Congatec SMARC conga-SA7 User manual
SMARC®conga-SA7
SMARC 2.1 module based on Intel® Atom®, Pentium® and Celeron® Elkhart Lake SoC
User’s Guide
Revision 0.1 (Preliminary)
Copyright © 2021 congatec GmbH SA70m01 2/65
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2021-04-22 AEM •Preliminary release
Copyright © 2021 congatec GmbH SA70m01 3/65
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-SA7. It is
one of three documents that should be referred to when designing a SMARC®application. The other reference documents that should be used
include the following:
SMARC®Design Guide 2.0
SMARC®Specification 2.1
The links to the SMARC®documents can be found on the SGET website at www.sget.org.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec GmbH be liable for any incidental, consequential, special,
or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other
information contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.
Copyright © 2021 congatec GmbH SA70m01 4/65
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2021, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Copyright © 2021 congatec GmbH SA70m01 5/65
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property of
their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.
Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and conditions
can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time and from time
to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license agreements,
which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either express
or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of fitness for a
particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive remedy
against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only.
Copyright © 2021 congatec GmbH SA70m01 6/65
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
MT/s Mega-transfers per second
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
cBC congatec Board Controller
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
DDI Digital Display Interface
HDA High Definition Audio
N.C Not connected
N.A Not available
T.B.D To be determined
C
E
R
T
I
F
I
C
A
T
I
O
N
I
S
O
9
0
0
1
TM
Copyright © 2021 congatec GmbH SA70m01 7/65
Contents
1 Introduction ............................................................................. 10
1.1 SMARC®Concept .................................................................... 10
1.2 conga-SA7 Options Information .............................................. 10
1.2.1 Options Information................................................................. 11
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Standard Power........................................................................ 14
2.4.1 Supply Voltage......................................................................... 14
2.4.2 Electrical Characteristics .......................................................... 14
2.4.3 Rise Time ................................................................................. 14
2.5 Power Consumption ................................................................ 15
2.6 Supply Voltage Battery Power ................................................. 16
2.7 Environmental Specifications................................................... 17
3 Block Diagram.......................................................................... 18
4 Cooling Solutions..................................................................... 19
4.1 CSP Dimensions....................................................................... 20
4.2 CSP Dimensions ...................................................................... 21
4.3 HSP Dimensions....................................................................... 22
4.4 HSP Dimensions....................................................................... 23
5 Connector Rows....................................................................... 24
5.1 PCI Express™........................................................................... 24
5.1.1 Possible Reference Clock Configuration.................................. 24
5.2 Display Interfaces..................................................................... 25
5.2.1 LVDS......................................................................................... 26
5.2.2 HDMI........................................................................................ 26
5.2.3 DP ++ ...................................................................................... 27
5.3 SATA ........................................................................................ 27
5.4 Gigabit Ethernet ...................................................................... 27
5.5 USB .......................................................................................... 28
5.6 Audio (HDA )............................................................................ 28
5.7 SD Card.................................................................................... 29
5.8 UART ............................................................................................. 29
5.9 GPIO ........................................................................................ 29
5.10 SPI............................................................................................ 30
5.11 I2C ........................................................................................... 30
5.12 Power Control .......................................................................... 30
6 Additional Features.................................................................. 33
6.1 Optional Onboard Interfaces................................................... 33
6.2 Security Features...................................................................... 33
6.3 congatec Board Controller (cBC) ............................................. 33
6.3.1 Board Information.................................................................... 33
6.3.2 General Purpose Input/Output................................................ 33
6.3.3 Fan Control .............................................................................. 34
6.3.4 Power Loss Control.................................................................. 34
6.3.5 Watchdog ................................................................................ 34
6.3.6 Enhanced Soft-Off State .......................................................... 34
6.4 OEM BIOS Customization........................................................ 35
6.4.1 OEM Default Settings .............................................................. 35
