Cypress CYBLE-212006-01 User manual

CYBLE-212006-01
CYBLE-202007-01
CYBLE-202013-11
EZ-BLE™ PRoC™ XR Module
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 002-15631 Rev.*D Revised April 21, 2017
General Description
The CYBLE-2X20XX-X1 is a BluetoothLow Energy (BLE)
wireless module solution. The CYBLE-2X20XX-X1 is a turnkey
solution and includes onboard crystal oscillators, passive
components, and the Cypress PRoC™ BLE. Refer to the
CYBL1XX7X datasheet for additional details on the capabilities
of the PRoC BLE device used on this module.
The CYBLE-2X20XX-X1 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its
programmable architecture. The CYBLE-2X20XX-X1 includes a
royalty-free BLE stack compatible with Bluetooth 4.2 and
provides up to 19 GPIOs in a 15.0 × 23.0 × 2.0 mm package.
The CYBLE-2X20XX-X1 is offered in two certified versions
(CYBLE-212006-01 and CYBLE-202007-01), as well as an
uncertified version (CYBLE-202013-11). The CYBLE-212006-01
includes an integrated trace antenna. The CYBLE-202007-01
supports an external antenna via a u-FL connector. The
CYBLE-202013-11 supports an external antenna through a RF
solder pad output. The CYBLE-202013-11 does not include a RF
shield and is not regulatory certified.
Module Description
■Module size: 15.00 mm × 23.00 mm × 2.00 mm
■Extended Range:
❐Up to 400 meters bidirectional communication[1,2]
❐Up to 450 meters in beacon only mode[1]
■Bluetooth 4.2 qualified single-mode module
❐QDID: 88957
❐Declaration ID: D032786
■Footprint compatible options for integrated antenna or
antenna-less design options
■Certified to FCC, IC, MIC, KC, and CE regulations
(CYBLE-212006-01 and CYBLE-202007-01 only)
■Castelated solder pad connections for ease-of-use
■256-KB flash memory, 32-KB SRAM memory
■Up to 19 GPIOs
■Industrial temperature range: –40 °C to +85 °C
■32-bit processor (0.9 DMIPS/MHz) operating up to 48 MHz
■Watchdog timer with dedicated internal low-speed oscillator
Power Consumption
■Maximum TX output power: +7.5 dbm
■RX Receive Sensitivity: –93 dbm
■Received signal strength indicator (RSSI) with 1-dB resolution
■TX current consumption
❐BLE silicon: 15.6 mA (radio only, 0 dbm)
❐RFX2401C: 27 mA (PA/LNA only, +7.5 dBm)
■RX current consumption
❐BLE silicon: 16.4 mA (radio only, 0 dbm)
❐RFX2401C: 8.0 mA (PA/LNA only)
■Cypress CYBL1XX7X silicon low power mode support
❐Deep Sleep: 1.3 A with watch crystal oscillator (WCO) on
❐Hibernate: 150 nA with SRAM retention
❐Stop: 60 nA with XRES wakeup
Functional Capabilities
■Up to 18 capacitive sensors for buttons or sliders
■12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■Two serial communication blocks (SCBs) supporting I2C
(master/slave), SPI (master/slave), or UART
■Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■LCD drive supported on all GPIOs (common or segment)
■Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
■I2S master interface
■BLE protocol stack supporting generic access profile (GAP)
Central, Peripheral, Observer, or Broadcaster roles
■Switches between Central and Peripheral roles on-the-go
■Standard BLE profiles and services for interoperability
■Custom profile and service for specific use cases
Benefits
CYBLE-2X20XX-X1 is provided as a turnkey solution, including
all necessary hardware required to use BLE communication
standards.
■Proven hardware design ready to use
■Cost optimized for applications without space constraint
■Reprogrammable architecture
■Fully certified module eliminates the time needed for design,
development and certification
■Bluetooth SIG qualified with QDID and Declaration ID
■Flexible communication protocol support
■PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
Notes
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interferance sources with output power of +7.5 dBm.
2. Specified as EZ-BLE XR module to module range. Mobile phone connection range will decrease based on the PA/LNA performance of the mobile phone used.

