Forenex MBE71 User manual

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MBE71
User
Manual
MBE71
Motherboard
User Manual
(Preliminary)
SBC
with Dual Cortex-A72 @2.0Ghz
+ Quad Cortex-A53 @ 1.5Ghz Core
Version: V3.0
Document No: doc-mbe7118w40v30
PCB Bare Board: PB71m68v11
*The content of this document is subject to be change without notice

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Packing List
1 x MBE71 Motherboard.
Ordering Information
Part Number: MBE71-abcxyMN
HDMI 2.0, eDP1.3 (2xlane), GigE, 5G-Wifi with mPCIE Socket, OTG-USB 3.0 (Type-
A), USB2.0 (Type-A), Micro-SD Socket, Grove GPIOs, Reset CONN, Optic Fiber CONN, 4-
wire UART Port, IR Port, Debug Port, Audio, USB-Hub, DC-Jack.
• abc : The type of RK3399 Processor
R39: Dual Core-A72 @2.0Ghz,+ Quad Core-A53 @ 1.5Ghz, (0 ~ 85°C)
K39: Dual Core-A72 @2.0Ghz,+ Quad Core-A53 @ 1.5Ghz, ( -20°~ 105°C)
• x: The size code of DDR3 Memory on board
1 1GB of DDR3
2 2GB of DDR3
• y: The size code of eMMC on board
4 4GB
8 8GB
F 16GB
• MN : The Function code
SS Standards
S1 Add Wi-Fi module
PS SS + 802.3at (PoE+)
P1 S1 + 802.3at (PoE+)
Optional Accessories
FEP21-B4356C AP12356,11 a/b/g/n/ac (2T2R)+BT(V4.1 LE), Wi-Fi module
FR-e2L eDP to Dual LVDS Converter Board
FR-U2R2 USB to Dual full RS232/RS422/485 Convert Board
FR-WW01 USB to LTE 4G module Carrier Board

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Revision histories
Rev. No.
Date
Substantial Changes
1.0
2021/01
First issue.

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Table of Contents
1. General Information ........................................................................................................... 6
1-1. Features ................................................................................................................................. 6
1-2. Function Block Diagram ......................................................................................................... 8
1-3. Board Dimension.................................................................................................................... 9
1-4. I/O Connector Summary ........................................................................................................ 9
1-5. I/O Connector Placement .................................................................................................... 10
2. Peripherals Port Description............................................................................................. 11
2-1. Power Jack (J4)(W4)............................................................................................................. 11
2-2. Power Switch, Header (H15)................................................................................................ 11
2-3. RTC Battery Backup Connector (W1)................................................................................... 11
2-4. IR Receiver Connector (IR1) ................................................................................................. 12
2-5. Power LED Connector (W7) ................................................................................................. 12
2-6. Image File Update Jumper (JP1) .......................................................................................... 12
2-7. USB 3.0 Type-A Port (J2) ...................................................................................................... 13
2-8. USB 2.0 Type-A Port (J3) ...................................................................................................... 13
2-9. Gigabit Ethernet Port w/PoE+ (J6)....................................................................................... 14
2-10. PoE+ Power Extract Connector (W12)................................................................................. 14
2-11. Micro SD/SDHC Card Slot (J1) .............................................................................................. 14
2-13. eDP Interface (ZIF2) ............................................................................................................. 15
2-14. LCD Panel Power Selection (H2) .......................................................................................... 16
2-15. LCD Backlight Control Connector (W2)................................................................................ 16
2-16. PCAP Touch Interface (W3).................................................................................................. 16
2-17. HDMI® 2.0 Port (J5).............................................................................................................. 17
2-18. Reset, wifi LEDs, Buzzer Combo Connector (W19) .............................................................. 17
2-19. RS232 Debug Connector (W20) ........................................................................................... 18
2-20. Grove-I2C,SPI,ADC,GPIOs Connector (W15)........................................................................ 18

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2-22. USB host2.0, MEMS signals Combo Connector (W10) ........................................................ 19
2-23. HUB Extended Ports (W8, W9, W18)................................................................................... 19
2-24. Audio Codec Interface (H10)................................................................................................ 20
2-25. mini-PCIe Slot(J9) ................................................................................................................. 21
2-26. MIPI-CSI Interface (W13) (Optional) ,Under development.................................................. 22
3. Software Programming Guide .......................................................................................... 23
3-1. Android Programming Guide............................................................................................... 23
3-1-1. ADB installation...............................................................................................23
3-1-2. To install APK software over the ADB function of PC : ..........................................25
3-1-3. GPIO installation..............................................................................................25
3-2. Linux Programming Guide.................................................................................................... 26
3-2-1. GPIO installation..............................................................................................26

