GOWIN SUG100 User manual

Gowin Power Analyzer
User Guide
SUG282-2.4E, 12/20/2022

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is a trademark of Guangdong Gowin Semiconductor Corporation and is
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Revision History
Date
Versio
n
Description
01/30/2018
1.2E
Initial version published.
08/16/2018
1.3E
The value range of VCC/VCCX updated;
Interface screenshots updated.
10/26/2018
1.4E
GW1NZ-1 and GW1NSR-2C supported.
11/15/2018
1.5E
GW1NSR-2 supported;
GW1N-6ES, GW1N-9ES and GW1NR-9ES removed.
02/25/2019
1.6E
The voltage configuration updated;
VCD File configuration supported;
Specified IO toggle rate configuration removed.
05/17/2019
1.7E
GW1N-1S supported;
03/09/2020
1.8E
GW1NRF-4B, GW1NS-4, GW1NS-4C, GW1NSE-2C, GW1NSER-4C
GW1NSR-4, GW1NSR-4C, GW2A-18C, GW2A-55C and GW2AR-18C
supported.
05/09/2020
1.9E
GW1N-9C, GW1NR-9C and GW2ANR-18C supported;
GW1N-2, GW1N-2B and GW1N-6 removed.
09/17/2020
2.0E
Power analysis of automotive grade devices supported.
06/16/2021
2.1E
Some figures updated;
The descriptions of operating conditions updated.
08/05/2021
2.2E
Changed 1.9.8Beta to 1.9.8 version.
Chapter 5 Gowin Power Estimator” added.
11/02/2021
2.3E
Some figures and descriptions updated.
12/20/2022
2.4E
Some figures and descriptions updated.

Contents
SUG282-2.4E
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Contents
Contents...............................................................................................................i
List of Figures....................................................................................................iii
List of Tables.......................................................................................................v
1About This Guide............................................................................................1
1.1 Purpose .............................................................................................................................. 1
1.2 Related Documents............................................................................................................1
1.3 Terminology and Abbreviations...........................................................................................1
1.4 Support and Feedback.......................................................................................................2
2Introduction.....................................................................................................3
3GPA ..................................................................................................................5
3.1 Start GPA............................................................................................................................5
3.1.1 Create/Load Config File...................................................................................................5
3.1.2 Open GPA View............................................................................................................... 6
3.2 GPA Configuration..............................................................................................................7
3.2.1 Operating Conditions.......................................................................................................7
3.2.2 Signal Toggle Rate Configuration.................................................................................... 9
3.2.3 Clock Enable Configuration........................................................................................... 16
3.3 GPA Power Analysis Report .............................................................................................23
4Power Analysis Report.................................................................................24
4.1 Power Message................................................................................................................25
4.2 Power Summary............................................................................................................... 25
4.2.1 Power Information..........................................................................................................25
4.2.2 Thermal Information....................................................................................................... 26
4.2.3 Configure Information.................................................................................................... 26
4.2.4 Supply Information.........................................................................................................27
4.3 Power Details.................................................................................................................... 27
4.3.1 Power by Block Type..................................................................................................... 27
4.3.2 Power by Hierarchy.......................................................................................................28
4.3.3 Power by Clock Domain................................................................................................ 28
5Gowin Power Estimator................................................................................29

Contents
SUG282-2.4E
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5.1 POWER SUMMARY......................................................................................................... 29
5.1.1 DEVICE ......................................................................................................................... 29
5.1.2 THERMAL INFO............................................................................................................ 30
5.1.3 VOLTAGE SOURCE POWER SUMMARY....................................................................31
5.1.4 BLOCK POWER............................................................................................................31
5.1.5 POWER SUMMARY......................................................................................................32
5.2 CLOCK TREE BLOCK POWER.......................................................................................32
5.3 IO BLOCK POWER..........................................................................................................33
5.3.1 INPUT & OUTPUT POWER..........................................................................................33
5.3.2 BIDIRECTIONAL & TRI_STATE POWER.....................................................................34
5.4 LOGIC BLOCK POWER...................................................................................................35
5.5 BSRAM BLOCK POWER................................................................................................. 36
5.5.1 SINGLE PORT BSRAM POWER..................................................................................36
5.5.2 SEMI DUAL-PORT BSRAM POWER............................................................................36
5.5.3 DUAL-PORT BSRAM POWER......................................................................................37
5.5.4 BLOCK ROM POWER ..................................................................................................38
5.6 DSP BLOCK POWER.......................................................................................................39
5.7 PLL BLOCK POWER........................................................................................................40
5.8 DLLDLY BLOCK POWER.................................................................................................40
Appendix A Calculation Principle for Junction Temperature........................41