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CYBLE-202013-11
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■Overview: EZ-BLE Module Portfolio, Module Roadmap
■EZ-BLE PRoC Product Overview
■PRoC BLE Silicon Datasheet
■Application notes: Cypress offers a number of BLE application
notes covering a broad range of topics, from basic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐AN96841 - Getting Started with EZ-BLE Module
❐AN94020 - Getting Started with PRoC BLE
❐AN97060 - PSoC®4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐AN91162 - Creating a BLE Custom Profile
❐AN91184 - PSoC 4 BLE - Designing BLE Applications
❐AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
❐AN85951 - PSoC®4 CapSense®Design Guide
❐AN95089 - PSoC®4/PRoC™ BLE Crystal Oscillator Selec-
tion and Tuning Techniques
❐AN91445 - Antenna Design and RF Layout Guidelines
■Technical Reference Manual (TRM):
❐PRoC®BLE Technical Reference Manual
■Knowledge Base Articles
❐KBA212334 - Pin Mapping Differences Between the EZ-BLE
PRoC® Evaluation Boards (CYBLE-212006-EVAL/CY-
BLE-202007-EVAL/CYBLE-202013-EVAL) and the BLE Pi-
oneer Kit (CY8CKIT-042-BLE)
❐KBA97095 - EZ-BLE™ Module Placement
❐KBA216380 - RF Regulatory Certifications for CY-
BLE-212006-01 and CYBLE-202007-01 EZ-BLE™ PRoC®
XR Modules
❐KBA213976 - FAQ for BLE and Regulatory Certifications with
EZ-BLE modules
❐KBA210802 - Queries on BLE Qualification and Declaration
Processes
■Development Kits:
❐CYBLE-212006-EVAL, CYBLE-212006-01 Eval Board
❐CYBLE-202007-EVAL, CYBLE-202007-01 Eval Board
❐CYBLE-202013-EVAL, CYBLE-202013-11 Eval Board
❐CY8CKIT-042-BLE, Bluetooth®Low Energy Pioneer Kit
❐CY8CKIT-002, PSoC®MiniProg3 Program and Debug Kit
■Test and Debug Tools:
❐CYSmart, Bluetooth®LE Test and Debug Tool (Windows)
❐CYSmart Mobile, Bluetooth®LE Test and Debug Tool
(Android/iOS Mobile App)
Two Easy-To-Use Design Environments to Get You Started Quickly
PSoC®Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, PRoC BLE and EZ-BLE module systems with no code size limitations. PSoC
peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,
production-ready PSoC Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Bluetooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.2 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
EZ-Serial™ BLE Firmware Platform
The EZ-Serial Firmware Platform provides a simple way to access the most common hardware and communication features needed
in BLE applications. EZ-Serial implements an intuitive API protocol over the UART interface and exposes various status and control
signals through the module’s GPIOs, making it easy to add BLE functionality quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the EZ-Serial webpage for
User Manuals and instructions for getting started as well as detailed reference materials.
EZ-BLE modules are pre-flashed with the EZ-Serial Firmware Platform. If you do not have EZ-Serial pre-loaded on your module, you
can download each EZ-BLE module’s firmware images on the EZ-Serial webpage.
Technical Support
■Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE and PRoC BLE forums.
■Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: [phone]. Select option 2 at the prompt.

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Contents
Overview............................................................................ 4
Module Description...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 7
Digital and Analog Capabilities and Connections......... 9
Power Supply Connections and Recommended External
Components.................................................................... 10
Connection Options................................................... 10
External Component Recommendation .................... 10
Antenna Matching Network Requirements for CY-
BLE-202013-11 ................................................................ 12
Critical Components List ........................................... 14
Antenna Design......................................................... 14
Qualified Antenna for CYBLE-202007-01 and CY-
BLE-202013-11 ................................................................ 14
Power Amplifier (PA) and Low Noise Amplifier (LNA) 14
Enabling Extended Range Feature ........................... 15
Low Power Operation................................................ 15
Electrical Specification .................................................. 16
GPIO ......................................................................... 18
XRES......................................................................... 19
Digital Peripherals ..................................................... 22
Serial Communication ............................................... 24
Memory ..................................................................... 25
System Resources .................................................... 25
Environmental Specifications ....................................... 31
Environmental Compliance ....................................... 31
RF Certification.......................................................... 31
Safety Certification .................................................... 31
Environmental Conditions ......................................... 31
ESD and EMI Protection ........................................... 31
Regulatory Information .................................................. 32
FCC........................................................................... 32
Industry Canada (IC) Certification............................. 33
European R&TTE Declaration of Conformity ............ 33
MIC Japan................................................................. 34
KC Korea................................................................... 34
Packaging........................................................................ 35
Ordering Information...................................................... 37
Part Numbering Convention ...................................... 37
Acronyms........................................................................ 38
Document Conventions ................................................. 38
Units of Measure ....................................................... 38
Document History Page................................................. 39
Sales, Solutions, and Legal Information ...................... 40
Worldwide Sales and Design Support....................... 40
Products .................................................................... 40
PSoC® Solutions ...................................................... 40
Cypress Developer Community................................. 40
Technical Support ..................................................... 40

