ZALMAN TNN 500AF User manual

※For other language versions please visit our website.

English
English Edition
www.zalman.co.kr www.zalmanusa.com
◈Please read before installation.
◈Visit our website and watch the TNN500AF installation video first to make
our installation easier.

English
TNN 500AF
▣Welcome
Congratulations on your purchase of ZALMAN Tech’s TNN 500AF.
With TNN500AF, you are no in the orld of silent computing. TNN
500AF is the ultimate ans er to every computer user’s dream of
creating a silent computing environment ith total system stability.
▣Contents
1. Sa ety Notices
2. Features
3. Patents
4. Components
5. Optional Components
6. Speci ications
7. Operational Notes
8. Installation Guide
9. Trademarks and Copyright Notice
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1. Safety Notices
TNN 500AF
1) Keep this unit a ay from heat sources and direct sunlight.
2) This unit should be placed on a flat, level, and solid surface.
3) Al ays shut do n the operating system and s itch the AC OFF before disassembling.
4) Keep this unit in an upright position hen the AC po er is ON.
5) Do not place or spill liquids on this unit.
6) Avoid inserting any objects into the system hile it is ON.
7) Lo er the caster stops to immobilize the unit before using the system.
8) If this unit is to be transported a long distance, place it in the original packing box or a custom
made hard case.
9) Do not drop or expose this unit to shock hile it is in transit.
10) Store and use out of the reach of children.
11) Check the condition of the product and its components before installation.
If there is a problem ith the product and/or its components, please contact the Retailer
immediately.
◈ Disclaimer
Zalman Tech Co., Ltd. Is not responsible for any damages due to external causes, including
but not limited to, improper use, problems ith electrical po er, accident, neglect, alteration,
repair, improper installation, or improper testing.
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Safety Notices

TNN 500AF is the orld’s first truly noiseless high-end computer case, developed ith heatpipe
technology, HSC(Heat Source Contact) po er technology, High Capacity Extrusion technique,
and FMS (Flexible Mounting Structure) design technology by ZALMAN Tech Co., Ltd. The
TNN 500AF package contains a high performance aluminum computer case ith an absolutely
noiseless cooling solution for the CPU, VGA Card, Po er Supply, and Northbridge free of fans,
making it ideal for storage servers, orkstations, high-end home systems, and sound studio
computer systems.
1) Complete Silence
The cooling system does not generate any noise because it does not utilize any fans. Even
the HDD noise is blocked out by the sturdy aluminum plates 5 to 7mm thick, achieving
completely silent computing.
2) Stability
① No Fans in the S stem
The majority of heat generated inside the system is
transferred through heatpipes to the heatsink plates
here it is dissipated via natural convection, reducing
inflo of dust dramatically. Consequently, this
prevents system crashes caused by dust buildup and
fan failures (fans last around 20,000 to 50,000 hours).
②High-Capacit Aluminum Heatsink Plates for
Natural Convection
T o large aluminum heatsink plates cool heat
generating components, such as the CPU and VGA
Chipset, through natural convection. Without any
moving parts, the TNN 500AF is virtually free of the
need for mechanical maintenance, and it is 100%
recyclable, making it environmentally friendly.
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Features
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2. Features
TNN 500AF

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2. Features
TNN 500AF
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③ Heat Transfer via Heatpipes
Virtually ever-lasting heatpipes transfer heat a ay
from the CPU, VGA chipset, and Northbridge chipset
preventing system crashes due to over heating.
- CPU Heatpipes
Heat from the CPU is transferred to the heatsink plate
through 6 heatpipes each 6 millimeters in diameter.
The six heatpipes can transfer up to 150W of heat
from the CPU - sufficient for the hottest CPUs on the
market. The CPU Block Base is made of pure copper
to ensure the highest cooling performance.
- VGA Card Heatpipes
Heat from the VGA Card is transferred to the heatsink
plate through 3 heatpipes each 6 millimeters in
diameter. The three heatpipes can transfer up to 75W
of heat from the VGA chipset - sufficient for the hottest
VGA cards on the market.
- Northbridge Heatpipe
Heat from the Northbridge chipset is transferred to the
heatsink plate through a single heatpipe, 5 millimeters
in diameter. This heatpipe can transfer up to 20W of
heat.
③ Heat Transfer via Rear-mount Thermal Blocks
When the Rear-mount Thermal Blocks are installed on
the back-side of the motherboard in line ith the
position of the FETs (Field Effect Transistor) and the
Northbridge chipset, each can lo er the FET
temperature by 10 to 30
°C and the Northbridge chipset
by 5 to 10
°C .
CPU Heatpipes
VGA Card Heatpipes
Northbridge Heatpipe
Rear-mount Thermal Blocks

