Atten AT-R1816 User manual

Contents
Introduction……………………………………………………........................3
Main technique parameter……………………………………..........................4
Structure introduction……………………………………….............................5
Function key introduction………………………………………………..….....6
The function of temperature curve………………………………………......6-8
Common alloy solder temperature curve adjustment parameters…………......9
Common alloy solder physical constant and characteristics……………..…..10
Running operation……………………………………………………...…11-19
Back soldering operation………………………………………………….19-20
Faults alarm……………………………………………………………….20-22
Attentions………………………………………………..……………….…..22
Parameters of the fixed curves …………...……..…………………………...23

Introduction
The “IR LEAD-LESS REFLOW OVEN” is equipment that used for
electronics production and the maintainance and repair of SMD components.
The AT-R1816 useses the far-infrared for heating the SMD components and
senses the temperature. Through the precise control of the microcomputer, the
AT-R1816 can make a temperature control curve to match the request of the
SMD production technique completely. The “temperature control curve” of the
AT-R1816 can be adjusted accurately, so it can be used for many kinds of
soldering paste which all have different material properties. It can shut down
automatically when there is a alarm or any faults. The AT-R1816 also can be
used for many other functions, such as soldering, maintenance and drying.

Main technique parameter
1 、 Working voltage: AC220V(AC110V order)
2 、 Working frequency:50-60Hz
3 、 Maximum output power: 600W
4 、 Heating methods: infrared radiation and hot air mix heating
5 、 Operating system: Chinese-English operating system
6 、 Working mode: automatic soldering mode, maintenance mode adjustable
7 、 Temperature curve paragraph: warm-up, heating, soldering, heat
preservation and cooling segment.
8 、 Range of temperature and time on warm-up: 70~150 , 0~5Min
9 、 Range of temperature and time on heating: warm-up temperature to 220 ,
0~5Min
10 、 Range of temperature and time on soldering: heating temperature to
30 0 , 0~30s
11 、 Range of temperature and time on heating preservation: soldering
temperature － (0~50 )
12 、 Effective soldering area: 180×120mm
13
、 Size: 300×250×160mm

2. The purpose and role of the heating
Activated the liquid flux of tin pulp; under the role of the liquid flux remove
the oxide of surface components inside the tin pulp; preparation for soldering.
In this section the temperature of the lead alloy solder and precious metal alloy
 solder should be set (150 ~180 ). eg: Sn42%-Bi58% Indium tin alloy low
temperature Lead Solder, Sn43%-Pb43%-Bi14% low-temperature lead solder
and so on. Set the Mid-temperature lead solder alloy temperature between
(180~220 ) ; Set the high temperature lead-free solder alloy temperature
between (220~250 ). If you have solder and tin pulp information, the
temperature of the heating can be installed in less than tin pulp melting point
temperature of 10 ° C is the best around.
3. The purpose and role of the soldering
The purpose is to complete the SMT soldering. As this stage is the highest
temperature in the whole soldering process, the components is easy to damage.
This process the solder physical and chemical changes of the largest are also to
the improvement of soldering process. The solder dissolves very easily in the
high temperature oxidation in air. If you have solder and tin pulp information,
you can installed the temperature of the soldering higher than tin pulp melting
point temperature of (30~50° C). We divided the solder into three: low
temperature solder （ 150~180 ℃ ） ,mid-temperature solder （ 190-220 ） ,
high-temperature solder(230~260). Now commonly used lead-free solder
materials for high-temperature solder, low-temperature solder is generally
precious metals lead-free solder and the special requirements of low-
temperature lead solder ， General electronic products use rarely, it often use in
specific requirements for electronic equipment. At present, many lead-free
solder are also no substitute for lead solder as the mid-temperature leaded
solder has excellent electrical properties, mechanical properties, impact
resistance properties of hot and cold, the antioxidant properties, therefore, in a
common electronic products also large-scale use.
In this segment you can set the time according to the requirement in the
following. After high temperature melting solder shown as liquid all the
components of SMT floating on the surface of the liquid solder. In the surface
tension effects of the flux and liquid, floating components will be move to the

