Beckhoff EPI1 Series Operator's manual

Documentation | EN
EPI1xxx, ERI1xxx
IO-Link box modules with digital inputs
2022-07-21 | Version: 1.6

Table of contents
EPI1xxx, ERI1xxx 3Version: 1.6
Table of contents
1 Foreword....................................................................................................................................................5
1.1 Notes on the documentation .............................................................................................................5
1.2 Safety instructions.............................................................................................................................6
1.3 Documentation issue status ..............................................................................................................7
2 Product overview ......................................................................................................................................8
2.1 EPI1xxx, ERI1xxx Module overview..................................................................................................8
2.2 EPI1008-000x, ERI1008-000x ..........................................................................................................9
2.2.1 Introduction ........................................................................................................................9
2.2.2 Technical Data ................................................................................................................. 10
2.2.3 Process image ................................................................................................................. 12
2.3 EPI1809-002x, ERI1809-002x ........................................................................................................13
2.3.1 Introduction ......................................................................................................................13
2.3.2 Technical data.................................................................................................................. 14
2.3.3 Process image ................................................................................................................. 16
3 IO-Link basics..........................................................................................................................................17
3.1 IO-Link system layout......................................................................................................................17
3.2 Establishment of IO Link communication ........................................................................................19
3.3 Device description IODD.................................................................................................................20
3.4 Parameter server ............................................................................................................................20
3.5 Data transfer rate ............................................................................................................................20
4 Mounting and connection.......................................................................................................................21
4.1 Mounting .........................................................................................................................................21
4.1.1 Dimensions EPIxxxx-xx0x and ERIxxxx-xx0x .................................................................. 21
4.1.2 Dimensions EPIxxxx-xx2x and ERIxxxx-xx2x .................................................................. 22
4.1.3 Fixing................................................................................................................................ 23
4.1.4 Tightening torques for plug connectors............................................................................ 24
4.2 IO-Link connection ..........................................................................................................................25
4.2.1 IO-Link master connection ............................................................................................... 25
4.2.2 Connection IO-Link Device .............................................................................................. 26
4.2.3 IO-Link status LED ........................................................................................................... 27
4.3 Status LEDs for power supply.........................................................................................................27
4.4 Signal connection............................................................................................................................28
4.4.1 Digital inputs M8 and M12................................................................................................ 28
4.5 UL Requirements ............................................................................................................................29
4.6 Cabling ............................................................................................................................................30
5 Commissioning and configuration........................................................................................................31
5.1 Configuration of the IO link master..................................................................................................31
5.1.1 Integrating IO link devices................................................................................................ 32
5.1.2 Removal of the IO-Link devices ....................................................................................... 34
5.1.3 Configuration of the IO-Link ports as digital inputs/outputs.............................................. 34
5.2 Configuration of the IO-Link devices ...............................................................................................35
5.2.1 Open the IO link configuration tool................................................................................... 35
5.2.2 Integrating IO-Link devices .............................................................................................. 36

Table of contents
EPI1xxx, ERI1xxx4 Version: 1.6
5.2.3 Removal of IO-Link devices ............................................................................................. 45
5.2.4 Activating the configuration .............................................................................................. 46
5.3 Settings of the IO-Link devices .......................................................................................................47
5.4 EPIxxxx, ERIxxxx - Setting of the IO-Link device parameters ........................................................49
5.5 ADS access to device parameters ..................................................................................................60
5.6 Configuration of the digital inputs....................................................................................................63
5.6.1 Input filter (Index 0x0800:01) ........................................................................................... 63
5.6.2 Signal Extension (Index 0x0800:02) ................................................................................ 64
5.6.3 Diagnosis (Index 0x0A00) ................................................................................................ 65
5.7 Input debouncing and pulse extension............................................................................................66
5.8 Process data ...................................................................................................................................68
5.9 Firmware update of the IO-Link device ...........................................................................................69
6 Device parameters ..................................................................................................................................71
6.1 Object Overview - EPI1809-0021....................................................................................................71
6.2 EPI1008-000x, ERI1008-000x - Object description and parameterization......................................73
6.3 EPI1809-002x, ERI1809-002x - Object description and parameterization......................................76
7 Appendix..................................................................................................................................................79
7.1 General operating conditions ..........................................................................................................79
7.2 Accessories.....................................................................................................................................80
7.3 Support and Service........................................................................................................................81

