Zte MG2639_V3 User manual

MG2639_V3 Module Hardware Design
User Manual
Version：V1.2

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
I
Copyright Statement
If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms
and conditions; if you don’t agree, please stop using this manual.
The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not
expressly granted in this manual. The contents in this manual are the proprietary information of
ZTE Corporation. This manual and any image, table, data or other information contained in this
manual may not be reproduced, transferred, distributed utilized or disclosed without the prior
written permission of ZTE Corporation.
and are the registered trademark of ZTE Corporation. All other trademarks
appeared in this manual are owned by the relevant companies. Nothing contained in this manual
should be construed as granting, by implication, estoppel, or otherwise, any license or right to use
any trademarks displayed in this manual without the prior written permission of ZTE Corporation
or third-party obligee.
This product conforms to the design requirements of relevant environment protection and
personal safety. The storage, usage and disposal of this product should comply with the product
user manual, relevant contracts or requirements of laws and regulation in relevant countries.
ZTE Corporation keeps the right to modify or improve the product described in the manual without
prior notice; and meanwhile keeps the right to modify or retract this manual.
If there is anything ambiguous in this manual, please consult ZTE Corporation or its distributor or
agent promptly.

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
II
Version update description
Product version
Document version
Document No.
Document update
descriptions
Date of release
MG2639_V3
V1.0
Released for the
first time
2013-9-6
MG2639_V3
V1.1
Add Refer to GPS
design 4.6
2013-11-08
MG2639_V3
V1.2
1) the module’s
thickness has
changed from
2.68mm to 3.0mm.
2) delete ‘GPS
supports passive
antenna only’ in
Section 4.6.
3) Add Section 4.7
‘Connection Method
of GPS Active
Antenna’.
2014-1-4
Writer
Document version
Date
Written by
Checked by
Approved by
1.0
2012-8-23
Cai Zongfei
1.1
2013-11-08
Cai Zongfei
1.2
2014-1-4
Zhao Xiaolin

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
III
With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module customers
with the following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports through
telephone, website, instant messenger, E-mail, etc.

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
IV
Preface
Summary
This document describes MG2639_V3 module’s product principle diagram, module’s PINs, hardware
interface and module’s structure, and instructs the users to perform hardware design of modules, and
quickly and conveniently design different kinds of wireless terminals on the basis of this module.
Target Readers
This document mainly applies to the following engineers:
System designing engineers
Mechanical engineers
Hardware engineers
Software engineers
Test engineers

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
V
Contents
1GENERAL DESCRIPTION OF MODULE............................................................................... 1
1.1 INTRODUCTION OF MODULE’S FUNCTIONS......................................................................1
1.2 MODULE’S APPLICATION BLOCK DIAGRAM......................................................................2
1.3 ABBREVIATIONS...................................................................... .................................................... 3
2DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES.................................................. 6
2.1 DEFINITIONS OF MODULE’S INTERFACES......................................................6
2.2 ANTENNA INTERFACE...................................................................................8
2.3 ANTENNA INTERFACE’S RF PERFORMANCE................................................11
3MODULE’S ELECTRICAL CHARACTERISTICS.................................................................. 12
3.1 DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS.....................................12
3.1.1 RESET.................................................................................................12
3.1.2 UART......................................................,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,.,,,,,12
3.1.3 I2C......................................................................................................12
3.1.4 SPI......................................................................................................13
3.1.5 PCM....................................................................................................13
3.1.6 USB....................................................................................................14
3.1.7 ADC....................................................................................................14
3.1.8 PWM..................................................................................................14
3.1.9 LCD....................................................................................................14
3.1.10GPS/GLONASS/BEIDOU......................................................................15
3.1.11CHARGING..........................................................................................16
3.1.12SIM CARD INTERFACE........................................................................16
3.1.13AUDIO INTERFACE.............................................................................16
3.1.14NETWORK SIGNAL INDICATION.........................................................17
3.2 MODULE’S POWER CONSUMPTION..............................................................17
3.3 RELIABILITY CHARACTERISTICS..................................................................17
3.4 ESD CHARACTERISTICS................................................................................18
4INTERFACE CIRCUIT DESIGN .......................................................................................... 19
4.1 RESET AND POWER DESIGN.......................................................................19

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
VI
4.2 UART INTERFACE.........................................................................................21
4.2.1 DESCRIPTIONS OF UART1 INTERFACE...............................................23
4.2.2 DESCRIPTIONS OF UART2 INTERFACE...............................................24
4.3 SIM CARD INTERFACE..................................................................................24
4.4 AUDIO INTERFACE.......................................................................................25
4.5 CHARGING INTERFACE................................................................................27
4.6 GPS INTERFACE...........................................................................................28
4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA......................................28
5PCB DESIGN ..................................................................................................................... 29
5.1 PCB DESIGN.................................................................................................29
6MODULE BOARD’S MOUNTING PROCESS AND BAKING GUIDE ..................................... 30
6.1 MODULE’S MOUNTING PROCESS.................................................................30
6.1.1 PROCESS ROUTING SELECTION.........................................................30
6.1.2 SOLDER PASTE SELECTION...............................................................30
6.1.3 DESIGN OF INTERFACE BOARD’S PAD & THICKNESSES OF GREEN OIL AND
WHITE OIL AT THE MODULE ON THE INTERFACE BOARD................30
6.1.4 DESIGN OF STEEL MESH APERTURE AT THE MODULE BOARD’S PAD ON THE
INTERFACE BOARD...........................................................................31
6.1.5 MODULE BOARD’S MOUNTING..........................................................31
6.1.6 FURNACE TEMPERATURE CURVE.....................................................32
6.1.7 REFLOW METHOD............................................................................33
6.1.8 MAINTENANCE OF RETURNED DEFECTS..........................................33
6.2 MODULE’S BAKING GUIDE..........................................................................33
6.2.1 MODULE’S BAKING ENVIRONMENT..................................................34
6.2.2 BAKING DEVICES AND OPERATION PROCEDURE..............................34
6.2.3 PARAMETER SETTINGS OF BAKING DEVICES...................................34
7. MECHANICAL DIMENSIONS............................................................................................. 35
7.1 APPEARANCE DIAGRAM.............................................................................35
7.2 MODULE’S ASSEMBLY DIAGRAM................................................................36
7.3 MODULE’S PCB PACKAGE DIMENSIONS......................................................37

