Crystal Clear T700T09X00 Owner's manual

Product Specification
T700T09X00
(REVISION 5)
Crystal Clear Technology Sdn. Bhd.
16 Jalan TP5, Taman Perindustrian Sime UEP,
47600 Subang Jaya, Selangor DE
Tel: [phone]
Website: www.cct.com.my

CRYSTAL CLEAR TECHNOLOGY SDN BHD
Spec. No: T700T09X00 REV5
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1.0 Table of Contents
No Title Page
1 Table of Contents 1
2 Record of revision 2
3 General Specification 3
4 Absol te Maxim m Ratings 4
5 Electrical Characteristics 5
6 Pin Assignment 7
7 Optical Characteristics 9
8 Timing Characteristics 12
9 Reliability Test Condition 14
10 Inspection Criteria 15
11 Preca tion and Limited Warranty 16
12 Mechanical Specification 20
13 Attachment:
Capacitive To ch Panel Specification – TP0085

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Spec. No: T700T09X00 REV5
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2.0 Records of Revision
Rev
Date
Item
Page
Comment
Originator
Checked By
1.0
2.0
3.0
4.0
5.0
22.11.15
08.12.15
28.01.16
01.03.16
10.05.16
Initial Release
Update mechanical drawing
Change IC
Change model name T700B09N00 to
T700X09X00
Change viewing direction
Change model name T700X09X00 to
T700T09X00, update reliability test,
change inspection criteria, change
precaution and limited warranty.
Azhar
Azhar
Azhar
Azhar
Adam
Liew
Liew
Azhar
Azhar
Azhar

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Spec. No: T700T09X00 REV5
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3.0 General Specification
T700T09X00 is 7.0” color TFT-LCD (Thin Film Transistor Liq id Crystal Display)
mod le composed of LCD panel, driver ICs control circ it, LED backlight. This display area
contains 1024 x 600 pixels and can display p to 16M colors. This prod ct compliant
with RoHS environmental req irement.
Item Contents Unit Note
LCD Type 7.0” TFT -
Display color 16M 1
Viewing Direction
(Optim m View) 12 O ’Clock
Viewing Direction
(Grey Inversion) 6 O ’Clock
Mod le size 165.4 X 105.7 X 2.78 mm 2
Active Area(W×H) 153.6 X 90.0 mm
N mber of Dots 1024×RGB×600 dots
Driver IC NT51008CH/NT52002H -
Backlight 27 White LEDs pcs
Brightness 500 (TYP) cd/m2
Interface Mode LVDS -
Note1: Color tone is slightly changed by temperat re and driving voltage.
Note2: FPC or wire are not incl ded.
Note3: Brightness on LCD s rface. Mod le with CTP or RTP, brightness will be abo t
20% (max) lower on the to ch panel s rface.

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4.0 Absol te Maxim m Ratings
4.1 Electrical Absol te Maxim m ratings (Vss = 0V, Ta = 25°C)
Item Symbol Min. Max. Unit Note
Power Voltage
DVDD -0.3 5.0 V
AVDD 6.5 13.5 V
VGH -0.3 42.0 V
VGL -20.0 0.3 V
VGH-VGL 40.0 V
Notes:
1. If the mod le is above these absol te maxim m ratings. It may become
permanently damaged.
2. VR Condition: Zener Diode: 20mA.
3. Please be s re sers are gro nded when handing LCD Mod le.
4 2 Environmental Absolute Maximum Ratings
Item
Storage Operating
Note
MIN. MAX. MIN. MAX.
Ambient Temperat re -30
℃
70
℃
-20
℃
60
℃
1,2
H midity - - - - 3
1. The response time will become lower when operated at low temperat re.
2. Backgro nd color changes slightly depending on ambient temperat re. The
phenomenon is reversible.
3. Ta<=40°C and 85%RH MAX.
(Ta>=40°C. Absol te h midity m st be lower than the h midity of 85%RH at
40°C)

