Chenbro RM23712 User manual

RM23712
Technical Product Specification
A document providing an overview of product features, functions, architecture,
and support specifications
Revision 1.0
Jan 2017
Chenbro RM Product Marketing

i
Revision History
Date
Revision Number
Modifications
2016/12/9
R0.9
Initial Release
2017/1/19
R1.0
Official version

RM23712 TPS
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Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by
this document.
Chenbro disclaimsall expressand implied warranties,including without limitation,the implied warranties
of merchantability,fitness for a particular purpose,and non-infringement, as well as any warranty arising
from course of performance,course of dealing,or usage in trade.
This document contains information on products, services and/or processes in development. All
information provided here is subject to change without notice. Contact your Chenbro representative to
obtain the latest TPS.
The products and services described may contain defects or errors known as errata which may
cause deviations from published specifications. Current characterized errata are available on
request.
Chenbro,and the Chenbro logo are trademarks of Chenbro MicornCo.,Ltd in the worldwide.
*Other names and brands may be claimed as theproperty of others
© 2017 Chenbro MicornCo.,Ltd.

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Table of Contents
1. Introduction............................................................................................................................................................1
1.1 Chapter Outline ..................................................................................................................................... 1
1.2 Server Board Use Disclaimer................................................................................................................. 1
1.3 Product Errata ........................................................................................................................................ 2
2. Product Overview ..................................................................................................................................................3
2.1 Operating System Support..................................................................................................................... 4
2.1.1 OS Validation Levels............................................................................................................................. 5
2.1.2 OS Technical Support Levels ................................................................................................................ 5
2.2 System Features Overview .................................................................................................................... 5
2.3 Server Board Features Overview........................................................................................................... 6
2.4 Back Panel Features............................................................................................................................... 9
2.5 Front Control Panel................................................................................................................................ 9
2.6 Front Drive Bay Options...................................................................................................................... 10
2.7 System Dimensions.............................................................................................................................. 10
2.7.1 Chassis Dimensions............................................................................................................................. 10
2.7.2 3.5’’ HDD Tray Dimensions .............................................................................................................. 11
2.7.3 Pull-out Tag Label Emboss Dimensions.......................................................................................... 12
2.8 Available Rack Mounting Kit Options............................................................................................ 13
2.9 System Level Environmental Limits ............................................................................................... 13
2.10 System Packaging............................................................................................................................... 14
2.10.1 RM23712 Weight Information......................................................................................................... 14
3. System Power........................................................................................................................................................15
3.1 General Description And Scope........................................................................................................... 15
3.1.1 Power Supply Module Mechanical Overview..................................................................................... 15
3.1.2 LED Marking and Identification.......................................................................................................... 16
3.1.3 Power Supply Card Edge Pin-Out ....................................................................................................... 17
3.1.4 Environmental Requirements............................................................................................................... 17
3.1.4.1 Temperature and Humidity Requirements.................................................................................17

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3.1.4.2 Altitude Requirements........................................................................................................18
3.2 Electrical Performance.........................................................................................................................18
3.2.1 AC power Input Specification..............................................................................................................18
3.2.1.1 AC Inlet connector..............................................................................................................18
3.2.1.2 Input voltage and frequency specification..........................................................................18
3.2.1.3 HVDC Input voltage...........................................................................................................18
3.2.1.4 Input current........................................................................................................................19
3.2.1.5 AC Line Fuse......................................................................................................................19
3.2.1.6 AC line inrush.....................................................................................................................19
3.2.1.7 Input Power Factor Correction ...........................................................................................19
3.2.1.8 AC line dropout ..................................................................................................................19
3.2.1.9 Efficiency............................................................................................................................20
3.2.1.10 Suspeceptibility Requirements ...........................................................................................20
3.2.1.10.1 Electrical Discharge Susceptibility................................................................................20
3.2.1.10.2 Fast Transient/Burst.......................................................................................................20
3.2.1.10.3 Radiated Immunity........................................................................................................20
3.2.1.10.4 Surge Immunity.............................................................................................................21
3.2.1.10.5 AC Line Transient Specification...................................................................................21
3.2.1.10.6 AC line fast transient (EFT) specification.....................................................................21
3.2.1.11 Power Recovery..................................................................................................................22
3.2.1.12 Voltage Brown Out.............................................................................................................22
3.2.1.13 AC Line Leakage Current...................................................................................................22
3.2.2 DC output voltages...............................................................................................................................22
3.2.2.1 Grounding...........................................................................................................................22
3.2.2.2 Output rating.......................................................................................................................22
3.2.2.3 Auxiliary Output (Standby)................................................................................................22
3.2.2.4 No load operation ...............................................................................................................22
3.2.2.5 Voltage Regulation.............................................................................................................23
3.2.2.6 Ripple and Noise Regulation..............................................................................................23
3.2.2.7 Dynamic loading.................................................................................................................23
3.2.2.8 Capacitive load ...................................................................................................................23
3.2.2.9 Close loop stability.............................................................................................................24
3.2.2.10 Residual Voltage Immunity in Standby mode....................................................................24
3.2.2.11 Soft starting.........................................................................................................................24
3.2.2.12 Hot Swap Requirements .....................................................................................................24
3.2.2.13 Load sharing control...........................................................................................................24
3.2.3 Timing Requirements...........................................................................................................................25

