High-Flying MYK2011_100 User manual

MYK2011_100 Low Power Wi-Fi Module User Manual
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 1 -
MYK2011_100
Low Power Wi-Fi Module User Manual
V 1.9
Overview of Characteristic
Support IEEE802.11b/g/n Wireless Standards
Based on Self-developed High Cost Effective MCU
Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme
Support UART/SPI/PWM/GPIO Data Communication Interface
Support Work As STA/AP/AP+STA Mode
Support Smart Link Function (APP program provide)
Support Wireless and Remote Firmware Upgrade Function
Support WPS Function
Support Multi-TCP Link (5 Channel) Apllication
Support External(I-PEX) Antenna Option
Single +3.3V Power Supply
Smallest Size: 23.1mm x 32.8mm x (3.45±0.3)mm
FCC/CE/TELEC Certificated

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TABLE OF CONTENTS
LIST OF FIGURES...................................................................................................................................3
LIST OF TABLES ....................................................................................................................................4
1. PRODUCT OVERVIEW ................................................................................................................5
1.1. General Description.................................................................................................................5
1.1.1 Device Features..................................................................................................................5
1.1.2 Device Paremeters .............................................................................................................6
1.1.3 Key Application ...................................................................................................................6
1.2. Hardware Introduction.............................................................................................................7
1.2.1. Pins Definition.....................................................................................................................7
1.2.2. Electrical Characteristics ....................................................................................................9
1.2.3. Mechanical Size................................................................................................................11
1.2.4. External Antenna ..............................................................................................................11
2. PACKAGE INFORMATION ........................................................................................................13
2.1. Recommended Reflow Profile ..............................................................................................13
2.2. Device Handling Instruction (Module IC SMT Preparation)...............................................13
2.3. Shipping Information.............................................................................................................13
3. OEM/INTEGRATORS INSTALLATION MANUAL ..................................................................15

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LIST OF FIGURES
Figure 1. MYK2011_100 View...............................................................................................................7
Figure 2. MYK2011_100 Pins Map........................................................................................................7
Figure 3. MYK2011_100 Mechanical Dimension ................................................................................11
Figure 4. MYK2011_100 PCB Symbol Size ........................................................................................11
Figure 5. Reflow Soldering Profile .......................................................................................................13
Figure 6. Shipping Information ............................................................................................................14

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LIST OF TABLES
Table 1 MYK2011_100 Module Technical Specifications.....................................................................6
Table 2 MYK2011_100 Pins Definition..................................................................................................7
Table 3 MYK2011_100 External Antenna Parameters .......................................................................12
Table 11 Reflow Soldering Parameter .................................................................................................13

MYK2011_100 Low Power Wi-Fi Module User Manual
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1. PRODUCT OVERVIEW
1.1. General Description
TheMYK2011_100 is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi module,
which provide a wireless interface to any equipment with a Serial/SPI interface for data
transfer.MYK2011_100 integrate MAC, baseband processor, RF transceiver with power amplifier in
hardware and all Wi-Fi protocol and configuration functionality and networking stack, in embedded
firmware to make a fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications.
TheMYK2011_100 employs the world's lowest power consumption embedded architecture. It has
been optimized for all kinds of client applications in the home automation, smart grid, handheld device,
personal medical application and industrial control that have lower data rates, and transmit or receive
data on an infrequent basis.
TheMYK2011_100 integrates all Wi-Fi functionality into a low-profile, 23.1x32.8x 2.7mm SMT module
package that can be easily mounted on main PCB with application specific circuits. Also, module
provides built-in antenna, external antenna option.
1.1.1 Device Features
Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2
Based on Self-developed High Cost Performance MCU
Ultra-low-power operation with all kinds of power-save modes.
Includes all the protocol and configuration functions for Wi-Fi connectivity.
Support STA/AP/AP+STA Mode
Support Smart Link Function
Support Wireless and Remote Firmware Upgrade Function
Support Max 8 Channel PWM/GPIO Output
Integrated pcb antenna, antenna connector options.
Compact surface mount module 23.1mm x 32.8mm x (3.45±0.3)mm.
Full IPv4 stack.
Low power RTOS and drivers.
CE/FCC/TELEC Certified.
RoHS compliant.
Single supply –3.3V operation.