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5.0 Electrical Characteristics and Instr ction Code
5.1 Electrical Characteristics (Vss = 0V, Ta = 25°C)
Parameter Symbol Min Typ Max Unit Note
Power s pply
DVDD 3.0 3.3 3.6 V Note 2
AVDD 10.8 11 11.2 V
VGH 19.7 20 20.3 V
VGL -6.5 -6.8 -7.1 V
Inp t signal voltage VCOM 2.8 (3.8) 4.8 V
Inp t logic high voltage VIH 0.7DVDD - DVDD V
Note 3
Inp t logic low voltage VIL 0 - 0.3DVDD V
Note 1: DVDD and VGL m st be applied first before we can apply VGH.
Note 2: DVDD setting sho ld match the signals o tp t voltage (refer to Note 3) of
c stomer’s system board.
Note 3: DCLK,HS,VS,RESET,U/D, L/R,DE,R0~R7,G0~G7,B0~B7,MODE,DITHB.
Note 4: VCOM (typ) is only a reference val e, it m st be adj sted ( se VR) and
optimized on each LCM.
5.2 C rrent Cons mption
Item Symbol Min Typ Max Unit remarks
C rrent for Driver
IGH - 0.2 1 mA VGH = 18.0V
IGL - 0.2 1 mA VGL = -6.0V
IDVDD - 50 60 mA DVDD = 3.3V
IAVDD - 25 30 mA AVDD = 9.6V

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5.3 Power Seq ence
a. Power On
b. Power Off
5.4 LED Backlight Specification (Vss = 0V, Ta = 25°C)
Note:
1. V
LED
=V
LED
(+)-V
LED
(-).
2. It is recommended that c stomer s pply constant c rrent to prolong the led
lifetime and optim m led performance
3. Definition of Lifetime: L minance < 50% of initial L minance
(Test condition: Ta = 25⁰C, Constant c rrent s pply (typical Val e))
Item Symbol Condition Min Typ Max Unit Note
S pply Voltage V
LED
- - 9.6 10.2 V 1
S pply C rrent If - - 160 170 mA
Led lifetime 20000 2

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6.0 Pin Assignment
P i n N o. S y m bo l I / O F n ct i on R e m a rk
1 VCOM P Common Voltage
2 VDD P Power Voltage for digital circ it
3 VDD P Power Voltage for digital circ it
4 NC --- No connection
5 Reset I Global reset pin
6 STBYB I
Standby mode, Normally p lled high STBYB =
“1”, normal operation STBYB = “0”, timing
controller, so rce driver will t rn off, all o tp t
are High-Z
7 GND P Gro nd
8 RXIN0- I -LVDS differential data inp t
9 RXIN0+ I + LVDS differential data inp t
10 GND P Gro nd
11 RXIN1- I -LVDS differential data inp t
12 RXIN1+ I + LVDS differential data inp t
13 GND P Gro nd
14 RXIN2- I -LVDS differential data inp t
15 RXIN2+ I + LVDS differential data inp t
16 GND P Gro nd
17 RXCLKIN- I -LVDS differential clock inp t
18 RXCLKIN+ I + LVDS differential clock inp t
19 GND P Gro nd
20 RXIN3- I -LVDS differential data inp t
21 RXIN3+ I + LVDS differential data inp t
22 GND P Gro nd
23 NC --- No connection
24 NC --- No connection
25 GND P Gro nd
26 NC --- No connection
27 DIMO O Backlight CABC controller signal o tp t
28 SELB I 6bit/8bit mode select Note1
29 AVDD P Power for Analog Circ it
30 GND P Gro nd
31 LED- P LED Cathode

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32 LED- P LED Cathode
33 L/R I Horizontal inversion Note3
34 U/D I Vertical inversion Note3
35 VGL P Gate OFF Voltage
36 CABCEN1 I CABC H/W enable Note2
37 CABCEN0 I CABC H/W enable Note2
38 VGH P Gate ON Voltage
39 LED+ P LED Anode
40 LED+ P LED Anode
I: inp t, O: o tp t, P: Power
Note1: If LVDS inp t data is 6 bits, SELB m st be set to High;
If LVDS inp t data is 8 bits, SELB m st be set to Low.
Note2: When CABC_EN=”00”, CABC OFF.
When CABC_EN=”01”, ser interface image.
When CABC_EN=”10”, still pict re.
When CABC_EN=”11”, moving image.
When CABC off, don’t connect DIMO, else connect it to backlight.
Note3: When L/R=”0”, set right to left scan direction.
When L/R=”1”, set left to right scan direction.
When U/D=”0”, set top to bottom scan direction.
When U/D=”1”, set bottom to top scan direction.
Note: Refer below fig re for Definition of scanning direction.

