FRAMOS D400e Series User manual

FRAMOS Industrial Depth Camera D400e Series
USER MANUAL
Version 1.0.0 from 2020-06-30
www.framos.com

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Table of Contents
Description and Features .............................................................................................. 6
1.1 Description.............................................................................................................................................. 6
1.2 Features.................................................................................................................................................. 6
1.3 Minimum System Requirements............................................................................................................. 7
Introduction.................................................................................................................... 8
2.1 Purpose of this Document ...................................................................................................................... 8
2.2 Terminology ............................................................................................................................................ 8
2.3 Stereo Vision Depth Technology Overview............................................................................................ 8
Component Overview...................................................................................................10
3.1 Stereo Depth Module............................................................................................................................ 10
3.2 Left and Right Imagers ......................................................................................................................... 11
3.3 Infrared Projector .................................................................................................................................. 12
3.4 Color Sensor......................................................................................................................................... 13
3.5 Labels on the Camera .......................................................................................................................... 13
3.6 Thermal Control .................................................................................................................................... 13
3.7 Mechanical Dimensions........................................................................................................................ 14
3.8 Storage and Operating Conditions ....................................................................................................... 15
3.9 Connectors and PINs of M12 and M8 .................................................................................................. 15
3.9.1 Ethernet M12 connector, X-Coded, Female .................................................................................... 15
3.9.2 Power M8 connector, A-Coded, Male .............................................................................................. 16
3.10 Power Consumption ............................................................................................................................. 16
Optimum Thermal Conditions.......................................................................................17
4.1 Fundamentals of the Camera’s Heat Dissipation ................................................................................. 17
4.2 Operating Conditions for Different Temperatures ................................................................................ 18
4.3 Maximum Operating Ambient Temperatures ....................................................................................... 21
4.4 Summary of Operating Conditions and Temperatures......................................................................... 21

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Mounting and Deployment............................................................................................23
5.1 Camera Mounting ................................................................................................................................. 23
5.2 Application of External Cabling............................................................................................................. 23
5.3 Cleaning Procedures ............................................................................................................................ 24
Functional Specification................................................................................................25
6.1 Stream Configurations Possible ........................................................................................................... 25
6.2 Depth Field of View (FOV).................................................................................................................... 26
6.3 Minimum-Z Depth ................................................................................................................................. 26
6.4 Depth Accuracy .................................................................................................................................... 27
6.5 Depth Camera Functions...................................................................................................................... 27
6.6 Color Camera Functions....................................................................................................................... 27
6.7 D400e Camera Specific Features ........................................................................................................ 28
6.7.1 Packet Size ...................................................................................................................................... 28
6.7.2 Inter Packet Delay ............................................................................................................................ 29
6.7.3 Heartbeat Time................................................................................................................................. 29
6.7.4 Intercam Sync Mode ........................................................................................................................ 29
6.7.5 RGB/Stereo Synchronization ........................................................................................................... 29
Firmware Updates ........................................................................................................31
7.1 Parallel Firmware Update ..................................................................................................................... 32
Software .......................................................................................................................33
8.1 FRAMOS Camera Suite SDK............................................................................................................... 33
8.1.1 Set IP Configuration ......................................................................................................................... 33
8.1.2 Manage Camera Calibration Tables ................................................................................................ 34
8.2 Intel® RealSense™ Software Development Kit 2.0 ............................................................................. 35
Regulatory Compliance ................................................................................................37
Accessories ..................................................................................................................39
References ...................................................................................................................40
Revision History............................................................................................................41

