Gemalto Cinterion ELS31-VA Operating and installation instructions

M2M.GEMALTO.COM
Cinterion®ELS31-VA/ELS51-VA
Hardware Interface Description
Version: 01.000
DocId: ELS31-VA_ELS51-VA_HID_v01.000

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Confidential / Preliminary
Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
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Document Name: Cinterion®ELS31-VA/ELS51-VAHardware Interface Description
Version: 01.000
Date: 2017-01-04
DocId: ELS31-VA_ELS51-VA_HID_v01.000
Status: Confidential / Preliminary

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
Contents
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Contents
1 Introduction.................................................................................................................9
1.1 Key Features at a Glance .................................................................................. 9
1.2 ELS31-VA/ELS51-VA System Overview ......................................................... 12
1.3 Circuit Concept ................................................................................................ 13
2 Interface Characteristics..........................................................................................14
2.1 Application Interface ........................................................................................ 14
2.1.1 Pad Assignment.................................................................................. 14
2.1.2 Signal Properties................................................................................. 16
2.1.2.1 Absolute Maximum Ratings ................................................ 21
2.1.3 USB Interface...................................................................................... 22
2.1.3.1 Interface implementation..................................................... 23
2.1.3.2 Reducing Power Consumption............................................ 24
2.1.4 Serial Interface ASC0 ......................................................................... 25
2.1.4.1 Serial Interface Start-up Behavior ....................................... 26
2.1.5 Serial Interface ASC1 ......................................................................... 27
2.1.6 UICC/SIM/USIM Interface................................................................... 29
2.1.7 Digital Audio Interface......................................................................... 31
2.1.8 Pulse Code Modulation Interface (PCM) ............................................ 31
2.1.9 Inter IC Sound Interface (I2S).............................................................. 33
2.1.10 GPIO Interface .................................................................................... 34
2.1.11 I2C Interface ........................................................................................ 36
2.1.12 SPI Interface ....................................................................................... 38
2.1.13 Pulse Counter ..................................................................................... 39
2.1.14 HSIC Interface (ELS51-VA Only)........................................................ 39
2.1.15 SDIO Interface (ELS51-VA Only)........................................................ 39
2.1.16 Control Signals.................................................................................... 42
2.1.16.1 Status LED .......................................................................... 42
2.1.16.2 Power Indication Circuit ...................................................... 43
2.1.16.3 Host Wakeup....................................................................... 43
2.1.16.4 Fast Shutdown .................................................................... 45
2.2 RF Antenna Interface....................................................................................... 46
2.2.1 Antenna Interface Specifications ........................................................ 46
2.2.2 Antenna Installation ............................................................................ 47
2.2.3 RF Line Routing Design...................................................................... 48
2.2.3.1 RF Interface Signals Circuit Diagram Example................... 48
2.2.3.2 Line Arrangement Examples ............................................... 49
2.3 Sample Application .......................................................................................... 54
2.3.1 Prevent Back Powering....................................................................... 56
2.3.2 Sample Level Conversion Circuit........................................................ 56

