FUSHENGTEK Technology WG-7302-E38/J19 User manual

WG-7302User’sGuide
WG-7302 User’s Guide
WG-7302

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WG-7302 User’s Guide
»Table of Contents «
1 Introduction ........................................................................................................................8
Ordering Information........................................................................................................8
2 Installation Procedure .........................................................................................................9
2.1 Installing the Board................................................................................................................................................. 9
2.2 Requirements IEC60950....................................................................................................................................... 10
3 System Specifications.......................................................................................................11
3.1 Component main data........................................................................................................................................... 11
Technical Information....................................................................................................11
3.2 System overview...................................................................................................................................................12
3.3 Integrated pre-mounted cooler.............................................................................................................................. 12
4 Connector Locations.........................................................................................................13
4.1 WG-7302 –front side ........................................................................................................................................ 13
4.2 WG-7302–back side.......................................................................................................................................... 14
5 Connector Definitions.......................................................................................................15
6 IO-Area Connectors..........................................................................................................16
6.1 HDMI Connectors (HDMI1, HDMI2)..................................................................................................................16
6.2 Ethernet Connector ............................................................................................................................................... 16
6.3 USB Connectors (IO Area)................................................................................................................................... 18
6.4 DC Power Jack Connector (Vin Ext.)...................................................................................................................19
7 Internal Connectors...........................................................................................................20
7.1 Power Connector (J1.)...........................................................................................................................................20
7.2 Internal SATA Power Connector (SATA_PWR.)................................................................................................20
7.3 SATA (Serial ATA) Disk interface (SATA1) ......................................................................................................21
7.4 LVDS Flat Panel Connector (J8)..........................................................................................................................22
7.5 Analog Connector (VGA).....................................................................................................................................23
7.6 USB Connectors (USB2 and USB3)..................................................................................................................... 24

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7.7 Serial COM1 –COM6 Ports.................................................................................................................................25
7.8 Audio Connector(AUDIO) ...................................................................................................................................26
7.9 GPIO Connector (GPIO)....................................................................................................................................... 27
7.10 LCD Power (LCD_PWR)...................................................................................................................................27
7.11 Clear CMOS (JCM1)..........................................................................................................................................27
7.12 Power Button and Reset (PWR)..........................................................................................................................27
7.13 “Always On” (AUTO_BTN) .............................................................................................................................. 28
8 Slot Connectors (mPCIe, mSATA)...................................................................................29
8.1 mPCIe or mSATA slot..........................................................................................................................................29
8.2 mPCIe slot.............................................................................................................................................................30
9 BIOS.................................................................................................................................31
9.1 Main................................................................................................................................................................... 31
9.2 Advanced ...........................................................................................................................................................32
9.2.1 ACPI Settings.............................................................................................................................................. 33
9.2.2 CPU Configuration ..................................................................................................................................... 34
9.2.3 OS Selection................................................................................................................................................ 35
9.2.4 IDE Configuration....................................................................................................................................... 36
9.2.5 CSM Configuration.....................................................................................................................................37
9.2.6 USB Configuration ........................................................................................................................................ 38
9.2.7 SIO Configuration.......................................................................................................................................... 39
9.3 Chipset .................................................................................................................................................................. 45
9.3.1 North Bridge .................................................................................................................................................. 46
9.3.2 South Bridge .................................................................................................................................................. 50
9.4 Security................................................................................................................................................................. 53
9.5 Boot....................................................................................................................................................................... 54
9.6 Save & Exit........................................................................................................................................................55
Appendix A:Customized......................................................................................................56
1 Display combinations............................................................................................................................................ 56
Appendix B:GPIO Sample Code..........................................................................................57
Appendix C:WatchDog Sample Code..................................................................................59

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Appendix D: Dimensional drawing......................................................................................60

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Document Revision History
Revision
Date
By
Comment
A
Oct 20th 2017
MU
Copyright Notice
Copyright © 2016, FUSHENGTEK Technology, ALL RIGHTS RESERVED.
No part of this document may be reproduced or transmitted in any form or by any means, electronically or
mechanically, for any purpose without the express written permission of FUSHENGTEK Technology.
Trademark Acknowledgement
Brand and product names are trademarks or registered trademarks of their respective owners
Disclaimer
FUSHENGTEK Technology reserves the right to make changes without notice to any product, including circuits
and/or software described or contained in this manual in order to improve design and/or performance.
Specifications listed in this manual are subject to change without notice. FUSHENGTEK Technology assumes no
responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright
or mask work rights to these products and makes no representations or warranties that these products are free from
patent, copyright or mask work right infringement unless otherwise specified. Applications that are described in this
manual are for illustration purposes only. FUSHENGTEK Technology makes no representation or warranty that such
application will be suitable for the specified use without further testing or modification.