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List of Figures
Figure 1 – M12 PIN Layout.....................................................................................................15
Figure 2 – M8 PIN Layout.......................................................................................................16
Figure 3 – Hottest Part of the Camera Housing........................................................................17
Figure 4 – D400e Series Camera Body Back Side ..................................................................23
Figure 5 – D400e Series Camera Synchronized Streams .........................................................30
Figure 6 – D400e Series Camera Streams out of Synchronization ............................................30
Figure 7 - Tool UpdateFirmware Part1.....................................................................................31
Figure 8 – Tool UpdateFirmware Part2 ....................................................................................31
Figure 9 - Tool UpdateFirmware Parallel Part1 .........................................................................32
Figure 10 – Tool UpdateFirmware Parallel Part2.......................................................................32
Figure 11 – Tool ConfigureIp Part1..........................................................................................34
Figure 12 – Tool ConfigureIp Part2..........................................................................................34
Figure 13 – Tool CalibrationTables Part1 .................................................................................35
Figure 14 – Tool CalibrationTables Part2 .................................................................................35
List of Tables
Table 1 – D400e Series Camera Features................................................................................ 6
Table 2 - Terminology ............................................................................................................. 8
Table 3 – D430 Depth Module Properties ...............................................................................10
Table 4 – D410 Depth Module Properties ...............................................................................10
Table 5 – D430 Imager Properties ..........................................................................................11
Table 6 – D410 Imager Properties ..........................................................................................11
Table 7 – D430 infrared projector properties............................................................................12
Table 8 – D410 infrared projector properties............................................................................12
Table 9 – Color Sensor Properties ..........................................................................................13
Table 10 – Camera Labels .....................................................................................................13
Table 11 – D400e Series Camera Dimensions ........................................................................14
Table 12 – Storage and Operating Conditions.........................................................................15
Table 13 – M12 PIN Layout....................................................................................................15
Table 14 – M8 PIN Layout......................................................................................................16
Table 15 – D400e Series Camera Power Consumption ...........................................................16
Table 16 – D400e Maximum Power Consumption...................................................................17
Table 17 – D400e Operating Temperature ..............................................................................18
Table 18 – Operating Conditions for Different Temperatures.....................................................18
Table 19 – Heat Dissipation Elements .....................................................................................20
Table 20 – Maximum Operating Ambient Temperatures ...........................................................21
Table 21 – Example of Possible Streams on Gigabit Ethernet Network......................................25
Table 22 – Depth FOV ...........................................................................................................26
Table 23 – Minimum-Z Depth .................................................................................................26
Table 24 – Depth Camera Functions ......................................................................................27
Table 25 – Color Camera Functions........................................................................................28
Table 26 – Revision History ....................................................................................................41

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List of Abbreviations
Abbreviation
Explanation
SDK
Software Development Kit
NIC
Network Interface Card
I/O
Input/output
DC
Direct Current
GND
Ground
IN
Input
OUT
Output
RMA
Return material authorization
TBD
To Be Determined
DHCP
Dynamic Host Communication Protocol
LLA
Link-local address

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Description and Features
1.1 Description
The FRAMOS Industrial Depth Camera D400e Series are built with Intel® RealSense™ technology.
The depth cameras have industrial M12 ethernet and M8 power connectors. Its water and dust
resistant housing is optimized for industrial environments. The FRAMOS Industrial Depth Camera
D400e Series are ideal for OEMs and integrators who need 3D as well as 2D vision in their products
and applications. The FRAMOS Industrial Depth Camera D400e Series are compatible with the
Cross-platform SDK for Intel® RealSense™ devices, enabling multiple programming languages,
wrappers, sample code and tools. FRAMOS D435e camera model features a wide field of view for
depth and RGB sensors, and global shutter feature of the depth sensors allows for applications
with fast motion.
1.2 Features
Resolution depth
D435e: 1280 x 720 px (global shutter)
D415e: 1280 x 720 px (rolling shutter)
Resolution RGB
1920 x 1080 px (rolling shutter)
FOV depth (HxVxD)
D435e: 86° x 57° x 94° (+/- 3°)
D415e: 65° x 40° x 72° (+/- 3°)
FOV RGB (HxVxD)
69° x 43° x 77° (+/- 3°)
Projector
Unstructured light in IR spectrum to
enhance depth quality
Operating range
0,2m – 10m+
Streaming speed
30 fps for simultaneous RGB and depth
streams @ 1280 x 720 px
Power consumption
6W (AUX) / 7W (PoE)
Housing material
Aluminium, anodized
Dimensions (LxHxW)
100mm x 47mm x 38mm
Mounting holes (backside)
4 x M3 ↧3,20mm
Connector 1*
M12 Ethernet, X-Coded (Data stream + PoE
possible)
Connector 2*
M8, 8 pin, A-Coded (Power supply + GPIO)
Housing Grade
IP66 (IP67 possible on project basis)
Protection glass
AR coating, scratch resistant (6H)
Physical Interface
Gigabit ethernet
Camera weight
Ca. 250 grams
Table 1 – D400e Series Camera Features