Foreword
EPI1xxx, ERI1xxx 5Version: 1.6
1 Foreword
1.1 Notes on the documentation
Intended audience
This description is only intended for the use of trained specialists in control and automation engineering who
are familiar with the applicable national standards.
It is essential that the documentation and the following notes and explanations are followed when installing
and commissioning these components.
It is the duty of the technical personnel to use the documentation published at the respective time of each
installation and commissioning.
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
Disclaimer
The documentation has been prepared with care. The products described are, however, constantly under
development.
We reserve the right to revise and change the documentation at any time and without prior announcement.
No claims for the modification of products that have already been supplied may be made on the basis of the
data, diagrams and descriptions in this documentation.
Trademarks
Beckhoff®, TwinCAT®, TwinCAT/BSD®, TC/BSD®, EtherCAT®, EtherCATG®, EtherCATG10®, EtherCATP®,
SafetyoverEtherCAT®, TwinSAFE®, XFC®, XTS® and XPlanar® are registered trademarks of and licensed by
Beckhoff Automation GmbH. Other designations used in this publication may be trademarks whose use by
third parties for their own purposes could violate the rights of the owners.
Patent Pending
The EtherCAT Technology is covered, including but not limited to the following patent applications and
patents: EP1590927, EP1789857, EP1456722, EP2137893, DE102015105702 with corresponding
applications or registrations in various other countries.
EtherCAT® is registered trademark and patented technology, licensed by Beckhoff Automation GmbH,
Germany.
Copyright
© Beckhoff Automation GmbH & Co. KG, Germany.
The reproduction, distribution and utilization of this document as well as the communication of its contents to
others without express authorization are prohibited.
Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a
patent, utility model or design.

Foreword
EPI1xxx, ERI1xxx6 Version: 1.6
1.2 Safety instructions
Safety regulations
Please note the following safety instructions and explanations!
Product-specific safety instructions can be found on following pages or in the areas mounting, wiring,
commissioning etc.
Exclusion of liability
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH & Co. KG.
Personnel qualification
This description is only intended for trained specialists in control, automation and drive engineering who are
familiar with the applicable national standards.
Description of instructions
In this documentation the following instructions are used.
These instructions must be read carefully and followed without fail!
DANGER
Serious risk of injury!
Failure to follow this safety instruction directly endangers the life and health of persons.
WARNING
Risk of injury!
Failure to follow this safety instruction endangers the life and health of persons.
CAUTION
Personal injuries!
Failure to follow this safety instruction can lead to injuries to persons.
NOTE
Damage to environment/equipment or data loss
Failure to follow this instruction can lead to environmental damage, equipment damage or data loss.
Tip or pointer
This symbol indicates information that contributes to better understanding.

Foreword
EPI1xxx, ERI1xxx 7Version: 1.6
1.3 Documentation issue status
Version Comment
1.6 • Imprint updated
• Structure update
1.5 • Dimensions updated
• UL requirements updated
1.4 • Status LEDs for power supply updated
1.3 • Chapter "process data" added
1.2 • ERI1xxx added
• Introduction updated
• Technical Data updated
• Connection IO-Link Master updated
• Cabling updated
• Update chapter IO-Link Master and IO-Link Device
• Update structure
• Corrections
1.1.2 • EPI1008-000x - Technical Data updated
• EPI1802-002x - Technical Data updated
1.1.1 • Status LEDs for power supply updated
• Firmware update of the IO-Link device updated
1.1.0 • EPI1008-000x - Object description and parameterization updated
• EPI1809-002x - Object description and parameterization updated
1.0.0 • First publication
0.6 • Corrections
0.5 • First preliminary version
Firm and hardware version
The documentation refers to the firm and hardware status that was valid at the time it was prepared.
The properties of the modules are subject to continuous development and improvement. Modules having
earlier production statuses cannot have the same properties as modules with the latest status. Existing
properties, however, are always retained and are not changed, so that these modules can always be
replaced by new ones.
The firmware and hardware version (delivery state) can be found in the batch number (D number) printed at
the side of the IO-Link box module.
Syntax of the batch number (D number)
D: WW YY FF HH
WW - week of production (calendar week)
YY - year of production
FF - firmware version
HH - hardware version
Example with D No. 29 10 02 01:
29 - week of production 29
10 - year of production 2010
02 - firmware version 02
01 - hardware version 01