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Life Support Policy
FUSHENGTEK Technology’s PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF THE GENERAL
MANAGER OF FUSHENGTEK Technology.
As used herein:
Life support devices or systems are devices or systems which (a) are intended for surgical implant into body or (b)
support or sustain life and whose failure to perform when properly used in accordance with instructions for use
provided in the labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component of a life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
Warranty
FUSHENGTEK Technology warrants its products to be free from defects in material and workmanship during the
warranty period. If a product proves to be defective in material or workmanship during the warranty period
FUSHENGTEK Technology will, at its sole option, repair or replace the product with a similar product.
Replacement Product or parts may include remanufactured or refurbished parts or components.
The warranty does not cover:
1. Damage, deterioration or malfunction resulting from:
A. Accident, misuse, neglect, fire, water, lightning or other acts of nature, unauthorized product
modification or failure to follow instructions supplied with the product.
B. Repair or attempted repair by anyone not authorized by FUSHENGTEK Technology.
C. Causes external to the product, such as electric power fluctuations or failure.
D. Normal wear and tear.
E. Any other causes which does not relate to a product defect.
2. Removal, installation and set-up service charges.
Exclusion of damages:
FUSHENGTEK TECHNOLOGY LIABILITY IS LIMITED TO THE COST OF REPAIR OR REPLACEMENT OF
THE PRODUCT.
FUSHENGTEK TECHNOLOGY SHALL NOT BE LIABLE FOR:
1. DAMAGE TO OTHER PROPERTY CAUSED BY ANY DEFECTS IN THE PRODUCT, DAMAGES
BASED UPON INCONVENIENCE, LOSS OF USE OF THE PRODUCT, LOSS OF TIME, LOSS OF
PROFITS, LOSS OF BUSINESS OPPORTUNITY, LOSS OF GOODWILL, INTERFERENCE WITH
BUSINESS RELATIONSHIPS OR OTHER COMMERCIAL LOSS, EVEN IF ADVISED OF THEIR
POSSIBILITY OF SUCH DAMAGES.
2. ANY OTHER DAMAGES, WHETHER INCIDENTAL, CONSEQUENTIAL OR OTHERWISE.
3. ANY CLAIM AGAINST THE CUSTOMER BY ANY OTHER PARTY

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FUSHENGTEK Technology Technical Support and Services
If you have questions about installing or using your FUSHENGTEK Technology Product, then please notice that you
will find many answers in this Users Guide. To obtain support please contact your local Distributor or Field
Application Engineer (FAE).
Before Contacting Support: Please be prepared to provide as much information as possible:
CPU Board
1. Type.
2. Part Number (find PN on label)
3. Serial Number if available (find SN on label)
Configuration
1. DRAM Type and Size.
2. BIOS Revision (find the version info in the BIOS Setup).
3. BIOS Settings different than Default Settings (refer to the BIOS Setup section).
System
1. O/S Make and Version.
2. Driver Version numbers (Graphics, Network, and Audio).
3. Attached Hardware: Hard disks, CD-Rom, LCD Panels etc.