List of Figures
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List of Figures
Figure 3-1 Create Config File............................................................................................................. 5
Figure 3-2 New GPAConfig File Dialog Box .....................................................................................6
Figure 3-3 Load Config File ...............................................................................................................6
Figure 3-4 GPA View.......................................................................................................................... 7
Figure 3-5 General Setting View........................................................................................................ 8
Figure 3-6 Rate Setting View.............................................................................................................10
Figure 3-7 Net Rate View...................................................................................................................10
Figure 3-8 Net Finder Dialog Box ...................................................................................................... 11
Figure 3-9 Set Net Toggle Rate ......................................................................................................... 11
Figure 3-10 Delete Toggle Rate......................................................................................................... 12
Figure 3-11 Prompt ............................................................................................................................ 12
Figure 3-12 Prompt............................................................................................................................ 12
Figure 3-13 VCD File View ................................................................................................................13
Figure 3-14 Add Vcd File Dialog Box................................................................................................. 13
Figure 3-15 Select VCD File Dialog Box............................................................................................14
Figure 3-16 Select Instance Dialog Box ............................................................................................14
Figure 3-17 Set the Start and End Time of the Waveform File.......................................................... 15
Figure 3-18 Prompt............................................................................................................................ 15
Figure 3-19 Prompt............................................................................................................................ 15
Figure 3-20 Default Rate Setting View...............................................................................................16
Figure 3-21 Clock Setting View..........................................................................................................16
Figure 3-22 Clock View...................................................................................................................... 17
Figure 3-23 Clock Enable Configuration............................................................................................17
Figure 3-24 Remove Clock Enable.................................................................................................... 18
Figure 3-25 BSRAM View.................................................................................................................. 18
Figure 3-26 Clock Enable forAll BSRAMs......................................................................................... 18
Figure 3-27 BSRAM Finder Dialog Box............................................................................................. 19
Figure 3-28 Specified BSRAM Clock Enable..................................................................................... 19
Figure 3-29 IO View...........................................................................................................................20
Figure 3-30 Port Finder Dialog Box...................................................................................................20
Figure 3-31 Specified I/O Enable Configuration................................................................................ 21
Figure 3-32 DFF View........................................................................................................................ 21

List of Figures
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Figure 3-33 DFF Finder Dialog Box...................................................................................................22
Figure 3-34 Specified DFF Enable Configuration.............................................................................. 22
Figure 3-35 Open GPA Report........................................................................................................... 23
Figure 4-1 GPA Report.......................................................................................................................24
Figure 4-2 Power Messages.............................................................................................................. 25
Figure 4-3 Power Information ............................................................................................................25
Figure 4-4 Thermal Information ......................................................................................................... 26
Figure 4-5 Configure Information....................................................................................................... 26
Figure 4-6 Supply Information............................................................................................................27
Figure 4-7 Power by Block Type........................................................................................................27
Figure 4-8 Power by Hierarchy..........................................................................................................28
Figure 4-9 Power by Clock Domain...................................................................................................28
Figure 5-1 DEVICE............................................................................................................................ 29
Figure 5-2 THERMAL INFO............................................................................................................... 30
Figure 5-3 VOLTAGE SOURCE POWER SUMMARY.......................................................................31
Figure 5-4 BLOCK POWER............................................................................................................... 31
Figure 5-5 POWER SUMMARY.........................................................................................................32
Figure 5-6 CLOCK TREE BLOCK POWER.......................................................................................32
Figure 5-7 INPUT & OUTPUT POWER.............................................................................................33
Figure 5-8 BIDIRECTIONAL & TRI_STATE POWER........................................................................34
Figure 5-9 LOGIC BLOCK POWER ..................................................................................................35
Figure 5-10 SINGLE PORT BSRAM POWER...................................................................................36
Figure 5-11 SEMI DUAL-PORT BSRAM POWER............................................................................. 37
Figure 5-12 DUAL-PORT BSRAM POWER ......................................................................................37
Figure 5-13 BLOCK ROM POWER ...................................................................................................38
Figure 5-14 DSP BLOCK POWER .................................................................................................... 39
Figure 5-15 PLL BLOCK POWER .....................................................................................................40
Figure 5-16 DLLDLY BLOCK POWER .............................................................................................. 40

