Toshiba e-STUDIO163 User manual

SERVICE MANUAL
MULTIFUNCTIONAL DIGITAL SYSTEMS
e-STUDIO163/203
File No. SME050024D0
R05092196100-TTEC
Ver04_2008-06

Trademarks
• The official name of Windows 95 is Microsoft Windows 95 Operating System.
• The official name of Windows 98 is Microsoft Windows 98 Operating System.
• The official name of Windows Me is Microsoft Windows Millennium Edition Operating System.
• The official name of Windows 2000 is Microsoft Windows 2000 Operating System.
• The official name of Windows XP is Microsoft Windows XP Operating System.
• Microsoft, Windows, Windows NT and the brand names and product names of other Microsoft prod-
ucts are trademarks or registered trademarks of Microsoft Corporation in the U.S. and/or other coun-
tries.
• Molykote is a registered trademark of Dow Corning Corporation.
• Other company names and product names in this manual are the trademarks of their respective
companies.
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
Under the copyright laws, this manual cannot be reproduced in any form without prior written permission
of TOSHIBA TEC CORPORATION. No patent liability is assumed, however, with respect to the use of the
information contained herein.
06/04

GENERAL PRECAUTIONS REGARDING THE SERVICE FOR
e-STUDIO163/203
The installation and service should be done by a qualified service
technician.
1) Transportation/Installation
- When transporting/installing the equipment, remove the drawer, employ two persons and be sure
to hold the positions as shown in the figure.
The equipment is quite heavy and weighs approximately 32 kg (70.55 lb), therefore pay full atten-
tion when handling it.
- Be sure not to hold the movable parts or units when transporting the equipment.
- Be sure to use a dedicated outlet with AC 110 V / 13.2 A, 115 V or 127 V / 12 A, 220-240 V or 240
V / 8 A for its power source.
- The equipment must be grounded for safety.
- Select a suitable place for installation. Avoid excessive heat, high humidity, dust, vibration and
direct sunlight.
- Provide proper ventilation since the equipment emits a slight amount of ozone.
- To insure adequate working space for the copying operation, keep a minimum clearance of 80
cm (32”) on the left, 80 cm (32”) on the right and 10 cm (4”) on the rear.
- The equipment shall be installed near the socket outlet and shall be easily accessible.
- Be sure to fix and plug in the power cable securely after the installation so that no one trips over
it.
06/04

2) General Precautions at Service
- Be sure to turn the power OFF and unplug the power cable during service (except for the service
should be done with the power turned ON).
- Unplug the power cable and clean the area around the prongs of the plug and socket outlet once
a year or more. A fire may occur when dust lies on this area.
- When the parts are disassembled, reassembly is the reverse of disassembly unless otherwise
noted in this manual or other related documents. Be careful not to install small parts such as
screws, washers, pins, E-rings, star washers in the wrong places.
- Basically, the equipment should not be operated with any parts removed or disassembled.
- The PC board must be stored in an anti-electrostatic bag and handled carefully using a wristband
since the ICs on it may be damaged due to static electricity.
- Avoid expose to laser beam during service. This equipment uses a laser diode. Be sure not to
expose your eyes to the laser beam. Do not insert reflecting parts or tools such as a screwdriver
on the laser beam path. Remove all reflecting metals such as watches, rings, etc. before starting
service.
- Be sure not to touch high-temperature sections such as the exposure lamp, fuser unit, damp
heater and areas around them.
- Be sure not to touch high-voltage sections such as the chargers, developer, high-voltage trans-
former and power supply unit. Especially, the board of these components should not be touched
since the electric charge may remain in the capacitors, etc. on them even after the power is
turned OFF.
- Make sure that the equipment will not operate before touching potentially dangerous places (e.g.
rotating/operating sections such as gears, belts pulleys, fans and laser beam exit of the laser
optical unit).
- Be careful when removing the covers since there might be the parts with very sharp edges
underneath.
- When servicing the equipment with the power turned ON, be sure not to touch live sections and
rotating/operating sections. Avoid exposing your eyes to laser beam.
- Use designated jigs and tools.
- Use recommended measuring instruments or equivalents.
- Return the equipment to the original state and check the operation when the service is finished.
3) Important Service Parts for Safety
- The breaker, door switch, fuse, thermostat, thermofuse, thermistor, IC-RAMs including lithium
batteries, etc. are particularly important for safety. Be sure to handle/install them properly. If
these parts are short-circuited and their functions become ineffective, they may result in fatal
accidents such as burnout. Do not allow a short-circuit or do not use the parts not recommended
by Toshiba TEC Corporation.
4) Cautionary Labels
- During servicing, be sure to check the rating plate and cautionary labels such as “Unplug the
power cable during service”, “CAUTION. HOT”, “CAUTION. HIGH VOLTAGE”, “CAUTION.
LASER BEAM”, etc. to see if there is any dirt on their surface and if they are properly stuck to the
equipment.
Caution: Before using the wristband, unplug the power cable of the equipment and
make sure that there are no charged objects which are not insulated in the
vicinity.