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1.3 Minimum System Requirements
Host PC Operating System:
Microsoft® Windows® 10
Linux Ubuntu 16.04
Host PC Architecture:
x86_64
ARM64 (NVIDIA® Jetson™ TX2)
Hardware:
Gigabit Network Interface Card (NIC)

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Introduction
2.1 Purpose of this Document
This document captures the specifications and the design–in details for the FRAMOS Industrial
Depth Camera D400e Series. This document provides information necessary to understand and
implement the camera system.
2.2 Terminology
Term
Description
6DOF
Six degrees of freedom (6DoF) refers to the freedom of
movement of a rigid body in three-dimensional space.
Forward/back, up/down, left/right, pitch, yaw, roll.
Stereo Depth
Baseline
The distance between the center of the left and right imagers in
a stereo camera.
Depth
Depth video streams are like color video streams except each
pixel has a value representing the distance away from the
camera instead of color information.
FOV
Field of View (FOV) describes the angular extent of a given
scene that is imaged by a camera. A camera's FOV can be
measured horizontally, vertically, or diagonally.
IR Projector
This refers to the source of infrared (IR) light used for illuminating
a scene, object, or person to collect depth data.
Imagers
Depth camera system uses a pair of cameras referred as imagers
to calculate depth. They are identical cameras configured with
identical settings.
Image Signal
Processor (ISP)
Image processing functions to enhance color image quality.
Left imager
From the perspective of the stereo camera looking out at the
world, the left imager is on the left side of the camera module.
Thus, when the user is facing the D400e camera, the left imager
is on the right side of the camera module.
Lens
This refers to the optical component of an imager in the D4
camera. Its purpose is to focus the incoming light rays onto the
CMOS chip in the imager.
Platform camera
This refers to the two-dimensional (2D) color camera on platform.
Table 2 - Terminology
2.3 Stereo Vision Depth Technology Overview
The FRAMOS Industrial Depth Camera D400e Series use stereo vision to calculate depth. The
stereo vision implementation consists of a left imager, right imager, and an optional infrared

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projector. The infrared projector projects non-visible static IR pattern to improve depth accuracy in
scenes with low texture. The left and right imagers capture the scene and send image data to the
vision processor. The vision processor calculates depth values for each pixel in the image by
correlating points on the left image to the right image. The depth pixel values are processed to
generate a depth frame. Subsequent depth frames create a depth video stream.

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Component Overview
3.1 Stereo Depth Module
The stereo depth module used in the D435e camera is the Intel® RealSense™ D430, while D415e
implements Intel® RealSense™ D410 depth module. Properties of the Intel® RealSense™ depth
modules are as follows:
D430
Baseline
50mm
Left/Right Imagers Type
Wide
Depth FOV HD (degrees)
H:87±3 / V:58±1 / D:95±3
Depth FOV VGA (degrees)
H:75±3 / V:62±1 / D:89±3
IR Projector
Wide
IR Projector FOV
H:90 / V:63 / D:99
Module Dimensions (mm)
X=70.7mm / Y=14mm / Z=10.53mm
Table 3 – D430 Depth Module Properties
D410
Baseline
55mm
Left/Right Imagers Type
Standard
Depth FOV HD (degrees)
H:65±2 / V:40±1 / D:72±2
Depth FOV VGA (degrees)
H:50±2 / V:40±1 / D:61±2
IR Projector
Standard
IR Projector FOV
H:67 / V:41 / D:75
Module Dimensions (mm)
X=74.7mm / Y=10mm / Z=4.7mm
Table 4 – D410 Depth Module Properties
H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z –
Thickness
Depth FOV specified at 2 meters.
Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to lens and
module to module by ~ +/- 3 degrees.

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3.2 Left and Right Imagers
D430
Image Sensor
OmniVision OV9282
Active Pixels
1280 X 800
Sensor Aspect Ratio
8:5
Format
10-bit RAW
F Number
f/2.0
Focal Length
1.93mm
Filter Type
None
Focus
Fixed
Shutter Type
Global Shutter
Horizontal Field of View
91.2 deg
Vertical Field of View
65.5 deg
Diagonal Field of View
100.6 deg
Distortion
<=1.5%
Table 5 – D430 Imager Properties
D410
Image Sensor
OmniVision OV2740
Active Pixels
1920 X 1080
Sensor Aspect Ratio
16:9
Format
10-bit RAW
F Number
f/2.0
Focal Length
1.88mm
Filter Type
None
Focus
Fixed
Shutter Type
Rolling Shutter
Horizontal Field of View
69.4 deg
Vertical Field of View
42.5 deg
Diagonal Field of View
77.0 deg
Distortion
<=1.5%
Table 6 – D410 Imager Properties

