2Board Description.................................................................................................................... 2
2.1 PXIe-700 Block Diagram and Pictures ............................................................................ 2
2.2 BPI FLASH Memory......................................................................................................... 3
2.3 Xilinx FPGA...................................................................................................................... 3
2.4 Memory............................................................................................................................. 3
2.5 GTX (High Speed Transceivers)...................................................................................... 3
2.6 HPC FMC......................................................................................................................... 4
2.7 LEDs................................................................................................................................. 4
2.8 Switches........................................................................................................................... 4
2.9 Clocks............................................................................................................................... 5
2.10 JTAG ................................................................................................................................ 5
2.11 PXIe.................................................................................................................................. 5
3Operation................................................................................................................................. 7
3.1 Carrier/Motherboard......................................................................................................... 7
3.2 Power Supplies ................................................................................................................ 7
3.3 VADJ voltage.................................................................................................................... 7
3.4 FPGA Configuration......................................................................................................... 9
3.4.1 Configuring FPGA through JTAG............................................................................. 9
3.4.2 Configuring FPGA from Flash .................................................................................. 9
4Application Development....................................................................................................... 11
Appendix....................................................................................................................................... 12
4.1 Pinout ............................................................................................................................. 12
4.1.1 PXIe......................................................................................................................... 12
4.1.2 HPC FMC................................................................................................................ 14
4.1.3 SFP+....................................................................................................................... 15
4.1.4 MMCX ..................................................................................................................... 15
4.1.5 LEDS....................................................................................................................... 16
4.1.6 Clocks...................................................................................................................... 16
4.1.7 DDR3 Interface....................................................................................................... 16
4.1.8 J5 Header................................................................................................................ 19