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2. Features
TNN 500AF
⑤ High-Efficienc , Fanless Power Suppl
The po er supply uses high-efficiency FET
components and Heat Source Contact (HSC)
technology, eliminating the need for a fan, and
has a 10% higher po er conversion efficiency
(80%) rating than conventional po er supplies.
Heat from the po er supply is transferred
directly to the high-capacity heatsink plates,
here it is dissipated by natural convection,
making the po er supply free of noise and
vibration.
- High-capacity active PFC inductors, separate s itching transformers for each po er rail
(+12V, +5V, +3.3V), and 2-FET for ard converter design all ork to create a superior
level of stable po er quality.
- Conventional po er supplies tend to have lo er output voltage due to line-dropping
phenomenon. The TNN Po er Supply extends the output voltage sensors up to the
motherboard connection for +3.3V, +5V, and +12V rails to prevent this, enhancing
output voltage accuracy and assuring system stability.
※ Data above ere measured according to INTEL ATX v2.03/ATX12V po er supply specs.
Measurement specifications : For each DC output, a bypass made up of one 0.1μF
ceramic capacitor and one 10μF electrolytic capacitor is connected and measured ith
an oscilloscope (input impedance 1MΩ) at a frequency band idth of 20MHz. The
aveforms may differ under different measurement conditions.
■Ripple and noise waveforms at DC output
a)+5VDC
(21.4mVp-p)
b)+3.3VDC
(42.2mVp-p)
c)+12V1DC
(80.8mVp-p)
d)+12V2DC
(88.4mVp-p)
e)-12VDC
(98.4mVp-p)
f)-5VDC
(56mVp-p)
g)+5VsdDC
(31.8mVp-p)
3) Electricity Conservation
Since TNN 500AF is equipped ith a high-efficiency po er supply and does not use any
fans, it utilizes 10 to 15% less po er compared to a conventional computer system under the
same configuration.

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2. Features
TNN 500AF
4) Ease o Use
①A latch is installed to prevent component
theft.
②The Remote Control enables the user to
conveniently experience multimedia
content and control the PC.
③Various I/O ports are provided (Audio,
USB, IEEE-1394, 1394B)
④Heatpipe HDD Cooler dissipates heat
from the hard disk and reduces vibration
transferred to the case.
⑤Four casters ( heels) ithstand up to four
metric tons of eight in total, and have
skid prevention / height adjustment
features built in.
⑥The case is structured to easily house up
to t o ODDs and five HDDs.
⑦Retractable handles are attached for
short-range transportation.
5) Shielding rom EMI (Electro-Magnetic
Inter erence)
The sturdy, thick (5 to 7mm) aluminum case and the EMI Interception
Block effectively contain EMI. Even the po er supply housing is designed
ith EMI shielding.
EMI Interception Block
EMI Interception Design
EMI Measurement Data Graphs
❶❷
❸
❹
❺
❼
❻

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2. Features
TNN 500AF
※ Test Results
▶AMD AMD64 Athlon64 S stem
①Thermal Test (Room Temperature : 25 ℃)
TNN 500AF AMD System Conventional AMD System
※Fan rpm at Full Load
②Po er Consumption Test

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2. Features
TNN 500AF
③ Configuration of Systems for Testing
④Testing Equipment and Programs
▣▣CPU Loading Program
CPU Burm (47, High)
▣▣Measurement Instrument
Personal Daq/56 (Iotech, Inc.) KIKUSUI PCR 1000L
▣▣Temperature Measurement Program
DaqView (Iotech, Inc.)