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3.3 Infrared Projector
The infrared projector improves the ability of the stereo camera system to determine depth by
projecting a static infrared pattern on the scene to increase texture on low texture scenes. The
infrared projector meets class 1 laser safety under normal operation. The power delivery and laser
safety circuits are on the stereo depth module. The infrared projector is referred as Standard or
Wide based on field of projection.
D430
Projector
Infrared
Pattern Type
Static
Illuminating Component
Vertical-cavity surface-emitting laser
(VCSEL) + Optics
Laser Controller
PWM
Optical Power
360mW average, 4.25W peak
Laser Wavelength
850nm ± 10 nm nominal @ 20°C
Laser Compliance
Class 1, IEC 60825-1:2007 Edition 2, IEC
60825-1:2014 Edition 3
H. Field of Projection
86°±3°
V. Field of Projection
57°±3°
D. Field of Projection
94°±3°
Table 7 – D430 infrared projector properties
D410
Projector
Infrared
Pattern Type
Static
Illuminating Component
Vertical-cavity surface-emitting laser
(VCSEL) + Optics
Laser Controller
PWM
Optical Power
360mW average, 440mW peak
Laser Wavelength
850nm ± 10 nm nominal @ 20°C
Laser Compliance
Class 1, IEC 60825-1:2007 Edition 2, IEC
60825-1:2014 Edition 3
H. Field of Projection
64°±3°
V. Field of Projection
41°±3°
D. Field of Projection
72°±3°
Table 8 – D410 infrared projector properties

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3.4 Color Sensor
The color sensor on the stereo depth module in addition to color image provides texture information.
Usages for the texture information include overlay on a depth image to create a color point cloud
and overlay on a 3d model for reconstruction.
Image Sensor
OmniVision OV2740
Color Image Signal Processor
Discrete
Active Pixels
1920 X 1080
Sensor Aspect Ratio
16:9
Format
10-bit RAW RGB
F Number
f/2.0
Focal Length
1.88mm
Filter Type
IR Cut Filter
Focus
Fixed
Shutter Type
Rolling Shutter
Horizontal Field of View
69.4 deg
Vertical Field of View
42.5 deg
Diagonal Field of View
77 deg
Distortion
<=1.5%
Table 9 – Color Sensor Properties
3.5 Labels on the Camera
The label on the sticker of the camera indicates two numbers:
PC = Product Code
With this number you can purchase the exact same product
at FRAMOS.
SN = Serial Number
This is the unique identifier of a single camera. For support
and RMA cases, this number is necessary.
Table 10 – Camera Labels
3.6 Thermal Control
The camera has thermal sensors implemented that prevent the camera from taking damage by
overheating. The temperature is mainly regulated by the measured housing temperature. Once it
exceeds 60°C, the intensity of the projector is reduced and eventually it will be switched OFF.
Most of the heat is conducted to the rear plate of the camera. Therefore, heat conductive material
for mounting the camera is recommended.

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3.7 Mechanical Dimensions
Front View D435e
Front View D415e
Side View D435e/D415e
Back View D435e/D415e
Table 11 – D400e Series Camera Dimensions

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3.8 Storage and Operating Conditions
Condition
Description
Min
Max
Unit
Storage (not
operating)
Temperature
(Sustained,
Controlled)
-20 70 °C
Relative
Humidity
5 95
% non
condensing
Case Temperature
(operating)
Temperature
0 60 °C
Table 12 – Storage and Operating Conditions
3.9 Connectors and PINs of M12 and M8
3.9.1 Ethernet M12 connector, X-Coded, Female
Figure 1 – M12 PIN Layout
M12 Pin
RJ45
1
1 (MX0+)
2
2 (MX0-)
3
3 (MX1+)
4
6 (MX1-)
5
7 (MX3+)
6
8 (MX3-)
7
5 (MX2-)
8
4 (MX2+)
Table 13 – M12 PIN Layout