List of Tables
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List of Tables
Table 1-1 Terminology and Abbreviations..........................................................................................1

1 About This Guide
1.1 Purpose
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1About This Guide
1.1 Purpose
This manual describes how to use the Gowin Power Analyzer. It
provides the descriptions of tool and analysis of the power consumption
report. It helps you estimate and analyze power consumption more easily.
As the software is subject to change without notice, some information may
not remain relevant and may need to be adjusted according to the software
that is in use.
1.2 Related Documents
The latest user guides are available on the GOWINSEMI Website. You
can find the related documents at www.gowinsemi.com:
SUG100, Gowin Software User Guide
SUG918, Gowin Software Quick Start Guide
1.3 Terminology and Abbreviations
Table 1-1 shows the abbreviations and terminology that are used in
this manual.
Table 1-1 Terminology and Abbreviations
Terminology and Abbreviations
Meaning
FPGA
Field Programmable Gate Array
GPA
Power Analysis
GPE
Gowin Power Estimator
θJA
Junction to Ambient
θJB
Junction to Board
θSA
Sink to Ambient

1 About This Guide
1.4 Support and Feedback
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1.4 Support and Feedback
Gowin Semiconductor provides customers with comprehensive
technical support. If you have any questions, comments, or suggestions,
please feel free to contact us directly by the following ways.
Website: www.gowinsemi.com
E-mail: [email protected]

2 Introduction
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2Introduction
The GPA tool is designed in-house by Gowin. It is used to analyze
FPGA power consumption to help you estimate system power and improve
the performance and reliability of the design.
Users set the part number, operating environment, and signal toggle
rate, etc. according to their requirements. The parameters have an impact
on chip power consumption. The GPA automatically estimates the power
consumption and produces a power consumption analysis report according
to the parameters.
Primary Function
Calculate Static Power Consumption
Static power consumption refers to the power consumption caused by
leakage current in the device. It is determined by the design, package,
process, voltage, and working environment of the chip.
Calculate Dynamic Power Consumption
Dynamic power consumption refers to the power consumption during
operating, which is determined dynamic power by the user-designed
logic circuit and the characteristics of the circuit.
Primary Feature
Supports setting the various factors that affects static power
consumption.
-Supports setting ambient temperature.
-Supports setting airflow.
-Supports setting heat sink performance and Board Thermal Model.
-Supports setting customized thermal impedance parameters.
Supports various ways to calculate signal toggle rate.
-User-specified IO and Net signal toggle rate
-Toggle rate calculated from the waveform file generated by
simulation
-Supports specified default toggle rate.
Enables/disables clock, BSRAM, I/O, and DFF.

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Power consumption analysis report supports various ways to analysis
power consumption.
-Supports analyzing power consumption based on voltage type.
-Supports analyzing power consumption based on Block type.
-Supports analyzing power consumption based on hierarchy.
-Supports analyzing power consumption based on clock domain.