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1. General Information
The motherboard MBE71 Series integrated various useful peripheral circuit that provides
completed connectivity for a wide variety of industrial automation and transportation
applications. Besides, the high-performance media-processor also especially for
infotainment/entertainment, HMI applications.
The heart of the MBE71 is the Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz
processor, which provides a complete platform for project evaluation and solution feasibility
testing that decreases the time to market and lowers initial cost.
1-1. Features
Processor:
Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz (MBE70Kxx)
Dual Cortex-A72 @2.0Ghz + Quad Cortex-A53 @ 1.5Ghz (MBE70xx)
System Memory:
1GB up to 2GB DDR3-1066 SDRAM onboard
Storage:
4GB up to 16GB eMMC Flash memory
Graphics:
ARM Mail-T860MP4 (Embedded 3D GPU), AFBC supported
Supports OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11
Video Decoder:
-H.264/H.265, 10bit, up to 4Kx2K@60fps,
-VP9, 8bit, up to 4Kx2K@60fps,
-MPEG-4/MPEG-2/VP8 up to 1080p@60fps
Video Encoder:
-H.264/MVC/VP8 encoders by 1080p@30fps
Display Interfaces:
Supports eDP 1.3, 2 lane (2.7Gbps per lane) , Res. up to1920x1200p@60fps
, 4 lane (2.7Gbps per lane) , Res. up to2560x1600p@60fps
Supports HDMI® V2.0, Res. up to 4Kx2K @60fps, HDCP1.4 /2.2

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Audio:
Realtek ALC5640 low power stereo codec
Inside Stereo Class-D speaker amplifiers provide 1.5W per channel into 8Ω or 2W
per channel into 4Ω
LAN:
Realtek RTL8211E Gigabit Ethernet transceiver with RGMII support
Extension USB device:
MicroChip USB2514, USB 2.0 high speed 4-port hub controllers
External extension memory Slot:
Micro-SD 3.0 slot enable capacity up to 256GB
Various interfaces for expansion peripherals:
USB-HUB Port Wafer x 3
Optic Fiber Wafer x 1, 4-wire UART Wafer x 1
Grove (I2C, SPI, ADC, GPIOs) Wafer x 1
Optional MIPI-CSI/DSI interface x 1, MEMS Wafer x 1, IR receiver Wafer x 1
Dimension (W x D x H):
126.5mm x 90mm x 18.7mm (4.98” x 3.5” x 0.76”)
Operating Temperature (3G and Wi-Fi not included):
-20°C ~ 70°C (MBE70E-K39 series)
0°C ~ 70°C (MBE70C-R39 series)
Operating Humidity:
0% ~ 90% relative humidity (non-condensing)
Operating System:
Android 7.1 / 8
Debian 9
Note:
1. The Operating Temperature is a result of the test performed in experimental
chamber. It is highly suggested to execute a solid testing under actually application
environment.
2. More frequent and larger data access on eMMC memory makes the lifespan
shorter. Therefore, it is highly recommended to use a Micro SD card for large data
access.

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1-2. Function Block Diagram

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1-3. Board Dimension
Dimension: 126.5mm (W) x 90mm (L) x 18.7mm (H)
Contact Service salesman for detail “.DXF” file.
1-4. I/O Connector Summary
External I/O (On board side):
Power Jack (J4),(W4)
Micro SD Socket (J1)
USB 3.0 Type-A Port (J2)
USB 2.0 Type-A Port (J3)
HDMI® Port (J5)
Gigabit Ethernet Port w/ PoE+ (J6)
Internal I/O
Image File Update Jumper (JP1)
RTC Battery Backup CONN (W1)
Power Switch, Header (H15)
Power LED CONN (W7)
USB host2.0, MEMS signals Combo CONN (W10)
Grove-I2C,SPI,ADC,GPIOs Combo CONN (W15)
Optic Fiber Light-Bar CONN (W14)
eDP Interface (ZIF2)
LCD Panel Power Selection, Header (H2)
LCD Backlight Control CONN (W2)
PCAP Touch CONN (W3)
4-wire UART CONN (W17)
RS232 Debug CONN (W20)
Reset, Wi-Fi LED, Buzzer Combo CONN (W19)
PoE+ Power Extract CONN (W12)
HUB Extended Ports, CONNs (W8, W9, W18)
Audio Codec Interface, Header (H10)
Mini-PCIe Slot (J9) for AP12356, 802.11 a/b/g/n/ac (2T2R)+BT(V4.1 LE) module
------Provides below are optional items ------
IR Receiver Connector, Wafer (IR1)
MIPI-CSI/DSI Interface (W13)

