Fibocom SQ806-W Series Installation instructions

FIBOCOM SQ806-W Series
Hardware Guide
Version: V1.0.3
Date: 2021-06-02

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FIBOCOM SQ806-W Series Hardware Guide 2/76
Applicability Type
No.
Product Model
Description
1
SQ806-W
1 GB +8 GB eMCP, WIFI version

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Copyright
Copyright © 2021 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.

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FIBOCOM SQ806-W Series Hardware Guide 4/76
Change History
Version
Author
Reviewer
Approver
Date
Description
V1.0.3
GaoTianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2021-06-02
Change FTM power
consumption and
BLE parameters
Add product model
of SQ806-W-10
V1.0.2
Ma Menghan
Ma
Menghan
Luo Qin
2020-12-30
Standardized the
document format,
corrected errors found in
the document, including
grammar, spelling, etc.,
and optimized the
sentence structure.
V1.0.1
Gao Tianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2020-08-25
Supplement product
appearance drawings
and TBD data
V1.0.0
Gao Tianhuan
He Ruzhi
Tu Min
Li Xiyi
Chen Guojiang
2020-04-14
Initial version

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Contents
1Introduction ...................................................................................................................8
1.1 Instruction ........................................................................................................................8
1.2 Reference Standards.......................................................................................................8
1.3 Related Document ...........................................................................................................8
2Product Overview..........................................................................................................9
2.1 General Description .........................................................................................................9
2.2 Main Performance............................................................................................................9
2.3 Function Block Diagram................................................................................................. 11
2.4 Pin Definitions................................................................................................................13
2.4.1 Pin Assignment...................................................................................................................13
2.4.2 Pin Description....................................................................................................................14
3Application Interface...................................................................................................24
3.1 Power Supply.................................................................................................................24
3.1.1 Power Input.........................................................................................................................24
3.1.2 VRTC ..................................................................................................................................26
3.1.3 Power Output......................................................................................................................26
3.2 Control Signal ................................................................................................................27
3.2.1 Power On/Off ......................................................................................................................27
3.2.2 Volume Control ...................................................................................................................30
3.2.3 Reset ..................................................................................................................................30
3.3 USB ...............................................................................................................................30
3.4 UART.............................................................................................................................32
3.5 SPI.................................................................................................................................33
3.6 SD .................................................................................................................................33
3.7 GPIO..............................................................................................................................35
3.8 I2C..................................................................................................................................37
3.9 ADC...............................................................................................................................37
3.10 Battery Interface ............................................................................................................38

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3.11 Motor Driver Interface ....................................................................................................38
3.12 LCM...............................................................................................................................38
3.13 TP..................................................................................................................................40
3.14 Camera..........................................................................................................................41
3.14.1 Rear Camera....................................................................................................................44
3.14.2 Front Camera....................................................................................................................45
3.14.3 Depth of Field Camera ..................................................................................................... 46
3.14.4 MIPI Design Considerations.............................................................................................47
3.15 Sensor ...........................................................................................................................49
3.16 Audio .............................................................................................................................49
3.16.1 Audio Interface Definition .................................................................................................49
3.16.2 Microphone Circuit Design ...............................................................................................51
3.16.3 Receiver Circuit Design....................................................................................................51
3.16.4 Headphone Interface Circuit Design ................................................................................52
3.16.5 Speaker Circuit Design.....................................................................................................52
3.17 Forced Download Interface Design ................................................................................53
4Antenna Interface ........................................................................................................54
4.1 WIFI/BT Antenna............................................................................................................54
4.1.1 WIFI/BT Operating Frequency ...........................................................................................54
4.1.2 Circuit Reference Design....................................................................................................54
4.2 Antenna Requirements ..................................................................................................55
5RF PCB Layout Design Guide ....................................................................................56
6WIFI and Bluetooth......................................................................................................59
6.1 WIFI Overview ...............................................................................................................59
6.2 WIFI Performance..........................................................................................................59
6.3 Bluetooth Overview........................................................................................................61
6.4 Bluetooth Performance ..................................................................................................62
7Electricity, Reliability and RF Performance...............................................................63
7.1 Recommended Parameters ...........................................................................................63

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7.2 Operating Current ..........................................................................................................63
7.3 Electrostatic Protection ..................................................................................................63
8Structural Specification ..............................................................................................65
8.1 Product Appearance ......................................................................................................65
8.2 Structural Dimension......................................................................................................65
8.3 Recommended PCB Soldering Pad Design ...................................................................66
9Production and Storage..............................................................................................67
9.1 SMT...............................................................................................................................67
9.2 Package and Storage ....................................................................................................67
AAcronyms.....................................................................................................................68
10 CE Conformance information ..............................................................................69
11 FCC Conformance information............................................................................70
12 ISED Conformance information...........................................................................74