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2. Features
TNN 500AF
※ Fan rpm at Full Load
▶Intel P4 Prescott S stem
①Thermal Test (Room Temperature : 25 ℃)
②Po er Consumption Test
TNN 500AF Intel System Conventional Intel System

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3. Patents
TNN 500AF
◈Korean Patent Application #04-82817
◈Korean Patent Application #03-30358
◈Korean Design Application #03-19970
◈International patent applications pending in the EU, USA, Japan and 30+ other countries
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Patents
③Configuration of Systems for Testing
④Testing Equipment and Programs
▣▣CPU Loading Program
Maximum Power Program for the Prescott Processor Rev. 1.2
▣▣Measurement Instrument
Personal Daq/56 (Iotech, Inc.) KIKUSUI PCR 1000L
▣▣Temperature Measurement Program
DaqView (Iotech, Inc.)
※Caution
1) If the CPU has a higher Thermal Design Po er (TDP) rating than an Intel Prescott or
an AMD Athlon64 3500+, the Heatpipe Northbridge Cooler and a Rear-mount Thermal
Blocks (ZM-RTB1) MUST be installed to cool the Northbridge.
2) To use CPUs ith a 100W or higher TDP rating, Rear-mount thermal Blocks Must be
installed (one for each FET) on the backside of the motherboard in-line ith each FET.

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Components
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4. Components
TNN 500AF
Right Heatsink Plate
Front Door
Swithch & Front
Aux. Panel
Top Plate & Cover
CPU Cooler Parts
Power Inlet
Bottom Plate
ODD/FDD/HDD Bracket
Fanless Power Supply
Left Heatsink Plate
Rear Plate
Northbridge
Cooler Parts
VGA Cooler
Parts

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4. Components
TNN 500AF
1) Heatpipe CPU Cooler Parts [One(1) Bag]
1) Components for Intel Pentium 4 (Socket 478)
2) Components for Intel Pentium 4 (Socket 775)
3) Components for AMD Amd64 (Socket 478)
One (1) Socket 478 CPU Clip
Four(4) PH M4X22 bolts
T o (2) Socket 478 Finger Bolts (M3X52)
T o (2) Socket 478 Clip Supports
One(1) Socket 775 Clip Support
One(1) Socket 754 Back Plate
T o Socket 754 Finger Bolts (#6-32X40)
T o (2) Socket 754 AMD Nipples
T o (2) Socket 775 Finger Bolts (M3X49)
Four (4) PH M3X22 Bolts
2) Heatpipe VGA Cooler Parts [One(1) Bag]
VGA Block A/B & Cover [one(1) Each]
Four (4) VGA Finger Bolts A (M2.5)
Eight (8) Ram Heatsinks
Four (4) VGA Springs
Four (4) VGA Finger Bolts B (M3)
Paper Washers
3) Heatpipe Northbridge Cooler Parts [One(1) Bag]
Block Base Block Cover Thermal Pad T o (2) Common Finger Bolts
4) Heatpipe HDD Cooler
One (1) ZM-2HC2 Set
5) Rear-mount Thermal Blocks
One(1) ZM-RTB1 Set (8 Blocks)
6) HDD Set [One(1) Bag]
Five (5) Ground Wires T enty Four (24) FH #6-32X7 Bolts

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4. Components
TNN 500AF
※ Interpreting the Bolt Abbreviations
PH M4X20 : PH(Pan Head) Type, Meter Scre , 4mm in Diameter, 20mm in Length
FH #6-32X8 : FH(Flat Head) Type, Scre #6, 32 Pitches per Inch, 8mm in Length
Pan Head Pan-Washer Head Flat Head Socket Head
7) ODD/FDD Bolts
[One(1) Bag]
T elve (12) PH M3X10 Bolts
8) Motherboard Bolts
[One(1) Bag]
Ten (10) PWH M3X5 Bolts
9) Thermal Grease
2.5 ml
10) ATA 133 Cable
[One(1) Bag]
One (1) ATA 133 Cable
11) Power Cord [One(1) Bag]
One (1) Po er Cord
12) Latch Key
[One(1) Bag]
T o (2) Latch Keys
14) Motherboard Power Cable [One(1) Bag]
15)
TNN 500AF User’s Guide (1Copy)
One(1) TNN 500AF
User’s Guide
16) Spare Parts
[One(1) Bag]
Length Length Length Length
13) Remote Control Set
One(1) Remote Control
T o(2) AAA Batteries
One(1) Motherboard Po er Cable
(24 pin -> 20pin)
One(1)
Installation CD
One(1) iMON & Multi-Median
User’s Guide

