Foxconn Sedona User manual

伺服器/Sled Server
User Manual
Sedona

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iii
Compliance Information
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This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
fthis device may not cause harmful interference, and
fthis device must accept any interference received, including interference that may cause
undesired operation.
Class A
This equipment has been tested and found to comply with the limits for a Class A digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and,
if not installed and used in accordance with manufacturer’s manual may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at
your own expense.
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granted to the user by the FCC to operate this equipment.
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This Class A digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada.
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This This device contains licence-exempt transmitter(s)/receiver(s) that comply with
Innovation, Science and Economic Development Canada’s licence-exempt RSS(s).
Operation is subject to the following two conditions:
1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause
undesired operation of the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux
CNR d’Innovation, Sciences et Développement économique Canada applicables aux
appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions
suivantes :
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
The transmitter module may not be co-located with any other transmitter or antenna.
Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
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iv
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The following statement is applicable to products shipped to China and marked with “Class A” on
the product’s compliance label.
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This product is in conformity with the protection requirements of EU Council Directive 2014/
EC/30/EU on the approximation of the laws of the Member States relating to electromagnetic
compatibility. Foxconn cannot accept responsibility for any failure to satisfy the protection
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This product has been tested and found to comply with the limits for Class A Information
Technology Equipment according to CISPR32/EN55032 and CISPR35/EN55035. The limits
for Class A equipment were derived for commercial and industrial environments to provide
reasonable protection against interference with licensed communication equipment.
Attention: This is a Class A product. In a domestic environment this product may cause radio
interference in which case the user may be required to take adequate measures.
Compliance with 2014/53/EU Radio Equipment Directive (RED)
In accordance with Article 10.8(a) and 10.8(b) of the RED, the following table provides
information on the frequency bands used and the maximum RF transmit power of the
product for sale in the EU:
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This product has been tested in accordance to, and complies with the European Low Voltage
Directive 2014/35/EU and European RoHS Directive 2011/65/EU.
The product has been marked with the CE Mark to illustrate its compliance.
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$XVWUDOLDDQG1HZ=HDODQG&ODVV$VWDWHPHQW
Attention: This is a Class A product. In a domestic environment this product may cause radio
interference in which case the user may be required to take adequate measures.

v
Copyright Information
This publication, including all photographs, illustrations and software, is protected under
international copyright laws, with all rights reserved. Neither this manual, nor any of the material
contained herein, may be reproduced without the express written consent of the manufacturer.
Version 1.0, 2021-03
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The information in this document is subject to change without notice. The manufacture makes
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DQ\LPSOLHGZDUUDQWLHVRIPHUFKDQWDELOLW\RU¿WQHVVIRUDQ\SDUWLFXODUSXUSRVH)XUWKHUPRUH7KH
manufacture reserves the right to revise this publication and to make changes from time to time
in the content hereof without obligation to notify any person of such revision or changes.
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Este equipamento não tem direito à proteção contra interferência prejudicial e não pode causar
interferência em sistemas devidamente autorizados.
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La operación de este equipo está sujeta a las siguientes dos condiciones: 1) es posible que este
equipo o dispositivo no cause interferencia perjudicial y 2) este equipo debe aceptar cualquier
interferencia, incluyendo la que pueda causar su operación no deseada.
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
取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功
率或變更原設計之特性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發
現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。前述合法通信，指依電信管理
法規定作業之無線電通信。低功率射頻器材須忍受合法通信或工業、科學及醫療用電波輻射性電
機設備之干擾。

vi
Safety Information
Read this important safety information section. Retain this manual for reference. Read this
section before servicing.
CAUTION:
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57&%DWWHU\
CAUTION:
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CAUTION:
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EDWWHULHGXPHPHW\SHRXG¶XQW\SHUHFRPPDQGHSDUOHFRQVWUXFWHU0HWWHUDXUHEXWOHVEDWWHULHVXVDJHHV
FRQIRUPHPHQWDX[LQVWUXFWLRQVGXIDEULFDQW
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The optical transceiver module in this server is a laser Class 1 product.
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This equipment cannot be operated above an ambient operation temperature of 45 degrees
centigrade.
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This equipment can only be accessed by SERVICE PERSONNEL or by USERS who have been
instructed about the reasons for the restrictions applied to the location. Access is through the
use of a TOOL or lock and key, or other means of security, and is controlled by the authority
responsible for the location.