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1 Introduction
1.1 Instruction
This document describes the electrical characteristics, RF performance, structure size, application
environment, etc. of SQ806-W series module (hereinafter referred to as module). With the assistance of
the document and other instructions, the developers can quickly understand the hardware functions of the
module and develop products.
1.2 Reference Standards
This product has been designed with the following standards.
IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11ac, IEEE
Std 802.11i
IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June
2007
IEEE 802.11-2007 WLAN MAC and PHY, June 2007
Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 +
HS, August 6, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009
1.3 Related Document
FIBOCOM SQ806 Series SMT Design Guide

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2 Product Overview
2.1 General Description
SQ806-W-00 module integrates core components such as Baseband, eMCP, PMU, etc; it supports
WIFI/BT short-distance radio transmission technology. The module is embedded with Android operating
system and supports various interfaces such as MIPI/USB/UART/SPI/I2C. It is the optimal solution for the
core system of wireless smart products. Its corresponding network modes and frequency bands are as
follows:
Table 2-1 SQ806-W supported bands
Mode
Band
WIFI 802.11 a/b/g/n/ac
2402 - 2482 MHz; 5125 - 5835MHz
BT4.2
2402 - 2480 MHz
2.2 Main Performance
The module is available in 262 LCC + LGA package that includes 146 LCC pins and 116 LGA pins. The
dimension is 40.5mm × 40.5mm × 2.8mm. It can provide a stable and reliable connection between the
industrial, consumer and automotive sectors. The following table describes the detailed performance
parameters of the module.
Table 2-2 Performance parameter
Performance
Description
Power
DC 3.5~4.2V, typical voltage: 3.8V
Application CPU
Arm Cortex-A53 microprocessor, 64-bit, Quad-core (1.3 GHz)
Memory
SQ806-W-00: 1GB LPDDR3+ 8 GB eMMC Flash
SQ806-W-10: 2GB LPDDR3+ 16 GB eMMC Flash

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Performance
Description
WLAN features
Support 2.4G and 5G WLAN wireless communication, support
802.11a, 802.11b, 802.11g, 802.11n and 802.11ac, maximum rate
up to 433Mbps
Bluetooth features
BT4.2 (BR/EDR + BLE)
LCD interface
4 Lane MIPI_DSI interface
Support maximum HD+ (1440 * 720) 60 fps
Camera interface
Two 4 Lane MIPI_CSI interface, up to 2.1Gbps per lane, support 2
or 3 cameras
Up to 13 MP, using dual ISP
Audio interface
Audio Input:
3 analog microphone inputs
Integrated internal bias
Audio output:
Class AB stereo headphone output
Class AB differential receiver output
Class D differential speaker amplifier output
USB interface
USB2.0 HS interface, with data transfer rate up to 480 Mbps
Support USB OTG (external 5V power supply)
UART interface
Three UART serial interfaces, with maximum rate up to 4Mbps
One 4-line serial interface supporting RTS and CTS hardware flow
control
One 2-line serial interface
One 2-line debug serial interface
SD interface
Support SD 3.0, 4bit SD; SD card supports hot plug
I2C interface
Multiple I2C interfaces, and can be used for peripherals such as TP,
Camera, and Sensor
ADC interface
Universal ADC
RTC clock
Support

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Performance
Description
Antenna interface
WIFI/BT antenna
Physical characteristics
Dimension: 40.5mm × 40.5mm × 2.8mm
Encapsulation: 146 LCC pins + 116 LGA pins
Weight: 9.6 ± 0.1g
Temperature range
Operating temperature: -30°C - 75°C 1)
Storage temperature: -40°C - 85°C
Software update
USB/OTA/SD
RoHS
RoHS Compliant
1) When the module is operating within this temperature range, the functions of it are normal and
the relevant performance meets the IEEE standard.
2.3 Function Block Diagram
Function diagram shows the main hardware features of the SQ806-W-00 module, including:
Baseband
Wireless transceiver
PMU
Memory
Peripheral interface
Communication expansion interface (USB/UART/I2C/SD/SPI)
MIPI DSI interface
MIPI CSI Interface
Analog audio interface
Note:

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Baseband
PMU
LCM UARTTP
ADC
RESET
PWRKEY
19.2M
XO
VBAT
Control Air Interface Memory
ConnectivityMultimedia
CAM
WIFI/BT
VRTC
LPDDR3
SDRAM
eMMC
Power WCN
SAW
Diplexer
AUDIO
I2C SPI SD GPIO USB VoL key
BATTERY
5G
2.4G
PA
Figure 2-1 Function block diagram

