ASROCK B560M-HDV R3.0 User manual

Contact Information
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support request form at https://event.asrock.com/tsd.asp
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B560M-HDV R3.0
Motherboard Layout

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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
5 ATX Power Connector (ATXPWR1)
6 USB 3.2 Gen1 Header (USB3_3_4)
7 USB 2.0 Header (USB_5_6)
8 SATA3 Connector (SATA3_3) (Upper), SATA3 Connector (SATA3_2) (Lower)
9 SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_0)
11 System Panel Header (PANEL1)
12 SPI TPM Header (SPI_TPM_J1)
13 Chassis Intrusion and Speaker Header (SPK_CI1)
14 Clear CMOS Jumper (CLRMOS1)
15 Front Panel Audio Header (HD_AUDIO1)

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B560M-HDV R3.0
I/O Panel
No. Description No. Description
1 D-Sub Port 7 USB 2.0 Ports (USB_3_4)
2 PS/2 Mouse Port 8 USB 3.2 Gen1 Ports (USB3_1_2)
3 LAN RJ-45 Port* 9 USB 2.0 Ports (USB_1_2)
4 Line In (Light Blue)** 10 PS/2 Keyboard Port
5 Front Speaker (Lime)** 11 DVI-D Port
6 Microphone (Pink)** 12 HDMI Port
12 67
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5
4
3
8
1
9
10
2
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Port
** Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

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Chapter 1 Introduction
ank you for purchasing ASRock B560M-HDV R3.0 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
1.1 Package Contents
• ASRock B560M-HDV R3.0 Motherboard (Micro ATX Form Factor)
• ASRock B560M-HDV R3.0 User Manual
• ASRock B560M-HDV R3.0 Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please visit our website for specic information about the model
you are using. You may nd the latest VGA cards and CPU support list on ASRock’s
website as well. ASRock website http://www.asrock.com.

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B560M-HDV R3.0
1.2 Specications
Platform • Micro ATX Form Factor
• Solid Capacitor design
CPU • Supports 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
• 5 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
Chipset • Intel® B560
Memory • Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• 11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4000+(OC)*
• 10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 3600+(OC)*
* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
11th Gen Intel® CoreTM Processors
• 1 x PCI Express 4.0 x16 Slot*
10th Gen Intel® CoreTM Processors
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 1 x PCI Express 3.0 x1 Slot
Graphics • Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
* Graphics specications may vary between CPU types.

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• 11th Gen Intel® CoreTM Processors support Intel® XeGraphics
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
• ree graphics output options: D-Sub, DVI-D and HDMI
* Supports up to 2 displays simultaneously
• Supports HDMI 2.0 with max. resolution up to 4K x 2K
(4096x2160) @ 60Hz with 11th Gen Intel® CoreTM Processors
• Supports HDMI 1.4 with max. resolution up to 4K x 2K
(4096x2160) @ 30Hz with 10th Gen Intel® CoreTM Processors
• Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
• Supports D-Sub with max. resolution up to 1920x1200 @
60Hz
• Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
• Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports
• Supports HDCP 2.2 with DVI-D and HDMI Ports (HDCP
2.3 ready with 11th Gen Intel® Core™ Processors)
Audio • 7.1 CH HD Audio (Realtek ALC887/897 Audio Codec)
• Supports Surge Protection
LAN • PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• 1 x Realtek RTL8111H
• Supports Wake-On-LAN
• Supports Lightning/ESD Protection
• Supports Energy Ecient Ethernet 802.3az
• Supports PXE
Rear Panel
I/O
• 1 x PS/2 Keyboard Port
• 1 x PS/2 Mouse Port
• 1 x D-Sub Port
• 1 x DVI-D Port
• 1 x HDMI Port
• 2 x USB 3.2 Gen1 Ports (Supports ESD Protection)
• 4 x USB 2.0 Ports (Supports ESD Protection)
• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
• HD Audio Jacks: Line in / Front Speaker / Microphone

