Fibocom SQ806-W Series Installation instructions

FIBOCOM SQ806-W Series
Hardware Guide
Version: V1.0.3
Date: 2021-06-02

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FIBOCOM SQ806-W Series Hardware Guide 2/76
Applicability Type
No.
Product Model
Description
1
SQ806-W
1 GB +8 GB eMCP, WIFI version

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Copyright
Copyright © 2021 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.

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FIBOCOM SQ806-W Series Hardware Guide 4/76
Change History
Version
Author
Reviewer
Approver
Date
Description
V1.0.3
GaoTianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2021-06-02
Change FTM power
consumption and
BLE parameters
Add product model
of SQ806-W-10
V1.0.2
Ma Menghan
Ma
Menghan
Luo Qin
2020-12-30
Standardized the
document format,
corrected errors found in
the document, including
grammar, spelling, etc.,
and optimized the
sentence structure.
V1.0.1
Gao Tianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2020-08-25
Supplement product
appearance drawings
and TBD data
V1.0.0
Gao Tianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2020-04-14
Initial version

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Contents
1Introduction ...................................................................................................................8
1.1 Instruction ........................................................................................................................8
1.2 Reference Standards.......................................................................................................8
1.3 Related Document ...........................................................................................................8
2Product Overview..........................................................................................................9
2.1 General Description .........................................................................................................9
2.2 Main Performance............................................................................................................9
2.3 Function Block Diagram................................................................................................. 11
2.4 Pin Definitions................................................................................................................13
2.4.1 Pin Assignment...................................................................................................................13
2.4.2 Pin Description....................................................................................................................14
3Application Interface...................................................................................................24
3.1 Power Supply.................................................................................................................24
3.1.1 Power Input.........................................................................................................................24
3.1.2 VRTC ..................................................................................................................................26
3.1.3 Power Output......................................................................................................................26
3.2 Control Signal ................................................................................................................27
3.2.1 Power On/Off ......................................................................................................................27
3.2.2 Volume Control ...................................................................................................................30
3.2.3 Reset ..................................................................................................................................30
3.3 USB ...............................................................................................................................30
3.4 UART.............................................................................................................................32
3.5 SPI.................................................................................................................................33
3.6 SD .................................................................................................................................33
3.7 GPIO..............................................................................................................................35
3.8 I2C..................................................................................................................................37
3.9 ADC...............................................................................................................................37
3.10 Battery Interface ............................................................................................................38

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3.11 Motor Driver Interface ....................................................................................................38
3.12 LCM...............................................................................................................................38
3.13 TP..................................................................................................................................40
3.14 Camera..........................................................................................................................41
3.14.1 Rear Camera....................................................................................................................44
3.14.2 Front Camera....................................................................................................................45
3.14.3 Depth of Field Camera ..................................................................................................... 46
3.14.4 MIPI Design Considerations.............................................................................................47
3.15 Sensor ...........................................................................................................................49
3.16 Audio .............................................................................................................................49
3.16.1 Audio Interface Definition .................................................................................................49
3.16.2 Microphone Circuit Design ...............................................................................................51
3.16.3 Receiver Circuit Design....................................................................................................51
3.16.4 Headphone Interface Circuit Design ................................................................................52
3.16.5 Speaker Circuit Design.....................................................................................................52
3.17 Forced Download Interface Design ................................................................................53
4Antenna Interface ........................................................................................................54
4.1 WIFI/BT Antenna............................................................................................................54
4.1.1 WIFI/BT Operating Frequency ...........................................................................................54
4.1.2 Circuit Reference Design....................................................................................................54
4.2 Antenna Requirements ..................................................................................................55
5RF PCB Layout Design Guide ....................................................................................56
6WIFI and Bluetooth......................................................................................................59
6.1 WIFI Overview ...............................................................................................................59
6.2 WIFI Performance..........................................................................................................59
6.3 Bluetooth Overview........................................................................................................61
6.4 Bluetooth Performance ..................................................................................................62
7Electricity, Reliability and RF Performance...............................................................63
7.1 Recommended Parameters ...........................................................................................63