Product overview
EPI1xxx, ERI1xxx8 Version: 1.6
2 Product overview
2.1 EPI1xxx, ERI1xxx Module overview
Digital input modules
Module Signal
connection
Number of
inputs
Filter (Default
setting)
Housing
EPI1008-0001 [}9] 8 x M8 8 3.0ms Industrial housing
ERI1008-0001 [}9] 8 x M8 8 3.0ms Zinc die-cast housing
EPI1008-0002 [}9] 4 x M12 8 3.0ms Industrial housing
ERI1008-0002 [}9] 4 x M12 8 3.0ms Zinc die-cast housing
EPI1809-0021 [}13] 16 x M8 16 3.0ms Industrial housing, wide body
ERI1809-0021 [}13] 16 x M8 16 3.0ms Zinc die-cast housing, wide body
EPI1809-0022 [}13] 8 x M12 16 3.0ms Industrial housing, wide body
ERI1809-0022 [}13] 8 x M12 16 3.0ms Zinc die-cast housing, wide body

Product overview
EPI1xxx, ERI1xxx 9Version: 1.6
2.2 EPI1008-000x, ERI1008-000x
2.2.1 Introduction
1 |
2 |
3 |
4 |
5 |
L+
n.c.
L-
C/Q
n.c.
IO-Link
interface
Class A
1 |
3 |
4 |
+24 V U
L-
Input
S1
Digital
inputs
EPI1008-0001 ERI1008-0001
1 |
2 |
3 |
4 |
5 |
L+
n.c.
L-
C/Q
n.c.
IO-Link
interface
Class A
1 |
2 |
3 |
4 |
5 |
+24 V U
Input B
L-
Input A
n.c.
S1
Digital
inputs
EPI1008-0002 ERI1008-0002
8 digital inputs 24VDC
The EPI1008 IO-Link box module with digital inputs acquires binary control signals from the process level
and transfers them, with electrical isolation, to the controller. The signal state is displayed by light emitting
diodes; the signal connection is made optionally through M8 connectors (EPI1008-0001, ERI1008-0001) or
M12 connectors (EPI1008-0002, ERI1008-0002). The sensors are supplied from US1 (derived from L+).
The IO-Link box modules with zinc die-cast housing (ERIxxxx) are ready for use in harsh industrial and
process environments. With the fully sealed design and metal surfaces the ERI series is ideal for
applications requiring enhanced load capacity and protection against weld spatter, for example.
Quick links
Installation [}21]

Product overview
EPI1xxx, ERI1xxx10 Version: 1.6
2.2.2 Technical Data
All values are typical values over the entire temperature range, unless stated otherwise.
IO-Link
Connection 1x M12 plug, 5-pin, A-coded
Data transfer rate 230.4kbaud (COM3)
Specification version IO-Link V1.1, ClassA
Requirements for IO-Linkmaster V1.1
Current consumption from L+ 100mA + sensor supply
Digital inputs EPI1008-0001
ERI1008-0001
EPI1008-0002
ERI1008-0002
Number 8
Connection 8 x M8 socket 4 x M12 socket
Characteristics Type3 according to EN61131-2, compatible with type1
Input filter 3ms (default).
Adjustable from 0ms to 20ms.
Pulse extension 0ms (default).
Adjustable from 0ms to 100ms.
Signal voltage "0" -3 … +5V
Signal voltage "1" +11 … +30V
Input current 3mA at 24VDC
Sensor power supply US1 24VDC from L+.
max. 0.5A in total, short-circuit proof.
Housing data EPI1008-000x ERI1008-000x
Dimensions WxHxD 30mmx 126mmx 26.5mm (without plug connectors)
Weight approx.165g
Installation position variable
Material PA6 (polyamide) Zinc die-cast
Environmental conditions
Ambient temperature during operation -25… +60°C
-25… +55°C according to cURus
Ambient temperature during storage -40… +85°C
Vibration resistance, shock resistance conforms to EN60068-2-6/ EN60068-2-27
Additional checks [}10]
EMC immunity / emission conforms to EN61000-6-2/ EN61000-6-4
Protection class IP65, IP66, IP67 (conforms to EN60529)
Approvals/markings
Approvals/markings*) CE, cURus [}29]
*) Real applicable approvals/markings see type plate on the side (product marking).
Additional tests
The devices have undergone the following additional tests:

Product overview
EPI1xxx, ERI1xxx 11Version: 1.6
Test Explanation
Vibration 10 frequency sweeps in 3 axes
5Hz<f<60Hz displacement 0.35mm, constant amplitude
60.1Hz<f<500Hz acceleration 5g, constant amplitude
Shocks 1000 shocks in each direction, in 3 axes
35g, 11ms

Product overview
EPI1xxx, ERI1xxx12 Version: 1.6
2.2.3 Process image
Input 0 to Input 7
The IO-Link device is connected to IO-Link Port1 of the IO-Link master (EP6224-2022).
You will find the 8 digital inputs of the module (here using the EPI1008-0001 as an example) under Input 0
to Input 7.
Fig.1: EPI1008-000x, Process image
Also see about this
2Process data [}68]