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1 Introduction
This manual describes theWG-7302 boards made by FUSHENGTEK Technology. In this manual the boards will also
be denoted WG-7302-E38/J19.
The WG-7302 boards are based on Intel Atom E38xx/J19SoC (System on Chip) “Intel Bay Trail” and will be
available in three versions. The three types of boards are listed in this table:
Ordering Information
Article
Description
WG-7302-A10-X
Display: 1x LVDS+ 1x HDMI or 1x LVDS+ 1x VGA
WG-7302-A11-X
Display: 1x eDP+ 1x HDMI or 1x eDP+ 1x VGA
WG-7302-A12-X
Display: 2x HDMI or 1x VGA+1x HDMI
WG-7302W-A10-X
Display: 1x LVDS+ 1x HDMI or 1x LVDS+ 1x VGA
Temperature :-40°C to +85°C
WG-7302W-A11-X
Display: 1x eDP+ 1x HDMI or 1x eDP+ 1x VGA
Temperature :-40°C to +85°C
WG-7302W-A12-X
Display: 2x HDMI or 1x VGA+ 1x HDMI
Temperature:-40°C to +85°C
Note:
X-CPU model，CPU：E3805,E3815,E3825,E3826,E3827,E3845,J1900
Use of this Users Guide implies a basic knowledge of PC-AT hard- and software. This manual is focused on
describing the E38/J19 board’s special features and is not intended to be a standard PC-AT textbook.
New users are recommended to study the short installation procedure stated in the following chapter before
switching-on the power.
All configuration and setup of the CPU board is either done automatically or manually by the user via the BIOS setup
menus. Only exceptions are the “Clear CMOS” Jumper and the “Always On” jumper.

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2 Installation Procedure
2.1 Installing the Board
To get the board running follow these steps. If the board shipped from FUSHENGTEK has already components like
RAM and CPU cooler mounted, then relevant steps below can be skipped.
1. Turn off the PSU (Power Supply Unit)
2. Insert the DDR3L SODIMM module
For a list of approved DDR3L SODIMMs contact your Distributor or FAE. See also chapter “System Memory
Support”.
3. Cooler Installation
Normally the cooler is pre-mounted, but in case not, then make sure the heat paste etc. on the cooler is intact and cover
the full area of the SoC. Connect Cooler Fan electrically to the FAN_CPU connector.
4. Connecting Interfaces
Insert all external cables for hard disk, keyboard etc. A monitor must be connected in order to change BIOS settings.
5. Connect and turn on PSU
Connect PSU to the board by theVin-External connector. Please note that current limitations apply, see relevant
connector description.
6. Power Button
If the board does not start by itself when switching on the ATX PSU AC mains, then follow these instructions to start
the board. Install the Always on Jumper in the Always On position or toggle the PWRBTN_IN# signal (available in
the FRONTPNL connector), by momentary shorting pins 3 (PWRBTN_IN#) and pin 2 (GND). A “normally open”
switch is recommended.
7. BIOS Setup
Enter the BIOS setup by pressing the <Del> key during boot up.
Enter “Exit Menu” and Load Setup Defaults.
Refer to the “BIOS Configuration / Setup “section of this manual for details on BIOS setup. Please note that BIOS
may boot in UEFI shell, if so then type exit to activate BIOS menu and select Set-up.
Warning: Turn off PSU (Power Supply Unit) completely (no mains power connected to the PSU) or
leave the Power Connectors unconnected while configuring the board. Otherwise components (RAM,
LAN cards etc.) might get damaged. Make sure to use +12V single supply only. Alternatively use a
standard ATX PSU with suitable cable kit and PS_ON# active.
Note: To clear all BIOS settings, including Password protection, activate “Clear CMOS Settings”
Jumper for ≈10 sec (without power connected).