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2.4 Pin Definitions
2.4.1 Pin Assignment
Figure 2-2 Pin assignment

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“NC” stands for “No Connect”, that is, the pin does not have network to be connected.
2.4.2 Pin Description
Table 2-3 I/O parameters description
Type
Description
IO
Input/Output
DI
Digital Input
DO
Digital Output
PI
Power Input
PO
Power Output
AI
Analog Input
AO
Analog Output
OD
Open Drain
Module pins are described in the following table:
Table 2-4 Pin description
Pin Name
Pin #
I/O
Pin Description
Note
Power
VBAT
1, 2, 145,
146
PI
Main power input
-
VRTC
126
PI/PO
RTC clock power supply
-
LDO5_1V8
111
PO
1.8V voltage output
-
LDO6_1V8
125
PO
1.8V voltage output
-
LDO10_2V85
228
PO
2.85V voltage output
-
LDO11_SD
38
PO
SD card power supply, 2.95V
-
Note:

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Pin Name
Pin #
I/O
Pin Description
Note
LDO12_2V95
32
PO
2.95V voltage output
-
LDO16_2V8
152
PO
2.8V voltage output
-
LDO17_2V85
129
PO
2.85V voltage output
-
VIB_DRV_N
28
PO
Motor driver output control
-
GND
3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89,
120, 122, 130, 132, 135, 140, 143, 144, 147, 148,
149, 150, 160~178, 180~182, 184~186, 188, 189,
192, 193, 198, 200, 201, 208, 209, 211~218, 221,
235, 245, 246, 250, 251, 262
ground
Battery Supply Interface
BAT_ID
260
AI
Battery ID pin
-
CHARGE_SEL
127
DI
Charging path select
External charge:
please connect this
pin to ground;
Internal charge: keeps
it suspending
VBAT_SNS
133
AI
Battery voltage detection
-
VBAT_THERM
134
AI
Battery temperature detection
-
CHG_LED_SINK_N
154
AO
Charge LED
-
Key
KEY_FORCE_BOOT
46
DI
Forced download pin
High level
effective,1.8V
KEY_VOL_UP
95
DI
Volume + key
Low level effective,
cannot pull up before
module power on
KEY_VOL_DOWN
96
DI
Volume - key
Low level effective.
Used as a volume

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Pin Name
Pin #
I/O
Pin Description
Note
down key by default
and can be configured
for low-level shutdown
and restart
KEY_PWR_N
114
DI
Power key
Low level effective
KEY_RESET_N
179
DI
Reset Key
Low level effective
KEY_CBL_PWR_N
261
DI
CBL Power key
Low level effective
SD Card Interface
SD_DET
45
DI
SD card detection
Low level effective by
default
SD_DATA3
44
I/O
SD card data interface
-
SD_DATA2
43
I/O
SD card data interface
-
SD_DATA1
42
I/O
SD card data interface
-
SD_DATA0
41
I/O
SD card data interface
-
SD_CMD
40
I/O
SD card command interface
-
SD_CLK
39
DO
SD card clock
-
I2C Interface
SENSOR_I2C_SCL
91
OD
Sensor I2C clock
-
SENSOR_I2C_SDA
92
OD
Sensor I2C data cable
-
TP_I2C_SCL
47
OD
TP I2C clock
-
TP_I2C_SDA
48
OD
TP I2C data cable
-
CAM_I2C_SCL0
83
OD
Camera I2C clock
Cannot be used as
I2C and GPIO for
other devices
CAM_I2C_SDA0
84
OD
Camera I2C data cable
CAM_I2C_SCL1
239
OD
Camera I2C clock
CAM_I2C_SDA1
240
OD
Camera I2C data cable
USB Interface
USB_VBUS
141, 142
PI
5V input
-

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Pin Name
Pin #
I/O
Pin Description
Note
USB_DP
14
AI/AO
USB 2.0 differential data
signal +
-
USB_DM
13
AI/AO
USB 2.0 differential data
signal -
-
USB_ID
16
DI
USB OTG detection pin
-
UART Interface
UART5_TX
34
DO
UART5 data transmission
-
UART5_RX
35
DI
UART5 data reception
-
UART5_CTS
36
DI
UART5 clear to send
-
UART5_RTS
37
DO
UART5 request to send
-
UART2_TX
94
DO
UART2 data transmission
Use as debug serial
port by default
UART2_RX
93
DI
UART2 data reception
UART4_TX
226
DO
UART4 data transmission
-
UART4_RX
225
DI
UART4 data reception
-
SPI Interface
SPI6_CLK
116
DO
SPI clock
-
SPI6_CS
117
DO
SPI chip select
-
SPI6_MISO
118
DI
SPI Master input Slave output
-
SPI6_MOSI
119
DO
SPI Master output Slave input
-
LCD Interface
MIPI_DSI0_CLK_N
52
AO
LCD MIPI differential clock
signal
-
MIPI_DSI0_CLK_P
53
AO
-
MIPI_DSI0_LN0_N
54
AO
LCD MIPI differential data
signal
-
MIPI_DSI0_LN0_P
55
AO
-
MIPI_DSI0_LN1_N
56
AO
-
MIPI_DSI0_LN1_P
57
AO
-
MIPI_DSI0_LN2_N
58
AO
-