center of the solder pad have the role of reform automatically. Also in the
humid of the solder flux the solder tin and surface metal of components formed
alloy layer infiltrated into components structural organization, which form the
ideal soldering structural. Setting the time about (10~30s), a large area and the
larger components shade of PCB should be set much longer time. The small
area or less parts PCB set shorter time generally. In order to ensure quality of
back solder in this stage should shorten the time as much as possible to
protecting components.
4. The purpose and role of the heat preservation
Let high-temperature liquid solder solidified into solid-state soldering
points. Solidification quality has a direct impact the crystal structure of the
solder and mechanical properties. If the solidification to fast will lead the solder
formation of crystalline rough, solder joint is not bright, mechanical properties
decrease. Under high temperature and mechanical impact, soldering points
easily crack lose mechanical and electrical connections role, lower product
durability. We always use to stop heating methods and heat preservation for
some time. In the temperature slow decline process the solder can solidification
and crystal good. Generally set the temperature point lower than the solder
point 10-20 ° C around. Use of natural cooling when the temperature dropped
to the temperature point it will enter cooling paragraph.
5. The purpose and role of the cooling paragraph
This cooling segment is simple, usually cooled to the temperature will not
scalding the people. To speed up the process of operation, may also stop the
process when the temperature fell to below 150 . To avoid burns to use tools,
hand belt or heat resistant grove take out the PCB board.
6. Note
General temperature curve set from the low-temperature, after satisfy the
soldering requirements as much as possible to reduce the soldering
temperature. Also can through extend back soldering time to reduce the
temperature, this will be conducive to the protection of low-temperature
components, especially some connectors and plug. Some components can not
satisfy temperature requirement, can be used to after soldering to solve.

Common alloy solder temperature curve
adjustment parameters
Solder Type Proportion Warm-up
/1min
Heating
/1min
Soldering
/30s
Keep

Cool

Low-temperature
,leaded
Sn43-Pb43-
Bi14 100-120 130-150 200-210 170 150
Lead-free low
temperature Sn42-Bi58 100-120 120-130 180-200 150 150
Lead-free low
temperature Sn48-In52 100-120 120-130 180-200 150 150
Lead, mid-
temperature Sn63-Pb37 130-150 170-180 230-240 180 150
Lead, mid-
temperature Sn60-Pb40 130-150 170-180 230-240 180 150
Lead, mid-
temperature
Sn62-Pb46-
Ag2 130-150 170-180 230-240 180 150
Lead-free, mid-
temperature Sn96.5-Ag3.5 130-150 180-190 240-250 240 150
Lead-free, mid-
temperature
Sn87-Ag3-
Cu3-In7 130-150 180-190 240-250 240 150
Lead-free, mid-
temperature Sn91-Zn9 130-150 180-190 240-250 230 150
Lead-free mid-
temperature
Sn95.4-Ag3.
1-Cn1.5 130-150 180-190 250-260 240 150
Lead-free mid-
temperature Sn99.3-Cu0.7 130-150 180-190 270-280 260 150
Lead-free high
temperature
Sn94-Ag3-
Cu3 130-150 190-220 240-250 240 150
Lead-free high
temperature Sn97-Cu3 130-150 190-220 270-280 250 150
Lead-free high
temperature Sn95-Sd5 130-150 190-220 270-280 250 150

Common alloy solder physical constant and
characteristics
Solder Alloy
Melting
temperat
ure
Mechanical properties
conductiv
ity
Sn Pb Ag Sb Bi In Au Cu Zn Liquidus
（
（（
（℃
℃℃
℃）
））
）
Push
Strength
（
（（
（ MPa ）
））
）
Elongati
on （
（（
（ % ）
））
）
rigidity
（
（（
（ HB ）
））
）
63 37 183 61 45 16.6 11.0
60 40 183 60 43 16.0 11.0
10 90 299 41 45 12.7 8.2
5 95 312 30 46 12.0 7.8
62 36 2 179 64 39 16.5 11.3
1 97.5 2.5 309 31 50 9.5 7.2
96.5 3.5 221 45 55 13 13.4
97.5 2.5 304 30 52 9.0 8.8
95 5 245 40 38 13.3 11.9
43 43 14 163 55 57 14 8.0
42 58 138 77 20-30 19.3 5.0
48 52 117 11 83 5 11.7
15 5 80 157 17 58 5 13.0
20 80 280 28 - 118 75
96.5 3.5 221 20 73 40 14.0
87 3 7 3 221 45 60 14 9.0
91 9 199
95.4 3.1 1.5 217
99.3 0.7 227
95 5 240