6.4.2 OEM Boot Logo....................................................................... 35
6.4.3 OEM POST Logo ..................................................................... 35
6.4.4 OEM BIOS Code/Data............................................................. 35
6.4.5 OEM DXE Driver...................................................................... 36
6.5 congatec Battery Management Interface ................................ 36
6.6 API Support (CGOS) ................................................................ 36
6.7 Suspend to Ram....................................................................... 36
7 conga Tech Notes .................................................................... 37
7.1 Intel®Elkhart Lake SoC Features.............................................. 37
7.1.1 Processor Core......................................................................... 37
7.1.1.1 Intel®Virtualization Technology ............................................... 37
7.1.1.2 AHCI ........................................................................................ 38
7.1.1.3 Thermal Management ............................................................. 38
7.2 ACPI Suspend Modes and Resume Events.............................. 39
7.3 USB Port Mapping ................................................................... 40
Copyright © 2021 congatec GmbH SA70m01 8/65
8 Signal Descriptions and Pinout Tables..................................... 41
9 System Resources .................................................................... 63
9.1 I/O Address Assignment.......................................................... 63
9.2 PCI Configuration Space Map ................................................. 63
9.3 I²C Bus and SMBus .................................................................. 63
9.4 congatec System Sensors ........................................................ 63
10 BIOS Setup Description........................................................... 64
10.1 Navigating the BIOS Setup Menu ........................................... 64
10.2 BIOS Versions........................................................................... 64
10.3 Updating the BIOS................................................................... 64
10.3.1 Update from External Flash ..................................................... 65
10.4 Supported Flash Devices ......................................................... 65
Copyright © 2021 congatec GmbH SA70m01 9/65
List of Tables
Table 1 Commercial Variants ................................................................ 11
Table 2 Industrial Variants..................................................................... 11
Table 3 Feature Summary..................................................................... 12
Table 4 Measurement Description........................................................ 15
Table 5 Power Consumption Values ..................................................... 16
Table 6 CMOS Battery Power Consumption ........................................ 16
Table 7 Cooling Solution Variants......................................................... 19
Table 8 PCIe Reference Clock Configuration ....................................... 24
Table 9 Display Combination .............................................................. 25
Table 10 Possible USB Port Mapping..................................................... 28
Table 11 Wake Events............................................................................. 39
Table 12 Signal Tables Terminology Descriptions .................................. 41
Table 13 SMARC Edge Finger Pinout..................................................... 42
Table 14 LVDS Signal Description .......................................................... 47
Table 15 HDMI Signal Descriptions........................................................ 50
Table 16 DisplayPort++.......................................................................... 51
Table 17 MIPI CSI-2/-3............................................................................ 51
Table 18 SDIO Signal Descriptions......................................................... 52
Table 19 SPI0 Signal Descriptions .......................................................... 53
Table 20 eSPI/SPI1 Signal Descriptions.................................................. 53
Table 21 I2S Signal Descriptions ............................................................ 54
Table 22 HDA / I2S Signal Descriptions ................................................. 54
Table 23 I2C Signal Descriptions............................................................ 54
Table 24 Asynchronous Serial Port Signal Description........................... 55
Table 25 USB Pinout Description............................................................ 55
Table 26 PCIe Signal Description ........................................................... 56
Table 27 SERDES Signal Description...................................................... 57
Table 28 SATA Signal Description .......................................................... 57
Table 29 Gigabit Ethernet Signal Description ........................................ 58
Table 30 Watchdog Signal Description .................................................. 58
Table 31 GPIO Signal Description .......................................................... 59
Table 32 Management Pins Signal Description...................................... 60
Table 33 Boot Select Signal Description ................................................ 61
Table 34 Power and GND Signal Descriptions....................................... 62
Copyright © 2021 congatec GmbH SA70m01 10/65
1 Introduction
1.1 SMARC®Concept
The Standardization Group for Embedded Technologies e.V (SGET) defined the SMARC standard for small form factor computer modules that
target applications with ultra low power, low cost and high performance. The SMARC connector and interfaces are optimized for high-speed
communication, and are suitable for ARM SoCs and low power x86 SoCs.
The SMARC standard bridges the gap between the COM Express standard and the Qseven standard by offering most of the interfaces defined
in the COM Express specification at a lower power. With a footprint of 82 mm x 50 mm or 82 mm x 80 mm, the SMARC standard promotes the
design of highly integrated, energy efficient systems.
Due to its small size and lower power demands, PC appliance designers can design low cost devices as well as explore a huge variety of product
development options—from compact space-saving designs to fully functional systems. This solution allows scalability, product diversification
and faster time to market.