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1-5. I/O Connector Placement
Component Side
Solder Side

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2. Peripherals Port Description
2-1. Power Jack (J4、W4)
Carries external power input.
If necessary, also provides extra DC/DC convert board with the wide range (9V to
36V) input voltage and a steady 12V output.
Pin Assignment(J4、W4):
2-2. Power Switch, Header (H15)
Shorts the Pin 1&2 of the H15, to power up MBE71 mainboard.
The Pin 3 & 4 of the H15 reserved.
2-3. RTC Battery Backup Connector (W1)
Connect to the non-rechargeable coin battery.
Pin Assignment:
Connector: (Power Barrel Jack6.3mm/ Tip2.0mm/ 90°)
Pin number(J4)
Pin number(W4)
Description
Sleeve
Pin1
GND
Tip
Pin2
DC12V
Connector: (Header 2x2 pin/ 2.0mm/ 180°)
Pin number
Status
Description
Pin 1-2
Open
Power off
Close
Power on
Pin 3-4
Leave Open
For factory use only
Connector: (wafer-2P/ 1.25mm/ 180°)
Pin number
Description
1
3.0V(+)
2
GND(-)
Open
Close

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2-4. IR Receiver Connector (IR1)
Connects an external IR-38.8Khz receiver module
Pin Assignment:
2-5. Power LED Connector (W7)
The green LED indicates the system’s power is plugged.
Pin Assignment:
2-6. Image File Update Jumper (JP1)
To open the JP1 before power-on that would make system to enter Image-File-
Update mode at power re-plug-in. After that, close the JP1 and beginning update
Image File from the USB port (J2).
Connector: (wafer-3P/ 1.25mm/ 180°)
Pin number
Description
1
IR Signal input(1k ohm of Series resistor inside)
2
GND
3
3.3V supply
Connector: (wafer-3P/ 1.25mm/ 180°)
Pin number
Description
1
Green Light
2
GND
3
Reserved for Red Light
JP1 Open
JP1 Close

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2-7. USB 3.0 Type-A Port (J2)
The dedicated USB port to in charge of updating the Image File while the MBE71
board being enter update mode. Refer to Section 2-6.
Under Linux OS environment, the J2 is regarded as an USB3.0 host. And gives
complete hot plug capability and complies with USB xHCI, Rev. 3.x (USB 3.1 Gen 1).
Under Android OS environment, the J2 can be set to host or device mode. The
detail refer to Section 3-1. Android Programming Guide.
Pin Assignment:
2-8. USB 2.0 Type-A Port (J3)
The MBE71 provides one USB 2.0 host port on board side that gives complete hot
plug capability and complies with USB UHCI, Rev. 2.0.
Pin Assignment:
Connector: (USB 3.0 Type-A )
Pin number
Description
Pin number
Description
1
VBUS
6
SSRX+
2
D-
7
GND
3
D+
8
SSTX-
4
GND
9
SSTX+
5
SSRX-
Connector: (USB Type A )
Pin number
Description
1
VBUS1(+5V)
2
USB1 Data -
3
USB1 Data +
4
USB1_GND

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2-9. Gigabit Ethernet Port w/PoE+ (J6)
The integrated 8-pin Gigabit Ethernet port is using an 8 Position 8 Contact (8P8C)
receptacle connector (commonly referred to as RJ-45).
Supports IEEE802.3 at compliant (type2) PD.
The Gigabit Ethernet port (RJ-45 port) has two individual LED
indicators located on the front side to show
Active LED is blinking in green color means that
activity of data flow IN or OUT of the device.
Link LED is in Red color means devices is operating in speeds 10/100Mbps.
Link LED is in Green color means devices is operating in speeds 1000Mbps.
2-10. PoE+ Power Extract Connector (W12)
There are two modes of PoE, A and B. Mode A delivers power on the data pairs of
Pin1,2&3,6 of Gigabit Ethernet Port (J6). Mode B delivers power on the Pin4,5&7,8
of Gigabit Ethernet Port (J6).
2-11. Micro SD/SDHC Card Slot (J1)
Micro SD/SDHC card slot enable SD card capacity up to 256GB.
Providing as an extra-storage device. Prevent more frequent and larger data access
on eMMC memory makes its lifespan shorter.
2-12. 4-wire UART Connector (W17)
Connector: ( wafer-4P/ 2.0mm/ 180°)
Pin number
Description
Pin number
Description
1
V+ (Mode A)
2
V- (Mode A)
3
V+ (Mode B)
4
V- (Mode B)
Connector: ( wafer-8P/ 1.0mm/ 180°)
Pin number
Description
Pin number
Description
1
DC3.3V/60mA-Out
2
GND
3
UART-3.3V-RTS
4
UART-3.3V-CTS
5
UART-3.3V-TX(SOUT)
6
UART-3.3V-RX(SIN)
Act
100M/Giga