5) Disposal of the Equipment, Supplies, Packing Materials, Used Batteries and IC-RAMs
- Regarding the recovery and disposal of the equipment, supplies, packing materials, used batter-
ies and IC-RAMs including lithium batteries, follow the relevant local regulations or rules.
Caution:
Dispose of used batteries and IC-RAMs including lithium batteries according to this manual.
Attention:
Se débarrasser de batteries et IC-RAMs usés y compris les batteries en lithium selon ce manuel.
Vorsicht:
Entsorgung der gebrauchten Batterien und IC-RAMs (inclusive der Lithium-Batterie) nach diesem Handbuch.


© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
CONTENTS
1
CONTENTS
e-STUDIO163/203
1. SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES ................................... 1-1
1.1 Specifications....................................................................................................................... 1-1
1.2 Accessories ......................................................................................................................... 1-4
1.3 Options ................................................................................................................................ 1-5
1.4 Supplies............................................................................................................................... 1-6
1.5 System List .......................................................................................................................... 1-7
2. OUTLINE OF THE MACHINE ....................................................................................... 2-1
2.1 Sectional View ..................................................................................................................... 2-1
2.2 Electric Parts Layout............................................................................................................ 2-4
2.3 Symbols and Functions of Various Components............................................................... 2-11
2.4 General Description ........................................................................................................... 2-15
2.4.1 System block diagram ............................................................................................ 2-15
2.4.2 Construction of boards ........................................................................................... 2-16
2.5 Disassembly and Replacement of Covers......................................................................... 2-18
2.6 Disassembly and Replacement of PC boards ................................................................... 2-23
2.7 Removal and Installation of Options .................................................................................. 2-28
3. COPY PROCESS .......................................................................................................... 3-1
3.1 General Description of Copying Process............................................................................. 3-1
3.2 Details of Copying Process.................................................................................................. 3-2
3.3 Comparison with e-STUDIO230/280 ................................................................................. 3-13
4. GENERAL OPERATION............................................................................................... 4-1
4.1 Overview of Operation ......................................................................................................... 4-1
4.2 Description of Operation...................................................................................................... 4-2
4.2.1 Warming-up.............................................................................................................. 4-2
4.2.2 Ready state (ready for copying) ............................................................................... 4-2
4.2.3 Drawer feed copying ................................................................................................ 4-3
4.2.4 Bypass feed copying ................................................................................................ 4-4
4.2.5 Interruption copying.................................................................................................. 4-4
4.3 Detection of Abnormality...................................................................................................... 4-5
4.3.1 Types of abnormality ................................................................................................ 4-5
4.3.2 Description of abnormality ........................................................................................ 4-6
4.4 Flow Chart ........................................................................................................................... 4-9
4.4.1 Immediately after the power is turned ON................................................................ 4-9
4.4.2 Automatic paper feed copying ................................................................................ 4-11
5. CONTROL PANEL........................................................................................................ 5-1
5.1 Control Panel and LED Display .......................................................................................... 5-1
5.2 Items Displayed on Control Panel ....................................................................................... 5-2
5.3 Relation between Equipment State and Operation.............................................................. 5-4
5.4 Operation............................................................................................................................. 5-5
5.4.1 Block diagram........................................................................................................... 5-5
5.4.2 LED display circuit.................................................................................................... 5-5
5.5 Disassembly and Replacement ........................................................................................... 5-6
6. SCANNER ..................................................................................................................... 6-1
6.1 General Description ............................................................................................................. 6-1
6.2 Construction......................................................................................................................... 6-2
6.3 Functions ............................................................................................................................. 6-3
6.4 Description of Operation...................................................................................................... 6-5
6.4.1 Scanning operation .................................................................................................. 6-5
6.4.2 Scan motor drive circuit ............................................................................................ 6-6

