Congatec Smarc conga-sa7 User manual

SMARC®conga-SA7

SMARC 2.1 module based on Intel® Atom®, Pentium® and Celeron® Elkhart Lake SoC

User’s Guide

Revision 0.1 (Preliminary)

Revision History

Revision Date (yyyy-mm-dd) Author Changes

0.1 2021-04-22 AEM •Preliminary release

Preface

This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-SA7. It is

one of three documents that should be referred to when designing a SMARC®application. The other reference documents that should be used

include the following:

SMARC®Design Guide 2.0

SMARC®Speciﬁcation 2.1

The links to the SMARC®documents can be found on the SGET website at www.sget.org.

Disclaimer

The information contained within this user’s guide, including but not limited to any product speciﬁcation, is subject to change without notice.

congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims

any implied warranties of merchantability or ﬁtness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes

no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for

discrepancies between the product and the user’s guide. In no event shall congatec GmbH be liable for any incidental, consequential, special,

or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other

information contained herein or the use thereof.

Intended Audience

This user’s guide is intended for technically qualiﬁed personnel. It is not intended for general audiences.

Lead-Free Designs (RoHS)

All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.

Electrostatic Sensitive Device

All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary

packaging (protective packaging). The secondary packaging does not provide electrostatic protection.

Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store

electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive ﬁelds unless the device is contained within its original

packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.

Symbols

The following symbols are used in this user’s guide:

Warning

Warnings indicate conditions that, if not observed, can cause personal injury.

Caution

Cautions warn the user about how to prevent damage to hardware or loss of data.

Note

Notes call attention to important information that should be observed.

without written permission from congatec GmbH.

congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is

supplied “as-is”.

Trademarks

Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property of

their respective trademark holders. These trademark holders are not afﬁliated with congatec GmbH, our products, or our website.

Warranty

congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited

warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and conditions

can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time and from time

to time.

The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license agreements,

which are available at www.congatec.com and/or upon request.

Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that the

products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or

due to non conformance to the agreed upon speciﬁcations, will be repaired or exchanged, at congatec’s option and expense.

Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product

freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.

Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged

or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to

congatec’s direct customer only and is not assignable or transferable.

Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either express

or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of ﬁtness for a

particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.

congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be

liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive remedy

against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only.

Certiﬁcation

congatec GmbH is certiﬁed to DIN EN ISO 9001 standard.

Technical Support

congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our

products can be easily used and implemented. We request that you ﬁrst visit our website at www.congatec.com for the latest documentation,

utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our

technical support department by email at [email protected].

Terminology

Term Description

GB Gigabyte

GHz Gigahertz

kB Kilobyte

MB Megabyte

MT/s Mega-transfers per second

Mbit Megabit

kHz Kilohertz

MHz Megahertz

TDP Thermal Design Power

cBC congatec Board Controller

PCIe PCI Express

SATA Serial ATA

PEG PCI Express Graphics

PCH Platform Controller Hub

eDP Embedded DisplayPort

DDI Digital Display Interface

HDA High Deﬁnition Audio

N.C Not connected

N.A Not available

T.B.D To be determined

Contents

1 Introduction ............................................................................. 10

1.1 SMARC®Concept .................................................................... 10

1.2 conga-SA7 Options Information .............................................. 10

1.2.1 Options Information................................................................. 11

2 Speciﬁcations........................................................................... 12

2.1 Feature List .............................................................................. 12

2.2 Supported Operating Systems ................................................ 13

2.3 Mechanical Dimensions ........................................................... 13

2.4 Standard Power........................................................................ 14

2.4.1 Supply Voltage......................................................................... 14

2.4.2 Electrical Characteristics .......................................................... 14

2.4.3 Rise Time ................................................................................. 14

2.5 Power Consumption ................................................................ 15

2.6 Supply Voltage Battery Power ................................................. 16

2.7 Environmental Speciﬁcations................................................... 17

3 Block Diagram.......................................................................... 18

4 Cooling Solutions..................................................................... 19

4.1 CSP Dimensions....................................................................... 20

4.2 CSP Dimensions ...................................................................... 21

4.3 HSP Dimensions....................................................................... 22

4.4 HSP Dimensions....................................................................... 23

5 Connector Rows....................................................................... 24

5.1 PCI Express™........................................................................... 24

5.1.1 Possible Reference Clock Conﬁguration.................................. 24

5.2 Display Interfaces..................................................................... 25

5.2.1 LVDS......................................................................................... 26

5.2.2 HDMI........................................................................................ 26

5.2.3 DP ++ ...................................................................................... 27

5.3 SATA ........................................................................................ 27

5.4 Gigabit Ethernet ...................................................................... 27

5.5 USB .......................................................................................... 28

5.6 Audio (HDA )............................................................................ 28

5.7 SD Card.................................................................................... 29

5.8 UART ............................................................................................. 29

5.9 GPIO ........................................................................................ 29

5.10 SPI............................................................................................ 30

5.11 I2C ........................................................................................... 30

5.12 Power Control .......................................................................... 30

6 Additional Features.................................................................. 33

6.1 Optional Onboard Interfaces................................................... 33

6.2 Security Features...................................................................... 33

6.3 congatec Board Controller (cBC) ............................................. 33