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8. Mounting the board in chassis
When fixing the Motherboard on a chassis it is recommended using screws with integrated washer and a diameter of
≈7mm. Do not use washers with teeth, as they can damage the PCB and cause short circuits.
2.2 Requirements IEC60950
Take care when designing chassis interface connectors in order to fulfill the IEC60950 standard.
When an interface or connector has a VCC (or other power) pin which is directly connected to a power plane
like the VCC plane:
To protect the external power lines of the peripheral devices the customer has to ensure:
• Wires have suitable rating to withstand the maximum available power.
• That the enclosure of the peripheral device fulfils the fire protecting requirements of IEC60950.
Lithium battery precautions
CAUTION!
Danger of explosion if battery is incorrectly re- placed.
Replace only with same or equivalent type
recommended by manufacturer. Dispose of used
batteries according to the manufacturer’s instruc- tions.
VORSICHT!
ExplosionsgefahrbeiunsachgemäßemAustausch der
Batterie. Ersatz nurdurch den
selbenodereinenvomHerstellerempfohlenengleichwertigen
Typ. EntsorgunggebrauchterBatteriennachAnga- ben des
Herstellers.
ATTENTION!
Risqued'explosion avec l'échangeinadéquat de la
batterie. Remplacementseulement par le mêmeou un
type équivalentrecommandépar le producteur.
L'évacuation des batteries usagéesconformément àdes
indications du fabricant.
PRECAUCION!
Peligro de explosiónsi la batería se
sustituyeincorrectamente. Sustituyasolamentepor el mismo
o tipoequivalenterecomendadopor el fabricante.
Dispongalasbateríasusadassegúnlasinstrucciones del
fabricante.
ADVARSEL!
Lithiumbatteri –
Eksplosionsfarevedfejlagtighåndtering. Udskiftningmå
kun ske med batteriafsammefabrikatog type.
Levérdetbrugtebatteritilbagetilleverandøren.
ADVARSEL!
Eksplosjonsfarevedfeilaktigskifteavbatteri.
Benyttsammebatteritypeeller en tilsvarende type
anbefaltavapparatfabrikanten.
Bruktebatterierkasseresihenholdtilfabrikantensinstruksjoner.
VARNING!
Explosionsfara vid felaktigtbatteribyte.
Användsammabatteritypeller en
ekvivalenttypsomrekommenderasavapparattillverkaren.
Kasseraanväntbatterienligtfabrikantensinstruktion.
VAROITUS!
Paristovoiräjähtää, jos se on virheellisestiasennettu.
Vaihdaparistoainoastaanlalteval-
mistajansuosittelemaantyyppiln.
Hävitäkäytettyparistovalmistajanohjeidenmukaisesti.
Warning: When mounting the board to chassis etc. please notice that the board contains components
on both sides of the PCB which can easily be damaged if board is handled without reasonable care. A
damaged component can result in malfunction or no function at all.

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3 System Specifications
3.1 Component main data
Technical Information
Form Factor
3.5" board
SOC
Intel®Atom™ E38xx/J1900 SoC (2 or 4 cores) , Low power 5-10W TDP
Supports:
Intel®Atom™ E3805 Single Core 1.33GHz3W
Intel®Atom™ E3815 Single Core 1.46GHz5W
Intel®Atom™ E3825 Dual Core 1.33GHz6W
Intel®Atom™ E3826 Dual Core1.46GHz7W
Intel®Atom™ E3827 Dual Core1.75GHz8W
Intel®Atom™ E3845 Quad Core1.91GHz10W
Intel®Atom™ J1900 Quad Core 2.0GHz10W
Memory
SO-DIMM Memory supporting DDR3L1066/1333 MHz (up to 8 GB)
Graphics
2x independent graphic outputs (eDP/LVDS, HDMI1.4a,VGA) LVDS up to
1920x1200 eDP up to 2560x1600/ HDMI up to 1920x1200/ VGA up to 2560x1600
Ethernet
2x RJ45 10/100/1000Mb/s Ethernet
SATA
1x mSATA + 1x SATA 2.0
USB
5x USB 2.0 and 1x USB2.0/3.0 (4 on front I/O, 2 internal)
Serial Ports
4x RS232 (3 wire) +2x RS232/422/485
I/O Features
1x mPCIe, 8x GPIOs，1x SIM
Audio
ALC662 HD Audio (Line-in ,Line-out, Mic-in)
Power Supply
+9V~+24VDC, Recommend +12VDC
Temperature
Operating-20°C to +75°C ,-40°C to +85°C (optional)
Dimensions
146 mm x 101 mm
Cooling
Passive cooling solutions
Operating
systems
Win7, Win8, WES7, WES8, Linux, VxWorks

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3.2 System overview
The block diagram below shows the architecture and main components of theWG-7302. The key component on the
board is the Intel® Atom E38xx SoC (Bay Trail).
3.3 Integrated pre-mounted cooler
RJ45
2x HDMI
VGA
4xRS232 (3 wire)
Line out
Line in
Mic in
HDA codec
Alc662
SO-DIMM Memory 1066/1333MHz
SIO
NCT6106D
Realtek
RTL8111E
Baytrail
On board
DC/DC
DCIN
eDP
mSATA (mPCIe)
RJ45
5x USB2.0
1x USB2.0
1x USB3.0
CH7511B
LVDS 18/24
mPCIe
8x GPIOs
2XRS232/422/485

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4 Connector Locations
4.1 WG-7302 –front side
SPI flash
E38XX/J19XX
SIO