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3 Operating Characteristics........................................................................................57
3.1 Operating Modes ............................................................................................. 57
3.2 Power Up/Power Down Scenarios................................................................... 58
3.2.1 Turn on ELS31-VA/ELS51-VA ............................................................ 58
3.2.1.1 Connecting ELS31-VA/ELS51-VA BATT Lines.................... 58
3.2.1.2 Switch on ELS31-VA/ELS51-VA Using ON Signal .............. 59
3.2.2 Restart ELS31-VA/ELS51-VA............................................................. 60
3.2.2.1 Restart ELS31-VA/ELS51-VA via AT+CFUN Command ..... 60
3.2.2.2 Restart ELS31-VA/ELS51-VA Using EMERG_RST ............ 60
3.2.3 Signal States after First Startup .......................................................... 62
3.2.4 Turn off ELS31-VA/ELS51-VA ............................................................ 63
3.2.4.1 Switch off ELS31-VA/ELS51-VA Using AT Command ......... 63
3.2.5 Automatic Shutdown ........................................................................... 64
3.2.5.1 Thermal Shutdown .............................................................. 64
3.2.5.2 Undervoltage Shutdown...................................................... 65
3.2.5.3 Overvoltage Shutdown........................................................ 65
3.3 Power Saving................................................................................................... 66
3.3.1 Power Saving while Attached to LTE Networks.................................. 66
3.3.2 Wake-up via RTS0/RTS1.................................................................... 67
3.4 Power Supply................................................................................................... 68
3.4.1 Power Supply Ratings......................................................................... 69
3.4.2 Minimizing Power Losses ................................................................... 70
3.4.3 Measuring the Supply Voltage (BATT_BB)......................................... 70
3.4.4 Monitoring Power Supply by AT Command ........................................ 70
3.5 Operating Temperatures.................................................................................. 71
3.6 Electrostatic Discharge .................................................................................... 72
3.6.1 ESD Protection for Antenna Interface................................................. 72
3.7 Blocking against RF on Interface Lines ........................................................... 73
3.8 Reliability Characteristics................................................................................. 76
4 Mechanical Dimensions, Mounting and Packaging...............................................77
4.1 Mechanical Dimensions of ELS31-VA/ELS51-VA ........................................... 77
4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform........................ 79
4.2.1 SMT PCB Assembly ........................................................................... 79
4.2.1.1 Land Pattern and Stencil..................................................... 79
4.2.1.2 Board Level Characterization.............................................. 81
4.2.2 Moisture Sensitivity Level ................................................................... 81
4.2.3 Soldering Conditions and Temperature .............................................. 82
4.2.3.1 Reflow Profile ...................................................................... 82
4.2.3.2 Maximum Temperature and Duration.................................. 83
4.2.4 Durability and Mechanical Handling.................................................... 84
4.2.4.1 Storage Conditions.............................................................. 84
4.2.4.2 Processing Life.................................................................... 85
4.2.4.3 Baking ................................................................................. 85
4.2.4.4 Electrostatic Discharge ....................................................... 85

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4.3 Packaging ........................................................................................................ 86
4.3.1 Tape and Reel .................................................................................... 86
4.3.1.1 Orientation........................................................................... 86
4.3.1.2 Barcode Label ..................................................................... 87
4.3.2 Shipping Materials .............................................................................. 88
4.3.2.1 Moisture Barrier Bag ........................................................... 88
4.3.2.2 Transportation Box .............................................................. 90
4.3.3 Trays ................................................................................................... 91
5 Regulatory and Type Approval Information...........................................................93
5.1 Directives and Standards................................................................................. 93
5.2 SAR requirements specific to portable mobiles ............................................... 95
5.3 Reference Equipment for Type Approval......................................................... 96
5.4 Compliance with FCC and IC Rules and Regulations ..................................... 97
6 Document Information..............................................................................................99
6.1 Revision History ............................................................................................... 99
6.2 Related Documents ....................................................................................... 100
6.3 Terms and Abbreviations ............................................................................... 100
6.4 Safety Precaution Notes ................................................................................ 103
7 Appendix.................................................................................................................. 104
7.1 List of Parts and Accessories......................................................................... 104