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2-13. eDP Interface (ZIF2)
Supports eDP 1.3(2.7Gbps per lane). 4 Lane with connector A1253WR-S-40P is
defaulted in factory.
Supports 2 Lane, Res. up to1920x1200p@60fps with connector A1253WR-S-30P.
Supports 4 Lane, Res. up to2560x1600p@60fpswith connector A1253WR-S-40P.
Pin Assignment: (*The blue signs reserved for future use)

Connector: (TFP584-30P/40P, 0.5mm, 90 ° )
Pin number
Description
Pin number
Description
1
NC
21
BL_GND
2
GND
22
BL_EN_H
3
Lane1_N
23
BL_PWM_DIM
4
Lane1_P
24
NC/Lane2_N
5
GND
25
NC/Lane2_P
6
Lane0_N
26
BL_VLED_12V
7
Lane0_P
27
BL_VLED_12V
8
GND
28
BL_VLED_12V
9
AUX_P
29
BL_VLED_12V
10
AUX_N
30
NC/Lane3_N
11
GND
31
NC/TP_USB_DM
12
LCD_VDD
32
NC/TP_USB_DP
13
LCD_VDD
33
GND
14
LCD_VDD
34
NC/TP_PWR
15
GND
35
NC/TP_PWR
16
GND
36
NC/Lane3_P
17
HPD
37
NC/TP_SCL
18
BL_GND
38
NC/TP_SDA
19
BL_GND
39
NC/TP_INT
20
BL_GND
40
NC/TP_RST

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2-14. LCD Panel Power Selection (H2)
Provides 3.3V to LCD_VDD Provides 5V to LCD_VDD
2-15. LCD Backlight Control Connector (W2)
The voltage of BL_VDD is same as DC_IN, due to the power source of BL_VDD is
passed from DC-in Jack (J4) or (W4) directly.
Pin Assignment:
2-16. PCAP Touch Interface (W3)
USB interface is defaulted touch port in factory; it can change to I2C interface
before ordering.
Pin Assignment:
Connector: (Wafer-6p/ 1.25mm/ 90 ° )
Pin number
Description
1
BL_VDD(12V) (default)/ 5V (option)
2
BL_VDD(12V)
3
GND
4
GND
5
Backlight_EN (active high), logical high level(3.3V)
6
Backlight_PWM (300Hz), logical high level(3.3V)
Connector: ( Wafer-6p/ 1.25mm/ 90 ° )
Pin number
Description
1
GND
2
Power supply DC-5V
3
USB_DP (default)/ SCL (option), logical high level(3.3V)
4
USB_DM (default)/ SDA (option), logical high level(3.3V)
5
INT, logical high level (3.3V)
6
Reset, logical high level(3.3V)

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2-17. HDMI® 2.0 Port (J5)
The HDMI port uses an HDMI Type-A receptacle connector. It allows connecting the
digital video devices which utilize a high definition video signal without a HDCP.
Supports HDMI® V2.0, Res. up to 4Kx2K(30-bit/pixel) @60fps, HDCP1.4 /2.2
Pin Assignment:
2-18. Reset, wifi LEDs, Buzzer Combo Connector (W19)
Connector: (19-pin HDMI Type A Receptacle,4.45 mm×13.9 mm)
Pin
Description
Pin
Description
1
TMDA_Data2+
2
Data2_GND
3
TMDA_Data2-
4
TMDA_Data1+
5
Data1_GND
6
TMDA_Data1-
7
TMDA_Data0+
8
Data0_GND
9
TMDA_Data0-
10
TMDA_CLK+
11
CLK_GND
12
TMDA_CLK-
13
NC
14
NC
15
DDC-SCL, logical high level(5V)
16
DDC-SDA, logical high level(5V)
17
CEC GND
18
Power 5V supply
19
Hot Plug Detect
Connector: ( A1001WV-S-8P/ 1.0mm/ 180°)
Pin number
Description
Pin number
Description
1
DC3.3V/25mA-Out
2
GND
3
Wifi LED-Out, Low active
4
BT LED-Out, Low active
5
Reset-In, Low active
6
GND
7
Buzzer-
8
Buzzer+