6.3.1 Board Information.................................................................... 33

6.3.2 General Purpose Input/Output................................................ 33

6.3.3 Fan Control .............................................................................. 34

6.3.4 Power Loss Control.................................................................. 34

6.3.5 Watchdog ................................................................................ 34

6.3.6 Enhanced Soft-Off State .......................................................... 34

6.4 OEM BIOS Customization........................................................ 35

6.4.1 OEM Default Settings .............................................................. 35

6.4.2 OEM Boot Logo....................................................................... 35

6.4.3 OEM POST Logo ..................................................................... 35

6.4.4 OEM BIOS Code/Data............................................................. 35

6.4.5 OEM DXE Driver...................................................................... 36

6.5 congatec Battery Management Interface ................................ 36

6.6 API Support (CGOS) ................................................................ 36

6.7 Suspend to Ram....................................................................... 36

7 conga Tech Notes .................................................................... 37

7.1 Intel®Elkhart Lake SoC Features.............................................. 37

7.1.1 Processor Core......................................................................... 37

7.1.1.1 Intel®Virtualization Technology ............................................... 37

7.1.1.2 AHCI ........................................................................................ 38

7.1.1.3 Thermal Management ............................................................. 38

7.2 ACPI Suspend Modes and Resume Events.............................. 39

7.3 USB Port Mapping ................................................................... 40

8 Signal Descriptions and Pinout Tables..................................... 41

9 System Resources .................................................................... 63

9.1 I/O Address Assignment.......................................................... 63

9.2 PCI Conﬁguration Space Map ................................................. 63

9.3 I²C Bus and SMBus .................................................................. 63

9.4 congatec System Sensors ........................................................ 63

10 BIOS Setup Description........................................................... 64

10.1 Navigating the BIOS Setup Menu ........................................... 64

10.2 BIOS Versions........................................................................... 64

10.3 Updating the BIOS................................................................... 64

10.3.1 Update from External Flash ..................................................... 65

10.4 Supported Flash Devices ......................................................... 65

List of Tables

Table 1 Commercial Variants ................................................................ 11

Table 2 Industrial Variants..................................................................... 11

Table 3 Feature Summary..................................................................... 12

Table 4 Measurement Description........................................................ 15

Table 5 Power Consumption Values ..................................................... 16

Table 6 CMOS Battery Power Consumption ........................................ 16

Table 7 Cooling Solution Variants......................................................... 19

Table 8 PCIe Reference Clock Conﬁguration ....................................... 24

Table 9 Display Combination .............................................................. 25

Table 10 Possible USB Port Mapping..................................................... 28

Table 11 Wake Events............................................................................. 39

Table 12 Signal Tables Terminology Descriptions .................................. 41

Table 13 SMARC Edge Finger Pinout..................................................... 42

Table 14 LVDS Signal Description .......................................................... 47

Table 15 HDMI Signal Descriptions........................................................ 50

Table 16 DisplayPort++.......................................................................... 51

Table 17 MIPI CSI-2/-3............................................................................ 51

Table 18 SDIO Signal Descriptions......................................................... 52

Table 19 SPI0 Signal Descriptions .......................................................... 53

Table 20 eSPI/SPI1 Signal Descriptions.................................................. 53

Table 21 I2S Signal Descriptions ............................................................ 54

Table 22 HDA / I2S Signal Descriptions ................................................. 54

Table 23 I2C Signal Descriptions............................................................ 54

Table 24 Asynchronous Serial Port Signal Description........................... 55

Table 25 USB Pinout Description............................................................ 55

Table 26 PCIe Signal Description ........................................................... 56

Table 27 SERDES Signal Description...................................................... 57

Table 28 SATA Signal Description .......................................................... 57

Table 29 Gigabit Ethernet Signal Description ........................................ 58

Table 30 Watchdog Signal Description .................................................. 58

Table 31 GPIO Signal Description .......................................................... 59

Table 32 Management Pins Signal Description...................................... 60

Table 33 Boot Select Signal Description ................................................ 61

Table 34 Power and GND Signal Descriptions....................................... 62

1 Introduction

1.1 SMARC®Concept

The Standardization Group for Embedded Technologies e.V (SGET) deﬁned the SMARC standard for small form factor computer modules that

target applications with ultra low power, low cost and high performance. The SMARC connector and interfaces are optimized for high-speed

communication, and are suitable for ARM SoCs and low power x86 SoCs.

The SMARC standard bridges the gap between the COM Express standard and the Qseven standard by offering most of the interfaces deﬁned

in the COM Express speciﬁcation at a lower power. With a footprint of 82 mm x 50 mm or 82 mm x 80 mm, the SMARC standard promotes the

design of highly integrated, energy efﬁcient systems.

Due to its small size and lower power demands, PC appliance designers can design low cost devices as well as explore a huge variety of product

development options—from compact space-saving designs to fully functional systems. This solution allows scalability, product diversiﬁcation

and faster time to market.

1.2 conga-SA7 Options Information

The conga-SA7 design is based on the SMARC 2.1 Speciﬁcation. The conga-SA7 features the Intel®Atom®, Pentium®and Celeron®Elkhart Lake

SoCs. With maximum 12 W TDP, the conga-SA7 offers Ultra Low Power boards with high computing performance and outstanding graphics.

Additionally, the conga-SA7 supports quad channel LPDDR4x memory with up 16 GB capacity and data rates up to 4267 MT/s, multiple I/O

interfaces, up to three independent displays and various congatec embedded features.

By offering most of the functional requirement for any SMARC application, the conga-SA7 provides manufacturers and developers with a

platform to jump-start the development of systems and applications based on SMARC speciﬁcation. Its features and capabilities make it an

ideal platform for designing compact, energy-efﬁcient, performance-oriented embedded systems.

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