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
Tables
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Tables
Table 1: Pad assignments............................................................................................ 15
Table 2: Signal properties ............................................................................................ 16
Table 3: Absolute maximum ratings............................................................................. 21
Table 4: Signals of the SIM interface (SMT application interface) ............................... 29
Table 5: Overview of PCM pin functions...................................................................... 32
Table 6: Overview of I2S pin functions ......................................................................... 33
Table 7: GPIO lines and possible alternative assignment............................................ 34
Table 8: SDIO interface features.................................................................................. 39
Table 9: SDIO interface lines ....................................................................................... 40
Table 10: SDIO timings.................................................................................................. 40
Table 11: Host wakeup line............................................................................................ 43
Table 12: Return loss in the active band........................................................................ 46
Table 13: RF Antenna interface LTE.............................................................................. 46
Table 14: Overview of operating modes ........................................................................ 57
Table 15: Signal states................................................................................................... 62
Table 16: Temperature dependent behavior.................................................................. 64
Table 17: Voltage supply ratings.................................................................................... 69
Table 18: Current consumption ratings.......................................................................... 69
Table 19: Board temperature ......................................................................................... 71
Table 20: Electrostatic values ........................................................................................ 72
Table 21: EMI measures on the application interface.................................................... 74
Table 22: Summary of reliability test conditions............................................................. 76
Table 23: Reflow temperature ratings............................................................................ 82
Table 24: Storage conditions ......................................................................................... 84
Table 25: Directives ....................................................................................................... 93
Table 26: Standards of North American type approval .................................................. 93
Table 27: Standards of Verizon type approval............................................................... 93
Table 28: Standards of GCF type approval.................................................................... 93
Table 29: Requirements of quality ................................................................................. 93
Table 30: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 94
Table 31: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 94
Table 32: Antenna gain limits for FCC and IC................................................................ 97
Table 33: List of parts and accessories........................................................................ 104
Table 34: Molex sales contacts (subject to change) .................................................... 105

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
Figures
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Figures
Figure 1: ELS31-VA/ELS51-VA system overview......................................................... 12
Figure 2: ELS31-VA/ELS51-VA baseband block diagram ............................................ 13
Figure 3: Numbering plan for connecting pads (bottom view)....................................... 14
Figure 4: USB circuit ..................................................................................................... 22
Figure 5: USB Additional ESD Protection Implementation............................................ 23
Figure 6: Serial interface ASC0..................................................................................... 25
Figure 7: ASC0 startup behavior................................................................................... 26
Figure 8: Serial interface ASC1..................................................................................... 27
Figure 9: ASC1 startup behavior................................................................................... 28
Figure 10: External UICC/SIM/USIM card holder circuit ................................................. 30
Figure 11: PCM timing short frame (4096KHz, 16kHz sample rate) ............................... 32
Figure 12: I2S timing (slave mode) .................................................................................. 33
Figure 13: GPIO startup behavior ................................................................................... 35
Figure 14: I2C interface connected to V180 .................................................................... 36
Figure 15: I2C startup behavior ....................................................................................... 37
Figure 16: Characteristics of SPI modes......................................................................... 38
Figure 17: SDIO interface timing diagrams (Input/Output).............................................. 40
Figure 18: Status signaling with LED driver .................................................................... 42
Figure 19: Power indication circuit .................................................................................. 43
Figure 20: Wake-up via RING0 ....................................................................................... 44
Figure 21: Fast shutdown timing ..................................................................................... 45
Figure 22: Antenna pads (bottom view) .......................................................................... 47
Figure 23: RF interface signals example......................................................................... 48
Figure 24: Embedded Stripline with 65µm prepreg (1080) and 710µm core .................. 49
Figure 25: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 50
Figure 26: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 51
Figure 27: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 52
Figure 28: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 53
Figure 29: Schematic diagram of ELS31-VA/ELS51-VA sample application .................. 55
Figure 30: Sample level conversion circuit...................................................................... 56
Figure 31: Sample circuit for applying power using an external µC ................................ 58
Figure 32: ON timing ....................................................................................................... 59
Figure 33: Emergency restart timing ............................................................................... 60
Figure 34: Switch off behavior......................................................................................... 63
Figure 35: Power saving and paging in LTE networks.................................................... 66
Figure 36: Wake-up via RTS0/RTS1............................................................................... 67
Figure 37: Position of reference points BATT_BB/BATT_RF and GND.......................... 70
Figure 38: ESD protection for RF antenna interface ....................................................... 72
Figure 39: EMI circuits..................................................................................................... 73
Figure 40: ELS31-VA/ELS51-VA– top and bottom view ................................................. 77
Figure 41: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm)........................ 78
Figure 42: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) - bottom view . 78
Figure 43: Land pattern (top view) .................................................................................. 79
Figure 44: Recommended design for 120 micron thick stencil (top view, dual design)... 80
Figure 45: Reflow Profile................................................................................................. 82
Figure 46: Carrier tape .................................................................................................... 86
Figure 47: Reel direction ................................................................................................. 86
Figure 48: Barcode label on tape reel ............................................................................. 87
Figure 49: Moisture barrier bag (MBB) with imprint......................................................... 88