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1.1.2 Device Paremeters
Table 1 MYK2011_100 Module Technical Specifications
Class
Item
Parameters
Wireless
Parameters
Certification
TBD
Wireless standard
802.11 b/g/n
Frequency range
2.412GHz-2.462GHz
Transmit Power
802.11b: +16 +/-2dBm (@11Mbps)
802.11g: +14 +/-2dBm (@54Mbps)
802.11n: +13 +/-2dBm (@HT20 , MCS7)
802.11n: +13 +/-2dBm (@HT40 , MCS7)
Receiver Sensitivity
802.11b: -93 dBm (@11Mbps ,CCK)
802.11g: -85 dBm (@54Mbps, OFDM)
802.11n: -82 dBm (@HT20, MCS7)
802.11n: -82 dBm (@HT40, MCS7)
Antenna Option
External:I-PEX Connector
Hardware
Parameters
Data Interface
UART
SPI, PWM, GPIO
Operating Voltage
2.8~3.6V
Operating Current
Peak [Continuous TX]: ~300mA
Normal [WiFi ON/OFF, DTIM=100ms]:
Average. ~12mA, Peak: 300mA
Operating Temp.
-40℃- 85℃
Storage Temp.
-45℃- 125℃
Dimensions and Size
23.1mm×32.8mm×(3.45±0.3)mm
Software
Parameters
Network Type
STA /AP/STA+AP
Security Mechanisms
WEP/WPA-PSK/WPA2-PSK
Encryption
WEP64/WEP128/TKIP/AES
Update Firmware
Local Wireless, Remote
Customization
Web Page Upgrade
Support SDK for application develop
Network Protocol
IPv4, TCP/UDP/HTTP
User Configuration
AT+instruction set. Android/ iOS
Smart Link APP tools
1.1.3 Key Application
Remote equipment monitoring
Asset tracking and telemetry
Security
Industrial sensors and controls
Home automation
Medical devices

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1.2. Hardware Introduction
Figure 1. MYK2011_100 View
1.2.1. Pins Definition
Figure 2. MYK2011_100 Pins Map
Table 2 MYK2011_100 Pins Definition
Pin
Describtion
Net Name
Signal
Type
Comments
1,17,32,48
Ground
GND
Power
2
Debug Pin
SWCLK
I, PD
Debug functional pin,

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Pin
Describtion
Net Name
Signal
Type
Comments
3
NC
No connect if not use.
4
NC
5
Debug Pin
SWD
I/O,PU
6
N.C
No connect
7
GPIO/AD
Sleep_RQ
I.PU
GPIO7, No connect if not use.
8
GPIO/AD
Sleep_ON
O
GPIO8, No connect if not use.
9
+3.3V Power
DVDD
Power
10
N.C
No connect
11
PWM/GPIO/AD
PWM_1
I/O
GPIO11, No connect if not use.
12
PWM/GPIO/AD
PWM_2
I/O
GPIO12, No connect if not use.
13
GPIO
GPIO13
I/O
GPIO13, No connect if not use.
14
N.C
No connect
15
WPS/GPIO
GPIO15
I/O
GPIO15, WPS Function Pin.
16
N.C
No connect
18
PWM/GPIO
PWM_3
I/O
GPIO18, No connect if not use.
19
N.C
No connect
20
PWM/GPIO
PWM_4
I/O
GPIO20, No connect if not use.
21
N.C
No connect
22
N.C
No connect
23
PWM/GPIO/AD
PWM_5
I/O
GPIO23, No connect if not use.
24
N.C
No connect
25
Power Control Switch
PWR_SW
I,PU
Leave it no connect
26
N.C
No connect
27
SPI Interface/AD/PWM
SPI_MISO
I
GPIO27, No connect if not use.
28
SPI Interface/PWM
SPI_CLK
I/O
GPIO28, No connect if not use.
29
SPI Interface/AD
SPI_CS
I/O
GPIO29, No connect if not use.
30
SPI Interface/PWM
SPI_MOSI
O
GPIO30, No connect if not use.
31
+3.3V Power
DVDD
Power
33
N.C
No connect
34
+3.3 Power
DVDD
Power
35
N.C
No connect
36
N.C
No connect
37
N.C
No connect
38
N.C
No connect
39
UART0
UART0_TX
O
GPIO39, No connect if not use.
40
UART0
UART0_RTS
I/O
GPIO40, No connect if not use.
41
UART0
UART0_RX
I
GPIO41, No connect if not use.
42
UART0
UART0_CTS
I/O
GPIO42, No connect if not use.
43
Wi-Fi Status
nLink
O
Detailed functions see
<Notes>
44
Module Boot Up
Indicator
nReady
O
“0” – Boot-up OK;
“1” – Boot-up No OK;

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Pin
Describtion
Net Name
Signal
Type
Comments
No connect if not use.;
45
Multi-Function
nReload
I,PU
Detailed functions see
<Notes>
46
N.C
No connect
47
Module Reset
EXT_RESETn
I,PU
“Low” effective reset input.
<Notes>
nReload Pin (Button) function：
1. When this pin is set to “low” during module boot up, the module will enter wireless
firmware and config upgrade mode. This mode is used for customer manufacture.
(See Appendix D to download software tools for customer batch configuration and
upgrade firmware during mass production)
2. After module is powered up, short press this button ( “Low” < = 2s ) to make the
module go into “Smart Link “ config mode, waiting for APP to set password and
other information. (See Appendix D to download SmartLink APP)
3. After module is powered up, long press this button ( “Low” >= 4s ) to make the
module recover to factory setting.
High-Flying strongly suggest customer fan out this pin to connector or button for
“Manufacture” and “ Smart Link” application.
nLink Pin (LED) function：
1. At wireless firmware and config upgrade mode , this LED used to indicate configure
and upgrade status.
2. At “Smart Link “ config mode, this LED used to indicate APP to finish setting.
3. At normal mode, it’s Wi-Fi link status indicator
High-Flying strongly suggest customer fan out this pin to LED.
1.2.2. Electrical Characteristics
Absolute Maximum Ratings:
Parameter
Condition
Min.
Typ.
Max.
Unit
Storage temperature range
-45
125
°C
Maximum soldering temperature
IPC/JEDEC J-STD-020
260
° C
Supply voltage
0
3.8
V
Voltage on any I/O pin
0
3.3
V
ESD (Human Body Model HBM)
TAMB=25°C
2
KV
ESD (Charged Device Model, CDM)
TAMB=25°C
1
KV
Power Supply & Power Consumption:
Parameter
Condition
Min.
Typ.
Max.
Unit
Operating Supply voltage
2.8
3.3
3.8
V
Supply current, peak
Continuous Tx
300
mA