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4.2 WG-7302 –back side
HDMI1
Power ok LED
HDMI 2
LAN1
LAN2
SATA LED
USB4
USB3
USB2（USB2.0）
USB1(USB3.0/ USB2.0)
（USB3.0/2.0）
LCD Power Button
SIM
VGA
SATA1
Vin Ext.
mPCIe(3G or Wi-Fi)
Always On
(Pin 1-2 ON,
Pin 2-3 NC,)
SATA Power
GPIO
Pin 2-3 Power On
Pin 1-2 Reset
LVDS or eDP
Clear COMS
SODIMM
mSATA
or
mPCIe
COM (1-6)
USB (5-6)
Audio
BAT
COM_SEL

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5 Connector Definitions
The following sections provide pin definitions and detailed description of all on-board connectors.
The connector definitions follow the following notation:
Column name
Description
Pin
Shows the pin-numbers in the connector. The graphical layout of the connector
definition tables is made similar to the physical connectors.
Signal
The mnemonic name of the signal at the current pin. The notation “XX#” states that
the signal “XX” is active low.
Type
AI: Analogue Input.
AO: Analogue Output.
I: Input, TTL compatible if nothing else stated.
IO: Input / Output. TTL compatible if nothing else stated.
IOT: Bi-directional tri-state IO pin.
IS: Schmitt-trigger input, TTL compatible.
IOC: Input / open-collector Output, TTL compatible.
IOD: Input / Output, CMOS level Schmitt-triggered. (Open drain output)
DSO: Differential Signaling Output with complementary signals on two paired wires
DSI: Differential Signaling Input with complementary signals on two paired wires
DSIO: Differential Signaling Input / Output (combined DSO and DSI)
O: Output, TTL compatible.
OC: Output, open-collector or open-drain, TTL compatible.
OT: Output with tri-state capability, TTL compatible.
LVDS: Low Voltage Differential Signal.
PWR: Power supply or ground reference pins.
NC: Pin not connected.
Additional notations:
-5.0 +5.0V signal voltage level, e.g. I-5.0
-3.3 +3.3V signal voltage level, e.g. O-3.3
-1.8 +1.8V signal voltage level, e.g. IO-1.8
Level
Ioh: Typical current in mA flowing out of an output pin through a grounded load,
while the output voltage is > 2.4 V DC (if nothing else stated).
Iol: Typical current in mA flowing into an output pin from a VCC connected load,
while the output voltage is < 0.4 V DC (if nothing else stated).
Pull U/D
On-board pull-up or pull-down resistors on input pins or open-collector output pins.
Note
Special remarks concerning the signal.
The abbreviation TBD is used for specifications which are not available yet or which are not sufficiently specified by
the component vendors.

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6 IO-Area Connectors
6.1 HDMI Connectors (HDMI1, HDMI2)
The HDMI® interface is available through the standard 19 pin Type A HDMI® connector
Pin
Signal
Description
Type
1
TMDS2+
TMDS data 2 (positive)
DSO-3.3
2
GND
Ground
PWR
3
TMDS2-
TMDS data 2 (negative)
DSO-3.3
4
TMDS1+
TMDS data 1(positive)
DSO-3.3
5
GND
Ground
PWR
6
TMDS1-
TMDS data 1 (negative)
DSO-3.3
7
TMDS0+
TMDS data 0 (positive)
DSO-3.3
8
GND
Ground
PWR
9
TMDS0-
TMDS data 0 (negative)
DSO-3.3
10
TMD CLK+
TMDS clock (positive)
DSO-3.3
11
GND
Ground
PWR
12
TMD CLK-
TMDS clock (negative)
DSO-3.3
13
N.C.
Not connected
NC
14
N.C.
Not connected
NC
15
DDC_CLK
DDC clock
IO-5.0
16
DDC_DATA
DDC data
IO-5.0
17
GND
Ground
PWR
18
VCC5 1)
Power +5V
PWR
19
TMDS_HPD
Hot plug detect
I-5.0
Note: 1) To protect the external power lines of peripheral devices make sure that
- the wires have the right diameter to withstand the maximum available current.
- to enclosure of the peripheral device fulfills the fire-protecting conditions of IEC/EN 60950.
6.2 Ethernet Connector
The WG-7302 support single channels of 10/100/1000Mb Ethernet based on Realtek® RTL8111E.
In order to achieve the specified performance of the Ethernet port, Category 5 twisted pair cables must be used with
10/100MB and Category 5E, 6 or 6E with 1Gb LAN networks.