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Pin Name
Pin #
I/O
Pin Description
Note
MIPI_DSI0_LN2_P
59
AO
-
MIPI_DSI0_LN3_N
60
AO
-
MIPI_DSI0_LN3_P
61
AO
-
LCD_RST_N
49
DO
LCD reset signal
-
PWM
29
DO
LCD backlight PWM control
signal
-
LCD_TE
50
DI
LCD swipe synchronization
signal
Keep it suspending
when not in use
Touch Panel Interface
TP_INT
30
DI
Main touch panel TP interrupt
signal
-
TP_RST
31
DO
Main touch panel TP reset
signal
-
Camera Interface
MIPI_CSI0_CLK_P
229
AI
Rear camera MIPI differential
clock signal +
-
MIPI_CSI0_CLK_N
230
AI
Rear camera MIPI differential
clock signal -
-
MIPI_CSI0_LN0_P
155
AI
Rear camera MIPI differential
data signal +
-
MIPI_CSI0_LN0_N
231
AI
Rear camera MIPI differential
data signal -
-
MIPI_CSI0_LN1_P
156
AI
Rear camera MIPI differential
data signal +
-
MIPI_CSI0_LN1_N
232
AI
Rear camera MIPI differential
data signal -
-
MIPI_CSI0_LN2_P
157
AI
Rear camera MIPI differential
-

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Pin Name
Pin #
I/O
Pin Description
Note
data signal +
MIPI_CSI0_LN2_N
233
AI
Rear camera MIPI differential
data signal -
-
MIPI_CSI0_LN3_P
158
AI
Rear camera MIPI differential
data signal +
-
MIPI_CSI0_LN3_N
234
AI
Rear camera MIPI differential
data signal -
-
MCAM_MCLK
74
DO
Rear camera main clock
signal
-
MCAM_RST
79
DO
Rear camera reset signal
-
MCAM_PWDN
80
DO
Rear camera shutdown signal
-
MIPI_CSI1_CLK_P
64
AI
Front camera MIPI differential
clock signal +
CSI1's 4 Lane can be
configured as 2 Lane
camera + 1 Lane
camera
MIPI_CSI1_CLK_N
63
AI
Front camera MIPI differential
clock signal -
MIPI_CSI1_LN0_P
66
AI
Front camera MIPI differential
data signal +
MIPI_CSI1_LN0_N
65
AI
Front camera MIPI differential
data signal -
MIPI_CSI1_LN1_P
68
AI
Front camera MIPI differential
data signal +
MIPI_CSI1_LN1_N
67
AI
Front camera MIPI differential
data signal -
MIPI_CSI1_LN2_P
73
AI
Front camera MIPI differential
data signal +
MIPI_CSI1_LN2_N
72
AI
Front camera MIPI differential
data signal -

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Pin Name
Pin #
I/O
Pin Description
Note
MIPI_CSI1_LN3_P
71
AI
Front camera MIPI differential
data signal +
MIPI_CSI1_LN3_N
70
AI
Front camera MIPI differential
data signal -
SCAM_MCLK
75
DO
Front camera main clock
signal
-
SCAM _RST
81
DO
Front camera reset signal
-
SCAM _PWDN
82
DO
Front camera shutdown
signal
-
DCAM_MCLK
238
DO
Depth of field camera MCLK
signal
-
DCAM _RST
237
DO
Depth of field camera reset
signal
-
DCAM _PWDN
236
DO
Depth of field camera
shutdown signal
-
Audio Interface
SPK_P
10
AO
Loudspeaker differential
output +
-
SPK_M
11
AO
Loudspeaker differential
output -
-
REC_P
8
AO
Receiver differential output +
-
REC_M
9
AO
Receiver differential output -
-
HPH_L
138
AO
Earphone left channel output
-
HPH_GND
137
-
Earphone reference ground
-
HPH_R
136
AO
Earphone right channel
output
-
HPH_DET
139
AI
Earphone plug detection
-