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
CONTENTS
2
6.5 Contact Image Sensor Unit Control Circuit.......................................................................... 6-8
6.5.1 Exposure LED control circuit .................................................................................... 6-8
6.5.2 CCD control circuit ................................................................................................... 6-9
6.6 Disassembly and Replacement ......................................................................................... 6-12
7. IMAGE PROCESSING .................................................................................................. 7-1
7.1 General Description ............................................................................................................. 7-1
7.2 Configuration ....................................................................................................................... 7-2
7.3 MAIN Board ......................................................................................................................... 7-3
7.3.1 Features ................................................................................................................... 7-3
7.3.2 Functions of image processing circuit ...................................................................... 7-4
8. LASER OPTICAL UNIT ................................................................................................ 8-1
8.1 General Description ............................................................................................................. 8-1
8.2 Structure .............................................................................................................................. 8-2
8.3 Laser Diode Control Circuit.................................................................................................. 8-5
8.4 Polygonal Motor Control Circuit ........................................................................................... 8-6
8.5 Disassembly and Replacement ........................................................................................... 8-7
9. DRIVE UNIT .................................................................................................................. 9-1
9.1 General Description ............................................................................................................. 9-1
9.2 Configuration ....................................................................................................................... 9-2
9.3 Functions ............................................................................................................................ 9-3
9.4 Main Motor Control Circuit ................................................................................................... 9-4
9.5 Disassembly and Replacement ........................................................................................... 9-6
10. PAPER FEEDING SYSTEM........................................................................................ 10-1
10.1 General Description........................................................................................................... 10-1
10.2 Configuration ..................................................................................................................... 10-2
10.3 Functions ........................................................................................................................... 10-3
10.4 Operation ........................................................................................................................... 10-5
10.4.1 Drawer.................................................................................................................... 10-5
10.4.2 Bypass tray............................................................................................................. 10-7
10.4.3 General operation................................................................................................... 10-9
10.5 Disassembly and Replacement ....................................................................................... 10-10
11. DRUM RELATED SECTION ....................................................................................... 11-1
11.1 General Description........................................................................................................... 11-1
11.2 Configuration ..................................................................................................................... 11-2
11.3 Functions ........................................................................................................................... 11-3
11.4 High-Voltage Output Control Circuit .................................................................................. 11-5
11.4.1 General description ................................................................................................ 11-5
11.4.2 Description of Operation......................................................................................... 11-6
11.5 Drum Temperature Detection Circuit ................................................................................. 11-7
11.5.1 General description ................................................................................................ 11-7
11.5.2 Circuit configuration................................................................................................ 11-7
11.6 Temperature/Humidity Detection Circuit............................................................................ 11-8
11.6.1 General Description................................................................................................ 11-8
11.6.2 Circuit configuration................................................................................................ 11-8
11.7 Disassembly and Replacement ......................................................................................... 11-9
12. DEVELOPMENT SYSTEM.......................................................................................... 12-1
12.1 General Description........................................................................................................... 12-1
12.2 Construction....................................................................................................................... 12-2
12.3 Functions ........................................................................................................................... 12-3
12.3.1 Function of each unit .............................................................................................. 12-3
12.3.2 Functions of the toner cartridge PC board (CTRG)................................................ 12-4
12.3.3 Recovered toner supply mechanism ...................................................................... 12-6

© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
CONTENTS
3
12.4 Toner Motor Control Circuit ............................................................................................... 12-7
12.5 Auto-Toner Circuit.............................................................................................................. 12-8
12.5.1 General description ................................................................................................ 12-8
12.5.2 Function of auto-toner sensor ................................................................................ 12-9
12.6 Disassembly and Replacement ....................................................................................... 12-11
13. FUSER / EXIT UNIT .................................................................................................... 13-1
13.1 General Description........................................................................................................... 13-1
13.2 Configurations.................................................................................................................... 13-2
13.3 Functions ........................................................................................................................... 13-3
13.4 Operation ........................................................................................................................... 13-4
13.5 Fuser Unit Control Circuit .................................................................................................. 13-5
13.5.1 Configuration .......................................................................................................... 13-5
13.5.2 Temperature detection section ............................................................................... 13-6
13.6 Disassembly and Replacement ....................................................................................... 13-11
14. POWER SUPPLY UNIT .............................................................................................. 14-1
14.1 Construction....................................................................................................................... 14-1
14.2 Operation of DC Output Circuit.......................................................................................... 14-2
14.3 Output Channel ................................................................................................................. 14-3
14.4 Fuse................................................................................................................................... 14-4
14.5 Configuration of Power Supply Unit................................................................................... 14-5
14.6 Power Supply Sequence ................................................................................................... 14-6
14.7 AC Wire Harness............................................................................................................... 14-7
15. PC BOARDS ............................................................................................................... 15-1

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
CONTENTS
4

1
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 1
1. SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1.1 Specifications
Copy process Indirect electrophotographic process (dry)
Type Desktop type
Original table Fixed type (the left rear corner used as guide to place originals)
Accepted originals Sheet, book and 3-dimensional object. The automatic document feeder
(ADF) only accepts paper which are not pasted or stapled. (Single-sided orig-
inals: 50 to 127 g/m2/13 to 34 lb. Bond) Carbon paper are not acceptable
either.
Maximum size: A3/LD
Copy speed (Copies/min.)
e-STUDIO163
e-STUDIO203
* “–” means “Not acceptable”.
* The copy speed in the above table are available when originals are manually placed for single side,
multiple copying.
* When the ADF is used, the copy speed of 16[20] sheets per minute is only available under the fol-
lowing conditions:
• Original/Mode: Single side original/A4/LT size. APS/automatic density are not selected.
• Number of sheets: 16[20] or more.
• Reproduction ratio: 100%
Values in [ ] are for e- STUDIO203 in case that the specification is different among e-STUDIO163
and e-STUDIO203.
Paper size Drawer Bypass feed PFU
Size specified Size not specified
A4, B5, LT 16 16 11 16
A5-R, ST-R - 16 11 -
A4-R, B5-R, LT-R 15.5 15.5 11 15.5
B4, LG, FOLIO, COMPUTER 13 13 11 13
A3, LD 11 11 11 11
Paper size Drawer Bypass feed PFU
Size specified Size not specified
A4, B5, LT 20 20 11 20
A5-R, ST-R - 20 11 -
A4-R, B5-R, LT-R 15.5 15.5 11 15.5
B4, LG, FOLIO, COMPUTER 13 13 11 13
A3, LD 11 11 11 11