3 GPA
3.1 Start GPA
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3GPA
The GPA helps you accurately estimate the power consumption by
part number, operating environment, voltage, signal toggle rate and clock
configuration. For a simple GPA example, see SUG918, Gowin Software
Quick Start Guide.
3.1 Start GPA
Before starting GPA, you need to create or load the config file (.gpa).
3.1.1 Create/Load Config File
Create Config File
The steps are as follows.
1. In the “Design” view, right-click to select “New File...”.
The “New” dialog box pops up.
2. Create “GPA Config File”, as shown in Figure 3-1.
3. Click “OK”, and the “New GPA Config File”dialog box will open, as
shown in Figure 3-2.
4. Enter Config File name and select create path, then click “OK”. The
GPA Config File appear in “Design > GPA Config Files”.
Figure 3-1 Create Config File

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3.1 Start GPA
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Figure 3-2 New GPA Config File Dialog Box
Add Config File
The steps are as follows:
1. In “Design”, right-click to select “Add Files...”. The “Select Files”
window will open.
2. Select the existing Config File (.gpa), as shown in Figure 3-3, click
“Open”. See GPA Config File in “Design > gpa Config Files”.
Figure 3-3 Load Config File
3.1.2 Open GPA View
After successful synthesis, double-click the Config File (.gpa) in
“Design” window, and GPA view opens, as shown in Figure 3-4.
The GPA view includes “General Setting” (used for configuring
operating conditions), “Rate Setting” (used for configuring signal toggle
rate), and “Clock Setting” (used for configuring clock enable).

3 GPA
3.2 GPA Configuration
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Figure 3-4 GPA View
3.2 GPA Configuration
To ensure the accuracy of the power consumption analysis, it is
necessary to set the chip operating conditions, toggle rate of the signal,
and enable/disable clock, BSRAM, I/O, DFF, etc. according to the design.
3.2.1 Operating Conditions
The “General Setting”view displays the operating conditions, thermal
impedance, and voltage.
As shown in Figure 3-5, the “General Setting” view displays “Operating
Conditions” for setting the chip temperature grade and process,
“Environment” for setting the chip operating conditions, and “Voltage” for
setting the chip voltage.

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3.2 GPA Configuration
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Figure 3-5 General Setting View
Parameter
1. Operating Conditions
Grade: The grade includes COMMERCIAL, INDUSTRIAL, and
AUTOMOTIVE. And the grade setting affects the minimum and
maximum operating temperature of the chip. The operating
temperature of COMMERCIAL device is from 0 ℃to 85 ℃; the
operating temperature of INDUSTRIAL devices is from 40 ℃to
100 ℃; and the operating temperature of automotive devices is
from 40 ℃to 125 ℃.
Process: The process of the chip includes TYPICAL or WORST.
2. Environment
“Environment” is used to configure the ambient temperature, air flow,
heat sink and Board Thermal Model, etc. Operating environment affects
static power consumption. Different operating environments will affect the
FPGA chip temperature and static power consumption. Air flow affects the
thermal performance of the chip.The heat sink is used for the heat
dissipation of the specified chip through the auxiliary device; The circuit
Board Thermal Model is used for the heat dissipation of the specified chip
through the board.
Junction temperature is determined by external temperature, chip
power consumption, and thermal impedance. Please refer to Appendix A
Calculation Principle for Junction Temperature for calculation principle of