Running operation
There are two working mode to select in this equipment, which are
"Solder" and "Repair". The mode “Solder” is designed to solder the circuit
board components, the whole process are “PREH” (warm-up), “HEAT”
(heating), “SLDR” (solder), “KEEP” (heat preservation) and “COOL” (wait
for the machine to cool down); the mode "Repair" is designed to dismantle
circuit board components, there is only one temperature setting segment.
Before you enter the working mode, make sure the parameters whether right or
not.
You must set the parameter of the machine when you first time use it or the
tin pulp formula has been changed. You also can change the language Chinese
or English which you want.
1. power on
Turn on the main power switch back of the instrument, on the left top of the
display have red light lighted, then press the key “ON/OFF” on the panel, to
enter the standby state, as shown in figure “Fig 3” 、 “ Fig 4”
Fig 3 ： Fig4
2. System setting
Turn on the main power switch and then press the key “RUN” first while
pressing the key “ON/OFF”, to enter the system setting mode. As shown in

figure 5, the display shows the language and the display mode, You can press
Fig5 system setting Fig6 Curve selection
the key “

”or “

”to select it, press the key “SET” to make sure your
change, and press the key “RUN” to save the setting.
As shown in figure 6, there are six curves can be selected, the curve of
selection 0 is use define, you can change the temperature and the time. And the
parameters of others curves are unchangeable. You can find the parameters of
each curve in the table on page 36.


 Select working mode
Under the standby screen, the display will be show the work state
“SOLDER” or “REPAIR”, press the key “

” to select the work mode. As
shown in figure3, press the key “RUN” to enter the working state, press the
key “SET” to enter the parameters setting, press the key “ON/OFF” to exit the
operation system.


 Setting parameters
On the standby menu press the key “SET” to enter the parameter setting
state. The mode column displayed the current mode “SOLDER”. The segment
column displayed the current selective segment, press the key “

” or “

” to

select segment you want to setting. Press the key “RUN” returns back the
standby menu, and press the key “SET” to enter the temperature setting state.
As shown in figure 5.
Note: Except the displayed, the mode of the graphics display and
the text display are the same.
Setting parameters of the segment “PREH”
Press the key “SET” once to enter the setting state of preheat segment,
as shown in “Fig 7” 、
、、
、“
““
“ Fig 8” Press the key “SET” again enter the
temperature setting state, as shown in “Fig 9” 、
、、
、“
““
“ Fig 10”press the key “

” or
“

” change the temperature between (70~15 0℃). Press the key “SET” to
saving or press the key “RUN” to discard modification.
After temperature setting, press the key “SET” once to enter the time
parameter setting state, as shown in “Fig 11” 、
、、
、“
““
“ Fig 12” Press the key “

” or
“

” setting the time between (0~5Min), press the key “SET” to saving. After
saving the parameter, press the key “RUN” enter the standby state.
Under the graphics display mode, the curves will auto redraw after return to
the standby state.
Fig7 Text Pre-heat settings Fig8 Curve Pre-heat settings

Fig9 Text Temperature settings Fig10 Curve Temperature settings
Fig 11 Text Time Settings Fig 12 Curve Time Settings

※ Setting parameter of segment “HEAT”
As shown in “Fig 13” 、
、、
、“
“ “
“ Fig 14”press the key “

”select the heating
segment, the screen display “HEAT”, press the key “SET” enter the
temperature setting state. As shown in “Fig 15” 、
、、
、 “ Fig 16”press the key “

”
or “

” setting the temperature between (preheat segment~22 0℃
0℃0℃
0℃ ) . Press the
key “SET” save the temperature setting and enter the time setting state. As
shown in “Fig 17” 、 “
““
“ Fig 18”press the key “

” or “

” setting the time
between (0~5Min), press the key “SET” to saving and return back mode select
or press the key “RUN” enter the operation standby state, as shown in
Fig 13 Text Heat settings Fig 14 Curve Heat settings