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 2
Copy speed for thick paper (Copies/min.)
e-STUDIO163/203
Thick 1 (81 g/m2to 105 g/m2, 21.3 lb. Bond to 28 lb. Bond): Bypass feed on a sheet by sheet basis only
Thick 2 (106 g/m2to 163 g/m2, 28 lb. Bond to 90 lb. Index): Bypass feed on a sheet by sheet basis only
!Copy paper
!First copy time ..................... Approx. 7.6 sec. (A4, 100%, original placed manually)
Approx. 7.7 sec. (LT, 100%, original placed manually)
!Warming-up time.................. Approx. 25 sec. (temperature: 20°C)
!Multiple copying ................... Up to 999 copies; Key in set numbers
!Reproduction ratio ............... Actual ratio: 100±0.5%
Zooming: 25 to 200% in increments of 1%
!Resolution/Gradation ........... Scanning: 600 dpi x 600 dpi
Printing: Equivalent to 2400 dpi x 600 dpi
Gradation: 256 steps
!Eliminated portion ................ Leading edges: 3.0±2.0 mm, Side/trailing edges: 2.0±2.0 mm (copy)
Leading / trailing edges: 5.0±2.0 mm, Side edges: 5.0±2.0 mm (print)
Paper feeding ......................... Standard drawer:
1 drawer (stack height 28 mm, equivalent to 250 sheets; 64 to
80 g/m2(17 to 22 lb. Bond))
Bypass feeding:
Stack height 11.8 mm: equivalent to 100 sheets; 64 to 80 g/m2
(17 to 22 lb. Bond)
Paper Feed Unit (PFU):
Option (One drawer: stack height 28 mm, equivalent to 250
sheets; 64 to 80 g/m2(17 to 22 lb. Bond))
Capacity of originals in the automatic document feeder (Option)
.................................................. A3 to A5-R, LD to ST-R:
100 sheets / 80 g/m2(Stack height 16 mm or less)
Toner supply ........................... Automatic toner density detection/supply
Toner cartridge replacing method (There is a recovered toner supply
mechanism.)
Drawer PFU Bypass copy Remarks
Size A3, A4, A4-R, B4, B5,
B5-R, LD, LG, LT, LT-R,
FOLIO, COMPUTER,
13"LG, 8.5" x 8.5", 8K,
16K, 16K-R
A3 to A5-R, LD to ST-R, FOLIO, COM-
PUTER, 13"LG, 8.5" x 8.5", 8K, 16K,
16K-R
(Non-standard or user-specified sizes
can be set.)
Weight 64 to 80 g/m250 to 163 g/m2(Single paper feeding)
64 to 80 g/m2(Continuous feeding)
Special
paper
– Tracing paper, labels, OHP film
(thickness: 80 µm or thicker),
These special papers rec-
ommended by Toshiba Tec
06/04

1
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 3
!Density control ..................... Automatic density mode and manual density mode selectable in 7
steps
!Weight.................................. Approximately 32 kg (70.55 lb.) (excluding the developer material and
toner)
!Power requirements............. AC 110 V / 13.2 A, 115 V or 127 V / 12 A
220-240 V or 240 V / 8 A (50/60 Hz)
* The acceptable value of each voltage is ±10%.
!Power consumption ............. 1.5 kW or less (100 V series)
1.6 kW or less (200 V series)
* The electric power is supplied to the ADF and PFU through the equipment.
!Total counter ........................ Electronical counter
!Dimensions of the equipment
.................................................. W 600 x D 643 x H 462.5 (mm): See the figure below
Fig. 1-1
W
H
D
06/04

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 4
1.2 Accessories
* Machine version
NAD: North America
ASD: Hong Kong / Latin America
AUD: Australia
MJD: Europe
ASU: Asia / Saudi Arabia
SAD: Saudi Arabia
ARD: Latin America
CND: China
TWD: Taiwan
KRD: Korea
JPD: Japan
Unpacking/setup instruction 1 set
Operator’s manual 1 pc.
Operator's manual pocket 1 pc.
Power cable 1 pc.
CD-ROM 2 pcs.
Rubber cap 6 pcs.
Transfer charger wire cleaner
(installed inside of the transfer cover)
1 pc.
Drum (installed inside of the equipment) 1 pc.
Developer material 1 pc.
Nozzle 1 pc. (except for CND)
Toner cartridge 1 pc.
Warranty sheet 1 pc. (for NAD and CND)
Setup report 1 set (for NAD, MJD and CND)
Customer satisfaction card 1 pc. (for MJD)
Packing list 1 pc. (for CND)
Customer survey sheet 1 pc. (for CND)
Certificate of conformance 1 pc. (for CND)
07/02

