BRIGHT LED ELECTRONICS BPT-HP133A-TRB User manual

佰鴻工業股份有限公司
http://www.brtled.com
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SINCE 1981
● Description
The BPT-HP133A-TRB is a silicon NPN
phototransistor detector in a 3.2x1.6x1.4mm
SMD type package.
●Features:
1. Wide range of collector current.
2. Lend for high sensitivity.
3. Low cost plastic package.
4. Lens Appearance: Water Clear
5. Cut off 820nm.
6. This product doesn’t contain restriction
Substance, comply ROHS standard.
●Applications:
1. SmokeDetector
2. Automatic Control System
3. Any design requiring sensitivity and
stablecharacteristics.
● Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Rating Unit
Power Dissipation Pd 100 mW
Emitter-Collector Breakdown Voltage BVCEO 50
Emitter-Collector Voltage BVECO 5 V
Operating Temperature Topr -40℃~85℃-
Storage Temperature Tstg -40℃~85℃-
Soldering Temperature Tsol See Page6 -
●Package Dimensions:
NOTES:
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
Ver.1.1 Page 1 of 7

佰鴻工業股份有限公司
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SINCE 1981
●Electrical and optical characteristics(Ta=25℃)
Parameter Symbol Condition Min. Typ. Max. Unit
Spectrum Sensitivity λ IF=50mA 500 - 1000 nm
Short Circuit Current λp IF=50mA - 940 - nm
Collector Light Current IC(ON) VCE=5V, λp=940nm,
H=1.0mw/cm21.665 3.455 - mA
Collector Dark Current ICEO VCE=20V - - 100 nA
Rise/Fall Time Tr/Tf VCE=5V, Ic=1mA, RL=1KΩ- 15/15 - us
Veiwing Angle 2θ1/2 I
F=50mA - - 60 - deg
● Typical Electro-Optical Characteristics Curves
400
0.1
Vce = 6V
0.01
0.1
Output current-mA
1.0
10
0.001
-40
0.01
Dark current-nA
1
0.1
10
RELATIVE RADIANT INTENSITY
1.0
Distance between lenses-inches
0.1
Fig.6 Coupling characteristics
Vce = 5 V
I = 20 mA
c
T =free air temperature-°
20
A
-20 0
c
40 60 80
0.7
0.8
0.9
1.0
0.2
0.1
% Pelative response
0.3
0.4
0.6
0.5
0.7
Fig.1 Collector current vs Collector emitter voltage
Ic-collector current-mA
100
1000
0
5
20
10
15
25
Vce-collector emitter voltage-V
H = 5 mW/cm
Fig.3 Dark current vs Free-air temperature
Vce = 15V
H = 0
246810
2
H = 10 mW/cm
H = 15 mW/cm
H = 20 mW/cm 2
2
2
Ic-collector current-mA
1.0
0.8
0.9
0.1
1.0
10
100
80
90
0.30.5 0.1 0.40.2 0.6
70
60
50
40
30
1200
RADIATION DIAGRAM
010 20
800
Wavelength-nm
600
500
-
700 900 1000 1100
Fig.5 Relative spectral response
H-irradilance-mW/cm
1.0 10
2
100
Fig.2 Collector current vs Irradlance
Ver.1.1 Page 2 of 7

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SINCE 1981
● Tapping and packaging specifications(Units: mm)
0.1
0.1
USER DIRECTION OF FEED
4.0 ±
±5.3 0.05
Emitter
Collector
START
1.98±
13.0± 0.5
NOTE: 3000 pcs PER REEL
±0.1
1.5± 0.1
0.14.0 ± 2.0± 0.05
1.75
0.3
END
±0.053.5
8.0 0.3±
±
1.46 0.1
FIXING TAPE
71.0± 1
0.13.47±
TRAILER
LEADER
179± 1
13.0± 0.5
●Package Method:(unit:mm) Vacuum
220
245
470
Aluminum Foil Bag
220
645
210
6 box/carton
Bar Code Label
3000 pcs/reel
12 bag/box
200
185
Ver.1.1 Page 3 of 7

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SINCE 1981
● Bin Limits:
Collector Light Current Bin Limits(VCE=5V, H=1.0mw/cm2, λp=940nm)
IC(ON) (mA)
BIN CODE Min Max
L 1.665 2.398
M 2.398 3.455
N 3.455 4.977
P 4.977 7.165
Tolerance for each Bin limit is ± 15%.
● BIN:x
Collector Light Current Bin Code
Ver.1.1 Page 4 of 7

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● Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750D:1026
MIL-STD-883D:1005
JIS-C-7021 :B-1
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
0/20
High
Temperature
High Humidity
Storage
MIL-STD-202F:103B
JIS-C-7021 :B-11
Ta=+85℃±5℃
RH=90%-95%
Test time=240hrs 0/20
High
Temperature
Storage
MIL-STD-883:1008
JIS-C-7021 :B-10
High Ta=+100℃±5℃
Test time=1,000hrs 0/20
Endurance
Test
Low
Temperature
Storage JIS-C-7021 :B-11
Low Ta=-40℃±5℃
Test time=1,000hrs 0/20
Temperature
Cycling
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS-C-7021 :A-2
-35℃±5℃~+25℃~+85℃±5℃~+25℃
30min 5min 30min 5min
Test Ti m e = 10cycle 0/20
Thermal Shock MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
-40℃±5℃~+85℃±5℃
20min 20min
Test Ti m e = 10cycle
0/20
Environmental
Test
Solder
Resistance MIL-STD-202:201A
MIL-STD-750:2031
JIS-C-7021 :A-1
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
260℃(Max.), within 10seconds. (Max.)
0/20
● Judgment criteria of failure for the reliability
Measuring items Symbol Measuring conditions Judgment criteria for failure
Forward voltage VF( V) IF=20mA Initial Level*1.1
Reverse current IR(uA) VR=5V Over U*2
Luminous intensity Iv ( mcd ) IF=20mA Initial Level*0.7
Note: 1.U means the upper limit of specified characteristics.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.1 Page 5 of 7

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SINCE 1981
Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃within 5 sec.260℃(Max)
Gradual Cooling (Avoid quenching).
●Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
Time
OVER 2 MIN.
4℃/SEC. MAX.
4℃/SEC. MAX.
10 SEC. MAX.
260℃MAX.
140~160℃
Temperature
Time
120~180 sec.
Preheat
245 ±5℃ within 5 sec.
Soldering heat Max. 260 ℃
120~150℃
Ver.1.1 Page 6 of 7

佰鴻工業股份有限公司
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SINCE 1981
●Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
●Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60℃±3℃.
●Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx xx xx
Year Month Day
Manufacture Location
Ver.1.1 Page 7 of 7
BPT-Hxxxxx -TRB