vii
Further Safety Information
Be sure to read all caution and danger statements in this documentation before performing the
instructions. Read any additional safety information that comes with your server or optional
device before you install the device.
Safety Precautions
For your protection, observe the following safety precautions when setting up your equipment:
fFollow all cautions and instructions marked on the equipment.
fEnsure that the voltage and frequency of your power source match the voltage and frequency
inscribed on the equipment’s electrical rating label.
fNever push objects of any kind through openings in the equipment. Dangerous voltages may be
present.
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damage to your equipment.
Safety Instructions
1. Please read these safety instructions carefully.
2. Please keep this Manual for later reference.
3. Please disconnect this equipment from AC outlet before cleaning. Don’t use liquid or sprayed
detergent for cleaning. Use moist sheet or cloth for cleaning.
4. For pluggable equipment, the socket-outlet must be installed near the equipment and must be
easily accessible.
5. Please keep this equipment from humidity.
Place this equipment on a safe reliable surface when installing. A drop or fall could cause injury.
7. Enclosure openings are for air circulation and protect the equipment from overheating. DO NOT
COVER THE OPENINGS.
Make sure the voltage of the power source matches rated voltages.
9. Place the power cord so that it won’t be stepped on or tripped over. Do not place anything on top
of the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect the equipment from outlet to avoid
damage to the system by transient voltages.
12. 'RQRWVSLOOOLTXLGVRQWRHTXLSPHQWWKLVPD\FDXVH¿UHRUHOHFWULFDOVKRFN
13. Never open the equipment. For safety reasons, the equipment should only be opened by
TXDOL¿HGVHUYLFHSHUVRQQHO
14. ,IDQ\RIWKHIROORZLQJVLWXDWLRQVDULVHVKDYHWKHHTXLSPHQWFKHFNHGE\TXDOL¿HGVHUYLFH
a. The power cord or plug is damaged.
b. Liquid seeped into the equipment.
c. The equipment has been exposed to moisture.
d. The equipment does not work well or operation does not match behavior described in user’s
manual.
e. The equipment has been dropped or damaged.
f. The equipment has obvious signs of damage.
15. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT WHERE TEMPERATURES
EXCEED 60 °C (140 °F); IT MAY DAMAGE THE EQUIPMENT.

viii
6\PEROV
The following symbols will appear in this manual to indicate different safety precaution:
Hazardous voltages are present. To reduce the risk of electric shock and danger
to personal health, follow the instructions.
There is a risk of personal injury and equipment damage. Follow the instructions.
Hot surface. Avoid contact. Surfaces are hot and may cause personal injury if
touched.
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DANGER:
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RQWKLVSURGXFWRUDWWDFKHGGHYLFHV
To Connect: To Disconnect:
1. Turn everything OFF.
2. First, attach all cables to devices.
3. Attach signal cables to connectors.
4. Attach power cords to outlet.
5. Turn device ON.
1. Turn everything OFF.
2. First, remove power cords from outlet.
3. Remove signal cables from connectors.
4. Remove all cables from devices.
CAUTION:
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ix
CAUTION:
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WKHIROORZLQJ
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KD]DUGRXVUDGLDWLRQH[SRVXUH
DANGER:
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GLUHFWH[SRVXUHWRWKHEHDP
DANGER:
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CAUTION:
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CAUTION:
7KHIROORZLQJODEHOLQGLFDWHVDKRWVXUIDFHQHDUE\

x
CAUTION:
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CAUTION:
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DANGER:
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CAUTION:
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xi
Table of Content
Compliance Information .........................................iii
Copyright Information ...........................................v
Safety Information..............................................vi
Further Safety Information ...................................... vii
Safety Precautions ............................................ vii
1. ,QWURGXFWLRQ
1.1. Checklist .................................................1
1.2. System Tour ..............................................1
1.3. Front View................................................2
1.4. Rear View ................................................2
1.5. System Board Component ...................................3
1.6. System Architecture ........................................4
2. 6\VWHP2SHUDWLRQV
2.1. Powering On ..............................................5
2.2. Powering Down............................................5
3. +DUGZDUH,QVWDOODWLRQ
3.1. Introduction ...............................................7
3.2. Debug Covers .............................................8
3.3. Top Covers ..............................................10
3.4. Atlas Key Modules.........................................12
3.5. NFC Modules ............................................14
3.6. Panel Mounts ............................................25
3.7. Storage .................................................30
3.8. System Fans .............................................34
3.9. Power Distribution Boards...................................37
3.10. Interposer Assemblies.....................................39
3.11. Expander Assemblies .....................................43
3.12. Expander Brackets .......................................44
3.13. K2C-AB................................................46
3.14. K2V4..................................................48
3.15. NVMe SSD .............................................50
3.16. Interposer Boards ........................................53

xii
3.17. Riser Boards............................................55
3.18. Heat Sinks..............................................56
3.19. Memory Modules.........................................58
3.20. Mainboards .............................................60
4. &DEOLQJ
4.1. Power Cable and Signal Cable ...............................63
5. &RQQHFWRU
5.1. Power Distribution Board ...................................65
5.2. Interposer Board..........................................65
5.3. Riser Board..............................................66
5.4. K2V4...................................................66
5.5. Trusted Platform Module....................................66
5.6. Near-Field Communication Module............................67
5.7. Near-Field Communication Reader............................67
5.8. Atlas Key Board...........................................67
 0DLQERDUG
6.1. Mainboard Jumpers .......................................69
7. 6SHFL¿FDWLRQV
 6SHFL¿FDWLRQV ............................................71
 6.8&RQ¿JXUDWLRQ ........................................71
 $SSHQGL[
8.1. RoHS...................................................73