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
VII
Figures
Figure 1-1 Module’s application block diagram...............................................................................................................3
Figure 2-1 π shape matching network diagram...............................................................................................................9
Figure 2-2 Antenna interface diagram.............................................................................................................................. 10
Figure 2-3 RF test socket dimensions................................................................................................................................ 11
Figure 4-1 Power & reset circuit reference design principle diagram................................................................ 19
Figure 4-2 Power reference circuit..................................................................................................................................... 20
Figure 4-3 Power-on/off time sequence .......................................................................................................................... 21
Figure 4-4 UART interface reference design diagram................................................................................................ 22
Figure 4-5 UART1 DCE－DTE connection relationship diagram....................................................................... 23
Figure 4-6 UART2 DCE－DTE connection relationship diagram........................................................................... 24
Figure 4-7 SIM card circuit reference design diagram............................................................................................... 25
Figure 4-8 Audio interface circuit reference design principle diagram.............................................................. 26
Figure 4-9 Charging interface circuit reference design principle diagram ....................................................... 27
Figure 5-1 Furnace temperature curve.......................................................................................错误！未定义书签。
Figure 6-1 MG2639_V3 appearance diagram................................................................................................................. 35
Figure 6-2 Module’s assembly diagram............................................................................................................................ 36
Figure 6-3 Relevant package dimensions from TOP view ........................................................................................ 37
Figure 6-4 Relevant package dimensions from BOTTOM view.............................................................................. 38
Tables
Table 1-1 Module’s functions...................................................................................................................................................1
Table 2-1 60pin stamp-hole definitions ..............................................................................................................................6
Table 2-2 Antenna interface’s RF performance.............................................................................................................11
Table 3-1 UART interface signal definitions................................................................................................................... 12
Table 3-2 I2C interface signal definitions........................................................................................................................ 13
Table 3-3 SPI Interface signal definitions ........................................................................................................................ 13
Table 3-4 PCM interface signal definitions...................................................................................................................... 13
Table 3-5 USB interface signal definitions....................................................................................................................... 14
Table 3-6 ADC interface signal definitions......................................................................................................................14
Table 3-7 PWM interface signal definitions.................................................................................................................... 14
Table 3-8 LCD interface signal definitions....................................................................................................................... 14

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
VIII
Table 3-9 GPS/GLONASS/Beidou interface signal definitions................................................................................15
Table 3-10 GPS basic parameters........................................................................................................................................ 15
Table 3-11 Charging interface signal definitions.......................................................................................................... 16
Table 3-12 SIM card interface signal definitions ..........................................................................................................16
Table 3-13 Audio interface signal definitions................................................................................................................ 17
Table 3-14 MG2639_V3 power consumption................................................................................................................. 17
Table 3-15 MG2639_V3 module’s temperature characteristics.............................................................................18
Table 3-16 ESD characteristics............................................................................................................................................. 18
Table 4-1 Voltage characteristics ........................................................................................................................................ 20
Table 4-3 UART1 interface definitions.............................................................................................................................. 23
Table 4-4 UART2 interface definitions.............................................................................................................................. 24

User Manual
This document is not allowed to
transmit without ZTE Corporation’s
permission
©ZTE CORPORATION All rights reserved
1
1General description of module
Developed by ZTE Corporation, MG2639_V3 is a kind of GSM850/EGSM900/DCS1800/ PCS1900
industrial module with the independent GPS function, which can be built in the Set-Top-Box,
vehicle-mounted terminals through a 60-PIN stamp-hole interface, and it allows users to
send/receive Emails, browse the web pages and download at high speed anywhere and anytime.
In a place where the GSM network is covered, users can get access to the Internet any time,
send/receive SMS and dial/answer voice calls, etc. In the field of mobile data communication, it
provides a highly free and convenient solution to users and truly realizes the dream of mobile office.
This chapter mainly provides a general description of the module, including basic functions and
logic block diagram.
1.1 Introduction of module’s functions
See the functions of MG2639_V3 module in table 1-1:
Table 1-1 Module’s functions
Parameters
MG2639_V3
General Features
Frequency bands
GSM850/EGSM900/DCS1800/PCS1900
GPS
GPS/GLONASS/Beidou
Dimensions
30.0 × 25.0 x 3.0mm
Weight
7g
Operating temperature
-35°C~+75°C
Limited temperature range
-40°C~+85°C
Storage temperature
-40°C~+85°C
Performance
Operating voltage
3.4V~4.2V
Typical=: 3.8V
Standard power consumption
Standby current: 24mA@-75dBm
Sleep current：1mA
Talk Current:: 128mA@-75dBm
Max. Current: 300mA@-104dBm
Max. TX power
GSM850/EGSM900: Class 4 (2W)
DCS1800/PCS1900: Class 1 (1W)
Rx. signal sensitivity
<-106dBm
Interfaces