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7.2 Operating Current ..........................................................................................................63
7.3 Electrostatic Protection ..................................................................................................63
8Structural Specification ..............................................................................................65
8.1 Product Appearance ......................................................................................................65
8.2 Structural Dimension......................................................................................................65
8.3 Recommended PCB Soldering Pad Design ...................................................................66
9Production and Storage..............................................................................................67
9.1 SMT...............................................................................................................................67
9.2 Package and Storage ....................................................................................................67
AAcronyms.....................................................................................................................68
10 CE Conformance information ..............................................................................69
11 FCC Conformance information............................................................................70
12 ISED Conformance information...........................................................................74

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1 Introduction
1.1 Instruction
This document describes the electrical characteristics, RF performance, structure size, application
environment, etc. of SQ806-W series module (hereinafter referred to as module). With the assistance of
the document and other instructions, the developers can quickly understand the hardware functions of the
module and develop products.
1.2 Reference Standards
This product has been designed with the following standards.
IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11ac, IEEE
Std 802.11i
IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June
2007
IEEE 802.11-2007 WLAN MAC and PHY, June 2007
Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 +
HS, August 6, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009
1.3 Related Document
FIBOCOM SQ806 Series SMT Design Guide

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2 Product Overview
2.1 General Description
SQ806-W-00 module integrates core components such as Baseband, eMCP, PMU, etc; it supports
WIFI/BT short-distance radio transmission technology. The module is embedded with Android operating
system and supports various interfaces such as MIPI/USB/UART/SPI/I2C. It is the optimal solution for the
core system of wireless smart products. Its corresponding network modes and frequency bands are as
follows:
Table 2-1 SQ806-W supported bands
Mode
Band
WIFI 802.11 a/b/g/n/ac
2402 - 2482 MHz; 5125 - 5835MHz
BT4.2
2402 - 2480 MHz
2.2 Main Performance
The module is available in 262 LCC + LGA package that includes 146 LCC pins and 116 LGA pins. The
dimension is 40.5mm × 40.5mm × 2.8mm. It can provide a stable and reliable connection between the
industrial, consumer and automotive sectors. The following table describes the detailed performance
parameters of the module.
Table 2-2 Performance parameter
Performance
Description
Power
DC 3.5~4.2V, typical voltage: 3.8V
Application CPU
Arm Cortex-A53 microprocessor, 64-bit, Quad-core (1.3 GHz)
Memory
SQ806-W-00: 1GB LPDDR3+ 8 GB eMMC Flash
SQ806-W-10: 2GB LPDDR3+ 16 GB eMMC Flash

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Performance
Description
WLAN features
Support 2.4G and 5G WLAN wireless communication, support
802.11a, 802.11b, 802.11g, 802.11n and 802.11ac, maximum rate
up to 433Mbps
Bluetooth features
BT4.2 (BR/EDR + BLE)
LCD interface
4 Lane MIPI_DSI interface
Support maximum HD+ (1440 * 720) 60 fps
Camera interface
Two 4 Lane MIPI_CSI interface, up to 2.1Gbps per lane, support 2
or 3 cameras
Up to 13 MP, using dual ISP
Audio interface
Audio Input:
3 analog microphone inputs
Integrated internal bias
Audio output:
Class AB stereo headphone output
Class AB differential receiver output
Class D differential speaker amplifier output
USB interface
USB2.0 HS interface, with data transfer rate up to 480 Mbps
Support USB OTG (external 5V power supply)
UART interface
Three UART serial interfaces, with maximum rate up to 4Mbps
One 4-line serial interface supporting RTS and CTS hardware flow
control
One 2-line serial interface
One 2-line debug serial interface
SD interface
Support SD 3.0, 4bit SD; SD card supports hot plug
I2C interface
Multiple I2C interfaces, and can be used for peripherals such as TP,
Camera, and Sensor
ADC interface
Universal ADC
RTC clock
Support