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B560M-HDV R3.0
Storage • 4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
Technology 18, NCQ, AHCI and Hot Plug
Connector • 1 x SPI TPM Header
• 1 x Chassis Intrusion and Speaker Header
• 1 x CPU Fan Connector (4-pin)
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
• 1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in
use.
• 1 x 24 pin ATX Power Connector
• 1 x 8 pin 12V Power Connector
• 1 x Front Panel Audio Connector
• 1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
ESD Protection)
• 1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
(Supports ESD Protection)
BIOS
Feature
• AMI UEFI Legal BIOS with multilingual GUI support
• ACPI 6.0 Compliant wake up events
• SMBIOS 2.7 Support
• CPU Core/Cache, CPU GT, VCCSA, DRAM, VCCIO, CPU
Standby, VCCIN AUX Voltage Multi-adjustment
Hardware
Monitor
• Fan Tachometer: CPU, Chassis/Water Pump Fans
• Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
ture): CPU, Chassis/Water Pump Fans
• Fan Multi-Speed Control: CPU, Chassis/Water Pump Fans
• CASE OPEN detection
• Voltage monitoring: CPU Vcore, +12V, +5V, +3.3V
OS • Microso® Windows® 10 64-bit / 11 64-bit
Certica-
tions
• FCC, CE
• ErP/EuP ready (ErP/EuP ready power supply is required)

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* For detailed product information, please visit our website: http://www.asrock.com
Please realize that there is a certain risk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.

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B560M-HDV R3.0
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
• Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
• In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a
grounded wrist strap or touch a safety grounded object before you handle the
components.
• Hold components by the edges and do not touch the ICs.
• Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
• When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
Chapter 2 Installation

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2.1 Installing the CPU
1. Before you insert the 1200-Pin CPU into the socket, please check if the PnP cap
is on the socket, if the CPU surface is unclean, or if there are any bent pins in the
socket. Do not force to insert the CPU into the socket if above situation is found.
Otherwise, the CPU will be seriously damaged.
2. Unplug all power cables before installing the CPU.
1
2
A
B

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B560M-HDV R3.0
4
5
3

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Please save and replace the cover if the processor is removed. e cover must be
placed if you wish to return the motherboard for aer service.

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B560M-HDV R3.0
2.2 Installing the CPU Fan and Heatsink
1 2
CPU_FAN

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2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
e DIMM only ts in one correct orientation. It will cause permanent damage to
the motherboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
1. For dual channel conguration, you always need to install identical (the same
brand, speed, size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one memory
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.

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B560M-HDV R3.0
1
2
3

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2.4 Expansion Slots (PCI Express Slots)
ere are 2 PCI Express slots slot on the motherboard.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
Before installing an expansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Please read the documentation of the
expansion card and make necessary hardware settings for the card before you start
the installation.

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B560M-HDV R3.0
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLRMOS1)
(see p.1, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option
“Clear Status” to clear the record of previous chassis intrusion status.

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2.6 Onboard Headers and Connectors
System Panel Header
(9-pin PANEL1)
(see p.1, No. 11)
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.1, No. 13)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
PWRBTN (Power Switch):
Connect to the power switch on the chassis front panel. You may congure the way to
turn o your system using the power switch.
RESET (Reset Switch):
Connect to the reset switch on the chassis front panel. Press the reset switch to restart
the computer if the computer freezes and fails to perform a normal restart.
PLED (System Power LED):
Connect to the power status indicator on the chassis front panel. e LED is on when
the system is operating. e LED keeps blinking when the system is in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Hard Drive Activity LED):
Connect to the hard drive activity LED on the chassis front panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists
of power switch, reset switch, power LED, hard drive activity LED, speaker and etc.
When connecting your chassis front panel module to this header, make sure the wire
assignments and the pin assignments are matched correctly.
GND
RESET#
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY

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B560M-HDV R3.0
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GN D
OUT2_R
MIC2_R
MIC2_L
OUT_RET
Serial ATA3 Connectors
Right Angle:
(SATA3_3:
see p.1, No. 8) (Upper)
(SATA3_2:
see p.1, No. 8) (Lower)
Vertical:
(SATA3_0:
see p.1, No. 10)
(SATA3_1:
see p.1, No. 9)
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up
to 6.0 Gb/s data transfer
rate.
USB 2.0 Header
(9-pin USB_5_6)
(see p.1, No. 7)
ere is one USB2.0
header on this
motherboard. is USB
2.0 header can support
two ports.
USB 3.2 Gen1 Header
(19-pin USB3_3_4)
(see p.1, No. 6)
ere is one header on
this motherboard. is
USB 3.2 Gen1 header can
support two ports.
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 15)
is header is for
connecting audio devices
to the front audio panel.
SATA3_0 SATA3_1
SATA3_3 SATA3_2
1
IntA_PB_D+
Dummy
IntA_PB_D-
GND
IntA_PB_SSTX+
GND
IntA_PB_SSTX-
IntA_PB_SSRX+
IntA_PB_SSRX-
VbusVbus
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+