Product overview
EPI1xxx, ERI1xxx 13Version: 1.6
2.3 EPI1809-002x, ERI1809-002x
2.3.1 Introduction
FE
FE
1 |
2 |
3 |
4 |
5 |
L+
n.c.
L-
C/Q
n.c.
IO-Link
interface
Class A
1 |
3 |
4 |
+24 V U
L-
Input
S1
Digital
inputs
EPI1809-0021 ERI1809-0021
FE
FE
1 |
2 |
3 |
4 |
5 |
L+
n.c.
L-
C/Q
n.c.
IO-Link
interface
Class A
1 |
2 |
3 |
4 |
5 |
+24 V U
Input B
L-
Input A
n.c.
S1
EPI1809-0022 ERI1809-0022
Digital
inputs
16 digital inputs 24VDC
The EPI1809-002x, ERI1809-002x IO-Link box modules with digital inputs acquire binary control signals from
the process level, and transfer them, electrically isolated, to the controller. The signal state is displayed by
light emitting diodes; the signal connection is made optionally through M8 connectors (EPI1809-0021,
ERI1809-0021) or M12 connectors (EPI1809-0022, ERI1809-0022).
The sensors are supplied from US1 (derived from L+).
The IO-Link box modules with zinc die-cast housing (ERIxxxx) are ready for use in harsh industrial and
process environments. With the fully sealed design and metal surfaces the ERI series is ideal for
applications requiring enhanced load capacity and protection against weld spatter, for example.

Product overview
EPI1xxx, ERI1xxx14 Version: 1.6
Quick links
Installation [}21]
2.3.2 Technical data
All values are typical values over the entire temperature range, unless stated otherwise.
IO-Link
Connection 1x M12 plug, 5-pin, A-coded
Data transfer rate 230.4kbaud (COM3)
Specification version IO-Link V1.1, ClassA
Requirements for IO-Linkmaster V1.1
Current consumption from L+ 100mA + sensor supply
Digital inputs EPI1809-0021
ERI1809-0021
EPI1809-0022
ERI1809-0022
Number 16
Connection 16 x M8 socket 16 x M12 socket
Characteristics Type3 according to EN61131-2, compatible with type1
Input filter 3ms (default).
Adjustable from 0ms to 20ms.
Pulse extension 0ms (default).
Adjustable from 0ms to 100ms.
Signal voltage "0" -3 … +5V
Signal voltage "1" +11 … +30V
Input current 3mA at 24VDC
Sensor power supply US1 24VDC from L+.
max. 0.5A in total, short-circuit proof.
Housing data EPI1809-002x ERI1809-002x
Dimensions WxHxD 60mmx 126mmx 26.5mm (without plug connectors)
Weight approx.250g
Installation position variable
Material PA6 (polyamide) Zinc die-cast
Environmental conditions
Ambient temperature during operation -25… +60°C
-25… +55°C according to cURus
Ambient temperature during storage -40… +85°C
Vibration resistance, shock resistance conforms to EN60068-2-6/ EN60068-2-27
Additional checks [}15]
EMC immunity / emission conforms to EN61000-6-2/ EN61000-6-4
Protection class IP65, IP66, IP67 (conforms to EN60529)
Approvals/markings
Approvals/markings*) CE, cURus [}29]
*) Real applicable approvals/markings see type plate on the side (product marking).

Product overview
EPI1xxx, ERI1xxx 15Version: 1.6
Additional tests
The devices have undergone the following additional tests:
Test Explanation
Vibration 10 frequency sweeps in 3 axes
5Hz<f<60Hz displacement 0.35mm, constant amplitude
60.1Hz<f<500Hz acceleration 5g, constant amplitude
Shocks 1000 shocks in each direction, in 3 axes
35g, 11ms

Product overview
EPI1xxx, ERI1xxx16 Version: 1.6
2.3.3 Process image
Input 0 to Input 15
The IO-Link device is connected to IO-Link Port1 of the IO-Link master.
You will find the 16 digital inputs of the module (here using the EPI1809-0021 as an example) under Input 0
to Input 15.
Fig.2: EPI1809-002x, Process image

IO-Link basics
EPI1xxx, ERI1xxx 17Version: 1.6
3 IO-Link basics
IO-Link is a communication system for connecting intelligent sensors and actuators to an automation system.
The IEC61131-9 standard specifies IO-Link under the designation "Single-drop digital communication
interface for small sensors and actuators" (SDCI).
Both the electrical connection data and the communication protocol are standardized and summarized in the
IO-Link Spec.
3.1 IO-Link system layout
An IO-Link system consists of an IO-Link master and one or more IO-Link devices, i.e. sensors or actuators.
The IO-Linkmaster provides the interface to the higher-level controller and controls communication with the
connected IO-Linkdevices.
The IO-Linkmasters from Beckhoff have several IO-Linkports, to each of which one IO-Linkdevice can be
connected. IO-Link is not a fieldbus, but rather a point-to-point connection.

