Zte MG2639_V3 User manual

MG2639_V3 Module Hardware Design
User Manual
Version：V1.2

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Version update description
Product version
Document version
Document No.
Document update
descriptions
Date of release
MG2639_V3
V1.0
Released for the
first time
2013-9-6
MG2639_V3
V1.1
Add Refer to GPS
design 4.6
2013-11-08
MG2639_V3
V1.2
1) the module’s
thickness has
changed from
2.68mm to 3.0mm.
2) delete ‘GPS
supports passive
antenna only’ in
Section 4.6.
3) Add Section 4.7
‘Connection Method
of GPS Active
Antenna’.
2014-1-4
Writer
Document version
Date
Written by
Checked by
Approved by
1.0
2012-8-23
Cai Zongfei
1.1
2013-11-08
Cai Zongfei
1.2
2014-1-4
Zhao Xiaolin

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With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module customers
with the following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports through
telephone, website, instant messenger, E-mail, etc.

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Preface
Summary
This document describes MG2639_V3 module’s product principle diagram, module’s PINs, hardware
interface and module’s structure, and instructs the users to perform hardware design of modules, and
quickly and conveniently design different kinds of wireless terminals on the basis of this module.
Target Readers
This document mainly applies to the following engineers:
System designing engineers
Mechanical engineers
Hardware engineers
Software engineers
Test engineers

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Contents
1GENERAL DESCRIPTION OF MODULE............................................................................... 1
1.1 INTRODUCTION OF MODULE’S FUNCTIONS......................................................................1
1.2 MODULE’S APPLICATION BLOCK DIAGRAM......................................................................2
1.3 ABBREVIATIONS...................................................................... .................................................... 3
2DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES.................................................. 6
2.1 DEFINITIONS OF MODULE’S INTERFACES......................................................6
2.2 ANTENNA INTERFACE...................................................................................8
2.3 ANTENNA INTERFACE’S RF PERFORMANCE................................................11
3MODULE’S ELECTRICAL CHARACTERISTICS.................................................................. 12
3.1 DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS.....................................12
3.1.1 RESET.................................................................................................12
3.1.2 UART......................................................,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,.,,,,,12
3.1.3 I2C......................................................................................................12
3.1.4 SPI......................................................................................................13
3.1.5 PCM....................................................................................................13
3.1.6 USB....................................................................................................14
3.1.7 ADC....................................................................................................14
3.1.8 PWM..................................................................................................14
3.1.9 LCD....................................................................................................14
3.1.10GPS/GLONASS/BEIDOU......................................................................15
3.1.11CHARGING..........................................................................................16
3.1.12SIM CARD INTERFACE........................................................................16
3.1.13AUDIO INTERFACE.............................................................................16
3.1.14NETWORK SIGNAL INDICATION.........................................................17
3.2 MODULE’S POWER CONSUMPTION..............................................................17
3.3 RELIABILITY CHARACTERISTICS..................................................................17
3.4 ESD CHARACTERISTICS................................................................................18
4INTERFACE CIRCUIT DESIGN .......................................................................................... 19
4.1 RESET AND POWER DESIGN.......................................................................19

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4.2 UART INTERFACE.........................................................................................21
4.2.1 DESCRIPTIONS OF UART1 INTERFACE...............................................23
4.2.2 DESCRIPTIONS OF UART2 INTERFACE...............................................24
4.3 SIM CARD INTERFACE..................................................................................24
4.4 AUDIO INTERFACE.......................................................................................25
4.5 CHARGING INTERFACE................................................................................27
4.6 GPS INTERFACE...........................................................................................28
4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA......................................28
5PCB DESIGN ..................................................................................................................... 29
5.1 PCB DESIGN.................................................................................................29
6MODULE BOARD’S MOUNTING PROCESS AND BAKING GUIDE ..................................... 30
6.1 MODULE’S MOUNTING PROCESS.................................................................30
6.1.1 PROCESS ROUTING SELECTION.........................................................30
6.1.2 SOLDER PASTE SELECTION...............................................................30
6.1.3 DESIGN OF INTERFACE BOARD’S PAD & THICKNESSES OF GREEN OIL AND
WHITE OIL AT THE MODULE ON THE INTERFACE BOARD................30
6.1.4 DESIGN OF STEEL MESH APERTURE AT THE MODULE BOARD’S PAD ON THE
INTERFACE BOARD...........................................................................31
6.1.5 MODULE BOARD’S MOUNTING..........................................................31
6.1.6 FURNACE TEMPERATURE CURVE.....................................................32
6.1.7 REFLOW METHOD............................................................................33
6.1.8 MAINTENANCE OF RETURNED DEFECTS..........................................33
6.2 MODULE’S BAKING GUIDE..........................................................................33
6.2.1 MODULE’S BAKING ENVIRONMENT..................................................34
6.2.2 BAKING DEVICES AND OPERATION PROCEDURE..............................34
6.2.3 PARAMETER SETTINGS OF BAKING DEVICES...................................34
7. MECHANICAL DIMENSIONS............................................................................................. 35
7.1 APPEARANCE DIAGRAM.............................................................................35
7.2 MODULE’S ASSEMBLY DIAGRAM................................................................36
7.3 MODULE’S PCB PACKAGE DIMENSIONS......................................................37

