Lanner HTCA-E400 User manual

HTCA-E400
HMB-E100/HMB-E200/HLM-E110
User Manual
Version: 1.1
Date of Release: 2023-02-20
Telecom Datacenter Appliances

HTCA-E400 User Manual
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This manual describes the overview of the various functionalities of this product, and the information you
need to get it ready for operation. It is intended for those who are:
-responsible for installing, administering and troubleshooting this system or Information Technology
professionals.
-assumed to be qualified in the servicing of computer equipment, such as professional system
integrators, or service personnel and technicians.
The latest version of this document can be found on Lanner’s official website, available either through the
product page or through the Lanner Download Center page with a login account and password.
The icons are used in the manual to serve as an indication of interest topics or important messages. Below
is a description of these icons:
Icon
Usage
This mark indicates that there is something you should pay special
attention to while using the product.
This mark indicates that there is a caution or warning and it is
something that could damage your property or product.
To obtain additional documentation resources and software updates for your system, please visit the
Lanner Download Center. As certain categories of documents are only available to users who are logged
in, please be registered for a Lanner Account at http://www.lannerinc.com/ to access published documents
and downloadable resources.
In addition to contacting your distributor or sales representative, you could submit a request to our Lanner
Technical Support,and fill in a support ticket to our technical support department.
Your feedback is valuable to us, as it will help us continue to provide you with more accurate and relevant
documentation. To provide any feedback, comments or to report an error, please email to
[email protected]m, Thank you for your time.
Note or Information
Warning or Important

HTCA-E400 User Manual
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Taiwan Corporate Headquarters
Lanner Electronics Inc.
7F, No.173, Sec.2, Datong Rd.
Xizhi District, New Taipei City 22184,
Taiwan
立端科技股份有限公司
221 新北市汐止區
大同路二段 173 號7樓
T: [phone]
F: [phone]
E: [email protected]m
China
Beijing L&S Lancom Platform Tech. Co., Ltd.
Guodong LOFT 9 Layer No. 9 Huinan Road,
Huilongguan Town, Changping District, Beijing
102208 China
T: [phone]
F: [phone]
E: [e-mail]
USA
Lanner Electronics Inc.
47790 Westinghouse Drive
Fremont, CA 94539
T: [phone]
F: [phone]
E: [e-mail]
Canada
Lanner Electronics Canada Ltd
3160A Orlando Drive
Mississauga, ON
L4V 1R5 Canada
T: [phone]
F: [phone]
E: [e-mail]
Europe
Lanner Europe B.V.
Wilhelmina van Pruisenweg 104
2595 AN The Hague
The Netherlands
T: [phone]
E: [e-mail]

HTCA-E400 User Manual
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This document is copyrighted © 2023. All rights are reserved. The original manufacturer reserves the right
to make improvements to the products described in this manual at any time without notice.
No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means
without the prior written permission of the original manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original manufacturer assumes no responsibility for its
use, nor for any infringements upon the rights of third parties that may result from such use.
Intel® and Atom™ are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the U.S.
and/or other countries. Intel® is a trademark of Intel Corporation or its subsidiaries in the U.S. and/or other
countries. Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp. All other product
names or trademarks are properties of their respective owners.
This product has passed the CE test for environmental specifications. Test conditions for passing included
the equipment being operated within an industrial enclosure. In order to protect the product from being
damaged by ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the use of CE-compliant
industrial enclosure products.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.

HTCA-E400 User Manual
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This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instruction
manual, may cause harmful interference to radio communications. The operation of this equipment in a
residential area is likely to cause harmful interference in which case users will be required to correct the
interference at their own expense.
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after installation.
Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and
roll up your sleeves.
Wear safety glasses if you are working under any conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential hazard to people or makes the equipment unsafe.
Disconnect all power by turning off the power and unplugging the power cord before installing or
removing a chassis or working near power supplies
Do not work alone if potentially hazardous conditions exist.
Never assume that power is disconnected from a circuit; always check the circuit.
In order not to result in potential electric shock or fire, please avoid improper use narrated below:
Replacing a battery with an incorrect type (e.g. in the case of certain lithium battery types), which can
defeat a safety guard.
Disposal of a battery into fire or a hot oven, or mechanically crushing or cutting of a battery, which can
result in an explosion.
Leaving a battery in an extremely high temperature surrounding environment, which can result in an
explosion or the leakage of flammable liquid or gas.
A battery subjected to extremely low air pressure that may result in an explosion or the leakage of
flammable liquid or gas.
Lithium Battery Caution:
Risk of Explosion if Battery is replaced by an incorrect type. Dispose of used batteries according to the
instructions.
Installation only by a trained electrician or only by an electrically trained person who knows all English
Installation and Device Specifications which are to be applied.
Do not carry the handle of power supplies when moving to another place.
The machine can only be used in a fixed location such as labs or computer facilities.
Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment
to acceptable operating temperatures without adequate circulation. Be sure that the room in which you
choose to operate your system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An
open chassis permits air leaks, which may interrupt and redirect the flow of cooling air from internal
components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs
when electronic components are improperly handled and can result in complete or intermittent failures.
Be sure to follow ESD-prevention procedures when removing and replacing components to avoid these
problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available,