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CYBLE-202013-11
Overview
Module Description
The CYBLE-2X20XX-X1 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-2X20XX-X1.
Dimension Item Specification
Module dimensions Length (X) 15.00 ± 0.15 mm
Width (Y) 23.00 ± 0.15 mm
Antenna location dimensions Length (X) 15.00 ± 0.15 mm
Width (Y) 4.65 ± 0.15 mm
PCB thickness Height (H) 0.80 ± 0.10 mm
Shield height Height (H) 1.20 ± 0.10 mm
Maximum component height Height (H)
1.20 mm typical (shield) - CYBLE-212006-01
1.25 mm typical (connector) - CYBLE-202007-01
0.75mm typical (crystal) - CYBLE-202013-11
Total module thickness (bottom of module to highest component) Height (H)
2.00 mm typical - CYBLE-212006-01
2.05 mm typical - CYBLE-202007-01
1.55 mm typical - CYBLE-202013-11

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CYBLE-202013-11
Figure 1. Module Mechanical Drawing
Top View
Bottom View
Side View
Note
3. No metal or traces should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information
on recommended host PCB layout, see Figure 3, Figure 4, Figure 5, and Figure 6 and Table 3.

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CYBLE-202007-01
CYBLE-202013-11
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-2X20XX-X1 connects to the host board via solder pads on the backside
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-2X20XX-X1 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2. Refer to AN96841 for module placement
best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module trace antenna should contain an additional
keep out area, where no grounding or signal trace are contained. The keep out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-2X20XX-X1 Antenna
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 30 Solder Pads 1.02 mm 0.71 mm 1.27 mm
Host PCB Keep Out Area Around Trace Antenna

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CYBLE-202007-01
CYBLE-202013-11
Recommended Host PCB Layout
Figure 4, Figure 5, Figure 6, and Ta ble 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-212006-01. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-2X20XX-X1 Figure 5. Module Pad Location from Origin
Top View (Seen on Host PCB)
Top View (Seen on Host PCB)

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CYBLE-202013-11
Table 3 provides the center location for each solder pad on the CYBLE-2X20XX-X1. All dimensions are referenced to the center of
the solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1 (0.38, 10.54) (14.96, 414.96)
2 (0.38, 11.81) (14.96, 464.96)
3 (0.38, 13.08) (14.96, 514.96)
4 (0.38, 14.35) (14.96, 564.96)
5 (0.38, 15.62) (14.96, 614.96)
6 (0.38, 16.89) (14.96, 664.96)
7 (0.38, 18.16) (14.96, 714.96)
8 (0.38, 19.43) (14.96, 764.96)
9 (0.38, 20.70) (14.96, 814.96)
10 (0.38, 21.97) (14.96, 864.96)
11 (2.32, 22.62) (91.34, 890.55)
12 (3.59, 22.62) (141.34, 890.55)
13 (4.86, 22.62) (191.34, 890.55)
14 (6.13, 22.62) (241.34, 890.55)
15 (7.40, 22.62) (291.34, 890.55)
16 (8.67, 22.62) (341.34, 890.55)
17 (9.94, 22.62) (391.34,8 90.55)
18 (11.21, 22.62) (441.34, 890.55)
19 (12.48, 22.62) (491.34, 890.55)
20 (13.75, 22.62) (541.34, 890.55
21 (14.62, 20.70) (575.59, 814.96)
22 (14.62, 19.43) (575.59, 764.96)
23 (14.62, 18.16) (575.59, 714.96)
24 (14.62, 16.89) (575.59, 664.96)
25 (14.62, 15.62) (575.59, 614.96)
26 (14.62, 14.35) (575.59, 564.96)
27 (14.62, 13.08) (575.59, 514.96)
28 (14.62, 11.81) (575.59, 464.96)
29 See Figure 2 See Figure 2
30 See Figure 2 See Figure 2
Top View (Seen on Host PCB)