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Figures
Figure 1-1 Module’s application block diagram...............................................................................................................3
Figure 2-1 π shape matching network diagram...............................................................................................................9
Figure 2-2 Antenna interface diagram.............................................................................................................................. 10
Figure 2-3 RF test socket dimensions................................................................................................................................ 11
Figure 4-1 Power & reset circuit reference design principle diagram................................................................ 19
Figure 4-2 Power reference circuit..................................................................................................................................... 20
Figure 4-3 Power-on/off time sequence .......................................................................................................................... 21
Figure 4-4 UART interface reference design diagram................................................................................................ 22
Figure 4-5 UART1 DCE－DTE connection relationship diagram....................................................................... 23
Figure 4-6 UART2 DCE－DTE connection relationship diagram........................................................................... 24
Figure 4-7 SIM card circuit reference design diagram............................................................................................... 25
Figure 4-8 Audio interface circuit reference design principle diagram.............................................................. 26
Figure 4-9 Charging interface circuit reference design principle diagram ....................................................... 27
Figure 5-1 Furnace temperature curve.......................................................................................错误！未定义书签。
Figure 6-1 MG2639_V3 appearance diagram................................................................................................................. 35
Figure 6-2 Module’s assembly diagram............................................................................................................................ 36
Figure 6-3 Relevant package dimensions from TOP view ........................................................................................ 37
Figure 6-4 Relevant package dimensions from BOTTOM view.............................................................................. 38
Tables
Table 1-1 Module’s functions...................................................................................................................................................1
Table 2-1 60pin stamp-hole definitions ..............................................................................................................................6
Table 2-2 Antenna interface’s RF performance.............................................................................................................11
Table 3-1 UART interface signal definitions................................................................................................................... 12
Table 3-2 I2C interface signal definitions........................................................................................................................ 13
Table 3-3 SPI Interface signal definitions ........................................................................................................................ 13
Table 3-4 PCM interface signal definitions...................................................................................................................... 13
Table 3-5 USB interface signal definitions....................................................................................................................... 14
Table 3-6 ADC interface signal definitions......................................................................................................................14
Table 3-7 PWM interface signal definitions.................................................................................................................... 14
Table 3-8 LCD interface signal definitions....................................................................................................................... 14

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Table 3-9 GPS/GLONASS/Beidou interface signal definitions................................................................................15
Table 3-10 GPS basic parameters........................................................................................................................................ 15
Table 3-11 Charging interface signal definitions.......................................................................................................... 16
Table 3-12 SIM card interface signal definitions ..........................................................................................................16
Table 3-13 Audio interface signal definitions................................................................................................................ 17
Table 3-14 MG2639_V3 power consumption................................................................................................................. 17
Table 3-15 MG2639_V3 module’s temperature characteristics.............................................................................18
Table 3-16 ESD characteristics............................................................................................................................................. 18
Table 4-1 Voltage characteristics ........................................................................................................................................ 20
Table 4-3 UART1 interface definitions.............................................................................................................................. 23
Table 4-4 UART2 interface definitions.............................................................................................................................. 24