HTCA-E400 User Manual
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ground yourself by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap, which should be between 1 and 10
megohms (Mohms).
Environment:
Do not install and/or operate this unit in any place that flammable objects are stored or used in.
If installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack
environment may be greater than room ambient. Therefore, consideration should be given to installing
the equipment in an environment compatible with the maximum ambient temperature (Tma) specified
by the manufacturer.
Installation of the equipment (especially in a rack) should consider the ventilation of the system’s intake
(for taking chilled air) and exhaust (for emitting hot air) openings so that the amount of air flow required
for safe operation of the equipment is not compromised.
To avoid a hazardous load condition, be sure the mechanical loading is even when mounting.
Consideration should be given to the connection of the equipment to the supply circuit and the effect
that overloading of the circuits might have on over-current protection and supply wiring. Appropriate
consideration of equipment nameplate ratings should be used when addressing this concern.
Reliable earthing should be maintained. Particular attention should be given to supply connections other
than direct connections to the branch circuit (e.g. use of power strips).
Installation & Operation:
The installation of this product must be performed by trained specialists; otherwise, a non-specialist
might create the risk of the system’s falling to the ground or other damages.
Lanner Electronics Inc. shall not be held liable for any losses resulting from insufficient strength for
supporting the system or use of inappropriate installation components.
Suivez ces consignes pour assurer la sécurité générale :
Laissez la zone du châssis propre et sans poussière pendant et après l’installation.
Ne portez pas de vêtements amples ou de bijoux qui pourraient être pris dans le châssis. Attachez votre
cravate ou écharpe et remontez vos manches.
Portez des lunettes de sécurité pour protéger vos yeux.
N’effectuez aucune action qui pourrait créer un danger pour d’autres ou rendre l’équipement dangereux.
Coupez complètement l’alimentation en éteignant l’alimentation et en débranchant le cordon
d’alimentation avant d’installer ou de retirer un châssis ou de travailler à proximité de sources
d’alimentation.
Ne travaillez pas seul si des conditions dangereuses sont présentes.
Ne considérez jamais que l’alimentation est coupée d’un circuit, vérifiez toujours le circuit. Cet appareil
génère, utilise et émet une énergie radiofréquence et, s’il n’est pas installé et utilisé conformément aux
instructions des fournisseurs de composants sans fil, il risque de provoquer des interférences dans les
communications radio.
Risque d’explosion si la pile est remplacée par une autre d’un mauvais type.
Jetez les piles usagées conformément aux instructions.
L’installation doit être effectuée par un électricien formé ou une personne formée à l’électricité
connaissant toutes les spécifications d’installation et d’appareil du produit.
Ne transportez pas l’unité en la tenant par le câble d’alimentation lorsque vous déplacez l’appareil.
La machine ne peut être utilisée qu’à un lieu fixe comme en laboratoire, salle d’ordinateurs ou salle de
classe.