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The signals for the Ethernet ports are as follows:
Signal
Description
MDI[0]+ / MDI[0]-
In MDI mode, this is the first pair in 1000Base-T, i.e. the BI_DA+/- pair, and is the
transmit pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DB+/- pair, and is the receive pair
in 10Base-T and 100Base-TX.
MDI[1]+ / MDI[1]-
In MDI mode, this is the second pair in 1000Base-T, i.e. the BI_DB+/- pair, and is
the receive pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DA+/- pair, and is the transmit pair
in 10Base-T and 100Base-TX.
MDI[2]+ / MDI[2]-
In MDI mode, this is the third pair in 1000Base-T, i.e. the BI_DC+/- pair.
In MDI crossover mode, this pair acts as the BI_DD+/- pair.
MDI[3]+ / MDI[3]-
In MDI mode, this is the fourth pair in 1000Base-T, i.e. the BI_DD+/- pair.
In MDI crossover mode, this pair acts as the BI_DC+/- pair.
Note: MDI = Media Dependent Interface.
The pinout of the RJ45 connectors is as follows
Signal
PIN
Type
Ioh/Iol
Note
MDI0+
MDI0-
MDI1+
MDI2+
MDI2-
MDI1-
MDI3+
MDI3-
Flashing =>
communication
8
7
6
5
4
3
2
1

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6.3 USB Connectors (IO Area)
The WG-7302B board contains support for 1 USB3.0/2.0 port (Lower USB port, USB1)and3 USB2.0 port (USB2,
USB3, USB4) in the IO area.
USB 2.0 ports allowing data transfers up to 480Mb/s. The USB 3.0 port allowing data transfers up to 5Gb/s.
(Two internal USB ports are available via internal 8-pin connectors)
For USB2.0 cabling it is required to use only High Speed USB cable, specified in USB2.0 standard:
For USB3.0 cabling it is required to use only High Speed USB cable, specified in USB3.0 standard:

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USB Ports 1 and 2 are mounted together, USB2 (USB2.0) on top of the USB1 (USB3.0/USB2.0).
Note
Type
Signal
PIN
Signal
Type
Note
IO
USB2-
USB2+
IO
1
PWR
5V/SB5V
1
2
3
4
GND
PWR
PWR
GND
PWR
IO
USB1-
USB1+
IO
1
PWR
5V/SB5V
1
2
3
4
GND
PWR
IO
RX0-
5
6
7
8
9
TX0+
IO
IO
RX0+
TX0-
IO
PWR
GND
PWR
Note 1: In order to meet the requirements of USB standard, the 5V input supply must be at least 5.00V
Signal
Description
USBn+ USBn-
RXn+ RXn-
TXn+ TXn-
(n= 0,1)
Differential pair works as serial differential receive/transmit data lines.
5V/SB5V
5V supply for external devices. SB5V is supplied during power-down to allow
wakeup on USB device activity. Protected by 1.0A current limiting circuit for each
USB port.
6.4 DC Power Jack Connector (Vin Ext.)
The DC Power Jack Connector (Vin Ext.) connector must be used to supply the board with +9V~+24V. Maximum
allowed current is 5A.
Warning: Hot Plugging power supply is not supported. Hot plugging might damage the board.
Notes:To protect the external power lines of peripheral devices make sure that
- the wires have the right diameter to withstand the maximum available current.
- to enclosure of the peripheral device fulfills the fire-protecting conditions of IEC/EN 60950.

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7 Internal Connectors
7.1 Power Connector (J1.)
Header
Pin
Signal
Min.
Typ.
Max.
Units
1
GND
2
GND
3
Power
+9.0
+12.0
+24.0
V
4
Power
+9.0
+12.0
+24.0
V
Maximum allowed current on each pin is 5A.
Available cable kit:
Power Cable
7.2 Internal SATA Power Connector (SATA_PWR.)
Header
Pin
Signal
Description
Type
1
1
GND
Power Ground
PWR
2
+5V
+5V power input
PWR
3
+5V
+5V power input
PWR
4
GND
Power Ground
PWR
Maximum allowed current on each pin is 2A.
Available cable kit:
SATA Power Cable