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1General description of module
Developed by ZTE Corporation, MG2639_V3 is a kind of GSM850/EGSM900/DCS1800/ PCS1900
industrial module with the independent GPS function, which can be built in the Set-Top-Box,
vehicle-mounted terminals through a 60-PIN stamp-hole interface, and it allows users to
send/receive Emails, browse the web pages and download at high speed anywhere and anytime.
In a place where the GSM network is covered, users can get access to the Internet any time,
send/receive SMS and dial/answer voice calls, etc. In the field of mobile data communication, it
provides a highly free and convenient solution to users and truly realizes the dream of mobile office.
This chapter mainly provides a general description of the module, including basic functions and
logic block diagram.
1.1 Introduction of module’s functions
See the functions of MG2639_V3 module in table 1-1:
Table 1-1 Module’s functions
Parameters
MG2639_V3
General Features
Frequency bands
GSM850/EGSM900/DCS1800/PCS1900
GPS
GPS/GLONASS/Beidou
Dimensions
30.0 × 25.0 x 3.0mm
Weight
7g
Operating temperature
-35°C~+75°C
Limited temperature range
-40°C~+85°C
Storage temperature
-40°C~+85°C
Performance
Operating voltage
3.4V~4.2V
Typical=: 3.8V
Standard power consumption
Standby current: 24mA@-75dBm
Sleep current：1mA
Talk Current:: 128mA@-75dBm
Max. Current: 300mA@-104dBm
Max. TX power
GSM850/EGSM900: Class 4 (2W)
DCS1800/PCS1900: Class 1 (1W)
Rx. signal sensitivity
<-106dBm
Interfaces

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Parameters
MG2639_V3
Connector
60pin Stamp-hole interface
Antenna
SMT 50Ω antenna connector
Integrated Full Duplex UART
AT commands/Data transmission
SIM card socket level
1.8V/3.0V
Data service
GPRS
Class 10
Mobile Station
Class B
Max Downlink
85.6kbps
Max Uplink
42.8kbps
Protocol
Internal TCP/IP & UDP protocol stack
Embedded FTP
SMS
Support TEXT/PDU Mode
Point-to-point MO/MT
SMS Cell Broadcast
Voice call
Audio encoder HR/FR/EFR/AMR//
Echo Cancellation/Volume Control/DTMF
AT Command Set
GSM 07.05/GSM 07.07/ZTE Proprietary AT
Commands
1.2 Module’s application block diagram
See the application block diagram of MG2639_V3 in the following figure:

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Figure 1-1 Module’s application block diagram
1.3 Abbreviations
A
ADC
Analog-Digital Converter
AFC
Automatic Frequency Control
AGC
Automatic Gain Control
ARFCN
Absolute Radio Frequency Channel Number
ARP
Antenna Reference Point
ASIC
Application Specific Integrated Circuit
B
BER
Bit Error Rate
BTS
Base Transceiver Station
C
CDMA
Code Division Multiple Access
CDG
CDMA Development Group
CS
Coding Scheme
CSD
Circuit Switched Data
CPU
Central Processing Unit
D
DAI
Digital Audio interface
DAC
Digital-to-Analog Converter
DCE
Data Communication Equipment
DSP
Digital Signal Processor
DTE
Data Terminal Equipment
DTMF
Dual Tone Multi-Frequency
DTR
Data Terminal Ready
E
EDGE
Enhanced Data Rate for GSM Evolution
EFR
Enhanced Full Rate
EGSM
Enhanced GSM

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EMC
Electromagnetic Compatibility
EMI
Electro Magnetic Interference
ESD
Electronic Static Discharge
ETS
European Telecommunication Standard
F
FDMA
Frequency Division Multiple Access
FR
Full Rate
G
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
GPS
Global Positioning System
H
HR
Half Rate
I
IC
Integrated Circuit
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
L
LCD
Liquid Crystal Display
LED
Light Emitting Diode
M
MCU
Machine Control Unit
MMI
Man Machine Interface
MS
Mobile Station
MTBF
Mean Time Before Failure
P
PCB
Printed Circuit Board
PCL
Power Control Level
PCS
Personal Communication System
PDU
Protocol Data Unit
PLL
Phase Locked Loop
PPP
Point-to-point protocol
R
RAM
Random Access Memory
RF
Radio Frequency
ROM
Read-only Memory
RMS
Root Mean Square
RTC
Real Time Clock
S
SIM
Subscriber Identification Module
SMS
Short Message Service
SMT
Surface Mount Technology
SRAM
Static Random Access Memory
T
TA
Terminal adapter
TDMA
Time Division Multiple Access
TE
Terminal Equipment also referred it as DTE
U
UART
Universal asynchronous receiver-transmitter

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UIM
User Identifier Management
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
V
VSWR
Voltage Standing Wave Ratio
Z
ZTE
ZTE Corporation