IO-Link basics
EPI1xxx, ERI1xxx18 Version: 1.6
CAUTION
Risk of device damage
The IO-Linkdevices must be supplied from the 24V power supply of the IO-Linkmaster provided for this
purpose. Otherwise, damage to the IO-Linkport is possible.

IO-Link basics
EPI1xxx, ERI1xxx 19Version: 1.6
3.2 Establishment of IO Link communication
The establishment of the IO-Link communication is illustrated in Fig. Establishment of IO-Link
communication. This illustrates in particular the sequence when automatically scanning [}40] the IO-Link
port.
Fig.3: Establishment of IO Link communication
• If an IO-Link device is connected to a master port, the master attempts to establish communication. A
defined signal level, the wake-up pulse, signals to the device that UART bytes are to be sent from now
on.
From this point on, all data will be interpreted by the IO-Link device as UART bytes.
• The master runs through all baud rates [}20], starting with the fastest baud rate (COM3 = 230
kbaud). A successful connection has been established when the slave responds to the wake-up pulse.
• First of all the master reads the basic parameters (Vendor ID, Device ID, process data length,
telegram type and cycle time) and compares them with the existing configuration.
• If no connection could be established to the device, or if the saved parameters differ from those read,
the corresponding error is output.
• If the saved parameters differ from those read, the IO-Link device changes to the PREOP state.
If the IO-Link device specification is V1.1, the parameter server [}20] is now executed. If the IO-Link
device specification is V1.0, this step is omitted and the device changes directly to OP.
• Finally the cycle time is written and the device changes to OP. After that the master cyclically
exchanges data with the device.

IO-Link basics
EPI1xxx, ERI1xxx20 Version: 1.6
3.3 Device description IODD
IO-Link devices possess individual system information in the form of an IO device description (IODD), which
contains:
• Communication features
• Device parameters with value range and default values
• Identification, process and diagnostic data
• Device data
• Text description
• Picture of the device
• Vendor's logo
If the IODD is imported, then the device data are automatically detected during automatic scanning [}40]
with TwinCAT and adopted in the System Manager.
3.4 Parameter server
In order to be able to use the functionality of the parameter server, both the IO-Link master and the IO-Link
device must be specified to V1.1. The IO-Link revision of the device can be read for the individual port under
Settings [}47]. All IO-Link masters from Beckhoff with current firmware support the IO-Link specification
V1.1.
• The parameter server in the IO-Link master contains parameter data that are saved in the IO-Link
device. The memory capacity is max. 2kbyte (including header).
If the IO-Link device is exchanged, then the data are loaded from the parameter server into the new
device. The requirement for this is that the device is of the same type (VendorID and DeviceID must be
the same).
• If a new IO-Link device is configured, then the IO-Link master loads the parameters from the IO-Link
device into the parameter server when starting for the first time.
Data from other IO-Link devices that are already configured (VendorID and DeviceID do not
correspond to the configured device) are overwritten.
• At each further start the IO-Link master uses a checksum to check whether the data in the parameter
server correspond to those on the IO-Link device and if necessary downloads them to the device.
• If the parameters change during the device runtime, this can be reported to the Master via the store
button [}55] (ParamDownloadStore [}56]). The master then starts the parameter server with an
upload.
• By default the event is not set each time the parameters are written, therefore the end of the
parameterization procedure has to be reported to the IO-Link device via the store button [}55]
(ParamDownloadStore [}56]).
The IO-Link device then sends the corresponding event to the master. The data are loaded into the
parameter server.
• In the case of a pre-programmed IO-Link device, no download takes place from the parameter server
to the device.
3.5 Data transfer rate
An IO-Link master according to specification V1.1 supports all three transmission methods and automatically
adjusts the baud rate to that of the IO-Link device.
An IO-Link device usually supports only one baud rate. IO-Link devices with different baud rates can be
connected to the various ports of the master.
• COM1 = 4.8 kbaud
• COM2 = 38.4 kbaud
• COM3 = 230.4 kbaud