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L’équipement électrique génère de la chaleur. La température ambiante peut ne pas être adéquate pour
refroidir l’équipement à une température de fonctionnement acceptable sans circulation adaptée. Vérifiez
que votre site propose une circulation d’air adéquate.
Vérifiez que le couvercle du châssis est bien fixé. La conception du châssis permet à l’air de
refroidissement de bien circuler. Un châssis ouvert laisse l’air s’échapper, ce qui peut interrompre et
rediriger le flux d’air frais destiné aux composants internes.
Les décharges électrostatiques (ESD) peuvent endommager l’équipement et gêner les circuits électriques.
Des dégâts d’ESD surviennent lorsque des composants électroniques sont mal manipulés et peuvent
causer des pannes totales ou intermittentes. Suivez les procédures de prévention d’ESD lors du retrait et
du remplacement de composants.
Portez un bracelet anti-ESD et veillez à ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est
disponible, reliez votre corps à la terre en touchant la partie métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet antistatique, qui doit être comprise entre 1 et
10 mégohms (Mohms).
Avant d’allumer l’appareil, reliez le câble de mise à la terre de l’équipement à la terre.
Une bonne mise à la terre (connexion à la terre) est très importante pour protéger l’équipement contre
les effets néfastes du bruit externe et réduire les risques d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble de mise à la terre après avoir éteint l’appareil.
Un câble de mise à la terre est requis et la zone reliant les sections du conducteur doit faire plus de 4
mm2 ou 10 AWG.
Desserrez la vis du terminal de mise àla terre.
Branchez le câble de mise à la terre à la terre.
L’appareil de protection pour la source d’alimentation CC
doit fournir 30 A de courant.
Cet appareil de protection doit être branché à la source
d’alimentation avant l’alimentation CC.

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Package Content.........................................................................................................................10
Ordering Information .................................................................................................................10
Available Blades..........................................................................................................................10
Optional Accessories ..................................................................................................................11
System Specifications.................................................................................................................11
HTCA-E400 Front Panel ..............................................................................................................12
HTCA-E400 Rear Panel................................................................................................................12
Package Content.........................................................................................................................13
Ordering Information .................................................................................................................13
Optional Accessories ..................................................................................................................13
HMB-E100 System Specifications...............................................................................................14
HMB-E100 Front Panel ...............................................................................................................15
HMB-E100 Block Diagram ..........................................................................................................15
Package Content.........................................................................................................................16
Ordering Information .................................................................................................................16
Optional Accessories ..................................................................................................................16
HMB-E200 System Specifications...............................................................................................17
HMB-E200 Front Panel ...............................................................................................................18
HMB-E200 Block Diagram ..........................................................................................................18

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Package Content.........................................................................................................................19
Ordering Information .................................................................................................................19
Optional Accessories ..................................................................................................................19
HLM-E110 System Specifications ...............................................................................................20
HLM-E110 Front Panel................................................................................................................21
HLM-E110 Block Diagram...........................................................................................................21
HMB-E100 & HMB-E200: Installing the CPU ..............................................................................22
HMB-E100 & HMB-E200: Installing the System Memory ..........................................................28
HMB-E100 & HMB-E200: Installing the M.2 SSD Storage Module (Optional) ...........................30
HMB-E100 & HMB-E200: Installing the OCP NIC 3.0 Modules (Optional).................................31
HMB-E100 & HMB-E200: Installing Disk Drives (Optional)........................................................32
HMB-E200: Installing the GPU graphic card (Optional) .............................................................33
HLM-E110: Installing Precision Time Card (Optional) ................................................................35
HTCA-E400: Installing/Accessing the Compute Sled/Switch Sled..............................................36
HTCA-E400: Replacing Power Supply Units................................................................................37
Warranty Policy ..........................................................................................................................64

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The HTCA-E400, a carrier-grade Open Edge Server, powered by 3rd Gen Intel Xeon Scalable Processors
(codenamed Ice lake) with built-in AI Acceleration, for 5G Open RAN, Edge Cloud, and AI edge-focused
applications with extensive configuration options. HTCA-E400 is a high-performance appliance designed to
leverage edge computing for accelerating 5G deployment.
Key Features:
⚫Carrier-grade, full redundancy and extreme high performance
⚫3rd Gen Intel® Xeon® Scalable Processor with AI Acceleration
⚫Support 5x 1U compute sleds or 2x 2U+1U compute sleds
⚫Support 2x switch sleds
⚫450mm Short Depth Chassis for Edge Deployment
⚫Distinguished, Flexible and Front I/O Access
⚫1+1 Redundant Hot-swappable PSU
⚫NEBS-3 Compliant for Harsh Conditions
Your package contains the following items:
1x HTCA-E400 Network Security Platform
1x HMB-E100A
1x HLM-E110A
1x CPU Heat sink (in separate box)
2x Handles, 3x Lock Brackets, 1x Screw pack
Note: Power Cable is not included. Power Cable requirements: Connector Type: C19; Cable Gauge: 12AWG;
Voltage: VAC (HTCA-E400 only supports 220VAC with redundancy mode).
SKU No.
Description
HTCA-E400
HybridTCATM 4U Telecom Network Appliance
SKU No.
Description
HMB-E100
1U Compute Sled for HTCA-E400
HMB-E200
2U Compute Sled for HTCA-E400
HLM-E110
1U Switch Sled for HTCA-E400