1.2 conga-SA7 Options Information
The conga-SA7 design is based on the SMARC 2.1 Specification. The conga-SA7 features the Intel®Atom®, Pentium®and Celeron®Elkhart Lake
SoCs. With maximum 12 W TDP, the conga-SA7 offers Ultra Low Power boards with high computing performance and outstanding graphics.
Additionally, the conga-SA7 supports quad channel LPDDR4x memory with up 16 GB capacity and data rates up to 4267 MT/s, multiple I/O
interfaces, up to three independent displays and various congatec embedded features.
By offering most of the functional requirement for any SMARC application, the conga-SA7 provides manufacturers and developers with a
platform to jump-start the development of systems and applications based on SMARC specification. Its features and capabilities make it an
ideal platform for designing compact, energy-efficient, performance-oriented embedded systems.
Copyright © 2021 congatec GmbH SA70m01 11/65
1.2.1 Options Information
The conga-SA7 is available in nine variants (six commercial and three industrial). The table below shows the different configurations available.
Table 1 Commercial Variants
Part-No 050100 050101 050102 050120 050121 050122
Processor Intel®Atom®x6425E
2.0 GHz, Quad Core
Intel®Atom®x6413E
1.5 GHz, Quad Core
Intel®Atom®x6211E
1.3 GHz, Dual Core
Intel®Pentium®J6426
2.0 GHz, Quad Core
Intel®Celeron®J6413
1.8 GHz, Quad Core
Intel®Pentium®N6415
1.2 GHz, Quad Core
Burst Freq. 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz
L2 Cache 1.5 MB 1.5 MB 1.5 MB 1.5 MB 1.5 MB 1.5 MB
Graphics Engine Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
GFX Base/Burst Freq. 500 / 750 MHz 500 / 750 MHz 350 / 750 MHz 400 / 850 MHz 400 / 800 MHz 350 / 800 MHz
Onboard Memory
(LPDDR4x)
16 GB, 3200 MT/s
quad channel
8 GB, 3200 MT/s
quad channel
4 GB, 3200 MT/s
quad channel
16 GB, 3200 MT/s
quad channel
8 GB, 3733 MT/s
quad channel
8 GB, 3200 MT/s
quad channel
eMMC 64 GB 32 GB 32 GB 64 GB 32 GB 32 GB
Wifi/BT Module N.A N.A N.A N.A N.A N.A
TPM (Discrete) Infineon SLB9670 Infineon SLB9670 Infineon SLB9670 Infineon SLB9670 Infineon SLB9670 Infineon SLB9670
SD Card 1x 4-bit 1x 4-bit 1x 4-bit 1x 4-bit 1x 4-bit 1x 4-bit
Max. TDP 12 W 9 W 6 W 10 W 10 W 6 W
Table 2 Industrial Variants
Part-No 050110 050111 050112
Processor Intel®Atom®x6425RE
1.9 GHz, Quad Core
Intel®Atom®x6414RE
1.5 GHz, Quad Core
Intel®Atom®x6212RE
1.2 GHz, Dual Core
Burst Freq. N.A N.A N.A
L2 Cache 1.5 MB 1.5 MB 1.5 MB
Graphics Engine Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
GFX Base/Burst Freq. 400 MHz/ N.A 400 MHz/ N.A 350 MHz/ N.A
Onboard Memory
(LPDDR4x)
8 GB, 4267 MT/s
quad channel
4 GB, 3200 MT/s
quad channel
4 GB, 3200 MT/s
quad channel
eMMC 32 GB 32 GB 32 GB
Wifi/BT Module N.A N.A N.A
TPM (Discrete) Infineon SLB9670 Infineon SLB9670 Infineon SLB9670
SD Card 1x 4-bit 1x 4-bit 1x 4-bit
Max. TDP 12 W 9 W 6 W
Copyright © 2021 congatec GmbH SA70m01 12/65
2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor SMARC®form factor specification, revision 2.1 (82 mm x 50 mm)
SoC Intel®Atom®, Pentium®and Celeron SoCs
Memory Onboard non-ECC LPDDR4x memory. Supports
-data rates up to 4267 MT/s
-up to 16 GB capacity
-in-band ECC (out of band ECC is not supported)
Chipset Integrated in the SoC
Audio Intel High Definition Audio
Ethernet 2x Gigabit Ethernet via TI DP83867CS/IS Ethernet PHY (with TSN support)