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2Descriptions of module’s external interf aces
MG2639_V3 module connects externally through a 60PIN stamp-hole interface.
2.1 Definitions of module’s interf aces
See the definitions of MG2639_V3 module’s 60PIN stamp-hole interface in the following table:
Table 2-1 60pin stamp-hole definitions
PIN
No.
PIN Name
Functions
Default
signal
direction,
whether or
not used for
GPIO（X）
Descriptions
Remarks
1
GND
Ground
Ground
2
RF_ANT
RF
I/O
RF antenna plug
3
GND
Ground
Ground
4
RING
UART1
Output,
GPIO9
Ringer signal
indication
The voltage varies upon
an incoming call or
receipt of text message.
2.8V IO
5
GND
Ground
Ground
6
VBAT
Power
Input
Work voltage
3.4~4.2V
7
RSSI_LED
LED
Output,
GPIO58
Network signal
indication
--Need add dynatron to
drive. The LED is ON at
high level.
-Power on state: the LED
is off;
- Network searching
state: the LED blinks at
3Hz
- Idle state: the LED
blinks at 1Hz
-Traffic state (call, data):
the LED blinks at 5Hz
8
URTS1
UART1
Output,
GPIO47
Ready to send
2.8V IO
9
UCTS1
UART1
Input,
GPIO48
Clear to send
2.8V IO
10
DCD1
UART1
Output,
GPIO15
Carrier detection
2.8V IO
11
SIM_RST
SIM card
Output
SIM card reset
12
SIM_CLK
SIM card
Output
SIM card clock
13
SIM_DATA
SIM card
I/O
SIM card data
14
VSIM
SIM card
Output
SIM card voltage
15
GND
Ground
Ground

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16
GPS_ANT
GPS
Input
GPS antenna
17
GND
Ground
Ground
18
V_GPS
GPS
Input
GPS power input
3.4V~4.2V
19
GPS_URXD
GPS
Input
GPS port
2.8V IO
20
GPS_UTXD
GPS
Output
GPS port
2.8V IO
21
VRTC
GPS RTC
Power
Input
Connect button
battery
2.0V~3.3V
22
GPS_FIXED_L
ED
GPS
Output
GPS status
indicator
2.8V IO，externally
connect dynatron to drive
the LED
23
BATSNS
Charging
control
Input
Battery voltage
detection
Need externally connect
charging circuit
24
ISENSE
Charging
control
Input
Charging current
detection
Need externally connect
charging circuit
25
VCHG
Power
Input
Charging power
4.3V~5V
26
CHR_LDO
Charging
control
Output
Charging ON/OFF
2.8V
27
GATDRV
Charging
control
Output
Charging
dynatron control
Need externally connect
charging circuit
28
ADCIN
Analogue
signal input
Input
ADC voltage
detection
0~2.8V
29
URXD1/SPIM
OSI
UART1/SPI
Input,
GPIO20
Receiving data for
serial port, UART1
can be used as SPI
interface when
not used
2.8V IO
30
UTXD1/SPIMI
SO
UART1/SPI
Output，
GPIO21
Port sending,
UART1 can be
used as SPI
interface when
not used
2.8V IO
31
SYSRST_N
Reset
Input
Reset signal
Valid at low level
32
EAR_L
Analogue
audio
Output
Earpiece speaker
anode
33
RECP
Analogue
audio
Output
Receiver speaker
anode
34
RECN
Analogue
audio
Output
Receiver speaker
cathode
35
MIC_P1
Analogue
audio
Input
Earpiece MIC
anode
36
MIC_P0
Analogue
audio
Input
Receiver MIC
anode
37
MIC_N0
Analogue
audio
Input
Receiver MIC
cathode
38
PWRKEY_N
Power key
Input
Power on/off
Valid at low level; need
external connect a
open-collector or
open-drain switch.
39
DTR1
UART1
Input,
GPIO5
Data terminal
ready _WAKEUP
2.8V IO
40
DSR1
UART1
Output,
Data set ready
2.8V IO