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7.0 Electrical Characteristics
Items Symbol Condition Min Typ Max Unit Remark
Response Time Tr + Tf
Θ = 0°
Ø = 0°
Ta = 25°C
- 25 50 ms Note5
Contrast Ratio Cr 500 700 - - Note4
Uniformity Δ
White - 70 - % Note2
S rface L minance Lv 300 320 - cd/m2 Note1
Viewing Angle
Θ
T
= 90
CR>10
60 70 -
° Note3
Θ
B
= 270
65 75 -
Θ
R
= 0
65 75 -
θ
L
= 180
65 75 -
CIE (X, Y)
Chromaticity
White X
W
Θ = 0°
Ø = 0°
Ta = 25°C
0.26 0.29 0.30
-
Note6
Y
W
0.26 0.29 0.30 -
Red
X
R
0.648 0.663 0.678 -
Y
R
0.310 0.325 0.340 -
Green
X
G
0.259 0.274 0.287 -
Y
G
0.587 0.602 0.617 -
Bl e
X
B
0.119 0.134 0.149 -
Y
B
0.103 0.118 0.133 -
Note: The parameter is slightly changed by temperat re, driving voltage and materiel
Note 1: The data are meas red after LEDs are t rned on for 5 min tes. LCM displays f ll white.
The brightness is the average val e of 9 meas red spots. Meas rement eq ipment
PR-705 (Φ8mm)
Meas ring condition:
- Meas ring s rro ndings: Dark room.
- Meas ring temperat re: Ta=25℃.
- Adj st operating voltage to get optim m contrast at the center of the display.
Meas red val e at the center point of LCD panel after more than 5 min tes while backlight t rning
on.

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Note 2: The l minance niformity is calc lated by sing following form la.
⊿Bp = Bp (Min.) / Bp (Max.)×100 (%)
Bp (Max.) = Maxim m brightness in 9
meas red spots Bp (Min.) = Minim m
brightness in 9 meas red spots.
Note 3: The definition of viewing angle:
Refer to the graph below marked by θ and Ф
Note 4: Definition of contrast ratio. (Test LCD sing DMS501)
Contrast ratio ( Cr ) = Brightness of selected dots
Brightness of non−selected dots

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Note 5: Definition of Response time. (Test LCD sing DMS501):
The o tp t signals of photo detector are meas red when the inp t signals are
changed from “black” to “white”(falling time) and from “white” to “black”(rising time),
respectively. The response time is defined as the time interval between the 10% and
90% of amplit des. Refer to fig re as below.
Note 6: Definition of Color of CIE Coordinate and NTSC Ratio.
Note 7: Definition of cross talk.
Cross talk ratio (%) = [pattern A Brightness-pattern B Brightness]/pattern A
Electric vol me val e = 3F+/-3Hex

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8.0 Timing Characteristics
8.1 AC Electrical Characteristics
Item Symbol
val es
Unit Remark
Min Typ Max
Clock freq ency Rxfclk 40.8 51.2 71 MHz
Inp t data skew margin Trskm 500 - ps
Clock high time Tlvch - 4/(7* RxFCLK)
- ns
Clock low time Tlvcl - 3/(7* RxFCLK)
- ns
8.2 Inp t Clock and Data Timing Diagram

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8.3 DC Electrical Characteristics
Parameter Symbol Val es Unit Remark
Min Typ Max
Differential inp t high
Threshold voltage
RxVTH
- - +0.1 V RXVCM=1.2V
Differential inp t low
Threshold voltage
RxVTH
-0.1 - - V
Inp t voltage range
(singled-end)
RxVIN
0 - 2.4 V
Differential inp t common
mode voltage
RxVCM
|VID|/2 - 2.4-|VID|/2 V
Differential voltage |VID|
0.2 - 0.6 V
Differential inp t leakage
c rrent
RVxliz
-10 - +10 A
8.4 Timing Characteristics
Item Symbol
Values Unit Remark
Min Typ Max
Clock frequency Fclk 40.8 51.2 67.2 MHz Frame rate=60Hz
Horizontal display area Thd 1024 DCLK
HS period time Th 1114 1344 1400 DCLK
HS Blanking Thb 90 320 376 DCLK
Vertical display area Tvd 600 H
VS period time Tv 610 635 800 H
VS blanking Thb 10 35 200 H
8.5 Data Inp t Format