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Model No.
Description
Power Supply
AC 3000W Power Supply
Power Supply
DC TBD Power Supply
Form Factor
4U Rackmount
Platform
CPU Options
Depend on 1U Compute Sled or 2U Compute Sled
BIOS
AMI SPI Flash BIOS
System Memory
Max. Capacity
Depend on CPU in 1U Compute Sled or 2U Compute Sled
Switch Blade
Switch Fabric
Depend on Switch Sled
Storage
Type
Depend on 1U Compute Sled or 2U Compute Sled
IPMI
Technology
Onboard AST2500
Port
1x RJ45 Management Port;
1x RJ45 LOM Port
Expansion
PCIe
Depend on 1U Compute Sled or 2U Compute Sled
Cooling
Processor
CPU Heatsinks with Fan Duct
System
Independent Smart fans on Compute Sled and Switch Sled
Environment
Operating Temperature
-5ºC to 50ºC (NEBS SKU);
0ºC to 40ºC (Commercial SKU)
Storage Temperature
-40ºC to 70ºC
Relative Humidity
5% to 90%, non-condensing
Miscellaneous
Watchdog
Yes
Internal RTC w/ Li Battery
Yes
Mechanical
Dimension (WxHxD)
444 x 175.5 x 450mm
Weight
27.5kg
Mounting
4U Rackmount
Power
Type / Watts
3000W 1+1 Redundant PSU
Input
220~240V @50-60Hz, Max.15.5A
OS Support
Linux
Cent OS 7.2 or above
Certification
EMC
CE Class A, FCC Class A, Design comply for NEBS Level 3

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No.
Description
F1
2U Compute Sled
1x 2U Compute Sled
F2
1U Compute Sled
1x 1U Compute Sled
F3
1U Switch Sled
1x 1U Programmable Switch Sled
F4
Power Supply
3000W 1+1 Redundant Hot-swappable PSU
F5
MGT Port
1x RJ45 Management Port
F6
LOM Port
1x RJ45 LOM Port
F4
F6
F1
F2
F3
F5

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The HMB-E100 compute sled is powered by 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake),
and provides front access I/O including 2x storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, mini-DP for VGA port,
LOM and USB 3.0 ports. The FHHL PCIe by 16 slot can support a GPU or FPGA card, in addition to an OCP
NIC 3.0 slot to plug in OCP NIC 3.0 modules. This compute sled is compatible with HTCA-E400 Series network
appliances.
Key Features:
⚫Support 3rd Gen Intel® Xeon® Scalable Processor (codenamed IceLake-SP)
⚫Front Access I/O: 2x Storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, 1x mini-DP for VGA port, 1x LOM port,
1x USB 3.0 port
⚫Support FHHL PCIe by 16 Module Card
⚫Support OCP NIC 3.0 Modules
⚫Compatible with HTCA-E400 Series
Your package contains the following items:
1x HMB-E100 1U x86 Compute Sled
1x CPU Heat sink (in separate box)
1x Screw Pack
SKU No.
Description
HMB-E100A
1U Compute Sled for HTCA-E400
Model No.
Description
NIC Module
BCM957508-N2100G, N2100G 2x100G OCP NIC 3.0 Module
TPM Module
IAC-TPM04A, TPM 2.0 Module

