Hailo EVB™ | Getting started guide | User’s guide
Page 5 Rev. 1.0 Confidential and Proprietary | Copyright © 2021 –Hailo Technologies Ltd.
Table of Contents
1. Introduction.....................................................................................................................................6
2. Mechanical properties.....................................................................................................................7
3. Board high level description ............................................................................................................8
3.1. SW1..........................................................................................................................................9
3.2. SW3..........................................................................................................................................9
3.3. GPIO header (J1) ......................................................................................................................9
3.4. UART connector (J3, J14) .......................................................................................................10
3.5. UART connector (J3, J14) .......................................................................................................10
3.6. Reset switch (J15) ..................................................................................................................10
3.7. USB Power connector (J22) ...................................................................................................10
3.8. SDIO headers (J24, J35)..........................................................................................................11
3.9. CSI-RX (MIPI) connectors (P1, P2, P3, P4)..............................................................................11
3.10. PCIE connector (P5) ...........................................................................................................12
4. Power measurement details..........................................................................................................13
4.1. EVB Top View.........................................................................................................................13
4.2. EVB Bottom View...................................................................................................................14
5. Thermal considerations - before you connect the module...........................................................15
6. Requirements.................................................................................................................................16
6.1. Full SDK installation requirements ........................................................................................16
6.2. Lean SDK installation requirements (inference only)............................................................16
7. Driver installation PCIE ..................................................................................................................17
8. Connecting the device ...................................................................................................................17
8.1. Dip switch configuration........................................................................................................17
8.2. PCIE connection.....................................................................................................................18
8.3. Ethernet connection..............................................................................................................19
9. Running inference..........................................................................................................................20
10. Next steps ..................................................................................................................................21