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9.0 Reliability Test Condition
Item Test Condition
Operating
High Temperat re 70degC, 240 hrs
Low Temperat re -20degC,240 hrs
Storage
High Temperat re 80degC, 240hrs and recovery for 2hrs
Low Temperat re -30degC, 240hrs and recovery for 2hrs
High Temperat re and High
H midity 50degC, 90%RH, 240hrs and recovery for 2 hrs
Thermal
Cycle
RT  20degC  Rt  70degC  RT
0min 30min 5min 30min 5min
50 cycles (Power off)
Shock
RT  20degV  70degC
0min 30min 30min
50 cycles (Power off)
Note: RT means Room temperat re

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10.0 Inspection Criteria
No Defect Definition of defect Inspection Criteria
1
a) Definition of dot
The size of defective dot over ½ of whole is
regards as one defective dot.
Smaller than ½ Larger than ½
‘No dot defect’ ‘1 dot defect’
(ignore) (co nted)
A – Viewing area
B – Viewing area
C – O tside Viewing area
b) Bright Dot
Dot appear bright and nchanged in size when
LCD panel is displaying black pattern Defect A B C
Bright Dot 1 1
NC Dark Dot 2 2
Total 4
NC – Not Co nt
c) Dark Dot
Dot appear dark and nchanged in size when
LCD panel is displaying p re color (RED,
GREEN or BLUE) pattern
d) 2 dot adjacent
1 pair 2 dots
Type 1 Type 2
or
Type 3
Defect Acc. Co nt
2 Bright dot Adjacent 0
2 Dark dot Adjacent 1
2
Black spot
White Spot
Bright spot
Pin Hole
Foreign Particle
-Black/Dark/Bright Spot is points on display
which appear dark/bright and s ally res lt from
contamination
- These defect do not vary in size intensity
(contrast) when contras is varied.
Defect Category A B
D ≤ 0.10 NC
NC
0.10 ≤ D ≤ 0.20 2
0.20 ≤ D ≤ 0.30 1
D ≥ 0.30 0
3
Black Line
White line
Particle between
POL and Glass
Scratch on Glass
Defect Category A B
W ≤ 0.03 NC
NC 0.03 ≤ W ≤ 0.08, L ≤2.0 2
W ≥ 0.08 0
4
POL B bble
POL Dented
Defect Category A B
D ≤ 0.20 NC
NC
0.20 ≤ D ≤ 0.30 3
0.30 ≤ D ≤ 0.50 2
D ≥ 0.5 0
5
M ra
(50% Grey) J dged by Limit sample