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2-19. RS232 Debug Connector (W20)
The debug port supports TX/RX with RS232 level and only use for debug purpose.
Pin Assignment:
2-20. Grove-I2C,SPI,ADC,GPIOs Connector (W15)
Supports Non-isolated GPIOs: GPI x4, GPO x4
ADC (Analog to Digital Channel_0 & 1), the Max. Input Voltage =1.8V, Res. 10bit,
tCLK=75ns, conversion time= 13tCLK, setup time=0.5tCLK.
Pin Assignment:
2-21. Optic Fiber Light-Bar Connector (W14)
Connector: ( wafer-3P/ 1.25mm/ 180°)
Pin number
Description
1
Debug-RS232-RX(SIN)
2
Debug-RS232-TX(SOUT)
3
COM_GND
Connector: (A1001WV-S-2x10P/ 1.0mm/ 180°)
Pin
Description
Pin
Description
1
DIN0, logical high level(3.3V)
2
DOUT0, logical high level(3.3V)
3
DIN1, logical high level(3.3V)
4
DOUT1, logical high level(3.3V)
5
DIN2, logical high level(3.3V)
6
DOUT2, logical high level(3.3V)
7
DIN3, logical high level(3.3V)
8
DOUT3, logical high level(3.3V)
9
GND
10
3.3V
11
SPI-3.3V-TXD
12
3.3V
13
SPI-3.3V-RXD
14
I2C4-3.3V-SDA
15
SPI-3.3V-CS
16
I2C4-3.3V-SCL
17
SPI-3.3V-CLK
18
ADC1-IN-1.8V
19
GND
20
ADC0-IN-1.8V
Connector: ( A1001WV-S-6P/ 1.0mm/ 180°)
Pin number
Description
Pin number
Description
1
Red, Low active
2
Green, Low active
3
Blue, Low active
4
White, Low active
5
GND
6
5V/500mA

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2-22. USB host2.0, MEMS signals Combo Connector (W10)
The connector (W10) can be either used as an extra USB 2.0 individually.
Or use for a LTE 4G modem module application.
Or use for a USB-MEMS application.
Pin Assignment:
2-23. HUB Extended Ports (W8, W9, W18)
The Wafer (W8) is designed to extend one more USB port.
The Wafer (W18) is designed to extend second USB port.
The Wafer (W9) is designed to either extend third USB port or as USB-touch panel
interface.
The all of three extended USB ports give complete hot plug capability and complies
with USB UHCI, Rev. 2.0.
The Pin Assignment (W8),(W9)(W18):
Connector: ( Wafer 1x9/ 1.25mm/ 90°)
Pin number
Description
1
LIGHT_INT_L (3.3V), Low active
2
GPIO(3.3V) Reserved
3
COMP_INT_L(3.3V), Low active
4
GSENSOR_INT_L(3.3V), Low active
5
GYR_INT_L(3.3V), Low active
6
USB_GND
7*
USB Data +
8
USB Data -
9
VBUS(+5V)
Connector: ( Wafer 1x4/ 1.25mm/ 90°)
Pin number
Description
1
VBUS3(+5V)
2
USB3 Data -
3
USB3 Data +
4
USB3_GND

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2-24. Audio Codec Interface (H10)
Supports speaker amplifiers 1.5W per channel into 8Ω or 2W per channel into 4Ω.
Pin Assignment:
Connector: (Header 2x10 pin/ 2.0mm/ 180°)
Pin
Description
Pin
Description
1
GND
2
HP_R
3
MIC_IN
4
HP_L
5
HP_GND
6
HP Plug-in detection, (3.3V)high active
7
SPK_R-
8
SPK_R+
9
SPK_L-
10
SPK_L+
11
GND
12
GND
13
Stereo_MIC_R /(LINE_IN_R)
14
Stereo_MIC_L /(LINE_IN_L)
15
LINE_OUT_L
16
LINE_OUT_R
17
Reserved for SPDIF_GND
18
GND
19
Reserved for SPDIF_VCC
20
Reserved for SPDIF_TX