Andor Technology iStar Installation instructions

iStarIsCMOS
Hardware Guide
for the iStar Intensied sCMOS camera
andor.com © Andor Technology Ltd. 2019
Version 1.2 rev 11 Jun 2019

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TABLE OF CONTENTS
SECTION 1: INTRODUCTION.............................................................................................................. 9
1.1 HELP AND TECHNICAL SUPPORT...................................................................................... 10
1.2 DISCLAIMER ......................................................................................................................... 11
1.3 TRADEMARKS AND PATENT INFORMATION...................................................................... 11
1.4 SPECIFICATIONS .................................................................................................................. 12
1.5 COMPONENTS...................................................................................................................... 13
1.5.1 Accessories................................................................................................................ 14
SECTION 2: PRODUCT OVERVIEW.................................................................................................. 15
2.1 HARDWARE DESCRIPTION ................................................................................................. 15
2.2 POWER AND SIGNAL CONNECTIONS ................................................................................ 16
2.2.1 connector PlAte ........................................................................................................ 16
2.2.2 Power suPPly unit (Psu) .......................................................................................... 18
SECTION 3: INSTALLATION .............................................................................................................. 19
3.1 CONNECTING THE ISTAR SCMOS TO OTHER EQUIPMENT............................................. 19
3.1.1 AttAching to AsPectrogrAPh...................................................................................... 19
3.1.2 AttAching to Alens system ........................................................................................ 20
3.1.3 AttAching to mounting Posts ..................................................................................... 20
3.1.4 AlternAtive Protective eArth viA eArth stud .............................................................. 20
3.1.5 connecting the istAr scmos cAmerA to the Pc........................................................ 21
3.2 COOLING............................................................................................................................... 22
3.2.1 imPortAnt considerAtions when using liquid cooling systems ..................................... 22
3.3 COOLING HOSE CONNECTORS.......................................................................................... 22
3.3.1 coolAnt recommendAtions.......................................................................................... 22
3.4 CONNECTING THE LIQUID COOLING SYSTEM ................................................................. 23
3.4.1 connecting the coolAnt hoses .................................................................................. 23
3.4.2 disconnecting the coolAnt hoses .............................................................................. 23
3.5 INSTALLING SOFTWARE AND USB DRIVERS..................................................................... 24
3.5.1 minimum comPuter requirements ............................................................................... 24
3.5.2 instAlling solis softwAre And usB driver ................................................................. 24
3.5.3 new hArdwAre wizArd ............................................................................................... 24

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SECTION 4: OPERATION ................................................................................................................... 25
4.1 EMERGENCY MAINS DISCONNECTION .............................................................................. 25
4.2 POWER-UP SEQUENCE........................................................................................................ 25
4.3 POWER-DOWN SEQUENCE.................................................................................................. 25
4.4 USING THE ISTAR SCMOS CAMERA ................................................................................... 25
4.5 PRE-ACQUISITION SETUP.................................................................................................... 26
4.5.1 setting the cooling temPerAture ................................................................................ 26
4.5.2 fAn control ............................................................................................................... 26
4.6 SETUP ACQUISITION PANEL ................................................................................................ 27
4.7 ACQUISITION MODES .......................................................................................................... 28
4.7.1 single scAn................................................................................................................. 28
4.7.2 Kinetic series .............................................................................................................. 28
4.7.3 AccumulAte ................................................................................................................. 28
4.7.4 run till ABort Acquisition .......................................................................................... 29
4.7.4.1 live mode................................................................................................... 29
4.7.5 fAst exPosure switch ................................................................................................ 29
4.7.6 frAme rAte control ................................................................................................... 30
4.8 READOUT MODES................................................................................................................. 30
4.8.1 Binning/roi ................................................................................................................ 31
4.8.2 orientAtion .................................................................................................................. 32
4.8.3 Acquisition And dAtA tyPes selection .......................................................................... 32
4.8.3.1 definitions of dAtA tyPes ........................................................................... 32
4.8.3.2 dAtA disPlAy And Processing modes ........................................................... 33
4.8.4 AutoscAle Acquisition ................................................................................................. 34
4.8.5 dAtA file hAndling ...................................................................................................... 35
4.8.5.1 sPooling (dAtA sPooling)............................................................................ 35
4.8.5.2 virtuAl memory.......................................................................................... 35
4.8.5.3 Auto-sAve .................................................................................................. 36
4.8.6 dAtAflow monitor ...................................................................................................... 36