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Supply current, IEEE PS
DTIM=100ms
12
mA
Output high voltage
Sourcing 6mA
2.8
V
Output low voltage
Sinking 6mA
0.2
V
Input high voltage
2.2
V
Input low voltage
0.8
V
GPIO Input pull-up resistor
200
kΩ
GPIO Input pull-down resistor
200
kΩ

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1.2.3. Mechanical Size
MYK2011_100 modules physical size （Unit: mm）as follows:
Figure 3. MYK2011_100 Mechanical Dimension
MYK2011_100 Module PCB symbol size (mm) as follows:
Figure 4. MYK2011_100 PCB Symbol Size
1.2.4. External Antenna
MYK2011_100 module supports external antenna(I-PEX or SMA) option for user dedicated application.

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If user select external antenna,MYK2011_100 modules must be connected to the 2.4G antenna
according to IEEE 802.11b/g/n standards.
The antenna parameters required as follows:
Table 3 MYK2011_100 External Antenna Parameters
Item
Parameters
Frequency range
2.4~2.5GHz
Impedance
50 Ohm
VSWR
2 (Max)
Return Loss
-10dB (Max)
Connector Type
I-PEX or populate directly

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2. PACKAGE INFORMATION
2.1. Recommended Reflow Profile
Figure 5. Reflow Soldering Profile
Table 11 Reflow Soldering Parameter
Note: 1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.2. Device Handling Instruction (Module IC SMT Preparation)
1. Shelf life in sealed bag: 12 months, at <30℃and <60% relative humidity (RH)
2. After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
3. Recommend to oven bake with N2 supplied
4. Recommend end to reflow oven with N2 supplied
5. Baked required with 24 hours at 125+-5℃before rework process
6. Recommend to store at ≦10% RH with vacuum packing
7. If SMT process needs twice reflow:
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note: Window time means from last bake end to next reflow start that has 168 hours space.
2.3. Shipping Information
NO.
Item
Temperature (Degree)
Time(Sec)
1
Reflow Time
Time of above 220
35~55 sec
2
Peak-Temp
260 max

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TAPE BOX
Size: 340*340*70 mm Size: 340*340*350 mm (inside)
Figure 6. Shipping Information
Note:
1 tape = 500pcs
1 box = 5 tapes = 5 * 500 pcs = 2500pcs

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3. OEM/INTEGRATORS INSTALLATION
MANUAL
Important Notice to OEM integrators
1.This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3.The separate approval is required for all other operating configurations, including portable configurations
with respect to Part 2.1093 and different antenna configurations
4.For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B,
the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter
module(s) are installed and operating. The modules should be transmitting and the evaluation should
confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The
Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not
be used on the final product. In these circumstances, the OEM integrator will be responsible for re-
evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
The final end product must be labeled in a visible area with the following:
Contains FCC ID: 2ACSVMYK2011-100 ; IC : 12243A-MYK2011100
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency

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energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference that may cause undesired
operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your
body. This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Industry Canada Statement
This device complies with Industry Canada RSS-210 and CAN ICES-3(B)/NMB-3(B). Operation is subject to
the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio RSS-210.
L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Cet émetteur ne doit pas être Co-placé ou ne fonctionnant en même temps qu'aucune autre antenne ou

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émetteur.
Caution Exposure:
This device meets the exemption from the routine evaluation limits in section 2.5 of RSS102 and users
can obtain Canadian information on RF exposure and compliance.
Le dispositif répond à l'exemption des limites d'évaluation de routine dans la section 2.5 de RSS102
et les utilisateurs peuvent obtenir des renseignements canadiens sur l'exposition aux RF et le respect.
This equipment should be installed and operated with a minimum distance of 20 centimeters between
the radiator and your body.
Cet équipement doit être installé et utilisé avec une distance minimale de 20 centimètres entre le
radiateur et votre corps.
© Copyright High-Flying, May, 2011
The information disclosed herein is proprietary to High-Flying and is not to be used by or disclosed to
unauthorized persons without the written consent of High-Flying. The recipient of this document shall respect the
security status of the information.
The master of this document is stored on an electronic database and is “write-protected” and may be altered only
by authorized persons at High-Flying. Viewing of the master document electronically on electronic database
ensures access to the current issue. Any other copies must be regarded as uncontrolled copies.