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11.0 Preca tion for Using TFT Mod les
1. Handing Preca tions
a. The display panel is made of glass and polarizer. As glass is fragile. It tends to chip
d ring handling especially on the edges. Please avoid dropping or jarring. Do not
s bject it to a mechanical shock of impact or by dropping it.
b. If the display panel is damaged and the liq id crystal s bstance leaks o t, be s re
not to get any in yo r mo th. If the s bstance is in contact with yo r skin or clothes,
wash it off sing soap and water.
c. Do not apply excessive force to the display s rface or the adjoining areas since this
may ca se the color tone to vary. Do not to ch the display with bare hands. This will
stain the display area and degrade the ins lation between terminals. Scratch and
dents may occ r on polarizer too.
d. The polarizer covering the display s rface of the LCD mod le is soft and easily
scratched. Handle this polarizer caref lly. Do not to ch, p sh or r b the exposed
polarizers with anything harder than a HB pencil lead (glass, tweezers, etc.). Do not
p t or attach anything on the display area to avoid leaving marks on it. Condensation
on the s rface and contact with terminals d e to cold will damage, stain or dirty the
polarizer. After prod cts are tested at low temperat re they m st be warmed p in a
container before coming in to contact with room temperat re air.
e. If the display s rface becomes contaminated, breathe on the s rface and gently wipe
it with a soft dry cloth. If it is heavily contaminated, moisten cloth with one of the
following solvents
- Isopropyl alcohol
- Ethyl alcohol
- Do not scr b hard to avoid damaging the display s rface.
f. Solvents other than those above-mentioned may damage the polarizer. Especially,
do not se the following.
- Water
- Ketone
- Aromatic solvents
- Wipe off saliva or water drops immediately, contact with water over a long
period of time may ca se deformation or color fading. Avoid contact with oil
and fats.
g. Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is
accelerated by water droplets, moist re condensation or a c rrent flow in a high-
h midity environment.
h. Install the LCD Mod le by sing the mo nting holes. When mo nting the LCD
mod le make s re it is free of twisting, warping and distortion. In partic lar, do not
forcibly p ll or bend the I/O cable or the backlight cable.
i. Do not attempt to disassemble or process the LCD mod le.
j. NC terminal sho ld be open. Do not connect anything.
k. If the logic circ it power is off, do not apply the inp t signals.
l. Electro-Static Discharge Control. Since this mod le ses a CMOS LSI, the same
caref l attention sho ld be paid to electrostatic discharge as for an ordinary CMOS
IC. To prevent destr ction of the elements by static electricity, be caref l to maintain
an optim m work environment.
- Before removing LCM from its packing case or incorporating it into a set, be
s re the mod le and yo r body have the same electric potential. Be s re to
gro nd the body when handling the LCD mod les.
- Tools req ired for assembly, s ch as soldering irons, m st be properly
gro nded. Make certain the AC power so rce for the soldering iron does not
leak. When sing an electric screwdriver to attach LCM, the screw driver
sho ld be of gro nd potentiality to minimize as m ch as possible any

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transmission of electromagnetic waves prod ced sparks coming from the
comm tator of the motor.
- To red ce the amo nt of static electricity generated, do not cond ct assembly
and other work nder dry conditions. To red ce the generation of static
electricity be caref l that the air in the work environment is not too dry. A
relative h midity of 50%-60% is recommended. As far as possible make the
electric potential of yo r work clothes and that of the work bench the gro nd
potential.
- The LCD mod le is coated with a film to protect the display s rface. Exercise
care when peeling off this protective film since static electricity may be
generated.
m. Since LCM has been assembled and adj sted with a high degree of precision, avoid
applying excessive shocks to the mod le or making any alterations or modifications
to it.
- Do not alter, modify or change the shape of the tab on the metal frame.
- Do not make extra holes on the printed circ it board, modify its shape or
change the positions of components to be attached.
- Do not damage or modify the pattern writing on the printed circ it board.
- Absol tely do not modify the zebra r bber strip (cond ctive r bber) or heat
seal connector.
- Except for soldering the interface, do not make any alterations or
modifications with a soldering iron.
- Do not drop, bend or twist the LCM.
2. Storage Preca tions
When storing the LCD mod les, the following preca tion are necessary.
a. Store them in a sealed polyethylene bag. If properly sealed, there is no need for
the desiccant.
b. Store them in a dark place. Do not expose to s nlight or fl orescent light, keep
the temperat re between 0C and 35C, and keep the relative h midity
between 40%RH and 60%RH.
c. The polarizer s rface sho ld not come in contact with any other objects.
3. Others
a. Liq id crystals solidify nder low temperat re (below the storage temperat re range)
leading to defective orientation or the generation of air b bbles (black or white). Air
b bbles may also be generated if the mod le is s bject to a low temperat re.
b. If the LCD mod les have been operating for a long time showing the same display
patterns, the display patterns may remain on the screen as ghost images and a slight
contrast irreg larity may also appear. A normal operating stat s can be regained by
s spending se for some time. It sho ld be noted that this phenomenon does not
adversely affect performance reliability.
c. To minimize the performance degradation of the LCD mod les res lting from
destr ction ca sed by static electricity etc. Exercise care to avoid holding the
following sections when handling the mod les.
Exposed area of the printed circ it board.
Terminal electrode sections.
4. Using LCD Mod les
a. Installing LCD Mod les
The hole in the printed circ it board is sed to fix LCM as shown in the pict re
below.
Attend to the following items when installing the LCM.