1
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 5
1.3 Options
Platen Cover KA-1640 PC
Automatic Document Feeder (ADF) MR-2017
Paper Feed Unit (PFU) MY-1027 / C
Expansion Memory GC-1240
Desk MH-1640
07/02

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 6
1.4 Supplies
Drum OD-1600 (except for China)
OD-2320 (for China)
Toner cartridge PS-ZT1640 (4) (for North America)
PS-ZT1640D (4) (for Asia, Central and South America)
PS-ZT1640D5K (4) (for Asia, Central and South America)
PS-ZT1640C (4) (for China)
PS-ZT1640C5K (4) (for China)
PS-ZT1640T (4) (for Taiwan)
PS-ZT1640T5K (4) (for Taiwan)
PS-ZT1640E (1) (for Europe)
PS-ZT1640E5K (1) (for Europe)
Developer material D-2320 (except for China)
D-2320C (for China)
07/02

1
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 7
1.5 System List
Fig. 1-2
Platen Cover
KA-1640PC
Desk
MH-1640
Expansion
Memory
GC-1240
Paper Feed
Unit (PFU)
MY-1027
Automatic
Document Feeder
(ADF)
MR-2017
07/02

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
SPECIFICATIONS / ACCESSORIES / OPTIONS / SUPPLIES
1 - 8

2
© 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO163/203
OUTLINE OF THE MACHINE
2 - 1
2. OUTLINE OF THE MACHINE
2.1 Sectional View
1) Front side
Fig. 2-1
A1 Original glass
A2 ADF original glass
A3 Contact image sensor unit (CIS)
A4 Scanner damp heater (Left side) DH1
A5 Scanner damp heater (Right side) DH2
A6 Scanner damp heater thermostat THMO2
B1 Laser optical unit
B2 Polygonal motor M4
C1 Pickup roller
C2 Separation claw
C3 Paper empty sensor S7
C4 Registration sensor S4
C5 Registration roller
E1 Bypass pickup roller
E2 Bypass feed roller
E3 Bypass separation pad
A2 A1A3
B1B2 C1 C2C3
E1
E2
E4
E5
E3
C4
C5
J1
J2
J3
J4J5 J8
J9
J7J6
H5
H1
H2
G1
G2
G3
I1
I4 I3
I2
I6I8
I9
I10K1
K2
K3
K4
K5
H4
H3
I5
F4
F1F2F3
I11
I7
A4 A5 A6

e-STUDIO163/203 © 2005 - 2008 TOSHIBA TEC CORPORATION All rights reserved
OUTLINE OF THE MACHINE
2 - 2
E4 Bypass paper sensor S8
E5 Bypass tray
F1 Needle electrode
F2 Main charger
F3 Main charger grid
F4 Toner cartridge
G1 Transfer charger wire
G2 Separation charger wire
G3 Transfer guide roller
H1 Drum
H2 Discharge LED
H3 Drum cleaning blade
H4 Recovery blade
H5 Drum separation finger
I1 Developer sleeve (Magnetic roller)
I2 Mixer-1
I3 Mixer-2
I4 Mixer-3
I5 Doctor blade
I6 Auto-toner sensor S6
I7 Toner recovery auger
I8 Toner recycle auger
I9 Drum thermistor THMS4
I10 Drum damp heater DH3
I11 Drum damp heater thermostat THMO3
J1 Fuser roller
J2 Pressure roller
J3 Fuser roller separation finger
J4 Center heater lamp LAMP1
J5 Side heater lamp LAMP2
J6 Center/Side/Edge thermistor THMS1/2/3
J7 Fuser thermostat THMO1
J8 Exit roller
J9 Exit sensor S5
K1 Front cover opening/closing switch SW4
K2 Front cover opening/closing interlock switch SW3
K3 Temperature/humidity sensor S3
K4 Switching regulator
K5 ADU cover opening/closing interlock switch SW2
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