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Form Factor
1U Computing Blade
Platform
Processor
Intel® Xeon® Processor Scalable Family (Ice Lake-SP)
CPU TDP
Heat Sink support up to 165W
CPU Socket
1x LGA4189
Chipset
Intel® C627A
Security Acceleration
Intel® QuickAssist Technology
BIOS
AMI SPI Flash BIOS
System Memory
Technology
DDR4 2133/2400/2666/2933/3200MHz RDIMM / LRDIMM
Max. Capacity
512GB
Socket
8x 288-pin DIMM
Networking
Ethernet Ports
1x Intel® E810-CAM2 Support 2x 100G (2xKR4) to Switch Blade;
1x Intel® i210AT to MGT
Storage
HDD/SSD Support
2x 2.5” SSD (7mm) Trays
Onboard Slots
1x M.2 2280 M-Key
I/O
Reset Button
Software Reset (Control by GPIO)
LED Indicator
Power/Status/Storage, refer to Appendix A
Power Button
1x ATX Power Switch
USB Port
1x USB 3.0 Port
Display Port
1x Mini-DP Port (VGA Signal)
LOM Port
1x RJ45 LOM Port
OCP NIC Slot
1x OCP NIC 3.0 Modules
Expansion
PCIe
1x PCIe*16 FH/HL
Cooling
Processor
Passive CPU Heat Sink, up to 165W
Fans
4x Smart Fans
Environment
Operating Temperature
0ºC to 40ºC (Commercial SKU)
Storage Temperature
-40ºC to 70ºC
Relative Humidity
5% to 90%, Non-condensing
Miscellaneous
Watchdog
Yes
Internal RTC w/ Li Battery
Yes
TPM
Yes, TPM 2.0 (Optional)
Mechanical
Dimension (WxHxD)
216.5 x 42.2 x 490.2mm
Weight
TBD kg
Power
Input
DC 12V
OS Support
Linux
Cent OS 7.2 or above
Certification
EMC
CE Class A, FCC Class A, Design comply for NEBS Level 3

HTCA-E400 User Manual
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No.
Description
F1
Storage
2x 2.5” SSD (7mm) Trays
F2
Front Expansion Slot
1x PCIe*16 FH/HL
F3
OCP NIC Slot
1x OCP NIC 3.0 Module Slot
F4
Display Port
1x Mini-DP Port (VGA Signal)
F5
LOM Port
1x RJ45 LOM Port
F6
USB Port
1x USB 3.0 Port
F7
LED Indicators
Power/Status/Storage, pls refer Appendix A
F8
Power Button
1x ATX Power Switch
F9
Reset Button
1x Reset Button (Software Control by GPIO)
The block diagram indicates how data flows among components on the motherboard. Please refer to the
following figure for your motherboard’s layout design.
F1
F2
F4
F5
F6
F7
F9
F8
F3

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The HMB-E200 compute sled is powered by 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake),
and provides front access I/O including 4x storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, 1x mini-DP for VGA
port, 1x LOM and 1x USB 3.0 ports. The FHHL PCIe by 16 expansion slots, HL for 2U heatsink and 3/4L for
1U heatsink, can support a GPU or FPGA card, in addition to an OCP NIC 3.0 slot to plug in OCP 3.0 NIC
modules. This compute sled is compatible with HTCA-E400 series network appliances.
Key Features:
⚫Support 3rd Gen Intel® Xeon® Scalable Processor (codenamed IceLake-SP)
⚫Front Access I/O: 4x Storage bays, 1x PCIe, 1x OCP NIC 3.0 slot, 1x mini-DP for VGA Port, 1x LOM Port,
1x USB 3.0 Port
⚫Support FH3/4L double width or single width PCIe Card
⚫Support OCP NIC 3.0 Modules
⚫Compatible with HTCA-E400 Series
Your package contains the following items:
1x HMB-E200 2U x86 Compute Sled
1x CPU Heat sink (in separate box)
1x Screw Pack
SKU No.
Description
HMB-E200A
2U Compute Sled for HTCA-E400
Model No.
Description
NIC Module
BCM957508-N2100G, N2100G 2x100G OCP NIC 3.0 Module
TPM Module
IAC-TPM04A, TPM 2.0 Module
Heat Sink
2U Heat Sink (up to 270W)