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
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Figure 50: Moisture Sensitivity Label .............................................................................. 89
Figure 51: Humidity Indicator Card - HIC ........................................................................ 90
Figure 52: Small quantity tray.......................................................................................... 91
Figure 53: Tray to ship odd module amounts.................................................................. 91
Figure 54: Trays with packaging materials...................................................................... 91
Figure 55: Tray dimensions............................................................................................. 92
Figure 56: Reference equipment for Type Approval ....................................................... 96

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
1 Introduction
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1 Introduction
This document1describes the hardware of the Cinterion®ELS31-VA and ELS51-VA modules
for Verizon Networks. It helps you quickly retrieve interface specifications, electrical and me-
chanical details and information on the requirements to be considered for integrating further
components.
The ELS31-VA and ELS51-VA modules include a baseband, a complete dual band RF front-
end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re-
lease 10 set of specifications) and Verizon Wireless LTE UE specifications.
The module variants differentiate a follows:
- ELS31-VA provides LTE connectivity with IP Services
- ELS51-VA adds a Linux execution environment available for customer applications
1.1 Key Features at a Glance
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Gemalto M2M product.
Feature Implementation
General
Frequency bands LTE dualband: B4, B13
Output power Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13
Power supply 3.3V to 4.5V
Operating temperature
(board temperature)
Normal operation: -30°C to +80°C
Extended operation: -40°C to +90°C
Physical Dimensions: 27.60mm x 18.80mm x 2.05mm
Weight: approx. 3g
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 DL 10Mbps, UL 5Mbps
LTE Cat. 1 data rates
SMS Point-to-point MT and MO
Text mode
Storage in mobile equipment
Software
AT commands Hayes, 3GPP TS 27.007, TS 27.005, product specific
SIM Application Toolkit SAT Release 99
Firmware update Generic update from host application over ASC0 or USB modem
OTA over ASC0 and over USB

Cinterion®ELS31-VA/ELS51-VA Hardware Interface Description
1.1 Key Features at a Glance
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Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application development equipment.
USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
2 serial interfaces ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
• Default baud rate: 115,200 baud
• Adjustable baud rates: 4,800 to 921,600, no autobauding support
• Supports RTS0/CTS0 hardware flow control.
• Indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)
ASC1 (shared with GPIO lines):
• 4-wire, unbalanced asynchronous interface
• Default baud rate: 115,200 baud
• Adjustable baud rates: 4,800bps to 921,600bps
• Supports RTS1/CTS1 hardware flow control
UICC interface Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC Module is prepared for an embedded UICC
GPIO interface 20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3):
GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, SPI,
and DAI signal lines
Programming is done via AT commands
I2C interface Supports I2C serial interface
SPI interface Supports SPI interface
SDIO ELS51-VA only:
4 wire interface.
HSIC ELS51-VA only:
High Speed Interchip Communication interface.
ADC Analog-to-Digital Converter with one unbalanced analog input.
Digitial audio interface 4 GPIO lines can be configured as PCM/I2S lines for VoLTE communica-
tion.
Antenna interface pads 50ΩLTE main antenna, 50LTE diversity antenna
Feature Implementation