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3.2.3.1 Output Voltage Timing....................................................................................................... 25
3.2.3.2 Overshoot ........................................................................................................................... 26
3.2.3.3 Undershoot ......................................................................................................................... 26
3.2.3.4 Temperature coefficient...................................................................................................... 26
3.2.4 Control and Indicator functions...........................................................................................................26
3.2.4.1 PSON# Input Signal (Power supply enable) ...................................................................... 26
3.2.4.2 Power OK (PG or PWOK) Output Signal.......................................................................... 27
3.2.4.3 SMBAlert# (PSAlert) Output Signal Pin............................................................................ 27
3.2.4.4 A0....................................................................................................................................... 28
3.2.4.5 A1....................................................................................................................................... 28
3.2.4.6 12VRS and Return Sense ................................................................................................... 28
3.2.4.7 Present ................................................................................................................................ 28
3.2.4.8 SDA and SCL..................................................................................................................... 28
3.3 Protection circuits ................................................................................................................................ 29
3.3.1 Over Voltage Protection (OVPmain & OVPauxilary )........................................................................ 29
3.3.2 Over Current and Short Circuit Protection (OCP/SCPmain & OCP/SCPauxilary )............................ 29
3.3.3 Over Temperature Protection (OTP).................................................................................................... 29
3.3.4 Fan Failure Protection.......................................................................................................................... 30
3.4 Power Supply Management................................................................................................................. 30
3.4.1 Hardware Layer ...................................................................................................................................30
3.4.2 Power Supply Management Controller (PSMC) ................................................................................. 31
3.4.2.1 Related Documents............................................................................................................. 31
3.4.2.2 Data Speed.......................................................................................................................... 31
3.4.2.3 Bus Errors........................................................................................................................... 31
3.4.2.4 Write byte/word.................................................................................................................. 32
3.4.2.5 Read byte/word................................................................................................................... 32
3.4.2.6 Block write/read ................................................................................................................. 33
3.4.2.7 Sensor Accuracy................................................................................................................. 33
3.4.2.8 PSMC Sensors.................................................................................................................... 34
3.4.3 Power Supply Field Replacement Unit (FRU) .................................................................................... 34
3.5 Smart On Function...............................................................................................................................40
3.5.1 PMBus command for Smart On........................................................................................................... 40
3.5.1.1 Hardware Connection......................................................................................................... 40
3.5.1.2 Configuring Smart On with SMART_ON_CONFIG (D0h).............................................. 40
3.5.2 Smart Standby Power Supply Operating State ....................................................................................40