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Form Factor
2U Computing Blade
Platform
Processor
Intel® Xeon® Processor Scalable Family (Ice Lake-SP)
CPU TDP
1U Heat Sink, support up to 165W;
2U Heat Sink, support up to 270W (Optional)
CPU Socket
1x LGA4189
Chipset
Intel® C627A
Security Acceleration
Intel® QuickAssist Technology
BIOS
AMI SPI Flash BIOS
System Memory
Technology
DDR4 2133/2400/2666/2933/3200MHz RDIMM / LRDIMM
Max. Capacity
512GB
Socket
8x 288-pin DIMM
Networking
Ethernet Ports
1x Intel® E810-CAM2 Support 2x 100G (2xKR4) to Switch Blade;
1x Intel® i210AT to MGT
Storage
HDD/SSD Support
4x 2.5” SSD (7mm) Trays
Onboard Slots
1x M.2 2280 M-Key
I/O
Reset Button
Software Reset (Control by GPIO)
LED Indicator
Power/Status/Storage, refer to Appendix A
Power Button
1x ATX Power Switch
USB Port
1x USB 3.0 Port
Display Port
1x Mini-DP Port (VGA Signal)
LOM Port
1x RJ45 LOM Port
NIC Slot
1x OCP NIC 3.0 Module Slot
Expansion
PCIe
1x PCIe*16 FH3/4L
Cooling
Fans
2x Smart Fans
Environment
Operating Temperature
0ºC to 40ºC (Commercial SKU)
Storage Temperature
-40ºC to 70ºC
Relative Humidity
5% to 90%, Non-condensing
Miscellaneous
Watchdog
Yes
Internal RTC w/ Li Battery
Yes
TPM
Yes, TPM 2.0 (Optional
Mechanical
Dimension (WxHxD)
216.5 x 85 x 490.2mm
Weight
TBD kg
Power
Input
DC 12V
OS Support
Linux
Cent OS 7.2 or above
Certification
EMC
CE Class A, FCC Class A, Design comply for NEBS Level 3

HTCA-E400 User Manual
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No.
Description
F1
Storage
4x 2.5” SSD (7mm) Trays
F2
Front Expansion Slot
1x PCIe*16 FH/HL
F3
NIC Slot
1x OCP NIC 3.0 Module Slot
F4
Display Port
1x Mini-DP Port (VGA Signal)
F5
LOM Port
1x RJ45 LOM Port
F6
USB Port
1x USB 3.0 Port
F7
LED Indicators
Power/Status/Storage, pls refer Appendix A
F8
Power Button
1x ATX Power Switch
F9
Reset Button
1x Reset Button (Software Control by GPIO)
F10
Auxiliary Power Connector
External Power Supply Rail for PCIe add-in card over 75W
dissipation
F1
F2
F4
F5
F6
F7
F8
F9
F3
F10

HTCA-E400 User Manual
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The HLM-E110 switch blade provides fabric interface with 100GbE QSFP28 x6, and 10/25GbE SFP+ x8 with
Intel Tofino Series switch controller. This switch blade is compatible with HTCA-E400 Series network
appliances to offer 10/25/100GbE fabric connectivity.
Key Features:
⚫Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP28
⚫Intel® Tofino Series (BFN-T10-032D-B0) the maximum bandwidth up to 3.2 Tb/s
⚫Optional IEEE 1588 support
⚫Compatible with HTCA-E400 Series
Your package contains the following items:
1x HLM-E110 1U Switch Sled
1x Screw pack
SKU No.
Description
HLM-E110A
6x 100GbE QSFP28, 8x 10/25GbE SFP28 Switch Sled for HTCA-E400 Series
Model No.
Description
Timing Module Card Kit
PSF9657-010 IEEE1588 Timing Module Kit

HTCA-E400 User Manual
20
Form Factor
1U Switch Sled
Platform
Controller
Intel® Tofino Series (BFN-T10-032D-B0)
Fabric Interface
6x 100GbE QSFP28, 8x 10/25GbE SFP28
I/O Interface
LED Indicator
Power/Status/Storage LED Indicator, pls refer to Appendix A
LAN Port
6x 100GbE QSFP28,
8x 10/25GbE SFP28
Console Port
1x Console Port
Management Port
1x Management Port
USB Port
1x USB 2.0 Port
Power Button
1x Power Button
Reset Button
1x Reset Button (Software control by GPIO)
Memory
Technology
DDR4 3200 SODIMM
Cooling
Fans
3x Smart Fans
Environment
Operating Temperature
0ºC to 40ºC
Storage Temperature
-40ºC to 70ºC
Humidity
5% to 90%, Non-condensing
Mechanical
Dimension (WxHxD)
216.5 x 42.2 x 444mm
Weight
TBD kg
POS Support
Linux
Cent OS 7.2 or above
Certification
EMC
CE Class A, FCC Class A