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4.9 GATING AND IMAGE INTENSIFIER SETTINGS (GATING) ...................................................37
4.9.1 gAte modes................................................................................................................37
4.9.2 using the gAte monitor .............................................................................................39
4.9.3 mcP gAin ..................................................................................................................40
4.9.4 insertion delAy...........................................................................................................41
4.9.5 intelligAte ..................................................................................................................43
4.9.6 integrAte onchiP (ioc) .............................................................................................44
4.9.7 digitAl delAy generAtor (ddg) steP (including gAte steP).........................................46
4.9.7.1 steP mode configurAtion ..........................................................................46
4.9.7.2 steP uPloAd..............................................................................................48
4.10 TRIGGERING MODES ...........................................................................................................49
4.10.1 internAl trigger.........................................................................................................49
4.10.2 externAl trigger........................................................................................................49
4.10.3 externAl stArt ...........................................................................................................50
4.10.4 softwAre trigger.......................................................................................................50
4.10.5 externAl exPosure trigger ........................................................................................50
4.11 SETTING UP PIV MODE ON ISTAR SCMOS ........................................................................51
4.11.1 solis settings for Piv mode......................................................................................51
4.11.2 setting uP the externAl delAy generAtor (ddg)............................................................
for two inPut signAls..................................................................................................52
SECTION 5: MAINTENANCE.............................................................................................................53
5.1 REGULAR CHECKS ..............................................................................................................53
5.2 ANNUAL ELECTRICAL SAFETY CHECKS ...........................................................................53
5.3 FUSE REPLACEMENT ..........................................................................................................53
5.4 COOLING HOSES AND CONNECTIONS..............................................................................53

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SECTION 6: TROUBLESHOOTING .................................................................................................. 54
6.1 CAMERA BUZZER DOES NOT SOUND ON START-UP...................................................... 54
6.2 CAMERA IS NOT RECOGNIZED BY PC.............................................................................. 54
6.3 BUZZER SOUNDS CONTINUOUSLY................................................................................... 54
6.4 FAN NOT OPERATING AS EXPECTED................................................................................ 54
6.5 CAMERA DOES NOT COOL TO THE REQUIRED TEMPERATURE.................................... 54
6.6 PREVENTING CONDENSATION .......................................................................................... 54
APPENDIX A: MECHANICAL DRAWINGS ....................................................................................... 56
APPENDIX B: DEW POINT GRAPH ................................................................................................. 57
APPENDIX C: INTENSIFIER INFORMATION ................................................................................... 58
APPENDIX D: DDG INFORMATION ................................................................................................. 60
APPENDIX E: SCMOS STRUCTURE AND OPERATION ................................................................. 63
APPENDIX F: OTHER INFORMATION ............................................................................................. 70

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SAFETY AND WARNING INFORMATION
PLEASE READ THIS INFORMATION FIRST BEFORE USING YOUR iSTAR INTENSIFIED sCMOS CAMERA.
1. To ensure correct and safe operation of this product, please read this guide before use and keep it in a safe place for future
reference
2. If equipment is used in a manner not specied by Andor, the protection provided by the equipment may be impaired
3. Before using the system, please follow and adhere to all warnings, safety, manual handling and operating instructions located
either on the product or in this manual
4. An integral part of protection against electric shock in the case of a fault is the protective earth provided via the earth conductors
in the mains cable. It is therefore vital that the earth system of the building, and in particular the socket, is constructed properly
to provide suitable protection when needed.
5. As the main protective earth is also provided via the Andor-supplied External Power Supply, then if this is not used, the
alternative Earth Stud must be used instead (see page 20).
6. The Andor iStar sCMOS is a precision scientic instrument containing fragile components. Always handle with care
7. Do not expose the product to extreme hot or cold temperatures
8. Ensure that a minimum clearance of approximately 100mm (4”) is maintained in front of all ventilation slots and the fan inlet
9. If using water cooling, ensure that cooling water supply is connected prior to powering the camera.
10. Do not expose the product to open ames
11. Do not allow objects to fall on the product
12. Do not expose the product to moisture, wet or spill liquids on the product. Do not store or place liquids on the product. If a
spillage occurs on the product, switch off power immediately, and wipe off with dry, lint-free cloth. If any ingress has occurred or
is suspected, unplug the mains cable, do not use, and contact Andor service
13. The product contains components that are extremely sensitive to static electricity and radiated electromagnetic elds, and
therefore should not be used, or stored, close to EMI/RFI generators, electrostatic eld generators, electromagnetic or
radioactive devices, or other similar sources of high energy elds
14. Operation of the system close to intense pulsed sources (e.g. plasma sources, arc welders, radio frequency generators, X-ray
instruments, and pulsed discharge optical sources) may compromise performance if shielding of the iStar sCMOS is inadequate
15. This product is not designed to provide protection from ionising radiation. Any customer using this product in such an
application should provide their own protection
16. The Andor iStar sCMOS is for use in research laboratories and other controlled scientic environments
17. This equipment has not been designed and manufactured for the medical diagnosis of patients
18. Use only the power supply cord provided with the system for this unit. Should this not be correct for your geographical area
contact your local Andor representative
19. Only the correctly specied mains supply and fuse must be used
20. Make sure the electrical cord is located so that it will not be subject to damage
22. There are no user-serviceable parts beyond the specied user accessible areas of the product and the enclosure must not be
opened. Only authorised service personnel may service this equipment
23. The above label indicates that this unit contains components which are sensitive to and can be damaged by electrostatic
discharge. When working on a unit which is not enclosed, it is necessary to follow anti static precautions to ensure damage does
not occur.
RegulatoRy ComplianCe
The iStar sCMOS complies with the requirements of the EU EMC and LV Directives
through testing to EN 61326-1 and EN 61010-1.
This product requires a DC power supply (refer to Section 1.6)