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3.5.2.1 Powering on Smart Standby supplies to maintain best efficiency......................................41
3.5.2.2 Powering on Smart Standby supplies during a fault or over current condition..................41
3.5.3 The Way to Enable Smart On Function...............................................................................................41
3.6 ENVIRONMENTAL...........................................................................................................................41
3.6.1 Temperature .........................................................................................................................................42
3.6.2 Humidity ..............................................................................................................................................42
3.6.3 Altitude.................................................................................................................................................42
3.6.4 Vibration ..............................................................................................................................................42
3.6.5 Mechanical Shock................................................................................................................................42
3.6.6 Thermal shock (Shipping)....................................................................................................................42
3.6.7 Catastrophic Failure.............................................................................................................................42
3.6.8 EMI ......................................................................................................................................................42
3.6.9 Magnetic Leakage Fields .....................................................................................................................43
3.6.10 Voltage Fluctuations and Flicker.........................................................................................................43
3.7 Reliability / Warranty / Service............................................................................................................43
3.7.1 Mean Time between Failures (MTBF).................................................................................................43
3.7.2 Warranty...............................................................................................................................................43
3.7.3 Serviceability........................................................................................................................................43
4. Thermal Management..........................................................................................................................................44
4.1 Thermal Operation and Configuration Requirements..........................................................................45
4.2 Thermal Management Overview..........................................................................................................46
4.2.1 Fan Speed Control................................................................................................................................47
4.2.2 Programmable Fan PWM Offset..........................................................................................................47
4.2.3 Hot-Swap Fans.....................................................................................................................................47
4.2.4 Fan Redundancy Detection ..................................................................................................................48
4.2.5 Fan Domains........................................................................................................................................48
4.2.6 Nominal Fan Speed..............................................................................................................................48
4.2.7 Thermal and Acoustic Management ....................................................................................................48
4.2.8 Thermal Sensor Input to Fan Speed Control........................................................................................49

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4.3 System Fans......................................................................................................................................... 50
4.4 Power Supply Module Fans................................................................................................................. 51
5. System Storage and Peripheral Drive Bay Overview.......................................................................................52
5.1 Front Mount Drive Support ................................................................................................................. 52
5.2 System Fan RVI and Hard Disk Drive Storage Performance.............................................................. 52
5.3 External Hot Swap Drive Carriers....................................................................................................... 52
5.4 Peripheral Power Sources.................................................................................................................... 54
5.5 Storage Backplane Optional ................................................................................................................ 55
5.5.1 SGPIO Functionality............................................................................................................................ 56
5.5.2 I2C Functionality................................................................................................................................. 56
5.5.3 12 x 3.5”Drive Hot-Swap Backplane Overview................................................................................. 56
5.5.3.1 12G Mini SAS HD 12 Port Backplane............................................................................... 56
5.5.3.1.1 SW Function........................................................................................................................................ 61
5.6 2 x 2.5’’ Hot Swap Drive Bay Accessory Kit...................................................................................... 62
5.7 Low Profile eUSB SSD Support.......................................................................................................... 65
5.8 SATA DOM Support........................................................................................................................... 65
6. Front Control Panel and I/O Panel Overview...................................................................................................68
6.1 I/O Panel Features................................................................................................................................ 68
6.2 Control Panel Features......................................................................................................................... 68
6.2.1 LED Board with Cable and Connectors............................................................................................... 69
7. PCIe* Riser Card Support..................................................................................................................................71
7.1 Riser Card Assembly ...........................................................................................................................71
7.2 Riser Card Option................................................................................................................................ 72
7.2.1 2-Slot PCIe Riser Card –Chenbro Product Code: 80H09323702A1 .................................................. 72
7.2.2 3-Slot PCIe Riser Card –Chenbro Product Code: 80H09323701A0 .................................................. 72
8. Intel® I/O Module Support.................................................................................................................................74
9. Basic and Advanced Server Management Features .........................................................................................75
9.1.1 Dedicated Management Port................................................................................................................ 76
9.1.2 Embedded Web Server ........................................................................................................................ 76

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9.1.3 Advanced Management Feature Support (RMM4 Lite) ......................................................................77
9.1.3.1 Keyboard, Video, Mouse (KVM) Redirection ...................................................................78
9.1.3.2 Remote Console..................................................................................................................79
9.1.3.3 Performance........................................................................................................................79
9.1.3.4 Security...............................................................................................................................79
9.1.3.5 Availability.........................................................................................................................79
9.1.3.6 Usage ..................................................................................................................................79
9.1.3.7 Force-enter BIOS Setup......................................................................................................80
9.1.3.8 Media Redirection ..............................................................................................................80
Appendix A: Integration and Usage Tips...................................................................................................................82
Appendix B: POST Code Diagnostic LED Decoder..................................................................................................83
Appendix C: POST Code Errors................................................................................................................................88
Appendix D: System Cable Routing Diagram...........................................................................................................95