3 GPA
3.2 GPA Configuration
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junction temperature. Details of Environment configuration parameters are
as follows.
Ambient Temperature: The unit is ℃. The range is to from minus
40 ℃~ 150℃, and the default is 25.000 ℃.
Custom Theta JA: You can specifies the thermal impedance θJA
between the chip and environment. The unit is ℃/W. The range is
from 0.001℃/W ~ 100℃/W, and the default is 25.000℃/W.
Heat Sink: Heat Sink includes 5 modes: None, Low Profile,
Medium Profile, High Profile and Custom. "None" indicates heat
sink is unused, and only thermal impedance θJA influences junction
temperature; Custom indicates that the user specifies the thermal
impedance θSA from the heat sink to the environment; Low Profile,
Medium Profile and High Profile modes represent θJA is
automatically calculated by GPA.
Air Flow: The unit is LFM or m/s. The unit displayed in the user
interface is LFM. There are four selection modes, including 0LFM,
100LFM (0.5 m/s), 200 LFM (1.0 m/s), 400 LFM (2.0 m/s); the
larger the Air Flow is, the smaller the thermal impedance from the
chip to the ambient is, and the smaller the junction temperature is.
Custom Theta JA: thermal impedance θSA between Heat Sink and
environment. The unit is ℃/W. The range is from 0.001℃/W ~
100℃/W, and the default is 25.000℃/W.
Board Thermal Model: Heat dissipation model of development
board. Thermal impedance model of the development board is the
path that dissipating heat from the development board to outside,
which includes three modes: None, Custom, and Typical. None
means board thermal is not to be considered; Custom indicates the
user specifies thermal impedance θJB from device to development
board; Typical indicates θJB is automatically determined by chip
package.
Board Temperature
CustomTheta JB: Thermal impedance θJB from junction to board.
The user can specify only if selecting Custom from Board Thermal
Model.
3. Voltage
VCC: core voltage. The unit is V, and for the voltage range of each
series device, you can see the pinout manuals at our website.
VCCX: auxiliary voltage. The unit is V, and for the voltage range of
each series device, you can see the pinout manuals at our website.
3.2.2 Signal Toggle Rate Configuration
Rate Setting is used for configuring signal toggle rate. You can set
toggle rate of IO or Net or use default toggle rate.
As shown in Figure 3-6, Rate Setting view displays Net Rate, VCD File
and Default Rate Setting.

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3.2 GPA Configuration
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The descriptions of each option are as follows.
Net Rate is used to configure specified net toggle rate.
VCD File is used to load waveform files generated by simulation.
Default Rate Setting is used to configure general default toggle rate for
IO and Net.
Note!
Net toggle rate specified by users is of the highest priority, Net toggle rate specified by the
waveform files generated by simulation is of the second-highest priority, and the default IO
and Net toggle rate is of the lowset priority.
Figure 3-6 Rate Setting View
Specified Net Toggle Rate
Net Rate is used to set net signal toggle rate specified by users, as
shown in Figure 3-7. Net toggle rate includes TOGGLE RATE mode and
SIGNAL RATE mode.
Click “%”to select TOGGLE RATE mode; Or click “transition/s” to
select SIGNAL RATE mode.
Figure 3-7 Net Rate View

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3.2 GPA Configuration
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Note!
TOGGLE RATE mode: The ratio of signal toggle rate to clock rate, and the unit is %;
SIGNAL RATE mode: The signal toggle rate, and the unit is transition/s.
Select Net signal. The steps are as follows.
1. Click “ ” , and “Net Finder” dialog box pops up, as shown in Figure
3-8.
2. Enter net name in Filter text box, click “Search”.
3. Select the specified net in list.
4. Click “OK”to finish selecting net signal.
Note!
You can also right-click to select "Add" in pop-up menu.
Figure 3-8 Net Finder Dialog Box
Note!
"Filter" supports wildcard screening;
The list supports options of left-click, Shift + left, and Ctrl + left.
5. See Net signals in Net Rate table, and double-click the corresponding
value column and enter signal toggle rate, as shown in Figure 3-9.
Figure 3-9 Set Net Toggle Rate

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3.2 GPA Configuration
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6. Select the row to be deleted in the editing area, and click “ ” or
right-click to select “Remove” in the pop-up menu. The “Confirm” dialog
box will pop up, click “Yes” to delete the net toggle rate, as shown in
Figure 3-10.
Figure 3-10 Delete Toggle Rate
7. For the net toggle rate that has been set, the shift between TOGGLE
RATE and SIGNAL RATE is not supported. If one of settings is selected,
“Sure to change the unit” will pop up, as shown in Figure 3-11.
Figure 3-11 Prompt
8. For the net added in the editing table, value should be set, or when
clicking “save”, a “Warning” dialog box will pop up, as shown in Figure
3-12.
Figure 3-12 Prompt
Load Waveform File Generated by Simulation
VCD File is used to load waveform files generated by simulation, as
shown in Figure 3-13. Waveform files are the basis for calculating IO and
NET toggle rate. Two types of waveform files generated by VCS or
modelsim simulation tools are supported: VCD (Value Change Dump) and
SAIF (Switching Activity Interchange) files.