Graphics Options Intel® UHD (Gen 11). Supports:
-API (DirectX 12.1, OpenGL 4.5, OpenCL 1.2, OpenGL ES 3.1, Vulkan 1.0)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-up to 3 independent displays (must be two DDI’s and one LVDS/eDP/DSI)
1x LVDS (dual channel)
1x DP++
1x HDMI 2.0b (native)
Optional Interface (assembly option):
-1x eDP 1.3 1 or 1x MIPI-DSI (x4 lane) 1
-1x DP++ (DDI1) 2
Peripheral
Interfaces
1x SATA® 6 Gb/s
Up to 4x PCIe®Gen3 ports
6x USB 2.0 (1x USB dual role)
2x USB 3.1 Gen 2 (1x USB dual role)
4x UART (two with handshake signals)
1x SD/SDIO
2x I²C
1x HDA
2x SPI (1x eSPI and 1x SPI)
Optional Interface (assembly option):
-M.2 1216 Wi-Fi/BT module 3
Mass Storage eMMC 5.1 onboard flash
BIOS AMI Aptio®V UEFI 2.x firmware
32 MB serial SPI with congatec Embedded BIOS features
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control,
I2C bus, Power loss control
Power Mgmt. ACPI 5.0 compliant with battery support
S5e mode (see section 6.3.6 “Enanced Soft-Off State”)
Also supports Suspend to RAM (S3)
Configurable TDP
Security Discrete SPI TPM 2.0 (Infineon SLB9670VQ2.0)
Copyright © 2021 congatec GmbH SA70m01 13/65
Note
1. No LVDS support with this option
2. No HDMI support with this option
3. Not available by default
2.2 Supported Operating Systems
The conga-SA7 supports the following operating systems:
•Microsoft®Windows®10 IoT Enterprise (64-bit)
•Linux Ubuntu (64-bit)
•Android 10 (64-bit)
•Yocto (64-bit)
•RTS Hypervisor
Note
We do not offer installation support for systems with less than 20 GB storage space.
2.3 Mechanical Dimensions
The conga-SA7 has the following dimensions:
•length of 82 mm
•width of 50 mm
The overall height (module, heatspreader and stack) is shown below:
Top Side Component
Carrier Board PCB
SMARC Module PCB
Heatspreader
Carrier Connector
Bottom Side Component
All dimensions are in millimeters
Height depends on the
connector height used
Height depends on the
connector height used
1.2±10%
3.2
2.8
Copyright © 2021 congatec GmbH SA70m01 14/65
2.4 Standard Power
2.4.1 Supply Voltage
The conga-SA7 provides a supply voltage range of 4.75 V – 5.25 V.
2.4.2 Electrical Characteristics
Characteristics Min. Typ. Max. Units Comment
5V Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple - - ± 50 mVPP 0–20MHz
Current
2.4.3 Rise Time
The input voltages shall rise from 10 percent of nominal to 90 percent of nominal at a minimum slope of 250 V/s. The smooth turn-on requires
that, during the 10 percent to 90 percent portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum5.25V
4.75V
5V
5.05V
4.95V
Copyright © 2021 congatec GmbH SA70m01 15/65
2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +5 V
•conga-SA7 COM
•conga-SEVA carrier board
•conga-SA7 cooling solution
•Microsoft Windows 10 (64 bit)
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency
S0: Peak value Highest power spike during the measurement of “S0: Maximum value”.
This state shows the peak value over a short period of time (worst case
power consumption value)
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V, while in Suspend to RAM state
S5 COM is powered by VCC_5V, while in Soft-Off state
S5e COM is powered by VCC_5V, while in enhanced Soft-Off state
Note
The peripherals did not influence the measured values because they were powered externally.