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ADDITIONAL NOTES - AVOIDING DAMAGE TO THE IMAGE INTENSIFIER
An image intensier is a very sensitive instrument, with care and good working practice, it should last many years.
1. There are two major potential forms of damage to be considered:
• Bleaching of the photocathode brought about by over-illuminance of this photo-sensitive interface
Bleaching of the photocathode reduces the Quantum Efciency (QE) response (it can render it completely
unresponsive) and may permanently increases the background noise of the Image Intensier.
• Ion damage of the cathode brought about by excessive numbers of photoelectrons in the Multichannel Plate
(hereinafter referred to as the MCP). As a general rule of thumb, when the sensor is already saturated, this type
of damage is liable to occur.
Excessive numbers of photoelectrons in the MCP brought about by excessive input light levels, or moderate
light levels and excessive gain can damage both the photocathode, MCP or the phosphor screen.
If the multichannel plate is overloaded with incoming electrons, it is much more likely for positive ions to
be knocked out of the walls of the multichannel plate by the colliding electrons. These ions are accelerated
towards the photocathode and can do considerable mechanical damage.
Excessive electrons can also increase the outgassing rate inside the tube to the point where the vacuum is
seriously diminished.
The protection circuitry in the iStar sCMOS monitors the current drawn by the phosphor, which is indirectly
linked to the incident signal intensity as seen through the MCP gain chain. Above a certain level the high
voltage power supply at the MCP shuts down to prevent damage. However, when only a sub-section of the
phosphor / photocathode is illuminated, damage can occur without the high voltage supply shutting down.
Applications involving focusing of strong spectral line features, or conned bright spots in a imaging scenario
must therefore be treated with appropriate caution.
The following best practices should be observed:
Always maintain the measured signal below the saturation level of the sensor. This should constitute a safe operating
condition in most circumstances.
• Do not focus features of <50 μm on the photocathode (i.e. stay around the resolution limit of the iStar sCMOS).
For example, a 10 μm feature might be sufciently intense to damage the photocathode but, when it is smeared
out to ~ 50 μm, it may not be saturating the sensor and therefore satises the general guideline above. This
applies to images and to spectra. Be particularly careful with automatic spectrographs that reset themselves
with the brighter zero order on the center of the focal plane.
• Always keep the photocathode covered when the detector is not in use (the photocathode will degrade even
when switched off). This can be facilitated by using a mechanical shutter whenever possible.
• If you are unsure of the signal levels to be detected, one should start with low signal levels and build up. If
necessary, use a CCD detector to check the signal level.
• Protect the iStar sCMOS from mechanical shock both in use, and in transit, as damage to the intensier tube
may result from sharp jolts.
2. To remove dirt or ngerprints on the input window of the image intensier, please contact your local Andor
representative for advice on how to best clean this interface.
3. Turning off the iStar sCMOS camera through mains or camera On/Off switch during acquisition or cooling may result
in damage to the camera. When possible, ensure sensor cooling temperature should be > 0oC (after switching Off
the cooler) before turning off the camera.
4. Prior to mounting the camera on an optical system, the black grommet which covers the image intensier and
protects it from unwanted photo-bleaching must be carefully removed without the use of any tools such as
screwdrivers.

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Revision HistoRy
Version Released Description
1.0 19 Sep 2016 Initial Release. Limited distribution in compact format.
1.1 06 Apr 2017 Added additional information regarding alternative earthing requirements if the standard
supplied power supply is not used with the product.
1.2 11 Jun 2019 Updated USA and Asia-Pacific addresses and updated back panel image.

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SECTION 1: INTRODUCTION
Thank you for choosing the iStar intensied Scientic CMOS (sCMOS) camera. You are now in possession of a
revolutionary new intensied camera which combines the ultra-fast, gated image intensier technology of the Andor iStar
with the high resolution, dynamic, high speed sCMOS sensor as seen previously in the Andor Zyla and Neo.
Figure 1: The iStar sCMOS Camera
This manual contains useful information and advice to ensure you get the optimum performance from your new system.
If you have any questions regarding your iStar sCMOS, camera please feel free to contact Andor directly, or via your
local representative or supplier.

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1.1 Help and teCHniCal suppoRt
If you have any questions regarding the use of this equipment, please contact the representative* from whom your
system was purchased, or:
Europe USA
Andor Technology Ltd.
7 Millennium Way
Springvale Business Park
Belfast
BT12 7AL
Northern Ireland
Tel. [phone]
Fax. [phone]
Andor Technology
300 Baker Avenue
Suite # 150
Concord
MA 01742
USA
Tel. [phone]
Fax. [phone]
Asia-Pacic China
Andor Technology (Japan)
5F IS Building
3-32-42 Higashi-Shinagawa
Tokyo 140-0002
Japan
Tel: [phone]
Fax: [phone]
Andor Technology
Unit 1, Building A,
66 Zhufang Rd, Haidian Dist.
Beijing 100085
China
Tel: [phone]
Fax. [phone]
* The latest contact details for your local representative can be found on the Contact and Support page of our website.