Fig 15 Text Temperature settings Fig 16 Curve Temperature settings
Fig 17 Text Time Settings Fig 18 Curve Time Settings
Setting parameter of segment “SLDR ”
Under the interface in “Fig19” 、 “
““
“ Fig20” 、
、、
、 “
“ “
“ Fig21” 、
、、
、 “
““
“
Fig22” 、
、、
、“
““
“ Fig23” 、
、、
、“
“ “
“ Fig24”press the key “

” select soldering segment, and
then press the key “SET” to enter the temperature setting state. Press the key
“

” or “

” setting the temperature between (heating segment~30 0℃).
Press the key “SET” save the setting and enter the time setting state. When the
temperature setting between (250~300 ℃) setting the time between (0~30s);
when the temperature lower than 25 0℃ setting the time (0~1Min). After that
press the key “SET” to save the setting or press the key “RUN” to discard
modification.
Fig 19 Text Welding set Fig 20 Curve Welding set

Fig 21 Text Temperature settings Fig 22 Curve Temperature settings
Fig 23 Text Time Settings Fig 24 Curve Time Settings
※ Setting parameter of segment “KEEP”
Under the interface in “Fig25” 、
、 、
、 “
““
“ Fig26” 、
、 、
、 “
““
“ Fig27” 、
、 、
、 “
““
“ Fig28” 、
、、
、 press
the key “

” select temperature keeping segment, and then press the key
“SET” to enter the temperature setting state. Press the key “

” or “

”
change the setting value and then press the key “SET” to save it, or press the
key “RUN” to discard the modification. You can’t change the setting
temperature lower 50 ℃
℃℃
℃ than the last process.
Fig 25 Text Insulation set Fig 26 Curve Insulation set

Fig 27 Text Temperature settings Fig 28 Curve Temperature settings
※ Setting parameter of segment “COOL”
Under the interface in “Fig29” 、 “
““
“ Fig30” 、
、 、
、 “
““
“ Fig31” 、
、、
、“
““
“ Fig32”press the
key “

” to select cooling segment, and press the key “SET” to enter the
temperature setting state. Press the key “

”or “

”change the setting value
from 70 ℃
℃℃
℃ to the setting last process, and then press the key “SET” to save it,
or press the key “RUN” to discard the modification.
Fig 29 Text Cooling settings Fig 30 Curve Cooling settings

Fig 31 Text Temperature settings Fig 32 Curve Temperature settings
Setting parameter of repair mode
Under the interface of standby as shown in , “Fig 33” 、
、 、
、 “
““
“ Fig 34” 、
、 、
、 “
““
“ Fig
35” 、
、 、
、 “
““
“ Fig 36” 、
、 、
、 “
““
“ Fig 37” 、
、 、
、 “
““
“ Fig 38” press the key “

” to select the
repair mode, press the key “SET” to enter the temperature setting state as
shown in . Press the key “

”or “

” to change the temperature, press the key
“SET” to save. On the repair mode the temperature range is divided into three
parts, when the temperature setting between (70~150 ) no need to setting
time; when the temperature setting between (150~200 ), setting the time
between (0~20Min). When the machine operation set time will shut down
automatically.
Fig 33Text Maintenance Fig 34Curve Maintenance

Fig 35Text Temperature settings Fig 36Curve Temperature settings
Fig 37Text Time Settings Fig 38Curve Time Settings
NOTE: On the setting the mode, if the machine have nothing operate it
will return back to the standby state; on the standby state, the machine have
nothing operate over 30Min will shut down automatically.
Back Soldering operation
After setting the equipment have safety conduction to operation. Put the
circuit board in the middle of the tray, closed chassis, press the key “RUN”
enter the working state, as shown in “Fig 39” 、
、 、
、 “
““
“ Fig 40” The working lamp
of machine will be light, and the screen will be display: working…” the
temperature display current temperature, the time display setting time. When
the temperature reaches the set point, the time start to countdown, after the
completion of the countdown the machine will enter the next section. When the
machine is working the working lamp will be shut down or flashing. Under the
graphics display mode, the curve will become broken line as the time goes by,
as shown in