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5. Optional Components
TNN 500AF
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Optional Components
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Specifications
1) Model : TNN 500AF
2) Dimensions : 400(L) x 286(W) x 597(H) mm
3) Weight : 26Kg
4) Compatible CPUs : All Intel Pentium 4 CPUs and AMD AMD64
CPUs Supported
※NOTE : When the Thermal Design Po er rating of the CPU is 100W or higher, a quiet 120mm
case fan MUST be installed and operated at 1000~1200rpm, and Rear-mount Thermal
Blocks (ZM-RTB1) must be installed on the backside of the motherboard. Refer to page 22.
1) CPUs that require a quiet case fan and Rear-mount Thermal Blocks(ZM-RTB1) (As of Oct. 30, 2004)
(※Before using one of the latest CPUs, check our ebsite for usage guidelines and
information regarding compatibility.)
CPU
Intel Pentium 4
AMD AMD64
Prescott 3.2E GHz
Prescott 550 (3.2 GHz)
Athlon 64 FX 55 (2.6 GHz)
Socket
478
775
939
TDP
103W
115W
104W
Heatpipe HDD Cooler (ZM-2HC2)

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6. Specifications
TNN 500AF
※Notes
1. NVIDIA PCX Series VGA Cards are not supported. Replace ith a Zalman-recommended
VGA card.
2. If the VGA card does not install normally due to physical incompatibility ith the case, stop
installation and replace ith a Zalman-recommended VGA card listed on the follo ing ebsite.
( .zalman.co.kr/product/TNN500AF)
2) CPUs with Thermal Design Power ratings under 100W. (As of Oct. 30, 2004)
( All CPUs that are slo er than those mentioned above have Thermal Design Po er ratings under 100W. )
3. Refer to the following website for more information regarding CPU compatibilit .
(www.zalman.co.kr/product/TNN500AF.html)
CPU
Intel Pentium 4
AMD AMD64
Northwood 3.4 GHz
Prescott 3.0E GHz
Prescott 540 (3.2 GHz)
Athlon 64 4000 + (2.4 GHz)
Athlon 64 FX 53 (2.4 GHz)
Opteron 150 (2.4 GHz)
Socket
478
478
775
775
939
940
TDP
89W
89W
84W
89W
89W
84W
5) Compatible VGA Cards
All AGP / PCI Express VGA cards that have heatsink mounting holes
(As of Oct. 30, 2004)
Manufacturer
ATI
nVidia
Matrox
Model
Up to X 800 XT
Up to geForce 6800
All Parhelia Series
Heatsink Mounting Hole

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6. Specifications
TNN 500AF
List of compatible motherboards, HDDs, and ODDs for building a TNN 500AF system is
available at the follo ing ebsite ( .zalman.co.kr/product/TNN500AF.html).
6) Thermal Trans er Capacity
①CPU Heatpipe (ZMC-6HB) : 150W
②VGA Card Heatpipe (ZMV-3HA) : 75W
③Northbridge Heatpipe (ZMN-1HB) : 20W
7) Power Supply Output Capacity : 400W
8) Power Supply Electrical Speci ications (Model : TNN400APF - V2)

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6. Specifications
TNN 500AF
9) Output Power Cable
Motherboard Power
(20-Pin)
Motherboard Power
(24-Pin)
Remote Control
Standby Power
VGA Card Auxiliary
Power
Motherboard
Auxiliary Power
HDD/ODD Power
FDD Power
VGA Card
Auxiliary Power
HDD/ODD Power
Serial ATA HDD
Power