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3.9.2 Power M8 connector, A-Coded, Male
Figure 2 – M8 PIN Layout
M8 Pin
Description
1
DC Power supply, 12-24V DC (+/- 10%)
2
Opto isolated IN
3
Opto isolated OUT
4
GND for opto isolated I/O
5
Direct coupled I/O 1 (optional)
6
Direct coupled I/O 2 (optional)
7
Not used
8
Power GND
Table 14 – M8 PIN Layout
3.10 Power Consumption
Condition
Typical
Max
Power via M8
5.5W
7W
Power via M12 (PoE)
6.9W
8W
Table 15 – D400e Series Camera Power Consumption

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Optimum Thermal Conditions
4.1 Fundamentals of the Camera’s Heat Dissipation
The power consumption of the D400e cameras is the main determining factor for heat creation
inside the camera, which depends on the operation mode of the camera. In the case that all
available functionality of the camera (i.e. frame rates or projector intensity) is used at maximum
capacity, the power consumption and thus the heat generation increases accordingly. Aside from
the resource utilization of the camera, the power supply option also has a large effect on power
consumption. PoE (power over Ethernet) has a higher power consumption due to the uneven
efficiency of circuitry compared to the circuitry used when powering the camera via the M8
connector.
Power Supply Option
Max.
Power via M8
7W
Power via M12 (PoE)
8W
Table 16 – D400e Maximum Power Consumption
Most of the power consumed by the camera is converted to heat and consequently, the camera
will generate heat that is released to the ambient via the camera’s housing.
Due to the internal structure of the camera, most heat dissipation will happen via the back side.
Therefore, this part of the camera body is intended for thermal coupling with an external dissipative
element such as a camera holder or stand. In tabletop applications, a simple heatsink element can
be used. It is recommended to use metal parts for camera mounts to assure a good thermal
conductivity on the back side of the camera body. Four M3 threaded holes are available on the
camera back side to attach the camera to a mounting facility. It is recommended to use thermal
paste on the contact surface between the camera and the heatsink for maximum thermal
conductivity.
Figure 3 – Hottest Part of the Camera Housing

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The maximum allowed operating temperature of the camera is defined as the temperature
measured on the camera housing on the back side of the case, as shown in the figure above.
Operating Temperature
Min.
Max.
Temperature of the case (measured on the back side of
the camera)
0 °C 60 °C
Table 17 – D400e Operating Temperature
Exceeding the maximum operating temperature defined in the table above can lead to permanent
damage of the camera. The thermal dynamic of the camera is relatively slow due to the mass of
the housing and its internal construction. Therefore, more than 1.5h of steady operation under an
unchanged ambient condition, is necessary for the camera to reach the thermal steady state.
The camera operator should be aware of the camera settings that affect power consumption
(framerate, laser usage, …), the power supply options and environmental conditions, to assure that
the camera remains in a safe temperature range at all time. Examples of using appropriate heatsinks
are discussed in the following chapter.
4.2 Operating Conditions for Different Temperatures
Depending on the ambient conditions, the camera can either operate without any additional heat
dissipation element or with an adequate heatsink attached. The allowed maximum ambient
temperatures are given for different operating modes of the camera, to indicate at which
configuration the camera can run in several application use cases.
Use case:
Description:
Typical1
Power supply: M8, 12V
Exposure time: 5 ms
Framerate: 30 fps
Laser projector power: 150 mW
Typical2
Power supply: M12, PoE
Exposure time: 5ms
Framerate: 30 fps
Laser projector power: 150mW
Max1
Power supply: M8, 12V
Exposure time: 30 ms
Framerate: 30 fps
Laser projector power: 360 mW
Max2
Power supply: M12, PoE
Exposure time: 30 ms
Framerate: 30 fps
Laser projector power: 360 mW
Table 18 – Operating Conditions for Different Temperatures

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The table below lists several heat dissipation elements that can be used to keep the camera in a
safe operation mode.
Heatsink:
Description:
H0
No heatsink attached
H1 - passive
SK 424 75 ME
Heatsink length: 75 mm
Thermal resistance: approx. 3.8 K/W
H2 - passive
SK 408 50 ME
Heatsink length: 50 mm
Thermal resistance: approx. 2.3 K/W
H3 - passive
SK 530 100 AL
Heatsink length: 100 mm
Thermal resistance: approx. 0.38 K/W

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H4 - active
SK 424 75 ME
Heatsink length: 75 mm
Cooling fan: Xilence XPF40
Table 19 – Heat Dissipation Elements