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CYBLE-202007-01
CYBLE-202013-11
Digital and Analog Capabilities and Connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
CYBLE-2X20XX-X1, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a ✓.
Table 4. Solder Pad Connection Definitions
Solder Pad
Number
Device
Port Pin UART SPI I2CTCPWM[4,5] Cap- Sense
WCO
Out
ECO
Out LCD SWD GPIO
1 GND Ground Connection
2 XRES External Reset Hardware Connection Input
3P4.0
[6] ✓(SCB1_RTS) ✓(SCB1_MOSI) ✓(TCPWM0_P) ✓(CMOD)✓✓
4P3.7✓(SCB1_CTS) ✓(TCPWM) ✓(Sensor) ✓✓ ✓
5P3.6✓(SCB1_RTS) ✓(TCPWM) ✓(Sensor) ✓✓
6P3.5✓(SCB1_TX) ✓(SCB1_SCL) ✓(TCPWM) ✓(Sensor) ✓✓
7P3.4✓(SCB1_RX) ✓(SCB1_SDA) ✓(TCPWM) ✓(Sensor) ✓✓
8V
REF Reference Voltage Input (Optional)
9P2.6 ✓(TCPWM) ✓(Sensor) ✓✓
10 P2.4 ✓(TCPWM) ✓(Sensor) ✓✓
11 P2.3 ✓(TCPWM) ✓(Sensor) ✓✓ ✓
12 P2.2 ✓(SCB0_SS3) ✓(TCPWM) ✓(Sensor) ✓✓
13 P2.0 ✓(SCB0_SS1) ✓(TCPWM) ✓(Sensor) ✓✓
14 P1.7 ✓(SCB0_CTS) ✓(SCB0_SCLK ✓(TCPWM) ✓(Sensor) ✓✓
15 P1.6 ✓(SCB0_RTS)✓(SCB0_SS0) ✓(TCPWM) ✓(Sensor) ✓✓
16 P1.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓(Sensor) ✓✓
17 P1.4 ✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓(Sensor) ✓✓
18 P0.7 ✓(SCB0_CTS) ✓(SCB0_SCLK ✓(TCPWM) ✓(Sensor) ✓✓(SWDCLK) ✓
19 P1.0 ✓(TCPWM) ✓(Sensor) ✓✓
20 P0.4 ✓(SCB0_RX) ✓(SCB0_MOSI) ✓(SCB0_SDA) ✓(TCPWM) ✓(Sensor) ✓✓ ✓
21 P0.5 ✓(SCB0_TX) ✓(SCB0_MISO) ✓(SCB0_SCL) ✓(TCPWM) ✓(Sensor) ✓✓
22 VDD Digital Power Supply Input (1.8 to 5.5V)
23 P0.6 ✓(SCB0_RTS) ✓(SCB0_SS0) ✓(TCPWM) ✓(Sensor) ✓✓(SWDIO) ✓
24 GND[7] Ground Connection
25 GND Ground Connection
26 GND Ground Connection
27 GND Ground Connection
28 VDDR Radio Power Supply (2V to 3.6V)
29 GND RF Ground Connection for use with CYBLE-202013-11 only; No Connect for CYBLE-212006-01 and CYBLE-202007-01
30 ANT RF Pin to External Antenna for use with CYBLE-202013-11 only; No Connect for CYBLE-212006-01 and CYBLE-202007-01
Notes
4. TCPWM: Timer, Counter, and Pulse Width Modulator. If supported, the pad can be configured to any of these peripheral functions.
5. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either positive
or negative polarity. TCPWM connections on port 4 are direct and can only be used with the specified TCPWM block and polarity specified above.
6. When using the capacitive sensing functionality, Pad 3 (P4.0) must be connected to a CMOD capacitor (located off of Cypress BLE Module). The value of this
capacitor is 2.2 nF and should be placed as close to the module as possible.
7. The main board needs to connect all GND connections (Pad 24/25/26/27) on the module to the common ground of the system.
8. If the I2S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator.

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Power Supply Connections and Recommended External Components
Power Connections
The CYBLE-2X20XX-X1 contains two power supply connec-
tions, VDD and VDDR. The VDD connection supplies power for
both digital and analog device operation. The VDDR connection
supplies power for the device radio.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts
a supply range of 2.0 V to 3.6 V. These specifications can be
found in Table 12. The maximum power supply ripple for both
power connections on the module is 100 mV, as shown in
Table 10.
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-2X20XX-X1.
Figure 8 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz. (Murata
BLM21PG331SN1D).
Figure 7. Recommended Host Schematic Options for a Single Supply Option
Two Ferrite Bead Option (Seen from Bottom)
Single Ferrite Bead Option (Seen from Bottom)