Copyright © 2021 congatec GmbH SA70m01 16/65
Table 5 Power Consumption Values
The table below provides additional information about the conga-SA7 power consumption. The values are recorded at various operating
mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS (64 bit) CPU Current (A)
Variant Cores Freq. /Max. Turbo S0: Min S0: Max S0: Peak S3 S5 S5e
050100 16 GB B.x TBD Windows 10 Intel®Atom®x6425E 4 2.0 / 3.0 GHz TBD TBD TBD TBD TBD TBD
050101 8 GB B.x TBD Windows 10 Intel®Atom®x6413E 4 1.5 / 3.0 GHz TBD TBD TBD TBD TBD TBD
050102 4 GB B.x TBD Windows 10 Intel®Atom®x6211E 2 1.3 / 3.0 GHz TBD TBD TBD TBD TBD TBD
050110 8 GB B.x TBD Windows 10 Intel®Atom®x6425RE 4 1.9 GHz/ N.A TBD TBD TBD TBD TBD TBD
050111 4 GB B.x TBD Windows 10 Intel®Atom®x6414RE 4 1.5 GHz/ N.A TBD TBD TBD TBD TBD TBD
050112 4 GB B.x TBD Windows 10 Intel®Atom®x6212RE 2 1.2 GHz/ N.A TBD TBD TBD TBD TBD TBD
050120 16 GB B.x TBD Windows 10 Intel®Pentium®J6426 4 2.0 / 3.0 GHz TBD TBD TBD TBD TBD TBD
050121 8 GB B.x TBD Windows 10 Intel®Celeron®J6413 4 1.8 / 3.0 GHz TBD TBD TBD TBD TBD TBD
050122 8 GB B.x TBD Windows 10 Intel®Pentium®N6415 4 1.2 / 3.0 GHz TBD TBD TBD TBD TBD TBD
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC TBD µA
20oC 3V DC TBD µA
70oC 3V DC TBD µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-SA7
Copyright © 2021 congatec GmbH SA70m01 17/65
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.
Copyright © 2021 congatec GmbH SA70m01 18/65
3 Block Diagram
PCIe Gen. 3
SATA 6 Gb/s
LPDDR4x up to 4,267 MT/s
DDI0
DDI1
DDI2
CAN
SD/SDIO
HDA/I2S0
I2S1
UART
SM Bus
eMMC
PCIe Gen. 3
USB 2.0
RGMII
RGMII
USB 2.0
USB 3.1 Gen 2
FSPI
eSPI
Intel
®
Atom
®
x6000E,
Intel
®
Pentium
®
and
Celeron
®
N and J
Series Processor
“Elkhart Lake”
SPI Flash 0
eMMC 5.1
TPM
GbE PHY
DP83867XS GbE PHY
DP83867XS
eDP to LVDS
Bridge
DP to TMDS
Level Shifter
Wi-Fi/BT
1x eDP or 1x MIPI-DSI x4
1x DP++
GbE0
GbE1
Optional - Not available by default
congatec
Board
Controller
5
th
Generation
I
2
C
GPIO
SM Bus
UART
Power Control
LID/SLEEP/FAN
Onboard
LPDDR4x
Memory
=
Ethernet1
Ethernet0
6x USB 2.0 (Port 0-5)
2x CAN
SD/SDIO
HDA/I2S2
I2S0
2x UART (SER1, 2)
2x UART (SER0, 3)
2x USB 3.1 (Port 2-3)
SPI
HDMI (DP1)
Power Control
I2C_PM
I2C_GP
eSPI
GPIO
LID# / SLEEP# / FAN
4x PCIe (Ports A - D)
SATA
LVDS_1
DP++ (DP0)
LVDS_0
SMARC Connector
Copyright © 2021 congatec GmbH SA70m01 19/65
4 Cooling Solutions
congatec GmbH offers the following cooling solutions for the conga-SA7 variants. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Table 7 Cooling Solution Variants
Cooling Solution Part No Description
1 CSP 050150 Passive cooling with 2.7 mm bore-hole standoffs for lidded CPU variants (industrial variants)
050153 Passive cooling with 2.7 mm bore-hole standoffs for bare-die CPU variants (commercial variants)
2 HSP 050151 Heatspreader with 2.7 mm bore-hole standoffs for lidded CPU variants (industrial variants)
050152 Heatspreader with 2.7 mm bore-hole standoffs for bare-die CPU variants (commercial variants)
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid
on the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or
cross-threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.
Copyright © 2021 congatec GmbH SA70m01 20/65
4.1 CSP Dimensions
Lidded Variants (Industrial)
82
53
53
6
20.1
A
A
423.98
34
4
17.6
63.76
74
82
ø2.7 x 6 mm
non-threaded standoff
for borehole version
2.2
3.2 ±0.15
3.2 ±0.15
This manual suits for next models
9
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