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GPIO19
41
VDDIO
LDO output
Output
2.8V
42
GND
Ground
Ground
43
URXD2
UART2
Input,
GPIO22
Receiving data
from serial port
2.8V IO
44
UTXD2
UART2
Output,
GPIO23
Transmitting data
from serial port
2.8V IO
45
USB_DM
USB
I/O
USB data -
46
USB_DP
USB
I/O
USB data +
47
LSDA0
Serial LCD
Output，
GPIO38
Serial LCD data
cable data0
1.8V IO
48
LSCE0B0
Serial LCD
Output，
GPIO40
Serial LCD
enabled
1.8V IO
49
LSRSTB
Serial LCD
Output，
GPIO46
Serial LCD reset
1.8V IO
50
LSCK0
Serial LCD
Output，
GPIO37
Serial LCD clock
cable
1.8V IO
51
LSDI0
Serial LCD
Input，
GPIO39
Serial LCD data
cable input
1.8V IO
52
LSA0DA0
Serial LCD
Output，
GPIO36
Serial LCD data
cable1
1.8V IO
53
SDA28/SPICS
I2C/SPI
I/O，GPIO2
I2C data cable,
also used for SPI
chip select
2.8V IO
54
SCL28/SPISC
K
I2C/SPI
Output，
GPIO1
I2C clock cable,
also used for SPI
clock;
2.8V IO
55
PWM/EARDE
T
PWM output
Output，
GPIO0
PWM output,
PWM can be used
as earpiece insert
detection when
not used
2.8V IO
56
PCMRST
PCM reset
Output，
GPIO56
Reset external
PCM settings
2.8V IO
57
PCMOUT
PCM
Output，
GPIO54
PCM data output
2.8V IO
58
PCMCLK
PCM
Output，
GPIO50
PCM clock
2.8V IO
59
PCMSYNC
PCM
Output，
GPIO55
PCM bytes SYNC
2.8V IO
60
PCMIN
PCM
Input，
GPIO53
PCM data input
2.8V IO
2.2 Antenna Interf ace
Regarding the antenna of MG2639_V3 module, proper measures should be taken to reduce the
access loss of effective bands, and good shielding should be established between external antenna

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and RF connector. Besides, external RF cables should be kept far away from all interference sources
such as high-speed digital signal or switch power supply.
According to the standard for mobile devices, the stationary wave ratio of MG2639_V3 module’s
antenna should be between 1.1 and 1.5, and input impedance is 50 ohm. Different environments may
have different requirements on the antenna’s gain. Generally, the larger gain in the band and smaller
outside the band, the better performance the antenna has.
Isolation degree among ports must more than 30dB when multi-ports antenna is used. For
example, between two different polarized ports on dual-polarized antenna, two different frequency
ports on dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna,
isolation degree should be more than 30dB.
MG2639_V3 module provides both GSM and GPS antenna interface, and either interface provides
both RF socket and stamp-hole connection method; therefore users can select reasonably according
to the product form to optimize the cost of BOM.
Scenario 1：
PIN2 and PIN16 are respectively used as the input pin for GSM and GPS antenna. Pay attention to
the following when using it as the antenna’s feed PIN:
（1）The feed connected to PIN2 or PIN 16 is 50ohm micro-strip or strip line. To approach the
module, put π shape matching network for later tuning. See π shape matching network
in the diagram below:
Figure 2-1 πshape matching network diagram
（2）The RF wires must be kept away from the GND, and generally the distance should be 3 times
of the width of RF wires.

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（3）It’s forbidden to put some interference sources such as DC to DC, WIFI module around RF
wires or RF port.
Scenario 2:
When using GSM/GPS RF socket as the antenna feed, disconnect PIN2/PIN16 from the main
board and make sure there are some empty areas below or around PIN2/PIN16. Keep 2mm distance
between the surface of PIN2/PIN16 and GND, and drill holes below PIN2/PIN16. It’s not suggested to
use the compatible design of PIN2/PIN16 at the same time when using the RF connector.
Figure 2-2 Antenna interface diagram

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Figure 2-3 RF test socket dimensions
2.3 Antenna interf ace’s RF perf ormance
See the antenna interface’s RF performance in table 2-2:
Table 2-2 Antenna interface’s RF performance
Antenna
interface’s RF
performance
Module’s uplink
（MS->BTS）
Module’s downlink
（BTS->MS）
Max. Tx.
Power
（dBm）
Antenna
interface’s Rx.
sensitivity
GSM850
824MHz-849MHz
869MHz-894MHz
33±2
< -107dBm
EGSM900
880MHz-915MHz
925MHz-960MHz
33±2
< -107dBm
DCS1800
1710MHz-1785MHz
1805MHz-1880MHz
30±2
< -106dBm
PCS1900
1850MHz-1910MHz
1930MHz-1990MHz
30±2
< -106dBm