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b. Cover the s rface with a transparent protective plate to protect the polarizer and LC
cell.
c. When assembling the LCM into other eq ipment, the spacer to the bit between the
LCM and the fitting plate sho ld have eno gh height to avoid ca sing stress to the
mod le s rface, refer to the individ al specifications for meas rements. The
meas rement tolerance sho ld be 0.1mm.
d. Preca tion for assemble the mod le with BTB connector:
Please note the position of the male and female connector position, don’t
assemble or assemble like the method which the following pict re shows
5. Preca tion for soldering the LCM
Man al soldering Machine drag
soldering
Machine press
soldering
No RoHS
Prod ct
290°C ~350°C.
Time: 3-5S.
330°C ~350°C.
Speed: 4-8 mm/s.
300°C ~330°C.
Time: 3-6S.
Press: 0.8~1.2Mpa
RoHS
Prod ct
340°C ~370°C.
Time: 3-5S.
350°C ~370°C.
Time: 4-8 mm/s.
330°C ~360°C.
Time: 3-6S.
Press: 0.8~1.2Mpa
a. If soldering fl x is sed, be s re to remove any remaining fl x after finishing the
soldering operation (This does not apply in the case of a non-halogen type of
fl x). It is recommended that yo protect the LCD s rface with a cover d ring
soldering to prevent any damage d e to fl x spatters.
b. When soldering the electrol minescent panel and PC board, the panel and board
sho ld not be detached more than three times. This maxim m n mber is
determined by the temperat re and time conditions mentioned above, tho gh
there may be some variance depending on the temperat re of the soldering iron.
c. When removing the electrol minescent panel from the PC board, be s re the
solder has completely melted, the soldered pad on the PC board co ld be
damaged.
6. Preca tions for Operation
a. Viewing angle varies with the change of liq id crystal driving voltage (VLCD).
Adj st VLCD to show the best contrast.

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b. It is recommended to drive LCD's within the specified voltage limit since over limit
will ca se shorter LCD life. An electrochemical reaction d e to direct c rrent
ca ses LCD deterioration. Avoid the se of direct c rrent drive.
c. Response time will be extremely delayed at lower temperat re compared to room
operating temperat re range and on the other hand, at higher temperat re LCD
shows dark color in them. However those phenomena do not mean malf nction.
The LCD will ret rn to normal performance when ambient temperat re revert to
room condition.
d. If the display area is p shed hard d ring operation, the display will become
abnormal. However, it will ret rn to normal if it is t rned off and on.
e. A slight dew depositing on terminals is a ca se for electro-chemical reaction
res lting in terminal open circ it.
f. Inp t logic voltage before apply analog e high voltage s ch as LCD driving
voltage when power on. Remove analog e high voltage before logic voltage when
power off the mod le. Inp t each signal after the positive/negative voltage
becomes stable.
g. Please keep the temperat re within the specified range for se and storage.
Polarization degradation, b bble generation or polarizer peel-off may occ r with
high temperat re and high h midity.
7. Safety
a. It is recommended to cr sh damaged or nnecessary LCDs into pieces and wash
them off with solvents s ch as acetone and ethanol, which sho ld later be b rned.
b. If any liq id leaks o t of a damaged glass cell and comes in contact with the hands,
wash off thoro ghly with soap and water.
8. Limited Warranty
Unless otherwise agreed between Crystal Clear Technology and c stomer,
Crystal Clear Technology will replace or repair any of its LCD and LCM which
is fo nd to be defective electrically and vis ally when inspected in accordance
with Crystal Clear Technology acceptance standards, for a period of one year
from date of shipment. Confirmation of s ch date shall be based on freight
doc ments. The warranty liability of Crystal Clear Technology is limited to
repair and/or replacement on the terms set forth above. Crystal Clear
Technology will not responsible for any s bseq ent or conseq ential events.
9. Ret rn LCM nder Warranty
No warranty can be granted if the preca tions stated above have been
disregarded. The typical examples of violations are:
- Broken LCD glass
- PCB eyelet’s damaged or modified
- PCB cond ctors damaged
- Circ it modified in any way, incl ding addition of components.
- PCB tampered with by grinding, engraving or painting varnish.
- Soldering to, or modifying the bezel in any manner.
Mod le repairs will be invoiced to c stomer pon m t al agreement. Mod les
m st be ret rned with s fficient description of fail re or defects. Any
connectors or cable installed by c stomer m st be removed completely
witho t damaging the PCB eyelet’s, cond ctors and terminals.