1
,QWURGXFWLRQ
1.1. Checklist
Carefully unpack the Sedona box and check that the following items are included:
fSedona box
Contact your vendor if any items are missing or appear damaged.
1.2. System Tour
1.2.1. Sedona
Rear View
Front View
1
2
3
4
5
678910
22
11
12
14
13
15
16
19 18 17
20
21
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7DEOH Sedona System Overview
1R ,WHP 1R ,WHP
1 Atlas 2.0 security key 2 1U chasssis
3 Mainboard 4 DDR4 RDIMM
5 CPU 6 System fan x 10
7 Cordite module 8 Cordite airduct
9 NVME x 2, K2C-AB x 1 10 Interposer board
11 NFC board and reader 12 Busbar clip
13 Power distribution board 14 Panel mount
15 SATA SSD 16 Moon remote heatsink
17 K2V4 PCIe Card 18 Riser board
19 PCIe Riser bracket 20 Debug port cover
21 Pull tab 22 Top cover
1

2
Introduction
1.3. Front View
1.3.1. Sedona
2 2 3 1
1543 54
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7DEOH Server Front View
1R ,WHP 1R ,WHP
1 Atlas-key port 2 QSFP28 port
3 RJ-45 port 4 Reset button
5 Power button
1.4. Rear View
21 1
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7DEOH Server Rear View
1R ,WHP 1R ,WHP
1 NFC module 2 Busbar clip cable

3
Introduction
1.5. System Board Component
11
1
15 11
12 13 14
1
2
1
21
1
23
25
2
2
24
22
1
5
1
2
3
4
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7DEOH System Board Component
1R ,WHP 1R ,WHP
1 Power button 2 Reset button
3 RJ45 for BMC (management port) 4 USB type-C
5 MC LED 6 BMC LED
7 Riser power connector 8 X&63,ÀDVKVRFNHW
9 Battery 10 ID LED
11 SUB20 debug connector 12 Sideband connector
13 JTAG connector 14 MB power connector (24-pin)
15 K2V4 UART connector 16 K2C-AB UART connector
17 0DLQSURFHVVRU63,ÀDVKVRFNHW 18 DIMM slot x 16
19 Slimline SAS connector x 2 20 MB power connector (10-pin)
21 Main processor 22 Riser slot
23 Fan signal connector 24 Trusted platform module
25 RJ45 internal connector 26 CPLD programming header
27 %0&63,ÀDVKVRFNHW

5
2
6\VWHP2SHUDWLRQV
This section provides information about getting your server box up and running.
The system power is supplied by rack busbar.
2.1. Powering On
Follow these steps to turn on the system:
1. Replace the server on the rack.
The power is connected to the server through the bus bar.
2. Push the power button to turn on the system.
2.2. Powering Down
Follow these steps to power down the system:
Press and hold the power button to turn off the server.

6
System Operations
This page intentionally left blank.

7
3
+DUGZDUH,QVWDOODWLRQ
3.1. Introduction
The procedures in this section apply to the Sedona server model.
3.1.1. Safety Measures
Computer components and electronic circuit boards can be damaged by discharges of static
electricity. Working on computers that are still connected to a power supply can be extremely
dangerous. Follow the simple guidelines below to avoid damage to your computer or injury to
yourself.
fAlways disconnect the computer from the power outlet whenever you are working inside the
computer case.
fIf possible, wear a grounded wrist strap when you are working inside the computer case.
Alternatively, discharge any static electricity by touching the bare metal chassis of the computer
case, or the bare metal body of any other grounded appliance.
fHold electronic circuit boards by the edges only. Do not touch the components on the board
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fLeave all components inside the static-proof packaging until you are ready to use the component
for the installation.

8
Hardware Installation
3.2. Debug Covers
3.2.1. Removing a Debug Cover
The top cover on the Sedona (41/43/45/47) can be removed as seen in the following sections.
Follow these steps to remove a top cover:
1. Locate the front panel to view the debug/USB cover.
2. Facing the cover, grasp the left end of the cover and rotate it out until it is angled and the
securing hook on the right side is no longer adhering to the bezel.
3. Slide the cover out and remove it.
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9
Hardware Installation
3.2.2. Installing a Debug Cover
Follow these steps to install a top cover:
1. Locate the front panel and the securing slot for the debug/USB cover.
2. Angle the right side of the cover to insert the securing hook in the slot.
3. Once the hook is inserted, rotate the left side towards the bezel until it locks in place.
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